DATA SHEET
The information in this document is subject to change without notice. Before using this document, please confirm that
this is the latest version.
Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices
representative for availability and additional information.
PHOTOCOUPLER
PS2501-1,-2,-4,PS2501L-1,-2,-4
HIGH ISOLATION VOLTAGE
SINGLE TRANSISTOR TYPE
MULTI PHOTOCOUPLER SERIES
The mark
shows major revised poi nts.
NEPOC Series
Document No. PN10225EJ01V0DS (1st edition)
(Previous No. P10025EJ8V0DS00)
Date Published February 2003 CP(K)
Printed in Japan
NEC Compound Semiconductor Devices 1988, 2003
DESCRIPTION
The PS2501-1, -2, -4 and PS2501L-1, -2, -4 are optically coupled isolators containing a GaAs light emitting diode
and an NPN silicon phototransistor.
The PS2501-1, -2, -4 are in a plastic DIP (Dual In-line Package) and the PS2501L-1, -2, -4 are lead bending type
(Gull-wing) for surface mount.
FEATURES
High isolation voltage (BV = 5 000 Vr.m.s.)
High collector to emitter voltage (VCEO = 80 V)
High-speed switching (tr = 3
µ
s TYP., tf = 5
µ
s TYP.)
Ordering number of tape product: PS2501L-1-E3, E4, F3, F4, PS2501L-2-E3, E4
Safety standards
UL approved: File No. E72422 (S)
APPLICATIONS
Power supply
Telephone/FAX.
FA/OA equipment
Programmable logic controller
Data Sheet PN10225EJ01V0DS
2
PS2501-1,-2,-4,PS2501L-1,-2,-4
PACKAGE DIMENSIONS (UNIT : mm)
DIP Type (New package)
PS2501-4
PS2501-1TOP VIEW
1. Anode
2. Cathode
3. Emitter
4. Collector
TOP VIEW
1, 3, 5, 7. Anode
2, 4, 6, 8. Cathode
9, 11, 13, 15. Emitter
10, 12, 14, 16. Collector
19.8±0.5
6.5±0.5
3.5±0.3
4.15±0.43.2±0.4
2.54
1.25±0.15 0.50±0.10
0.25
M
0 to 15˚
7.62
0.25
+0.1
–0.05
3.5±0.3
4.15±0.43.2±0.4
2.54
1.25±0.15 0.50±0.10
0.25
M
4.6±0.35
6.5±0.5
0 to 15˚
7.62
0.25
+0.1
–0.05
12
43
12345678
16 15 14 13 12 11 10 9
Caution New package 1-ch, 4-ch only
DIP Type
PS2501-4
PS2501-1TOP VIEW
TOP VIEW
9.7±0.5
6.5±0.5
3.5±0.3
4.15±0.43.3±0.5
2.54
1.25±0.15 0.50±0.10
0.25
M
0 to 15˚
7.62
0.25
+0.1
–0.05
PS2501-2
4.6±0.5
6.5±0.5
3.5±0.3
4.15±0.43.3±0.5
2.54
1.25±0.15 0.50±0.10
0.25
M
0 to 15˚
7.62
0.25
+0.1
–0.05
19.8±0.5
6.5±0.5
0 to 15˚
7.62
0.25
+0.1
–0.05
3.5±0.3
4.15±0.43.3±0.5
2.54
1.25±0.15 0.50±0.10
0.25
M
1, 3. Anode
2, 4. Cathode
5, 7. Emitter
6, 8. Collector
TOP VIEW
12
43
12345678
16 15 14 13 12 11 10 9
1234
8765
1. Anode
2. Cathode
3. Emitter
4. Collector
1, 3, 5, 7. Anode
2, 4, 6, 8. Cathode
9, 11, 13, 15. Emitter
10, 12, 14, 16. Collector
Data Sheet PN10225EJ01V0DS 3
PS2501-1,-2,-4,PS2501L-1,-2,-4
Lead Bending Type (New package)
PS2501L-4
PS2501L-1
TOP VIEW TOP VIEW
0.25
M
4.6±0.35
6.5±0.5
3.5±0.3
2.54
1.25±0.15
0.15
0.9±0.25
9.60±0.4
0.25
+0.1
–0.05
0.1
+0.1
–0.05
19.8±0.5
6.5±0.5
2.54
1.25±0.15
0.25
M
3.5±0.3
0.15
0.9±0.25
9.60±0.4
0.25
+0.1
–0.05
0.1
+0.1
–0.05
12
43
12345678
16 15 14 13 12 11 10 9
1. Anode
2. Cathode
3. Emitter
4. Collector 1, 3, 5, 7. Anode
2, 4, 6, 8. Cathode
9, 11, 13, 15. Emitter
10, 12, 14, 16. Collector
Caution New package 1-ch, 4-ch only
Lead Bending Type
PS2501L-2
TOP VIEW
PS2501L-1
TOP VIEW
PS2501L-4 TOP VIEW
4.6±0.5
6.5±0.5
0.25
M
3.5±0.3
2.54
1.25±0.15
0.15
0.9±0.25
9.60±0.4
0.25
+0.1
–0.05
0.1
+0.1
–0.05
9.7±0.5
6.5±0.5
2.54
1.25±0.15
0.25
M
0.15
3.5±0.3
0.9±0.25
9.60±0.4
0.25
+0.1
–0.05
0.1
+0.1
–0.05
19.8±0.5
6.5±0.5
2.54
1.25±0.15
0.25
M
3.5±0.3
0.15
0.9±0.25
9.60±0.4
0.25
+0.1
–0.05
0.1
+0.1
–0.05
12
43
12345678
16 15 14 13 12 11 10 9
1234
8765 1, 3. Anode
2, 4. Cathode
5, 7. Emitter
6, 8. Collector
1. Anode
2. Cathode
3. Emitter
4. Collector
1, 3, 5, 7. Anode
2, 4, 6, 8. Cathode
9, 11, 13, 15. Emitter
10, 12, 14, 16. Collector
Data Sheet PN10225EJ01V0DS
4
PS2501-1,-2,-4,PS2501L-1,-2,-4
MARKING EXAMPLE
2501
MD003 PS2501-2
MD003
D
E
F
PS2501-1 PS2501-2, -4
Assembly Lot
Week Assembled
Year Assembled
(Last 1 Digit)
In-house Code
CTR Rank Code
No. 1 pin
Mark
Package
New PKG
Standard PKG
Made in Japan Made in Taiwan
No. 1 pin
Mark
M
D
E*1
F
Week Assembled
Year Assembled
(Last 1 Digit)
In-house Code
CTR Rank Code
Package
New PKG
Standard PKG
Made in Japan Made in Taiwan
003
M003
*1 PS2501-4 only
Country Assembled
Type Number
Assembly Lot
DD
H
Data Sheet PN10225EJ01V0DS 5
PS2501-1,-2,-4,PS2501L-1,-2,-4
ORDERING INFORMATION
Part Number Package Packi ng Styl e Applic at i on Part Number*1
PS2501-1 4-pin DIP Magazine c ase 100 pcs PS2501-1
PS2501L
PS2501L-1-E3 Embossed Tape 1 000 pcs/reel
PS2501L-1-E4
PS2501L-1-F3 Embossed Tape 2 000 pcs/reel
PS2501L-1-F4
PS2501-2 8-pin DIP Magazine c ase 45 pcs PS2501-2
PS2501L-2
PS2501L-2-E3 Embossed Tape 1 000 pcs/reel
PS2501L-2-E4
PS2501-4 16-pin DIP Magazine c ase 20 pcs PS2501-4
PS2501L-4
*1 For the application of the Safety Standard, following part number should be used.
ABSOLUTE MAXIMUM RATINGS (TA = 25 °
°°
°C, unless otherwise specified)
Ratings
Parameter Symbol PS2501-1,
PS2501L-1 PS2501-2,-4
PS2501L-2,-4 Unit
Diode Reverse V ol tage VR6V
Forward Current (DC) IF80 mA
Power Dissipati on Derating
PD/°C 1.5 1.2 mW/°C
Power Dissipati on PD150 120 mW/ch
Peak Forward Current*1 IFP 1A
Transistor Collector to Emitter Voltage VCEO 80 V
Emitter to Collector Voltage VECO 7V
Collector Current IC50 mA/ch
Power Dissipati on Derating
PC/°C 1.5 1.2 mW/°C
Power Dissipati on PC150 120 mW/ch
Isolat i on Voltage*2 B V 5 000 Vr.m. s.
Operating Am bi ent Tem perature TA55 to +100 °C
Storage Temperat ure Tstg 55 to +150 °C
*1 PW = 100
µ
s, Duty Cycle = 1 %
*2 AC voltage for 1 minute at TA = 25 °C, RH = 60 % between input and output
Data Sheet PN10225EJ01V0DS
6
PS2501-1,-2,-4,PS2501L-1,-2,-4
ELECTRICAL CHARACTERISTICS (TA = 25 °
°°
°C)
Parameter Symbol Conditions MIN. TYP. MAX. Unit
Diode Forward Voltage VFIF = 10 mA 1.17 1.4 V
Reverse Current I RVR = 5 V 5
µ
A
Terminal Capaci tance CtV = 0 V, f = 1.0 MHz 50 pF
Transistor Collector to E m i t ter Dar k
Current ICEO VCE = 80 V, I F = 0 m A 100 nA
Coupled Current Transfer Ratio
(IC/IF)*1 CTR IF = 5 mA, VCE = 5 V 80 300 600 %
Collector Saturatio n
Voltage VCE(sat) IF = 10 mA , I C = 2 m A 0.3 V
Isolat i on Resist ance RI-O VI-O = 1.0 kVDC 1011
Isolat i on Capacitanc e CI-O V = 0 V, f = 1. 0 M Hz 0.5 pF
Rise Time*2 trVCC = 10 V, I C = 2 mA, RL = 100 3
µ
s
Fall Time*2 tf5
*1 CTR rank ( * : only PS2501-1, PS2501L-1)
K* : 300 to 600 (%)
L* : 200 to 400 (%)
M* : 80 to 240 (%)
D* : 100 to 300 (%)
H* : 80 to 160 (%)
W*: 130 to 260 (%)
Q* : 100 to 200 (%)
N : 80 to 600 (%)
*2 Test circuit for switching time
PW = 100 s
Duty Cycle = 1/10
µ
Pulse Input V
CC
V
OUT
R
L
= 100
50
I
F
Data Sheet PN10225EJ01V0DS 7
PS2501-1,-2,-4,PS2501L-1,-2,-4
TYPICAL CHARACTERISTICS (TA = 25 °
°°
°C, unless otherwise specified)
150
100
50
0255075
100 125 150
1.5 mW/˚C
1.2 mW/˚C
150
100
50
25 50 100 125 1500
10 000
100
1 000
100
10
1
7550250–25–50
V
CE
= 80 V 10
1.0
0.80.60.40.20
5
1
0.5
0.1
10 mA
40
1.5 mW/˚C
1.2 mW/˚C
20 mA
50 mA
2 mA
I
F
= 1 mA
5 mA
40 V
24 V
10 V
5 V
PS2501-1
PS2501L-1
PS2501-2
PS2501L-2
PS2501-4
PS2501L-4
PS2501-1
PS2501L-1
PS2501-2
PS2501L-2
PS2501-4
PS2501L-4
100
1.51.41.31.21.11.00.90.80.7
50
10
5
1
0.5
0.1
0 ˚C
–25 ˚C
–55 ˚C
+60 ˚C
+25 ˚C
T
A
= +100 ˚C
Diode Power Dissipation P
D
(mW)
Transistor Power Dissipation P
C
(mW)
Ambient Temperature T
A
(˚C)
Forward Current I
F
(mA)
Forward Voltage V
F
(V)
Collector to Emitter Dark Current I
CEO
(nA)
Collector Saturation Voltage V
CE(sat)
(V)
Ambient Temperature T
A
(˚C)
Ambient Temperature T
A
(˚C)
DIODE POWER DISSIPATION vs.
AMBIENT TEMPERATURE TRANSISTOR POWER DISSIPATION
vs. AMBIENT TEMPERATURE
FORWARD CURRENT vs.
FORWARD VOLTAGE
COLLECTOR TO EMITTER DARK
CURRENT vs. AMBIENT TEMPERATURE COLLECTOR CURRENT vs.
COLLECTOR SATURATION VOLTAGE
Collector Current I
C
(mA)
75
70
2
60
50
40
30
20
10
046810
20 mA
I
F
= 5 mA
10 mA
50 mA
Collector Current I
C
(mA)
Collector to Emitter Voltage V
CE
(V)
COLLECTOR CURRENT vs.
COLLECTOR TO EMITTER VOLTAGE
Data Sheet PN10225EJ01V0DS
8
PS2501-1,-2,-4,PS2501L-1,-2,-4
1.2
–50
1.0
0.8
0.6
0.4
0.2
0–25 0 25 50 75 100
50
10
1
0.1 10 k
5 k
1 k
5001005010
1 000
100
10
1100 k50 k10 k5 k1 k500100
0
–5
–10
–15
–20
0.5 1 2 5 10 20 50 100200 500
,,,,,,,,,,,,,,,,,,,,,,,,
,,,,,,,,,,,,,,,,,,,,,,,,
,,,,,,,,,,,,,,,,,,,,,,,,
,,,,,,,,,,,,,,,,,,,,,,,,
,,,,,,,,,,,,,,,,,,,,,,,,
,,,,,,,,,,,,,,,,,,,,,,,,
,,,,,,,,,,,,,,,,,,,,,,,,
,,,,,,,,,,,,,,,,,,,,,,,,
I
C
= 2 mA,
V
CC
= 10 V,
CTR = 290 %
t
f
t
r
t
d
t
s
I
F
= 5 mA,
V
CC
= 5 V,
CTR = 290 %
t
s
t
d
t
r
t
f
I
F
= 5 mA,
V
CE
= 5 V
100
300
R
L
= 1 k
Normalized to 1.0
at T
A
= 25 ˚C,
I
F
= 5 mA, V
CE
= 5 V
Forward Current I
F
(mA)
Ambient Temperature T
A
(˚C)
Load Resistance R
L
()
Frequency f (kHz)
Normalized Current Transfer Ratio CTR
Current Transfer Ratio CTR (%)
Normalized Gain G
V
Load Resistance R
L
()
Switching Time t ( s)
µ
NORMALIZED CURRENT TRANSFER
RATIO vs. AMBIENT TEMPERATURE CURRENT TRANSFER RATIO vs.
FORWARD CURRENT
SWITCHING TIME vs.
LOAD RESISTANCE SWITCHING TIME vs.
LOAD RESISTANCE
FREQUENCY RESPONSE
Switching Time t ( s)
µ
450
400
350
300
250
200
150
100
50
00.05 0.1 0.5 1 5 10 50
T
A
= 25 ˚C
T
A
= 60 ˚C
1.2
1.0
0.8
0.6
0.4
0.2
010
2
10
3
10
4
10
5
Time (Hr)
CTR (Relative Value)
LONG TERM CTR DEGRADATION
I
F
= 5 mA
Sample A
B
C
D
V
CE
= 5 V
Remark The graphs indicate nominal characteristics.
Data Sheet PN10225EJ01V0DS 9
PS2501-1,-2,-4,PS2501L-1,-2,-4
TAPING SPECIFICATIONS (UNIT : mm)
Tape Direction
Outline and Dimensions (Tape)
Outline and Dimensions (Reel)
Packing: 1 000 pcs/reel
2.0±0.5
R 1.0
13.0±0.2
φ
21.0±0.8
φ
PS2501L-1-E3 PS2501L-1-E4
1.55±0.1
2.0±0.1
4.0±0.1
1.75±0.1
4.5 MAX.
4.0±0.1
0.4
5.3±0.1
8.0±0.1
7.5±0.1
16.0±0.3
10.3±0.1
1.5
+0.1
–0
φ
254±2.0
80.0±1.0
2.0±0.5
φ
φ
15.9 to 19.4
Outer edge of
flange
21.5±1.0
17.5±1.0
Data Sheet PN10225EJ01V0DS
10
PS2501-1,-2,-4,PS2501L-1,-2,-4
Tape Direction
Outline and Dimensions (Tape)
Outline and Dimensions (Reel)
PS2501L-1-F3 PS2501L-1-F4
1.55±0.1
2.0±0.1
4.0±0.1
1.75±0.1
4.5 MAX.
4.0±0.1
0.4
5.3±0.1
8.0±0.1
7.5±0.1
16.0±0.3
10.3±0.1
1.5
+0.1
–0
φ
Packing: 2 000 pcs/reel
2.0±0.5
R 1.0
13.0±0.2
φ
21.0±0.8
φ
330±2.0
100±1.0
2.0±0.5
φ
φ
15.9 to 19.4
Outer edge of
flange
21.5±1.0
17.5±1.0
Data Sheet PN10225EJ01V0DS 11
PS2501-1,-2,-4,PS2501L-1,-2,-4
Tape Direction
Outline and Dimensions (Tape)
Outline and Dimensions (Reel)
PS2501L-2-E3 PS2501L-2-E4
1.55±0.1
2.0±0.1
4.0±0.1
1.75±0.1
4.5 MAX.
10.4±0.1
12.0±0.1
1.5
+0.1
–0
7.5±0.1
10.3±0.1
16.0±0.3
4.0±0.1
0.3
Packing: 1 000 pcs/reel
15.9 to 19.4
Outer edge of
flange
100±1.0
φ
330±2.0
φ
2.0±0.5
R 1.0
13.0±0.2
φ
21.0±0.8
φ
2.0±0.5
21.5±1.0
17.5±1.0
Data Sheet PN10225EJ01V0DS
12
PS2501-1,-2,-4,PS2501L-1,-2,-4
NOTES ON HANDLING
1. Recommended soldering conditions
(1) Infrared reflow soldering
Peak reflow temperature 260°C or below (package surface temperature)
Time of peak reflow temperature 10 seconds or less
Time of temperature higher than 220°C 60 seconds or less
Time to preheat temperature from 120 to 180°C 120±30 s
Number of reflows Three
Flux Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
120±30 s
(preheating)
220˚C
180˚C
Package Surface Temperature T (˚C)
Time (s)
Recommended Temperature Profile of Infrared Reflow
(heating)
to 10 s
to 60 s
260˚C MAX.
120˚C
(2) Wave soldering
Temperature 260°C or below (molten solder temperature)
Time 10 seconds or less
Preheating conditions 120°C or below (package surface temperature)
Number of times One (Allowed to be dipped in solder including plastic mold portion.)
Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine
content of 0.2 Wt% is recommended.)
(3) Cautions
•Fluxes
Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.
2. Cautions regarding noise
Be aware that when voltage is applied suddenly between the photocoupler’s input and output or between
collector-emitters at startup, the output side may enter the on state, even if the voltage is within the absolute
maximum ratings.
Data Sheet PN10225EJ01V0DS 13
PS2501-1,-2,-4,PS2501L-1,-2,-4
USAGE CAUTIONS
1. Protect against static electricity when handling.
2. Avoid storage at a high temperature and high humidity.
Data Sheet PN10225EJ01V0DS
14
PS2501-1,-2,-4,PS2501L-1,-2,-4
M8E 00. 4 - 0110
The information in this document is current as of February, 2003. The information is subject to
change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or
data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all
products and/or types are available in every country. Please check with an NEC sales representative
for availability and additional information.
No part of this document may be copied or reproduced in any form or by any means without prior
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.
NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of
third parties by or arising from the use of NEC semiconductor products listed in this document or any other
liability arising from the use of such products. No license, express, implied or otherwise, is granted under any
patents, copyrights or other intellectual property rights of NEC or others.
Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of customer's equipment shall be done under the full
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third
parties arising from the use of these circuits, software and information.
While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers
agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize
risks of damage to property or injury (including death) to persons arising from defects in NEC
semiconductor products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment, and anti-failure features.
NEC semiconductor products are classified into the following three quality grades:
"Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products
developed based on a customer-designated "quality assurance program" for a specific application. The
recommended applications of a semiconductor product depend on its quality grade, as indicated below.
Customers must check the quality grade of each semiconductor product before using it in a particular
application.
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and visual equipment, home electronic appliances, machine tools, personal electronic equipment
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support systems and medical equipment for life support, etc.
The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's
data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not
intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness
to support a given application.
(Note)
(1) "NEC" as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd.
and also includes its majority-owned subsidiaries.
(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for
NEC (as defined above).
NEC Compound Semiconductor Devices Hong Kong Limited
Hong Kong Head Office
Taipei Branch Office
Korea Branch Office
TEL: +852-3107-7303
TEL: +886-2-8712-0478
TEL: +82-2-558-2120
FAX: +852-3107-7309
FAX: +886-2-2545-3859
FAX: +82-2-558-5209
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TEL: +49-211-6503-01 FAX: +49-211-6503-487
California Eastern Laboratories, Inc. http://www.cel.com/
TEL: +1-408-988-3500 FAX: +1-408-988-0279
0302
NEC Compound Semiconductor Devices, Ltd.
5th Sales Group, Sales Division TEL: +81-44-435-1588 FAX: +81-44-435-1579 E-mail: salesinfo@csd-nec.com
For further information, please contact
PS2501-1,-2,-4,PS2501L-1,-2,-4
SAFETY INFORMATION ON THIS PRODUCT
Caution GaAs Products The product cont ains gallium arsenide, GaAs .
GaAs vapor and powder are hazardous to human health if inhaled or inges ted.
Do not des troy or burn the product.
Do not c ut or cleav e off any part of the product.
Do not c rush or chemi cally di ssolv e the product.
Do not put the product i n the mouth.
Follow related l aws and ordinances for dispos al . The product should be exc l uded from general
industri al was te or household garbage.