LM5021 www.ti.com SNVS359D - MAY 2005 - REVISED MARCH 2013 LM5021 AC-DC Current Mode PWM Controller Check for Samples: LM5021 FEATURES DESCRIPTION * * * * * * * * * The LM5021 off-line pulse width modulation (PWM) controller contains all of the features needed to implement highly efficient off-line single-ended flyback and forward power converters using currentmode control. The LM5021 features include an ultralow (25 A) start-up current, which minimizes power losses in the high voltage start-up network. A skip cycle mode reduces power consumption with light loads for energy conserving applications (ENERGY STAR(R), CECP, etc.). Additional features include under-voltage lockout, cycle-by-cycle current limit, hiccup mode overload protection, slope compensation, soft-start and oscillator synchronization capability. This high performance 8-pin IC has total propagation delays less than 100nS and a 1MHz capable oscillator that is programmed with a single resistor. 1 2 * * * * * * Ultra Low Start-up Current (25 A maximum) Current Mode Control Skip Cycle Mode for Low Standby Power Single Resistor Programmable Oscillator Synchronizable Oscillator Adjustable Soft-Start Integrated 0.7A Peak Gate Driver Direct Opto-Coupler Interface Maximum Duty Cycle Limiting (80% for LM5021-1 or 50% for LM5021-2) Slope Compensation for (LM5021-1 Only) Under Voltage Lockout (UVLO) with Hysteresis Cycle-by-Cycle Over-Current Protection Hiccup Mode for Continuous Overload Protection Leading Edge Blanking of Current Sense Signal Packages: VSSOP-8 or PDIP-8 WHITE SPACE Simplified Application Diagram VOUT + AC 90 ~ 264 Vac VCC VIN LM5021 RT + SS COMP OUT CS GND FEEDBACK WITH ISOLATION 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 2005-2013, Texas Instruments Incorporated LM5021 SNVS359D - MAY 2005 - REVISED MARCH 2013 www.ti.com Connection Diagram COMP 1 8 SS VIN 2 7 RT VCC 3 6 CS OUT 4 5 GND Figure 1. Top View VSSOP-8 (See Package Number DGK0008A) PDIP-8 (See Package Number P0008E) PIN DESCRIPTIONS Pin Name Description Application Information 1 COMP Control input for the Pulse Width Modulator and Hiccup comparators. COMP pull-up is provided by an internal 5K resistor which may be used to bias an opto-coupler transistor. 2 VIN Input voltage. Input to start-up regulator. The VIN pin is clamped at 36V by an internal zener diode. 3 VCC Output only of a linear bias supply regulator. Nominally 8.5V. VCC provides bias to controller and gate drive sections of the LM5021. An external capacitor must be connected from this pin to ground. 4 OUT MOSFET gate driver output. High current output to the external MOSFET gate input with source/sink current capability of 0.3A and 0.7A respectively. 5 GND Ground return. 6 CS 7 RT / SYNC 8 SS Current Sense input. Current sense input for current mode control and over-current protection. Current limiting is accomplished using a dedicated current sense comparator. If the CS comparator input exceeds 0.5 Volts the OUT pin switches low for cycle-by-cycle current limit. CS is held low for 90ns after OUT switches high to blank the leading edge current spike. Oscillator timing resistor pin and synchronization input. An external resistor connected from RT to GND sets the oscillator frequency. This pin will also accept synchronization pulses from an external clock. Soft-start / Hiccup time An external capacitor and an internal 22 A current source set the soft-start ramp. The soft -start capacitor controls both the soft-start rate and the hiccup mode period. These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 2 Submit Documentation Feedback Copyright (c) 2005-2013, Texas Instruments Incorporated Product Folder Links: LM5021 LM5021 www.ti.com SNVS359D - MAY 2005 - REVISED MARCH 2013 Absolute Maximum Ratings (1) (2) VIN to GND -0.3V to 30V VIN Clamp Continuous Current 5mA CS to GND -0.3V to 1.25V RT to GND -0.3V to 5.5V All other pins to GND -0.3V to 7.0V ESD Rating (3) Human Body Model 2kV Storage Temperature -65C to +150C Operating Junction Temperature (1) (2) (3) +150C Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the device is intended to be functional. For specifications and test conditions, see the Electrical Characteristics. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. The human body model is a 100 pF capacitor discharged through a 1.5k resistor into each pin. Operating Ratings VIN Voltage (1) (2) 8V to 30V Junction Temperature (1) (2) -40C to +125C Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the device is intended to be functional. For specifications and test conditions, see the Electrical Characteristics. After initial turn-on at VIN = 20V. Electrical Characteristics (1) Specifications in standard type face are for TJ= +25C and those in boldface type apply over the full Operating Junction Temperature Range. Unless otherwise specified: VIN = 15V, RT = 44.2K. Symbol Parameter Conditions Min Typ Max Unit 18 25 A 20 23 V STARTUP CIRCUIT Start Up Current Before VCC Enable VCC Regulator enable threshold 17 VCC Regulator disable threshold IVIN 7.25 VIN ESD Clamp voltage I = 5mA 30 Operating supply current COMP = 0VDC V 36 40 V 2.5 3.75 mA VCC SUPPLY Controller enable threshold 6.5 7 7.5 V Controller disable threshold 5.3 5.8 6.3 V 8 8.5 9 V VCC regulated output No External Load VCC dropout voltage (VIN - VCC) I = 5 mA VCC regulator current limit VCC = 7.5V (2) 1.7 V 15 22 mA 75 125 SKIP CYCLE MODE COMPARATOR Skip Cycle mode enable threshold [COMP - 1.25V] Skip Cycle mode hysteresis 175 mV 5 mV 35 ns CURRENT LIMIT CS limit to OUT delay CS limit threshold (1) (2) CS stepped from 0 to 0.6V, time to OUT transition low, Cload = 0. 0.45 0.5 Leading Edge Blanking time 90 CS blanking sinking impedance 35 0.55 V ns 55 Min and Max limits are 100% production tested at 25C. Limits over the operating temperature range are specified through correlation using Statistical Quality Control (SQC) methods. Limits are used to calculate Average Outgoing Quality Level (AOQL). Device thermal limitations may limit usable range. Submit Documentation Feedback Copyright (c) 2005-2013, Texas Instruments Incorporated Product Folder Links: LM5021 3 LM5021 SNVS359D - MAY 2005 - REVISED MARCH 2013 www.ti.com Electrical Characteristics(1) (continued) Specifications in standard type face are for TJ= +25C and those in boldface type apply over the full Operating Junction Temperature Range. Unless otherwise specified: VIN = 15V, RT = 44.2K. Symbol Parameter Conditions Min Typ Max Unit SS pin open-circuit voltage 4.3 5.2 6.1 V Soft-start Current Source 15 22 30 A 0.35 0.55 0.75 SOFT-START VSS-OCV Soft-start to COMP Offset COMP sinking impedance During SS ramp V 60 OSCILLATOR Frequency1 (RT = 44.2K) 135 150 165 kHz Frequency2 (RT = 13.3K) 440 500 560 kHz Sync threshold 2.4 3.2 3.8 V PWM COMPARATOR COMP to OUT delay COMP set to 2V CS stepped 0 to 0.4V, time to OUT transition low, Cload = 0. Min Duty Cycle COMP = 0V Max Duty Cycle (-1 Device) 20 75 80 Max Duty Cycle (-2 Device) 0 % 85 % 50 COMP to PWM comparator gain % 0.33 COMP Open Circuit Voltage 4.2 5.1 COMP at Max Duty Cycle COMP Short Circuit Current ns 6 V 2.75 V COMP = 0V 0.6 1.1 1.5 mA CS pin to PWM Comparator offset at maximum duty cycle 70 90 110 mV SLOPE COMPENSATION Slope Comp Amplitude (LM5021-1 only) OUTPUT SECTION OUT High Saturation IOUT = 50mA, VCC OUT 0.6 1.1 V OUT Low Saturation IOUT = 100mA 0.3 1 V Peak Source Current OUT = VCC/2. 0.3 Peak Sink Current OUT = VCC/2. 0.7 A Rise time Cload = 1nF 25 ns Fall time Cload = 1nF 10 ns A HICCUP MODE VOVLD Over load detection threshold COMP pin VSS-OCV - 0.8 VSS-OCV - 0.6 VSS-OCV- 0.4 V VHIC Hiccup mode threshold SS pin VSS-OCV - 0.8 VSS-OCV - 0.6 VSS-OCV- 0.4 V SS pin 0.1 0.3 0.5 V 0.1 0.25 0.4 A 6 10 14 A VRST Hiccup mode Restart threshold IDTCS Dead-time current source IOVCS Overload detection timer current source THERMAL RESISTANCE 4 JA VSSOP-8 Junction to Ambient 0 LFM 200 C/W JA PDIP-8 Junction to Ambient 0 LFM 107 C/W Submit Documentation Feedback Copyright (c) 2005-2013, Texas Instruments Incorporated Product Folder Links: LM5021 LM5021 www.ti.com SNVS359D - MAY 2005 - REVISED MARCH 2013 Simplified Block Diagram 8.5V LINEAR REGULATOR VIN 2 VIN UVLO 20V RISING 7.25V FALLING 36V CLAMP VCC 3 VCC UVLO 7V RISING 5.8V FALLING EN VCC_UVLO DIS CLK VCC_UVLO RT/ SYNC 7 OSC VCC_UVLO SLOPE COMPENSATION RAMP GENERATOR (LM5021 - 1 ONLY) MAX DUTY LIMIT LM5021 - 1 (80%) LM5021 - 2 (50%) 50 PA 0 PA PWM COMPARATOR 5.2V 5k COMP 1 S DRIVER Q OUT 4 R + 1.25V 2R PWM LOGIC - R SKIP CYCLE COMPARATOR 550 mV 5.2V + - 22 PA + SS 125 mV CS 6 COMP CURRENT LIMIT COMPARATOR 1.8k SOFTSTART AND HICCUP MODE LOGIC + SS 8 0.25 PA 10 PA 500 mV CLK Leading Edge Blanking VCC_UVLO GND 5 Submit Documentation Feedback Copyright (c) 2005-2013, Texas Instruments Incorporated Product Folder Links: LM5021 5 LM5021 SNVS359D - MAY 2005 - REVISED MARCH 2013 www.ti.com Typical Performance Characteristics Unless otherwise specified: TJ = 25C. VIN Start-Up Current VIN UVLO 16 3 VIN Falling 12 VIN CURRENT (mA) VIN CURRENT (PA) 14 10 8 6 4 2 1 VIN Rising 2 0 15 0 16 17 19 18 20 0 21 10 20 VIN VOLTAGE (V) VIN (V) Figure 2. Figure 3. VIN Current vs OUT Load 30 VIN Voltage Falling vs VCC Voltage 25 6 FS = 160 kHz VCC (V) VIN CURRENT (mA) 20 5 FS = 80 kHz 4 3 2 0 0 500 1000 1500 0 2000 5 10 15 20 25 OUT DRIVER LOAD (pF) VIN (V) Figure 4. Figure 5. OUT Driver Current vs Temperature Hiccup Mode Deadtime vs Softstart Capacitance 100 0.9 0.8 Sinking 10 0.7 OFF TIME (s) OUT PEAK CURRENT (A) 10 5 FS = 40 kHz 0.6 0.5 1 0.4 0.1 Sourcing 0.3 0.2 0.01 -40 0 40 80 120 TEMPERATURE (oC) 1 10 100 1000 SOFTSTART CAPACITANCE (nF) Figure 6. 6 15 Figure 7. Submit Documentation Feedback Copyright (c) 2005-2013, Texas Instruments Incorporated Product Folder Links: LM5021 LM5021 www.ti.com SNVS359D - MAY 2005 - REVISED MARCH 2013 Typical Performance Characteristics (continued) Unless otherwise specified: TJ = 25C. Output Switching Frequency vs RT OUT SWITCHING FREQUENCY (kHz) 1000 LM5021-1 LM5021-2 100 10 1 10 100 1000 RT (kQ) Figure 8. Submit Documentation Feedback Copyright (c) 2005-2013, Texas Instruments Incorporated Product Folder Links: LM5021 7 LM5021 SNVS359D - MAY 2005 - REVISED MARCH 2013 www.ti.com DETAILED OPERATING DESCRIPTION START UP CIRCUIT Referring to Figure 9, the input capacitor CVIN is trickle charged through the start-up resistor Rstart, when the rectified ac input voltage HV is applied. The VIN current consumed by the LM5021 is only 18 A (nominal) while the capacitor CVIN is initially charged to the start-up threshold. When the input voltage, VIN reaches the upper VIN UVLO threshold of 20V, the internal VCC linear regulator is enabled. The VCC regulator will remain on until VIN falls to the lower UVLO threshold of 7.25V (12.5V hysteresis). When the VCC regulator is turned on, the external capacitor at the VCC pin begins to charge. The PWM controller, soft-start circuit and gate driver are enabled when the VCC voltage reaches the VCC UVLO upper threshold of 7V. The VCC UVLO has 1.2V hysteresis between the upper and lower thresholds to avoid chattering during transients on the VCC pin. When the VCC UVLO enables the switching power supply, energy is transferred from the primary to the secondary transformer winding(s). A bias winding, shown in Figure 9, delivers power to the VIN pin to sustain the VCC regulator. The voltage supplied should be from 11V (VCC regulated voltage maximum plus VCC regulator dropout voltage) to 30V (maximum operating VIN voltage). The bias winding should always be connected to the VIN pin as shown in Figure 9. Do not connect the bias winding to the VCC pin. The start-up sequence is completed and normal operation begins when the voltage from the bias winding is sufficient to maintain VCC level greater than the VCC UVLO threshold (5.8V typical). The LM5021 is designed for ultra-low start-up current into the VIN pin. To accomplish this very low start-up current, the VCC regulator of the LM5021 is unique as compared to the VCC regulator used in other controllers of the LM5xxx family. The LM5021 is designed specifically for applications with the bias winding connected to the VIN pin as shown in Figure 9. It is not recommended that the bias winding be connected to the VCC pin of the LM5021. The size of the start-up resistor Rstart not only affects power supply start-up time, but also power supply efficiency since the resistor dissipates power in normal operation. The ultra low start-up current of the LM5021 allows a large value Rstart resistor (up to 3 M) for improved efficiency with reasonable start-up time. HV Rstart TRANSFORMER BIAS WINDING VCC REGULATOR VIN VCC + CVIN VIN UVLO UPPER S LOWER R Q CVCC INTERNAL BIAS GENERATOR VCC UVLO Enable Driver Figure 9. Start-Up Circuit Block Diagram RELATIONSHIP BETWEEN INPUT CAPACITOR CIN & VCC CAPACITOR CVCC The internal VCC linear regulator is enabled when VIN reaches 20V. The drop in VIN due to charge transfer from CVIN to CVCC after the regulator is enabled can be calculated from the following equations where VIN' is the voltage on CVIN immediately after the VCC regulator charges CVCC. 8 VIN x CVIN = VCC x CVCC (1) (20V - VIN') CVIN = 8.5V CVCC (2) Submit Documentation Feedback Copyright (c) 2005-2013, Texas Instruments Incorporated Product Folder Links: LM5021 LM5021 www.ti.com SNVS359D - MAY 2005 - REVISED MARCH 2013 VIN = 20V - 8.5V x CVCC CVIN (3) Assuming CVIN value as 10 F, and CVCC of 1F, then the drop in VIN will be 0.85V, or the VIN value drops to 19.15V. The value of the VCC capacitor can be small (less than 1uF) as it supplies only transient gate drive current of a short duration. The CVIN capacitor must be sized to supply the gate drive current and the quiescent current of LM5021until the transformer bias winding delivers sufficient voltage to VIN to sustain the VCC voltage. The CVIN capacitor value can be calculated from the operating VCC load current after it's output voltage reaches the VCC UVLO threshold. For example, if the LM5021 is driving an external MOSFET with total gate charge (Qg) of 25nC, the average gate drive current is Qg x Fsw, where Fsw is the switching frequency. Assuming a switching frequency of 150KHz, the average gate drive current is 3.75mA. Since the IC consumes approximately 2.5mA operating current in addition to the gate current, the total current drawn from CVIN capacitor is the operating current plus the gate charge current, or 6.25mA. The CVIN capacitor must supply this current for a brief time until the transformer bias winding takes over. The CVIN voltage must not fall below 8.5V during the start-up sequence or the cycle will be restarted. The maximum allowable start-up time can be calculated using the value of CVIN, the change in voltage allow at VIN (19.15V - 8.5V) and the VCC regulator current (6.25mA). Tmax, the maximum time allowed to energize the bias winding is: CVIN x (19.15V - 8.5V) = 17 ms Tmax = 6.25 mA (4) If the calculated value of Tmax is too small, the value of Cin should be increased further to allow more time before the transformer bias winding takes over and delivers the operating current to the VCC regulator. Increasing CVIN will increase the time from the application of the rectified ac (HV in the Figure 9) to the time when VIN reaches the 20V start threshold. The initial charging time of CVIN is: TVIN_THRESHOLD = RSTART x CVIN x ln 1- 20V HV -1 (5) PWM COMPARATOR/SLOPE COMPENSATION The PWM comparator compares the current sense signal with the loop error voltage from the COMP pin. The COMP pin voltage is reduced by 1.25V then attenuated by a 3:1 resistor divider. The PWM comparator input offset voltage is designed such that less than 1.25V at the COMP pin will result in a zero duty cycle at the controller output. For duty cycles greater than 50 percent, current mode control circuits are subject to sub-harmonic oscillation. By adding an additional fixed slope voltage ramp signal (slope compensation) to the current sense signal, this oscillation can be avoided. The LM5021-1 integrates this slope compensation by summing a ramp signal generated by the oscillator with the current sense signal. The slope compensation is generated by a current ramp driven through an internal 1.8 k resistor connected to the CS pin. Additional slope compensation may be added by increasing the resistance between the current sense filter capacitor and the CS pin, thereby increasing the voltage ramp created by the oscillator current ramp. Since the LM5021-2 is not capable of duty cycles greater than 50%, there is no slope compensation feature in this device. CURRENT LIMIT/CURRENT SENSE The LM5021 provides a cycle-by-cycle over current protection feature. Current limit is triggered by an internal current sense comparator threshold which is set at 500mV. If the CS pin voltage plus the slope compensation voltage exceeds 500mV, the OUT pin output pulse will be immediately terminated. An RC filter, located near the LM5021, is recommended for the CS pin to attenuate the noise coupled from the power FET's gate to source. The CS pin capacitance is discharged at the end of each PWM clock cycle by an internal switch. The discharge switch remains on for an additional 90ns leading edge blanking interval to attenuate the current sense transient that occurs when the external power FET is turned on. In addition to providing leading edge blanking, this circuit also improves dynamic performance by discharging the current sense filter capacitor at the conclusion of every cycle. Submit Documentation Feedback Copyright (c) 2005-2013, Texas Instruments Incorporated Product Folder Links: LM5021 9 LM5021 SNVS359D - MAY 2005 - REVISED MARCH 2013 www.ti.com The LM5021 CS comparator is very fast, and may respond to short duration noise pulses. Layout considerations are critical for the current sense filter and sense resistor. The capacitor associated with the CS filter must be placed very close to the device and connected directly to the pins of the IC (CS and GND). If a current sense transformer is used, both leads of the transformer secondary should be routed to the sense resistor, which should also be located close to the IC. If a current sense resistor located in the power FET's source is used for current sense, a low inductance resistor is required. In this case, all of the noise sensitive low current grounds should be connected in common near the IC and then a single connection should be made to the power ground (sense resistor ground point). OSCILLATOR, SHUTDOWN and SYNC CAPABILITY A single external resistor connected between RT and GND pins sets the LM5021 oscillator frequency. The LM5021-2 device, with 50% maximum duty cycle, includes an internal flip-flop that divides the oscillator frequency by two. This method produces a precise 50% maximum duty cycle limit. Because of this frequency divider, the oscillator frequency of the LM5021-2 is actually twice the frequency of the gate drive output (OUT). For the LM5021-1 device, the oscillator frequency and the operational output frequency are the same. To set a desired output switching frequency (Fsw), the RT resistor can be calculated from: LM5021-1: RT = 6.63 x 109 FSW (6) LM5021-2: RT = 6.63 x 109 2 x FSW (7) The LM5021 can also be synchronized to an external clock. The external clock must have a higher frequency than the free running oscillator frequency set by the RT resistor. The clock signal should be capacitively coupled into the RT pin with a 100pF capacitor. A peak voltage level greater than 3.8 Volts at the RT pin is required for detection of the sync pulse. The dc voltage across the RT resistor is internally regulated at 2 volts. Therefore, the ac pulse superimposed on the RT resistor must have 1.8V or greater amplitude to successfully synchronize the oscillator. The sync pulse width should be set between 15ns to 150ns by the external components. The RT resistor is always required, whether the oscillator is free running or externally synchronized. The RT resistor should be located very close to the device and connected directly to the pins of the LM5021 (RT and GND). GATE DRIVER and MAX DUTY CYCLE LIMIT The LM5021 provides a gate driver (OUT), which can source peak current of 0.3A and sink 0.7A. The LM5021 is available in two duty-cycle limit options. The maximum output duty-cycle is typically 80% for the LM5021-1 option, and precisely equal to 50% for the LM5021-2 option. The maximum duty cycle function for the LM5021-2 is accomplished with an internal toggle flip-flop to ensure an accurate duty cycle limit. The internal oscillator frequency of the LM5021-2 is therefore twice the switching frequency of the PWM controller (OUT pin). The 80% maximum duty-cycle function for the LM5021-1 is determined by the internal oscillator. For the LM5021-1 the internal oscillator frequency and the switching frequency of the PWM controller are the same. SOFT-START The soft-start feature allows the power converter to gradually reach the initial steady state operating point, thus reducing start-up stresses and current surges. An internal 22 A current source charges an external capacitor connected to the SS pin. The capacitor voltage will ramp up slowly, limiting the COMP pin voltage and the duty cycle of the output pulses. The soft-start capacitor is also used to generate the hiccup mode delay time when the output of the switching power supply is continuously overloaded. HICCUP MODE OVERLOAD CURRENT LIMITING Hiccup mode is a method of protecting the power supply from over-heating and damage during an extended overload condition. When the output fault is removed the power supply will automatically restart. 10 Submit Documentation Feedback Copyright (c) 2005-2013, Texas Instruments Incorporated Product Folder Links: LM5021 LM5021 www.ti.com SNVS359D - MAY 2005 - REVISED MARCH 2013 Figure 10, Figure 11, and Figure 12 illustrate the equivalent circuit of the hiccup mode for LM5021 and the relevant waveforms. During start-up and in normal operation, the external soft-start capacitor Css is pulled up by a current source that delivers 22 A to the SS pin capacitor. In normal operation, the soft-start capacitor continues to charge and eventually reaches the saturation voltage of the current source (VSS_OCV, nominally 5.2V). During start-up the COMP pin voltage follows the SS capacitor voltage and gradually increases the peak current delivered by the power supply. When the output of the switching power supply reaches the desired voltage, the voltage feedback amplifier takes control of the COMP signal (via the opto-coupler). In normal operation the COMP level is held at an intermediate voltage between 1.25V and 2.75V controlled by the voltage regulation loop. When the COMP pin voltage is below 1.25V, the duty-cycle is zero. When the COMP level is above 2.75V, the duty cycle will be limited by the 0.5V threshold of cycle-by-cycle current limit comparator. If the output of the power supply is overloaded, the voltage regulation loop demands more current by increasing the COMP pin control voltage. When the COMP pin exceeds the over voltage detection threshold (VOVLD, nominally 4.6V), the SS capacitor Css will be discharged by a 10 A overload detection timer current source, IOVCS. If COMP remains above VOVLD long enough for the SS capacitor to discharge to the Hiccup mode threshold (VHIC, nominally 4.6V), the controller enters the hiccup mode. The OUT pin is then latched low and the SS capacitor discharge current source is reduced from 10 A to 0.25 A, the dead-time current source, IDTCS. The SS pin voltage is slowly reduced until it reaches the Restart threshold (VRST, nominally 0.3V). Then a new start-up sequence commences with 22 A current source charging the capacitor CSS. The slow discharge of the SS capacitor from the Hiccup threshold to the Restart threshold provides an extended off time that reduces the overheating of components including diodes and MOSFETs due to the continuous overload. The off time during the hiccup mode can be calculated from the following equation: CSS x (VHC - VRST) Toff = IDTCS CSS x (4.6V - 0.3V) = 0.25 PA (8) Example: Toff = 808 ms, assuming the CSS capacitor value is 0.047 F Short duration intermittent overloads will not trigger the hiccup mode. The overload duration required to trigger the hiccup response is set by the capacitor CSS, the 10 A discharge current source and voltage difference between the saturation level of the SS pin and the Hiccup mode threshold. Figure 12 shows the waveform of SS pin with a short duration overload condition. The overload time required to enter the hiccup mode can be calculated from the following equation: CSS x (VSS_OCV - VHC) Toverload = = IOVCS CSS x 0.6V 10 PA (9) Example: Toverload = 2.82 ms, assuming the CSS capacitor value is 0.047 F Submit Documentation Feedback Copyright (c) 2005-2013, Texas Instruments Incorporated Product Folder Links: LM5021 11 LM5021 SNVS359D - MAY 2005 - REVISED MARCH 2013 www.ti.com 5.2V COMP OVERLOAD DETECTION 550 mV 5.2V + 4.6V - EN 22 PA + SS EN S + 4.6V 10 PA EN Q 0.25 PA R HICCUP MODE COMPARATOR 0.3V OUT DRIVER PWM + - RESTART COMPARATOR Figure 10. Hiccup Mode Control WHITE SPACE WHITE SPACE Soft-Start Normal operation Overload Detection SMPS latched OFF Soft-Start COMP -10 PA 5.2V 4.6V SS +22 PA -0.25 PA +22 PA 0.3V Figure 11. Waveform at SS and COMP Pin due to Continuous Overload 12 Submit Documentation Feedback Copyright (c) 2005-2013, Texas Instruments Incorporated Product Folder Links: LM5021 LM5021 www.ti.com SNVS359D - MAY 2005 - REVISED MARCH 2013 COMP 5.2V 4.6V SS -10 PA +22 PA during over +22 PA after releasing the over load load Figure 12. Waveform at SS and COMP Pin due to Brief Overload SKIP CYCLE OPERATION During light load conditions, the efficiency of the switching power supply typically drops as the losses associated with switching and operating bias currents of the converter become a significant percentage of the power delivered to the load. The largest component of the power loss is the switching loss associated with the gate driver and external MOSFET gate charge. Each PWM cycle consumes a finite amout of energy as the MOSFET is turned on and then turned off. These switching losses are proportional to the frequency of operation. The Skip Cycle function integrated within the LM5021 controller reduces the average switching frequency to reduce switching losses and improve efficiency during light load conditions. When a light load condition occurs, the COMP pin voltage is reduced by the voltage feedback loop to reduce the peak current delivered by the controller. Referring to Figure 13, the PWM comparator input tracks the COMP pin voltage through a 1.25V level shift circuit and a 3:1 resistor divider. As the COMP pin voltage falls, the input to the PWM comparator falls proportionately. When the PWM comparator input falls to 125mV, the Skip Cycle comparator detects the light load condition and disables output pulses from the controller. The controller continues to skip switching cycles until the power supply output falls and the COMP pin voltage increases to demand more output current. The number of cycles skipped will depend on the load and the response time of the frequency compensation network. Eventually the COMP voltage will increase when the voltage loop requires more current to sustain the regulated output voltage. When the PWM comparator input exceeds 130mV (5mV hysteresis), normal fixed frequency switching resumes. Typical power supply designs will produce a short burst of output pulses followed by a long skip cycle interval. The average switching frequency in the Skip Cycle mode can be a small fraction of the normal operating frequency of the power supply. The skip cycle mode of operation can be disabled by adding an offset voltage to the CS pin (refer to Figure 14). A resistive divider connected to a regulated source, injecting a 125mV offset (minimum) on the CS pin, will force the voltage at the PWM Comparator to be greater than 125 mV, disabling the Skip Cycle Comparator. Submit Documentation Feedback Copyright (c) 2005-2013, Texas Instruments Incorporated Product Folder Links: LM5021 13 LM5021 SNVS359D - MAY 2005 - REVISED MARCH 2013 www.ti.com 5.2V 5k COMP 1.25V + PWM COMPARATOR 2R PWM LOGIC - R + SKIP CYCLE COMPARATOR 125 mV CS 1.8k + CLK LEADING EDGE BLANKING - CURRENT LIMIT COMPARATOR 500 mV Figure 13. Skip Cycle Control VIN OUT LM5021 Voffset > 125 mV CS VCC RSense Figure 14. Disabling the Skip Cycle Mode 14 Submit Documentation Feedback Copyright (c) 2005-2013, Texas Instruments Incorporated Product Folder Links: LM5021 LM5021 www.ti.com SNVS359D - MAY 2005 - REVISED MARCH 2013 Typical Application Circuit Submit Documentation Feedback Copyright (c) 2005-2013, Texas Instruments Incorporated Product Folder Links: LM5021 15 LM5021 SNVS359D - MAY 2005 - REVISED MARCH 2013 www.ti.com REVISION HISTORY Changes from Revision C (March 2013) to Revision D * 16 Page Changed layout of National Data Sheet to TI format .......................................................................................................... 15 Submit Documentation Feedback Copyright (c) 2005-2013, Texas Instruments Incorporated Product Folder Links: LM5021 PACKAGE OPTION ADDENDUM www.ti.com 1-Nov-2013 PACKAGING INFORMATION Orderable Device Status (1) LM5021MM-1/NOPB Package Type Package Pins Package Drawing Qty ACTIVE VSSOP DGK 8 1000 Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (C) Device Marking Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 21-1 (4/5) LM5021MM-2 NRND VSSOP DGK 8 1000 TBD Call TI Call TI -40 to 125 21-2 LM5021MM-2/NOPB ACTIVE VSSOP DGK 8 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 21-2 LM5021MMX-1/NOPB ACTIVE VSSOP DGK 8 3500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 21-1 LM5021MMX-2 NRND VSSOP DGK 8 3500 TBD Call TI Call TI -40 to 125 21-2 LM5021MMX-2/NOPB ACTIVE VSSOP DGK 8 3500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 21-2 LM5021NA-1/NOPB ACTIVE PDIP P 8 40 Green (RoHS & no Sb/Br) CU SN Level-1-NA-UNLIM -40 to 125 LM5021NA -1 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 1-Nov-2013 (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 11-Oct-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LM5021MM-1/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM5021MM-2 VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM5021MM-2/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM5021MMX-1/NOPB VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM5021MMX-2 VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM5021MMX-2/NOPB VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Oct-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM5021MM-1/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0 LM5021MM-2 VSSOP DGK 8 1000 210.0 185.0 35.0 LM5021MM-2/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0 LM5021MMX-1/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0 LM5021MMX-2 VSSOP DGK 8 3500 367.0 367.0 35.0 LM5021MMX-2/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as "components") are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI's terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers' products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers' products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI's goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or "enhanced plastic" are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP(R) Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2013, Texas Instruments Incorporated