2
TechnischeInformation/TechnicalInformation
FF100R12KS4
IGBT-Module
IGBT-modules
preparedby:AC
approvedby:WR
dateofpublication:2013-10-02
revision:3.4
IGBT,Wechselrichter/IGBT,Inverter
HöchstzulässigeWerte/MaximumRatedValues
Kollektor-Emitter-Sperrspannung
Collector-emittervoltage Tvj = 25°C VCES 1200 V
Kollektor-Dauergleichstrom
ContinuousDCcollectorcurrent TC = 80°C, Tvj max = 150°C
TC = 25°C, Tvj max = 150°C
IC nom
IC100
150 A
A
PeriodischerKollektor-Spitzenstrom
Repetitivepeakcollectorcurrent tP = 1 ms ICRM 200 A
Gesamt-Verlustleistung
Totalpowerdissipation TC = 25°C, Tvj max = 150 Ptot 780 W
Gate-Emitter-Spitzenspannung
Gate-emitterpeakvoltage VGES +/-20 V
CharakteristischeWerte/CharacteristicValues min. typ. max.
Kollektor-Emitter-Sättigungsspannung
Collector-emittersaturationvoltage IC = 100 A, VGE = 15 V
IC = 100 A, VGE = 15 V VCE sat
3,20
3,85
3,70
V
V
Tvj = 25°C
Tvj = 125°C
Gate-Schwellenspannung
Gatethresholdvoltage IC = 4,00 mA, VCE = VGE, Tvj = 25°C VGEth 4,5 5,5 6,5 V
Gateladung
Gatecharge VGE = -15 V ... +15 V QG1,10 µC
InternerGatewiderstand
Internalgateresistor Tvj = 25°C RGint 2,5 Ω
Eingangskapazität
Inputcapacitance f = 1 MHz, Tvj = 25°C, VCE = 25 V, VGE = 0 V Cies 6,50 nF
Rückwirkungskapazität
Reversetransfercapacitance f = 1 MHz, Tvj = 25°C, VCE = 25 V, VGE = 0 V Cres 0,42 nF
Kollektor-Emitter-Reststrom
Collector-emittercut-offcurrent VCE = 1200 V, VGE = 0 V, Tvj = 25°C ICES 5,0 mA
Gate-Emitter-Reststrom
Gate-emitterleakagecurrent VCE = 0 V, VGE = 20 V, Tvj = 25°C IGES 400 nA
Einschaltverzögerungszeit,induktiveLast
Turn-ondelaytime,inductiveload IC = 100 A, VCE = 600 V
VGE = ±15 V
RGon = 9,1 Ω
td on
0,10
0,11
µs
µs
Tvj = 25°C
Tvj = 125°C
Anstiegszeit,induktiveLast
Risetime,inductiveload IC = 100 A, VCE = 600 V
VGE = ±15 V
RGon = 9,1 Ω
tr
0,06
0,07
µs
µs
Tvj = 25°C
Tvj = 125°C
Abschaltverzögerungszeit,induktiveLast
Turn-offdelaytime,inductiveload IC = 100 A, VCE = 600 V
VGE = ±15 V
RGoff = 9,1 Ω
td off
0,53
0,55
µs
µs
Tvj = 25°C
Tvj = 125°C
Fallzeit,induktiveLast
Falltime,inductiveload IC = 100 A, VCE = 600 V
VGE = ±15 V
RGoff = 9,1 Ω
tf
0,03
0,04
µs
µs
Tvj = 25°C
Tvj = 125°C
EinschaltverlustenergieproPuls
Turn-onenergylossperpulse IC = 100 A, VCE = 600 V, LS = 60 nH
VGE = ±15 V, di/dt = 1000 A/µs
RGon = 9,1 ΩEon
9,50
mJ
mJ
Tvj = 25°C
Tvj = 125°C
AbschaltverlustenergieproPuls
Turn-offenergylossperpulse IC = 100 A, VCE = 600 V, LS = 60 nH
VGE = ±15 V
RGoff = 9,1 ΩEoff
7,70
mJ
mJ
Tvj = 25°C
Tvj = 125°C
Kurzschlußverhalten
SCdata VGE ≤ 15 V, VCC = 900 V
VCEmax = VCES -LsCE ·di/dt ISC
650
A
Tvj = 125°C
tP ≤ 10 µs,
Wärmewiderstand,ChipbisGehäuse
Thermalresistance,junctiontocase proIGBT/perIGBT RthJC 0,16 K/W
Wärmewiderstand,GehäusebisKühlkörper
Thermalresistance,casetoheatsink proIGBT/perIGBT
λPaste=1W/(m·K)/λgrease=1W/(m·K) RthCH 0,03 K/W
TemperaturimSchaltbetrieb
Temperatureunderswitchingconditions Tvj op -40 125 °C