SN74GTLPH16916
17-BIT LVTTL-TO-GTLP UNIVERSAL BUS TRANSCEIVER
WITH BUFFERED CLOCK OUTPUTS
SCES347C – JANUARY 2001 – REVISED JANUAR Y 2002
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POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
D
Member of the Texas Instruments
Widebus Family
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UBT Transceiver Combines D-Type
Latches and D-Type Flip-Flops for
Operation in Transparent, Latched,
Clocked, and Clock-Enabled Mode
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TI-OPC Circuitry Limits Ringing on
Unevenly Loaded Backplanes
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OEC Circuitry Improves Signal Integrity
and Reduces Electromagnetic Interference
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Bidirectional Interface Between GTLP
Signal Levels and LVTTL Logic Levels
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GTLP Buffered CLKAB Signal (CLKOUT)
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LVTTL Interfaces Are 5-V Tolerant
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Medium-Drive GTLP Outputs (50 mA)
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LVTTL Outputs (–24 mA/24 mA)
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GTLP Rise and Fall Times Designed for
Optimal Data-Transfer Rate and Signal
Integrity in Distributed Loads
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Ioff, Power-Up 3-State, and BIAS VCC
Support Live Insertion
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Bus Hold on A-Port Data Inputs
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Distributed VCC and GND Pins Minimize
High-Speed Switching Noise
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Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
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ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
description
The SN74GTLPH16916 is a medium-drive, 17-bit UBT transceiver that provides LVTTL-to-GTLP and
GTLP-to-LVTTL signal-level translation. It allows for transparent, latched, clocked, and clock-enabled modes
of data transfer . Additionally, it provides for a copy of CLKAB at GTLP signal levels (CLKOUT) and conversion
of a GTLP clock to LVTTL logic levels (CLKIN). The device provides a high-speed interface between cards
operating at LVTTL logic levels and a backplane operating at GTLP signal levels. High-speed (about three times
faster than standard TTL or LVTTL) backplane operation is a direct result of GTLP’s reduced output swing
(<1 V), reduced input threshold levels, improved differential input, OECcircuitry, and TI-OPC circuitry.
Improved GTLP OEC and TI-OPC circuits minimize bus-settling time and have been designed and tested using
several backplane models. The medium drive allows incident-wave switching in heavily loaded backplanes with
equivalent load impedance down to 19 Ω.
Copyright 2002, Texas Instruments Incorporated
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
OEC, TI-OPC, UBT, and Widebus are trademarks of Texas Instruments.
DGG OR DGV PACKAGE
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OEAB
LEAB
A1
GND
A2
A3
VCC
A4
A5
A6
GND
A7
A8
A9
A10
A11
A12
GND
A13
A14
A15
VCC
A16
A17
GND
CLKIN
OEBA
LEBA
CEAB
CLKAB
B1
GND
B2
B3
BIAS VCC
B4
B5
B6
GND
B7
B8
B9
B10
B11
B12
GND
B13
B14
B15
VREF
B16
B17
GND
CLKOUT
CLKBA
CEBA
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.