©2000 Integrated Device Technology, Inc.
MAY 2000
DSC 3592/7
1
HIGH-SPEED
64K x 16 BANK-SWITCHABLE
DUAL-PORTED SRAM WITH
EXTERNAL BANK SELECTS
Features
64K x 16 Bank-Switchable Dual-Ported SRAM Architecture
Four independent 16K x 16 banks
1 Megabit of memory on chip
Fast asynchronous address-to-data access time: 15ns
User-controlled input pins included for bank selects
Independent port controls with asynchronous address &
data busses
Four 16-bit mailboxes available to each port for inter-
IDT707288S/L
NOTES:
1. The first six address pins for each port serve dual functions. When MBSEL = VIH, the pins serve as memory address inputs. When MBSEL = VIL, the pins
serve as mailbox address inputs.
2. Each bank has an input pin assigned that allows the user to toggle the assignment of that bank between the two ports. Refer to Truth Table I for
more details.
Functional Block Diagram
processor communications; interrupt option
Interrupt flags with programmable masking
Dual Chip Enables allow for depth expansion without
external logic
UB and LB are available for x8 or x16 bus matching
TTL-compatible, single 5V (±10%) power supply
Available in a 100-pin Thin Quad Flatpack (14mm x 14mm)
16Kx16
MEMORY
ARRAY
(BANK 3)
MUX
MUX
R/WL
CE0L
CE1L
UBL
LBL
OEL
I/O8L-15L
I/O0L-7L
A13L
A0L(1)
A5L(1)
A0L(1)
LBL/UBL
OEL
R/WL
CEL
MAILBOX
INTERRUPT
LOGIC
16Kx16
MEMORY
ARRAY
(BANK 1)
MUX
MUX
16Kx16
MEMORY
ARRAY
(BANK 0)
MUX
MUX
CONTROL
LOGIC
I/O
CONTROL
BANK
DECODE
ADDRESS
DECODE
R/WR
CE0R
CE1R
UBR
LBR
OER
I/O8R-15R
I/O0R-7R
A13R
A0R(1)
CONTROL
LOGIC
I/O
CONTROL
BANK
DECODE
ADDRESS
DECODE
A5R(1)
A0R(1)
LBR/UBR
OER
R/WR
CER
3592 drw 01
MBSELR
INTR
MBSELL
INTL
BKSEL3(2)
BKSEL0(2) BANK
SELECT
BA1R
BA0R
BA1L
BA0L
6.42
IDT707288S/L
High-Speed 64K x 16 Dual-Port Static RAM Industrial and Commercial Temperature Ranges
2
Description
The IDT707288 is a high-speed 64K x 16 (1M bit) Bank-Switchable
Dual-Ported SRAM organized into four independent 16K x 16 banks. The
device has two independent ports with separate control, address, and
I/O pins for each port, allowing each port to asynchronously access
any 16K x 16 memory block not already accessed by the other port.
Accesses by the ports into specific banks are controlled via bank select pin
inputs under the user's control. Mailboxes are provided to allow inter-
processor communication. Interrupts are provided to indicate mailbox
writes have occurred. An automatic power down feature controlled by
the chip enables (CE0 and CE1) permits the on-chip circuitry of each port
to enter a very low standby power mode and allows fast depth expansion.
The IDT707288 offers a maximum address-to-data access time as fast
as 15ns, and is packaged in a 100-pin Thin Quad Flatpack (TQFP).
Functionality
The IDT707288 is a high-speed asynchronous 64K x 16 Bank-
Switchable Dual-Ported SRAM, organized in four 16K x 16 banks. The
two ports are permitted independent, simultaneous access into separate
banks within the shared array. There are four user-controlled Bank Select
input pins, and each of these pins is associated with a specific bank within
the memory array. Access to a specific bank is gained by placing the
associated Bank Select pin in the appropriate state: VIH assigns the bank
to the left port, and VIL assigns the bank to the right port (See Truth Table
IV). Once a bank is assigned to a particular port, the port has full access
to read and write within that bank. Each port can be assigned as many
banks within the array as needed, up to and including all four banks.
The IDT707288 provides mailboxes to allow inter-processor commu-
nication. Each port has four 16-bit mailbox registers available to which it
can write and read and which the opposite port can read only. These
mailboxes are external to the common SRAM array, and are accessed
by setting MBSEL = VIL while setting CE = VIH. Each mailbox has an
associated interrupt: a port can generate an interrupt to the opposite port
by writing to the upper byte of any one of its four 16-bit mailboxes. The
interrupted port can clear the interrupt by reading the upper byte. This read
will not alter the contents of the mailbox.
If desired, any source of interrupt can be independently masked via
software. Two registers are provided to permit interpretation of interrupts:
the Interrupt Cause Register and the Interrupt Status Register. The
Interrupt Cause Register gives the user a snapshot of what has caused
the interrupt to be generated - the specific mailbox written to. The
information in this register provides post-mask signals: interrupt sources
that have been masked will not be updated. The Interrupt Status Register
gives the user the status of all bits that could potentially cause an interrupt
regardless of whether they have been masked. Truth Table V gives a
detailed explanation of the use of these registers.
6.42
IDT707288S/L
High-Speed 64K x 16 Dual-Port Static RAM Industrial and Commercial Temperature Ranges
3
INDEX
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
10099 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76
IDT707288PF
PN100-1(4)
100-Pin TQFP
Top View(5)
GND
OER
R/WR
MBSELR
CE1R
CE0R
BKSEL3
NC
GND
A9R
A10R
A8R
A7R
A6R
A11R
I/O10R
I/O11R
I/O12R
I/O13R
I/O14R
I/O15R
GND
UBR
LBR
3592 drw 02
I/O15L
GND
OEL
R/WL
MBSELL
CE1L
CE0L
Vcc
BKSEL0
A11L
A10L
NC
A9L
A8L
A7L
A6L
I/O10L
I/O11L
I/O12L
I/O13L
I/O14L
UBL
LBL
GND
I/O5R
I/O4R
I/O3R
I/O2R
I/O0R
I/O0L
GND
I/O2L
I/O4L
I/O5L
I/O6L
I/O7L
I/O3L
I/O1R
I/O7R
I/O8R
I/O9R
I/O8L
I/O9L
I/O6R
A4R
A5L
A4L
A3R
A0R
A12R
INTR
INTL
BKSEL1
A3L
A5R
GND
Vcc
I/O1L
Vcc
GND
A13R
NC
BA0R
BA1R
A1R
A2R
BKSEL2
GND
NC
A0L
A12L
BA0L
BA1L
A1L
A2L
A13L
,
Pin Names
NOTES:
1. All VCC pins must be connected to power supply.
2. All GND pins must be connected to ground supply.
3. Package body is approximately 14mm x 14mm x 1.4mm.
4. This package code is used to reference the package diagram.
5. This text does not indicate orientation of the actual part-marking.
NOTES:
1. Duplicated per port.
2. Each bank has an input pin assigned that allows the user to toggle the assignment
of that bank between the two ports. Refer to Truth Table IV for more details. When
changing the bank assignments, accesses of the affected banks must be
suspended. Accesses may continue uninterrupted in banks that are not being
reallocted.
3. Generated upon mailbox access.
4. All Vcc pins must be connected to power supply.
5. All GND pins must be connected to ground supply.
6. The first six address pins (A0-A5) for each port serve dual functions. When MBSEL
= VIH, the pins serve as memory address inputs. When MBSEL = VIL, the pins
serve as mailbox address inputs (A6-A13 are ignored).
Pin Configurations(1,2,3)
A0 - A13(1,6) Address Inputs
BA0 - BA1(1) B ank Ad d re s s Inp uts
MBSEL(1) Mailb ox Ac ce ss Co ntrol Gate
BKSEL0-3(2) B ank Se le ct Inp uts
R/W(1) Re ad/Write Enab le
OE(1) Output Enab le
CE
0, CE
1(1) Chip Enables
UB
, LB(1) I/ O B yte E nab l e s
I/O0 - I/O15(1) B i di re c tio nal Data Inp ut/ Outp ut
INT(1) Interrup t F lag (Output)(3)
VCC(4) +5VPower
GND(5) Ground
3 592 t bl 01
6.42
IDT707288S/L
High-Speed 64K x 16 Dual-Port Static RAM Industrial and Commercial Temperature Ranges
4
Truth Table III Mailbox Read/Write Control(1)
NOTES:
1. Chip Enable references are shown above with the actual CE0 and CE1 levels; CE is a reference only.
2. Port "A" and "B" references are located where CE is used.
3 . "H" = VIH and "L" = VIL.
4. CE and MBSEL cannot both be active at the same time.
Truth Table I Chip Enable(1,2,3,4)
Truth Table II Non-Contention Read/Write Control
NOTES:
1. BA0L - BA1L BA0R - BA1R: cannot access same bank simultaneously from both ports.
2. Refer to Truth Table I.
3. CE and MBSEL cannot both be active at the same time.
NOTES:
1. There are four mailbox locations per port written to and read from all the I/O's (I/O0-I/O15). These four mailboxes are addressed by A0-A5. Refer to Truth Table V.
2. Refer to Truth Table I.
3. Each mailbox location contains a 16-bit word, controllable in bytes by setting input levels to UB and LB appropriately.
CE CE0CE1Mode
LVIL VIH Port Se le cted (TTL Active)
< 0.2V >VCC -0.2V Po rt Se lec te d (CMOS Activ e)
H
VIH X Port Deselected (TTL Inactive)
XV
IL Port Deselected (TTL Inactive)
>VCC -0.2V X Po rt Des ele cte d (CMOS Inactiv e)
X<0.2V Port Deselected (CMOS Inactive)
3 592 t b l 02
Inputs(1) Outputs
Mode
CE(2) R/WOE UB LB MBSEL I/O8-15 I/O0-7
H X X X X H Hig h-Z Hig h-Z De se lcte d : P o wer-Do wn
X(3) XXHH X
(3) Hi g h-Z Hig h-Z B o th B yte s De s e le c te d
LLXLHHDATA
IN High-Z Write to Upper Byte Only
L L X H L H High-Z DATAIN Wri te to Lo we r B y te O nly
LLXLLHDATA
IN DATAIN Write to B o th By te s
LHLLHHDATA
OUT High-Z Read Upper Byte Only
LHLHLHHigh-ZDATA
OUT Re ad Lo we r By te Only
LHLLLHDATA
OUT DATAOUT Re ad B o th B yte s
X(3) XHXX X
(3) High-Z High-Z Outputs Disabled
3 5 92 tbl 03
Inputs Outputs
Mode
CE(2) R/WOE UB LB MBSEL I/O8-15 I/O0-7
HHL X
(3) X(3) LDATA
OUT DATAOUT Read Data from Mailbox, cle ars interrup t
HHLLLLDATA
OUT DATAOUT Read Data from Mailbox, cle ars interrup t
HLX L
(3) L(3) LDATA
IN DATAIN Write Data into Mailb ox
LXXXXL ____ ____ No t All owe d
3592 tbl 04
6.42
IDT707288S/L
High-Speed 64K x 16 Dual-Port Static RAM Industrial and Commercial Temperature Ranges
5
Absolute Maximum Ratings(1)
DC Electrical Characteristics Over the Operating
Temperature and Supply Voltage Range (V CC = 5.0V ± 10%)
Capacitance(1)
(TA = +25°C, f = 1.0mhz) TQFP Package
Recommended DC Operating
Conditions
Maximum Operating Temperature
and Supply Voltage(1)
NOTES:
1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may
cause permanent damage to the device. This is a stress rating only and
functional operation of the device at these or any other conditions above those
indicated in the operational sections of this specification is not implied. Exposure
to absolute maximum rating conditions for extended periods may affect
reliability.
2. VTERM must not exceed Vcc + 10% for more than 25% of the cycle time or 10ns
maximum, and is limited to < 20mA for the period of VTERM > Vcc + 10%.
NOTES:
1. VIL > -1.5V for pulse width less than 10ns.
2. VTERM must not exceed Vcc + 10%.
NOTES:
1. This parameter is determined by device characterization but is not production
tested.
2 . 3dV represents the interpolated capacitance when the input and output signals
switch from 0V to 3V or from 3V to 0V.
3. COUT represents CI/O as well.
NOTE:
1. At Vcc < 2.0V, input leakages are undefined.
NOTES:
1. This is the parameter TA. This is the "instant on" case temperature.
Symbol Rating Commercial
& Industrial Unit
VTERM(2) Te rminal Voltage
wi th Re s p e ct
to GND
-0.5 to +7.0 V
TBIAS Temperature
Under Bias -55 to +125 oC
TSTG Storage
Temperature -65 to +150 oC
IOUT DC Outp ut
Current 50 mA
3592 tbl 05
Grade Ambient
Temperature GND Vcc
Commercial 0OC to + 70OC0V5.0V
+ 10%
Industrial -40OC to + 85OC0V 5.0V
+ 10%
3 592 t bl 06
Symbol Parameter Min. Typ. Max. Unit
VCC Supply Voltage 4.5 5.0 5.5 V
GND Ground 0 0 0 V
VIH Inp ut Hig h Vo l tag e 2. 2 ____ 6.0(2) V
VIL Inp ut Lo w Vo l tag e -0. 5(1) ____ 0.8 V
3592 tbl 07
Symbol Parameter Conditions(2) Max. Unit
CIN Inp ut Cap ac itanc e V IN = 3dV 9 pF
COUT(3) Outp ut Capac i tanc e V OUT = 3dV 10 pF
3592 tbl 08
Symbol Parameter Test Conditions
707288S 707288L
UnitMin. Max. Min. Max.
|ILI| Input Leak age Curre nt(1) VCC = 5.5V, VIN = 0V to VCC ___ 10 ___ A
|ILO| Output Leakage Current CE = VIH, MBSEL = VIH, VOUT = 0V to VCC ___ 10 ___ A
VOL Output Lo w Vo ltage IOL = +4mA ___ 0.4 ___ 0.4 V
VOH Output Hig h Voltag e IOH = -4mA 2.4 ___ 2.4 ___ V
3592 t bl 0 9
6.42
IDT707288S/L
High-Speed 64K x 16 Dual-Port Static RAM Industrial and Commercial Temperature Ranges
6
DC Electrical Characteristics Over the Operating
Temperature and Supply Voltage Range(1,6) (VCC = 5.0V ± 10%)
NOTES:
1. 'X' in part numbers indicates power rating (S or L).
2. VCC = 5V, TA = +25°C, and are not production tested. ICCDC = 120mA (Typ.)
3. At f = fMAX, address and control lines (except Output Enable) are cycling at the maximum frequency read cycle of 1/ tRC, and using “AC Test Conditions” of input
levels of GND to 3V.
4. f = 0 means no address or control lines change.
5 . Port "A" may be either left or right port. Port "B" is the opposite from port "A".
6. Refer to Truth Table I.
707288X15
Com'l Only 707288X20
Com'l & Ind 707288X25
Com'l & Ind
S ym bol P arameter Test Condi tion V ersi on Typ. (2) Max. Typ.(2) Max. Typ.(2) Max. Unit
ICC Dynamic Op erating Curre nt
(Bo th Po rts Activ e) CE = VIL, Outputs Disabled
MBSEL = VIH
f = fMAX(3)
COM'L S
L220
220 350
300 200
200 340
290 190
190 330
280 mA
IND S
L____
____
____
____ 250
250 370
320 240
240 360
310
ISB1 Stand by Current
(Bo th Po rts - TTL Le ve l
Inputs)
CEL = CER = VIH
MBSELR = MBSELL = VIH
f = fMAX(3)
COM'L S
L50
50 90
65 45
45 90
65 40
40 90
65 mA
IND S
L____
____
____
____ 45
45 100
75 40
40 100
75
ISB2 Stand by Current
(One Port - TTL Leve l Inputs ) CE"A" = VIL and CE"B" = VIH(5)
Active Po rt Outputs Disable d,
f=fMAX(3)
MBSELR = MBSELL = VIH
COM'L S
L130
130 230
200 120
120 215
185 110
110 200
170 mA
IND S
L____
____
____
____ 140
140 235
205 130
130 220
190
ISB3 Full Standby Current (Both
P orts - A ll CMOS Le ve l
Inputs)
Bo th Ports CEL and
CER > VCC - 0. 2V
VIN > VCC - 0.2V o r
VIN < 0. 2 V, f = 0(4)
MBSELR = MBSELL > VCC - 0. 2V
COM'L S
L1.5
1.5 15
51.5
1.5 15
51.5
1.5 15
5mA
IND S
L____
____
____
____ 1.5
1.5 30
10 1.5
1.5 30
10
ISB4 Full Stand by Current
(One Port - All CMOS Le ve l
Inputs)
CE"A" < 0. 2V and
CE"B" > VCC - 0. 2V(5)
MBSELR = MBSELL > VCC - 0. 2V
VIN > VCC - 0.2V or V IN < 0.2V
Active Port Outputs Disabled
f = fMAX(3)
COM'L S
L145
145 230
195 135
135 210
180 130
130 200
170 mA
IND S
L____
____
____
____ 135
135 230
200 130
130 220
190
3592 tbl 10
6.42
IDT707288S/L
High-Speed 64K x 16 Dual-Port Static RAM Industrial and Commercial Temperature Ranges
7
AC Test Conditions
Figure 1. AC Output Test Load
Figure 3. Lumped Capacitance Load Typical Derating Curve
AC Electrical Characteristics Over the
Operating Temperature and Supply Voltage Range(4)
NOTES:
1. Transition is measured 0mV from Low or High-impedance voltage with Output Test Load (Figure 2).
2. This parameter is guaranteed by device characterization, but is not production tested.
3. To access RAM, CE = VIL and MBSEL = VIH. To access mailbox, CE = VIH and MBSEL = VIL.
4. 'X' in part numbers indicates power rating (S or L).
5. Refer to Truth Table I.
Inp ut P ul se Le v e ls
Input Ris e/Fall Time s
Inp ut Ti mi ng Re fere nc e Le v el s
Output Re ference Levels
Outp ut Lo ad
GND to 3.0V
3ns Max .
1.5V
1.5V
Figures 1,2 and 3
3592 tbl 11 3592 drw 04
893
30pF
347
5V
DATAOUT
INT
893
5pF*
347
5V
DATAOUT
ÆtACE/tAA
(Typical, ns)
3592 drw 05
1
2
3
4
5
6
7
8
20 40 10060 80 120 140 160 180 200
Capacitance (pF)
-1
0
- 10pF is the I/O capacitance
of this device, and 30pF is the
AC Test Load Capacitance
,
707288X15
Com'l Only 707288X20
Com 'l & I nd 707288X25
Com 'l & I nd
UnitSymbol Parameter Min.Max.Min.Max.Min.Max.
READ CYCLE
tRC Re ad Cyc le Time 15 ____ 20 ____ 25 ____ ns
tAA Address Access Time ____ 15 ____ 20 ____ 25 ns
tACE Chip Enable Acces s Time(3) ____ 15 ____ 20 ____ 25 ns
tABE Byte Enable Access Time(3) ____ 15 ____ 20 ____ 25 ns
tAOE Outp ut Enable Acce ss Time ____ 9____ 10 ____ 11 ns
tOH Output Hold from Address Change 3 ____ 3____ 3____ ns
tLZ Output Low-Z Time (1,2) 0____ 0____ 0____ ns
tHZ Output Hig h-Z Time (1,2) ____ 8____ 9____ 10 ns
tPU Ch ip Enab le to Po we r Up Time (2,5) 0____ 0____ 0____ ns
tPD Chip Dis ab le to P owe r Down Time (2,5) ____ 15 ____ 20 ____ 25 ns
tMOP Mailbox Flag Update Pulse (OE or MBSEL)10
____ 10 ____ 10 ____ ns
tMAA Mailbox Address Access Time ____ 15 ____ 20 ____ 25 ns
3592 tbl 12
Figure 2. Output Test Load
(for tLZ, tHZ, tWZ, tOW)
*Including scope and jig.
6.42
IDT707288S/L
High-Speed 64K x 16 Dual-Port Static RAM Industrial and Commercial Temperature Ranges
8
NOTES:
1. Bank 0 refers to the first 16Kx16 memory spaces, Bank 1 to the second 16Kx16
memory spaces, Bank 2 to the third 16Kx16 memory spaces, and Bank 3
to the fourth 16Kx16 memory spaces. 'LEFT' indicates the bank is assigned
to the left port; 'RIGHT' indicates the bank is assigned to the right port. 0-4 banks
may be assigned to either port.
2 . The bank select pin inputs must be set at either VIH or VIL - these inputs are not
tri-statable. When changing the bank assignments, accesses of the affected
banks must be suspended. Accesses may continue uninterrupted in banks that
are not beign reallocated.
3. 'H' = VIH, 'L' = VIL, 'X' = Don't Care.
Assigning the Banks via the
External Bank Selects
There are four bank select pins available on the IDT707288, and each
of these pins is associated with a specific bank within the memory array.
The pins are user-controlled inputs: access to a specific bank is assigned
to a particular port by setting the input to the appropriate level. The process
of assigning the banks is detailed in Truth Table IV. Once a bank is assigned
to a port, the owning port has full access to read and write within that bank.
The opposite port is unable to access that bank until the user reassigns the
port. Access by a port to a bank which it does not control will have no effect
Truth Table IV Memory Bank
Assignment (CE = VIH)(2,3)
Mailbox Interrupts and Interrupt
Control Registers
If the user chooses the mailbox interrupt function, four mailbox locations
are assigned to each port. These mailbox locations are external to the
memory array. The mailboxes are accessed by setting MBSEL = VIL
while holding CE = VIH.
The mailboxes are 16 bits wide and controllable by byte: the message
is user-defined since these are addressable SRAM locations. An interrupt
is generated to the opposite port upon writing to the upper byte of any
mailbox location. A port can read the message it has just written in order
to verify it: this read will not alter the status of the interrupt sent to the opposite
port. The interrupted port can clear the interrupt by reading the upper byte
of the applicable mailbox. This read will not alter the contents of the mailbox.
The use of mailboxes to generate interrupts to the opposite port and the
reading of mailboxes to clear interrupts is detailed in Truth Table V.
If desired, any of the mailbox interrupts can be independently masked
via software. Masking of the interrupt sources is done in the Mask Register.
The masks are individual and independent: a port can mask any
combination of interrupt sources with no effect on the other sources. Each
port can modify only its own Mask Register. The use of this register is
detailed in Truth Table V.
Two registers are provided to permit interpretation of interrupts: these
are the Interrupt Cause Register and the Interrupt Status Register. The
Interrupt Cause Register gives the user a snapshot of what has caused
the interrupt to be generated - the specific mailbox written to by the opposite
port. The information in this register provides post-mask signals: interrupt
sources that have been masked will not be updated. The Interrupt Status
Register gives the user the status of all bits that could potentially cause an
interrupt regardless of whether they have been masked. The use of the
Interrupt Cause Register and the Interrupt Status Register is detailed in
Truth Table V.
if written, and if read unknown values on D0-D15 will be returned. Each
port can be assigned as many banks within the array as needed, up to
and including all four banks.
The bank select pin inputs must be set at either VIH or VIL - these inputs
are not tri-statable. When changing the bankassignments, accesses of the
affected banks must be suspended. Accesses may continue uninterrupted
in banks that are not being reallocated.
BKSEL0 BKSEL1 BKSEL2 BKSEL3 BANK AND
DIRECTION(1)
HX X XBANK 0 LEFT
XHXXBANK 1 LEFT
XXHXBANK 2 LEFT
XXXHBANK 3 LEFT
L X X X BANK 0 RIGHT
X L X X BANK 1 RIGHT
X X L X BANK 2 RIGHT
X X X L BANK 3 RIGHT
3592 tbl 13
6.42
IDT707288S/L
High-Speed 64K x 16 Dual-Port Static RAM Industrial and Commercial Temperature Ranges
9
Truth Table V Mailbox Interrupts (CE = VIH)(8,9)
NOTES:
1. There are four independent mailbox locations available to each side, external to the standard memory array. The mailboxes can be written to in either 8-bit or
16-bit widths. The upper byte of each mailbox has an associated interrupt to the opposite port. The mailbox interrupts can be individually masked if desired,
and the status of the interrupt determined by polling the Interrupt Status Register (see Note 6 for this table). A port can read its own mailboxes to verify the data
written, without affecting the interrupt which is sent to the opposite port.
2. These registers allow a port to read the data written to a specific mailbox location by the opposite port. Reading the upper byte of the data in a particular
mailbox clears the interrupt associated with that mailbox without modifying the data written. Once the address and R/W are stable, the actual clearing of the
interrupt is triggered by the transition of MBSEL from VIH to VIL.
3. This register contains the Mask Register (bits D0-D3), the Interrupt Cause Register (bits D4-D7), and the Interrupt Status Register (bits D8-D11). The controls for
R/W, UB, and LB are manipulated in accordance with the appropriate function. See Notes 4, 5, and 6 for this table. Bits D12-D15 are "Don't Care".
4. This register, the Mask Register, allows the user to independently mask the various interrupt sources. Writing VIH to the appropriate bit (D0 = Mailbox 0, D1 =
Mailbox 1, D2 = Mailbox 2, and D3 = Mailbox 3) disables the interrupt, while writing VIL enables the interrupt. All four bits in this register must be written at the
same time. This register can be read at any time to verify the mask settings. The masks are individual and independent: any single interrupt source can be
masked with no effect on the other sources. Each port can modify only its own mask settings.
5. This register, the Interrupt Cause Register, gives the user a snapshot of what has caused the interrupt to be generated. Reading VOL for a specific bit (D4 =
Mailbox 0, D5 = Mailbox 1, D6 = Mailbox 2, and D7 = Mailbox 3) indicates that the associated interrupt source has generated an interrupt. Acknowledging the
interrupt clears the bit in this register (see Note 2 for this table). This register provides post-mask information: if the interrupt source has been masked, the
associated bit in this register will not update.
6. This register, the Interrupt Status Register, gives the user the status of all interrupt sources that could potentially cause an interrupt regardless of whether they
have been masked. Reading VOL for a specific bit (D8 = Mailbox 0, D9 = Mailbox 1, D10 = Mailbox 2, and D11 = Mailbox 3) indicates that the associated
interrupt source has generated an interrupt. Acknowledging the interrupt clears the associated bit in this register (see Note 2 for this table). This register provides
pre-mask information: regardless of whether an interrupt source has been masked, the associated bit in this register will update.
7. Access to registers defined as "RESERVED" will have no effect, if written, and if read unknown values on D0-D15 will be returned.
8. These registers are not guaranteed to initialize in any known state. At power-up, the initialization sequence should include the set-up of these registers.
9. 'L' = VIL or VOL, 'H' = VIH or VOH, 'X' = Don't Care.
MB
SEL R/WUB LB A5 A4 A3 A2 A1 A0 D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 D10 D11 D12 D13 D14 D15 DES CRIP TI ON
L X X X L L L L L L RESERVED (7) RESERVED (7)
LXXX
RESERVED (7) RESERVED (7)
L(1)(1)(1)HLLLLLXXXXXXXXXXXXXXXX MAILBOX 0 - SET INTERRUP T ON OP POS ITE P ORT
L(1)(1)(1)HLLLLHXXXXXXXXXXXX XXXX MAILBOX 1 - SET INTERRUP T ON OP P OS ITE PORT
L(1)(1)(1)HLLLHLXXXXXXXXXXXX XXXX MAILBOX 2 - SET INTERRUP T ON OP POS ITE P ORT
L(1)(1)(1)HLLLHHXXXXXXXXXXXX XXXX MAILBOX 3 - SET INTERRUP T ON OP POS ITE P ORT
H(2)(2)HLLHLLXXXXXXXXXXXXXXXX MAILBOX 0 - CLEAR OPPOSITE PORT INTERRUPT
H(2)(2)HLLHLHXXXXXXXXXXXX XXXX MAILBOX 1 - CLEAR OPPOSITE PORT INTERRUPT
H(2)(2)HLLHHLXXXXXXXXXXXX XXXX MAILBOX 2 - CLEAR OPPOSITE PORT INTERRUPT
H(2)(2)HLLHHHXXXXXXXXXXXX XXXX MAILBOX 3 - CLEAR OPPOSITE PORT INTERRUPT
L(3)(3)(3)HLHLLL(4)(4)(4)(4)(5)(5)(5)(5)(6)(6)(6)(6)XXXX MAILBOX INTERRUP T CONTROL S
LXXX
RESERVED (7) RESERVED (7)
L X X X H H H H H H RESERVED (7) RESERVED (7)
3592 tbl 14
6.42
IDT707288S/L
High-Speed 64K x 16 Dual-Port Static RAM Industrial and Commercial Temperature Ranges
10
tRC
R/W
CE
ADDR
tAA
OE
UB,LB
3592 drw 06
(3)
tACE (3)
tAOE(3)
tABE (3)
(1)
tLZ tOH
(2)
tHZ
DATAOUT VALID DATA(3)
(5)
Waveform of Read Cycles(4)
Timing of Power-Up Power-Down
NOTES:
1. Timing depends on which signal is asserted last, CE, OE, LB, or UB.
2. Timing depends on which signal is de-asserted first CE, OE, LB, or UB.
3. Start of valid data depends on which timing becomes effective last: tAOE, tACE, tABE or tAA.
4. MBSEL = VIH.
5. Refer to Truth Table I.
CE
3592 drw 07
tPU
ICC
ISB
tPD
50% 50%
(5)
,
6.42
IDT707288S/L
High-Speed 64K x 16 Dual-Port Static RAM Industrial and Commercial Temperature Ranges
11
NOTES:
1. Transition is measured 0mV from Low or High-impedance voltage with Output Test Load (Figure 2).
2. This parameter is guaranteed by device characterization, but is not production tested.
3. To access RAM, CE = VIL and MBSEL = VIH. To access mailbox, CE = VIH and MBSEL = VIL. Either condition must be valid for the entire tEW time.
Refer to Truth Tables I and III.
4 . The specification for tDH must be met by the device supplying write data to the RAM under all operating conditions. Although tDH and t OW values will vary over voltage
and temperature, the actual tDH will always be smaller than the actual tOW.
5. 'X' in part numbers indicates power rating (S or L).
AC Electrical Characteristics Over the
Operating Temperature and Supply Voltage(5)
Symbol Parameter
707288X15
Com'l Only 707288X20
Com' l & I nd 707288X25
Com' l & I nd
UnitMin. Max. Min. Max. Min. Max.
WRI TE CYCLE
tWC Write Cycle Time 15 ____ 20 ____ 25 ____ ns
tEW Chip Enable to End-of-Write(3) 12 ____ 15 ____ 20 ____ ns
tAW Address Valid to End-of-Write 12 ____ 15 ____ 20 ____ ns
tAS Address Set-up Time(3) 0____ 0____ 0____ ns
tBS B ank Se t-up Time 0 ____ 0____ 0____ ns
tWP Write Pulse Width 12 ____ 15 ____ 20 ____ ns
tWR Write Re c o ve ry Tim e 0 ____ 0____ 0____ ns
tDW Data Valid to End-of-Write 15 ____ 15 ____ 20 ____ ns
tHZ Output Hig h-Z Time (1,2) ____ 8____ 9____ 10 ns
tDH Data Ho ld Time (4) 0____ 0____ 0____ ns
tWZ Write Enab le to Outp ut in Hi gh-Z(1,2) ____ 8____ 9____ 10 ns
tOW Outp ut A cti ve fro m En d -o f-Write(1,2,4) 3____ 3____ 3____ ns
tMWRD Mailbox Write to Read Time 5 ____ 5____ 5____ ns
3592 tbl 15
6.42
IDT707288S/L
High-Speed 64K x 16 Dual-Port Static RAM Industrial and Commercial Temperature Ranges
12
Timing Waveform of Write Cycle No. 1, R/W Controlled Timing(1,5,8)
NOTES:
1. R/W or CE or UB and LB = VIH during all address transitions.
2. A write occurs during the overlap (tEW or tWP) of a CE = VIL and a R/W = VIL for memory array writing cycle.
3. tWR is measured from the earlier of CE or R/W (or MBSEL or R/W) going to VIH to the end of write cycle.
4. During this period, the I/O pins are in the output state and input signals must not be applied.
5. If the CE or MBSEL = VIL transition occurs simultaneously with or after the R/W = VIL transition, the outputs remain in the High-impedance state.
6. Timing depends on which enable signal is asserted last, CE or R/W.
7 . This parameter is guaranteed by device characterization, but is not production tested. Transition is measured 0mV from steady state with the Output Test Load (Figure
2).
8. If OE = VIL during R/W controlled write cycle, the write pulse width must be the larger of tWP or (tWZ + tDW) to allow the I/O drivers to turn off and data to be placed
on the bus for the required tDW. If OE = VIH during an R/W controlled write cycle, this requirement does not apply and the write pulse can be as short as the specified
tWP.
9. To access RAM, CE = VIL and MBSEL = VIH. To access mailboxes, CE = VIH and MBSEL = VIL. tEW must be met for either condition.
10. Refer to Truth Table I.
Timing Waveform of Write Cycle No. 2, CE, UB, LB Controlled Timing(1,5)
R/W
tWC
tHZ
tAW
tWR
tAS tWP
DATAOUT
(2)
tWZ
tDW tDH
tOW
OE
ADDRESS
DATAIN
(6)
(4)
(7)
UB or LB
3592 drw 08
(9)
CE or
MBSEL
(9,10)
(7)
(3)
tLZ
VALID(4)
3592 drw 09
tWC
tAS tWR
tDW tDH
ADDRESS
DATAIN
R/W
tAW
tEW
UB or LB
(3)
(2)
(6)
CE or MBSEL(9,10)
(9)
6.42
IDT707288S/L
High-Speed 64K x 16 Dual-Port Static RAM Industrial and Commercial Temperature Ranges
13
Timing Waveform of Mailbox Read after Write Timing, Either Side(1,2)
NOTES:
1. CE = VIH for the duration of the above timing (both write and read cycle), refer to Truth Table I.
2. UB and LB are controlled as necessary to enable the desired byte accesses.
Timing Waveform of Left Port Write to right Port Read of Same Data(1,2,3)
NOTES:
1. UB and LB are controlled as necessary to enable the desired byte accesses.
2 . Timing for Right Port Write to Left Port Read is identical.
3 . Refer to Truth Table I and IV.
BKSEL0-3
3592 drw 10
tWC
I/O0L-15L
ADDRESSES MATCH
R/WL
DATAIN
VALID
DATAOUT
VALID
Read Cycle
Write Cycle
CEL
A0L-13L
and A0R-13R
CER
I/O0R-15R
R/WR
OER
tAS tWP
tAWtEW
tDW tDH
tWR
tBS
tLZ
tACE
tHZ
tOH
,
MBSEL
3592 drw 11
tAW tEW
tMOP
I/O0-15
VALID ADDRESS
tMAA
R/W
tWR
tOH
tACE
VALID ADDRESS
DATAIN
VALID DATAOUT
VALID
tDW
tWP tDH
tAS
tMWRD tAOE
Read CycleWrite Cycle
A0-A5
OE
6.42
IDT707288S/L
High-Speed 64K x 16 Dual-Port Static RAM Industrial and Commercial Temperature Ranges
14
Waveform of Interrupt Timing(1,5)
NOTES:
1. All timing is the same for left and right ports. Port A may be either the left or right port. Port B is the port opposite from port A.
2. See Interrupt Truth Table V.
3. Timing depends on which enable signal (CE or R/W) is asserted last.
4. Timing depends on which enable signal (CE or R/W) is de-asserted first.
5. Refer to Truth Table I.
NOTES:
1. 'X' in part numbers indicates power rating (S or L).
AC Electrical Characteristics Over the
Operating Temperature and Supply Voltage Range(1)
707288X15
Com'l Only 707288X20
Com'l & Ind 707288X25
Com'l & Ind
Symbol Parameter Min.Max.Min.Max.Min.Max.Unit
INTE RRUPT TIMI NG
tAS Address Set-up Time 0 ____ 0____ 0____ ns
tWR Write Recovery Time 0 ____ 0____ 0____ ns
tINS Inte rrup t S e t Tim e ____ 15 ____ 20 ____ 25 ns
tINR Inte rrup t Re s e t Tim e ____ 15 ____ 20 ____ 25 ns
3 592 t bl 16
3592 drw 12
ADDR"A" MAILBOX SET ADDRESS
MBSEL"A"
R/W"A"
tAS
tWC
tWR
(3) (4)
tINS(3)
INT"B"
(2)
3592 drw 13
ADDR"B" MAILBOX CLEAR ADDRESS
MBSEL"B"
OE"B"
tAS
tRC
(3)
tINR(3)
INT"B"
(2)
6.42
IDT707288S/L
High-Speed 64K x 16 Dual-Port Static RAM Industrial and Commercial Temperature Ranges
15
3592 drw 14
IDT707288
Bank-Switchable
SRAM
CE0
CE1
CE1
CE0
CE0
CE1
A14(1)
CE1
CE0
VCC VCC
IDT707288
Bank-Switchable
SRAM
IDT707288
Bank-Switchable
SRAM
IDT707288
Bank-Switchable
SRAM
Control Inputs
Control Inputs
Control Inputs
Control Inputs BKSEL0-3
R/W
LB,UB
OE
Depth and Width Expansion
The IDT707288 features dual chip enables (refer to Truth Table I) in
order to facilitate rapid and simple depth expansion with no requirements
for external logic. Figure 4 illustrates how to control the various chip
enables in order to expand two devices in depth.
The IDT707288 can also be used in applications requiring expanded
Figure 4. Depth and Width Expansion with IDT707288
width, as indicated in Figure 4. Since the banks are allocated at the
discretion of the user, the external controller can be set up to drive the input
signals for the various devices as required to allow for 32-bit or wider
applications.
NOTE:
1. This signal is provided by external logic. It is not a bit present on the address bus.
6.42
IDT707288S/L
High-Speed 64K x 16 Dual-Port Static RAM Industrial and Commercial Temperature Ranges
16
Ordering Information
A
Power
999
Speed
A
Package
A
Process/
Temperature
Range
Blank
ICommercial (0°Cto+70°C)
Industrial (-40°Cto+85°C)
PF 100-pin TQFP (PN100-1)
15
20
25
S
LStandard Power
Low Power
XXXXX
Device
Type
1Mbit (4 x 16K x 16)
Bank-Switchable Dual-Ported SRAM
with External Bank Selects
707288
IDT
3592 drw 15
Commercial Only
Commercial & Industrial
Commercial & Industrial Speed in nanoseconds
.
The IDT logo is a registered trademark of Integrated Device Technology, Inc.
Datasheet Document History
1/18/99: Initiated datasheet document history
Converted to new format
Cosmetic and typographical corrections
Page 2 Added additional notes to pin configurations
3/11/99: Removed preliminary note
Cosmetic and typographical corrections
6/4/99: Changed drawing format
Page 1 Corrected DSC number
3/10/00: Added Industrial Temperature Ranges and removed corresponding notes
Replaced IDT logo
Page 1 Made overbar correction on drawing
Changed ±200mV to 0mV in notes
5/23/00: Page 5 Increased storage temperature parameter
Clarified TA parameter
Page 6 DC Electrical parameterschanged wording from "open" to "disabled"
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