〇Product structure : Silicon monolithic integrated circuit 〇This product has no designed protection against radioactive rays
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TSZ22111 • 14 • 001
www.rohm.com
Nano EnergyTM
Ultra Low Iq Buck Converter
For Low Power Applications
BD70522GUL
General Description
The BD70522GUL is a Buck Converter featuring 180nA
quiescent current and supports output current up to
500mA. The Constant ON-Time (COT) control with ULP
(Ultra Low Power) mode provides superior transient
response and extends battery life by providing excellent
light load efficiency below 10µA load range. The output
voltage can be selected from 9 pre-set voltages by VSEL
pins. When the input voltage gets close to the output
voltage, the IC enters 100%ON mode where the
switching operation stops.
Features
Nano EnergyTM
180nA (Typ) Quiescent Current
Up to 90% Efficiency at 10µA Output Current
Up to 500mA Output Current
9 Selectable Output Voltages
(1.2V, 1.5V, 1.8V, 2.0V, 2.5V, 2.8V, 3.0V, 3.2V, 3.3V)
Power Good Output
100%ON Mode for Low Input Voltage
Discharge Function on VOUT
Applications
Smoke Detector
Thermostat
Portable Devices
Wearable Devices
Low-Iq Applications without Standby Switcher
Energy Harvesting
Key Specifications
Input Voltage Range: 2.5V to 5.5V
Output Voltage Range: 1.2V to 3.3V
Maximum Output Current: 500mA
Operating Quiescent Current: 180nA (Typ)
Standby Current: 50nA (Typ)
Operating Temperature Range: -40°C to +85°C
Package W(Typ) x D(Typ) x H(Max)
VCSP50L1C 1.76mm x 1.56mm x 0.57mm
Typical Application Circuit
VIN
EN
VSEL1
VSEL2
LX
VOUT
PGND
VIN VOUT
CIN
L1
PG VPG
COUT
10μF22μF
2.2μH1.2V-3.3V
2.5V-5.5V
VEN
VSEL1
VSEL2
RPULLUP
AGND
Figure 1. Typical Application Circuit
「Nano EnergyTM」is a trademark of Rohm Co., Ltd.
Datashee
t
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TSZ22111 • 15 • 001
BD70522GUL
Contents
General Description ........................................................................................................................................................................ 1
Features.......................................................................................................................................................................................... 1
Applications .................................................................................................................................................................................... 1
Key Specifications .......................................................................................................................................................................... 1
Package .......................................................................................................................................................................................... 1
Typical Application Circuit ............................................................................................................................................................... 1
Contents ......................................................................................................................................................................................... 2
Pin Configuration ............................................................................................................................................................................ 3
Pin Descriptions .............................................................................................................................................................................. 3
Block Diagram ................................................................................................................................................................................ 3
Absolute Maximum Ratings ............................................................................................................................................................ 4
Thermal Resistance ........................................................................................................................................................................ 4
Recommended Operating Conditions ............................................................................................................................................. 4
Electrical Characteristics................................................................................................................................................................. 4
Electrical Characteristics - continued .............................................................................................................................................. 5
Detailed Descriptions ...................................................................................................................................................................... 6
Typical Performance Curves ........................................................................................................................................................... 8
Figure 7-10. Efficiency vs Output Current ................................................................................................................................... 8
Figure 11-14. Output Voltage vs Output Current ......................................................................................................................... 9
Figure 15-18. Switching Frequency vs Output Current ............................................................................................................. 10
Figure 19-22. Output Ripple Voltage vs Output Current ............................................................................................................ 11
Figure 23-26. Load Transient Response ................................................................................................................................... 12
Figure 27-30. Line Transient Response .................................................................................................................................... 13
Figure 31-34. Line Transient Response .................................................................................................................................... 14
Figure 35-36. Startup................................................................................................................................................................. 15
Figure 37-38. Shutdown ............................................................................................................................................................ 15
Figure 39-42. Input Voltage Ramp Up/Down ............................................................................................................................. 16
Timing Chart ................................................................................................................................................................................. 17
Application Examples ................................................................................................................................................................... 18
I/O Equivalence Circuits................................................................................................................................................................ 19
Operational Notes ......................................................................................................................................................................... 20
Ordering Information ..................................................................................................................................................................... 22
Marking Diagram .......................................................................................................................................................................... 22
Physical Dimension and Packing Information ............................................................................................................................... 23
Revision History ............................................................................................................................................................................ 24
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TSZ22111 • 15 • 001
BD70522GUL
Pin Configuration
Figure 2. Pin Configuration
Pin Descriptions
Pin No.
Pin Name
Description
A1
PGND
Power Ground Pin
A2
LX
Switching Pin. Connect an inductor to this pin.
A3
VIN
Power Supply Input Pin. Connect an input capacitor close to this pin.
B1
VOUT
Feedback Pin for internal feedback divider network and regulation loop.
This pin is also used for VOUT discharge while EN pin is set to low.
B2
AGND
Analog Ground Pin
B3
EN
Enable Pin. This pin must be terminated.
High : Enable
Low : Shutdown
Do not pull up EN terminal higher than VIN voltage.
C1
PG
Power Good Open Drain Output Pin. PG remains low while the VOUT pin voltage
is lower than the threshold voltage. If not used, this pin can be left open.
Do not pull up PG terminal to a voltage which is higher than VIN voltage.
C2
VSEL2
Output Voltage Selection Pins.
These pins have three states :
High = VIN (Connect these pins to VIN directly without pull up resistors)
Low = GND (Connect these pins to GND directly without pull down resistors)
OPEN = No Connection (PCB:C<50pF, R>1Mohm)
The setting of these pins cannot be changed while the IC is operating.
C3
VSEL1
Block Diagram
Ultra Low Power
Reference
VFB
Main
Ref
ULP
Ref
UVLO
EN
Control
Logic
Limit
Low Side
Current
Limit Comp
Zero Cross
Comp
Current
Limit Comp
Limit
High Side
Soft
Start
VTH_UVLO
VIN
UVLO
Comp
VTH_PG
V100TH_REF
VIN
VOUT
Discharge
UVLO
EN
VOUT
VIN
LX
PGND
Main
Comp
ULP
Comp
Internal
Feedback
Network
PG
Comp
100% ON Mode
Comp
EN
VSEL1
VSEL2
PG
AGND
Figure 3. Block Diagram
Top View
A
B
C
1 2 3
PG VSEL1
VOUT
LX
EN
VIN
PGND
VSEL2
AGND
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TSZ22111 • 15 • 001
BD70522GUL
Absolute Maximum Ratings (Ta=25°C)
Parameter
Symbol
Rating
Unit
Supply Voltage
VIN
-0.3 to +6
V
LX Voltage
VLX
-0.3 to VIN+0.3V
V
EN Voltage
VEN
-0.3 to VIN+0.3V
V
PG Voltage
VPG
-0.3 to VIN+0.3V
V
VSEL1, 2 Voltage
VSEL
-0.3 to VIN+0.3V
V
PG Sink Current
IPG
10
mA
Power Dissipation
Pd
0.592 (Note 1)
W
Maximum Junction Temperature
Tjmax
150
°C
Storage Temperature Range
Tstg
- 55 to + 150
°C
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB boards with power dissipation taken into consideration by
increasing board size and copper area so as not to exceed the maximum junction temperature rating.
(Note 1) The derating is 4.74 mW/°C while the device is operating above Ta≧25°C (Mounted on 4-layer 50.0mm x 58.0mm x 1.6mm FR-4 board)
Thermal Resistance
Parameter
Symbol
Thermal Resistance (Typ)
Unit
VCSP50L1C
Junction to Ambient
θJA
168.8
°C/W
Layer Number of
Measurement Board
Material
Board Size
4 Layers
FR-4
50.0mm x 58.0mm x 1.6mmt
Recommended Operating Conditions
Parameter
Symbol
Min
Typ
Max
Unit
Supply Voltage(Note 2)
VIN
2.5
3.6
5.5
V
Output Current
IOUT
-
-
500
mA
Inductance(Note 3)
L
-
2.2
-
µH
Output Capacitance(Note 4)
COUT
10
22
100
µF
Operating Temperature
Topr
-40
+25
+85
°C
(Note 2) Initial startup voltage is over 2.6V (Max)
(Note 3) The effective inductance should be kept in the specified range from 1.5µH to 3.5µH, including the variety of tolerance, temperature, current derating.
(Note 4) The effective capacitance should be kept this specified range including variety of tolerance, temperature, bias voltage derating.
Electrical Characteristics
(Unless otherwise specified VIN=3.6V Ta=25°C)
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
Circuit Current
Shutdown Current
IST
-
50
1000
nA
Operating Quiescent Current
IQ
-
180
1000
nA
No switching, VEN= VIN
VSEL=VIN
Include VSEL, EN pin current
Under Voltage Lockout
UVLO Detection Threshold
VUVLO
2.30
2.40
2.50
V
VIN falling
UVLO Release Threshold
VUVLORLS
2.40
2.50
2.60
V
VIN rising
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TSZ22111 • 15 • 001
BD70522GUL
Electrical Characteristics - continued
(Unless otherwise specified VIN=3.6V Ta=25°C)
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
Control
EN High Level
VENH
1.1
-
-
V
EN Low Level
VENL
-
-
0.3
V
EN Input Current
IEN
-
0
1
µA
VSEL High Level
VSELH
VIN-0.3
-
VIN+0.3
V
VSEL Low Level
VSELL
-0.3
-
+0.3
V
VSEL Input Current
IVSEL
-
0
1
µA
Power Switch
High-side FET On-Resistance
RONH
-
0.30
0.45
Ω
ILX =50mA
Low-side FET On-Resistance
RONL
-
0.15
0.23
Ω
ILX=-50mA
High-side FET Switch Current Limit 1
ILIMITH1
1225
1750
2275
mA
Peak current of inductor
Low-side FET Switch Current Limit
ILIMITL
680
970
1260
mA
Bottom current of inductor
High-side FET Switch Current Limit 2
ILIMITH2
680
970
1260
mA
100%ON Mode
VOUT Discharge FET On-Resistance
RDISCH
50
100
200
Ω
IOUT=-10mA
Power Good Output
Power Good Detection Threshold
VPGTH
-
95
-
%
VOUT rising
Power Good Hysteresis
VPGHYS
-
-5
-
%
PG Low Level Output Voltage
VOLPG
-0.3
-
0.3
V
IPG=-1mA
PG Output Off Leak Current
IOFFPG
-
0
1
µA
100% ON Mode Transition
100% ON Mode Detection Threshold
V100THM
100
200
300
mV
VIN falling, VIN = VOUT + V100THM
100% ON Mode Release Threshold
V100THP
150
250
350
mV
VIN rising, VIN = VOUT + V100THP
Output
Output Voltage Range
VOUTRG
1.2
-
3.3
V
Refer to Table 1
Output Voltage Accuracy 1
VOACC1
-2.0
0.0
2.0
%
IOUT=10mA
Output Voltage Accuracy 2
VOACC2
-2.5
0.0
2.5
%
IOUT=100mA
Startup Delay Time
tSDELAY
2.5
5.0
10.0
ms
Soft-Start Time
tSS
1.5
3.0
6.0
ms
Table 1. Output Voltage Settings (Note 5)
VSET
VSEL1
VSEL2
1.2V
GND
OPEN
1.5V
OPEN
GND
1.8V
GND
GND
2.0V
VIN
GND
2.5V
OPEN
VIN
2.8V
VIN
OPEN
3.0V
OPEN
OPEN
3.2V
GND
VIN
3.3V
VIN
VIN
(Note 5) The output voltage is only determined by the states of VSEL1 and VSEL2 during the startup delay.
In order to reduce the current consumption, the output voltage cannot be changed by changing the
states of VSEL1 and VSEL2 after the startup delay.
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TSZ22111 • 15 • 001
BD70522GUL
Detailed Descriptions
1. Constant ON-Time (COT) Control
The COT control topology supports CCM (Continuous Current Mode) for medium and high load conditions and
DCM (Discontinuous Current Mode) for light load conditions.
The ON-Time is set in proportion to the output voltage (VOUT), and in inverse proportion to power supply voltage
(VIN). Therefore, when in CCM, even if VIN or VOUT settings changes, the IC always operates in a constant frequency
1MHz (Typ) approximately.
If the load current decreases, the IC enters DCM seamlessly to maintain high efficiency down to very light loads,
and the switching frequency varies approximately linearly with the load current.
2. 100%ON Mode
When VIN gets close to VOUT, the IC stops switching and starts 100% duty cycle operation. It connects the output to
the input via the inductor and the internal high side MOSFET switch, when VIN falls below the 100%ON Mode Enter
Threshold (V100THM). And when VIN increases and exceeds the 100%ON Mode Release Threshold (V100THP), the IC
starts to switch again.
V100THP
V100THM
VPGTH
VUVLORLS VUVLO
VPGHYS
200mV(Typ)
250mV(Typ)
100%
MODE
100%
MODE
Soft
Start
①①①
2.5V(Typ) 2.4V(Typ)
95%(Typ)
5%(Typ)
Low Low
High
VIN
VOUT
PG t
t
① ① ① ’
① : Soft Start End
① : VIN①V100THP①
① ’① VIN①V100THM
Figure 4. 100% ON Mode Transition
3. Ultra Low Power (ULP) Mode
2 comparators are used in this IC for monitoring VOUT.
One is main comparator (Main Comp) and the other is ULP comparator (ULP Comp).
The transition from normal mode to ULP mode is judged pulse by pulse. While the Main Comp or the ULP Comp
detects the decrease in VOUT, the LX node switches for one pulse, then becomes high impedance.
If the high impedance state lasts over 8μs, the IC transits from normal mode to ULP mode.
In ULP mode, the Main Comp and the Power Good comparator (PG Comp) are disabled to reduce the current
consumption. And when the ULP Comp detects the decrease in VOUT, the Main Comp and the PG Comp are
enabled, and the IC transits from ULP mode to normal mode.
normal mode ULP mode normal mode ULP mode normal mode
8us 8us 8us
Main Comp: ON
PG Comp: ON
Main Comp: OFF
PG Comp: OFF
Main Comp: ON
PG Comp: ON
Main Comp: OFF
PG Comp: OFF
Main Comp: ON
PG Comp: ON
Figure 5. Transition between Normal Mode and ULP Mode
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TSZ22111 • 15 • 001
BD70522GUL
4. On-Time Extension
The On-Time is extended automatically to get the best transient response in the case of high duty cycle operation.
If the Main Comp Output does not return to high level within Constant On-Time, the On-Time is extended until the
Main Comp Output returns to high, and the maximum On-Time is limited to 16μs.
FB
+
Ramp
Compensator
VREF
Main Comp
Output
LX On-Time Extension
with delay
shot
IL
Constant
On-Time
Figure 6. On-Time Extension
5. Discharge for VOUT
VOUT pin has a MOSFET for discharge which connects VOUT pin to GND when the IC is in standby state.
(EN=Low or UVLO state or TSD state)
6. Power Good (PG) Output
PG pin is an open-drain output.
The PG Comp is active when EN pin is set to high and VIN is above the threshold VUVLORLS.
PG pin remains low when the VOUT is lower than the PG detection threshold (VPGTH) or during the soft-start time.
PG pin goes to high impedance when VOUT exceeds VPGTH.
And it is pulled to low level once VOUT falls below the PG release threshold (VPGTH-VPGHYS).
7. Under Voltage Lock Out (UVLO)
UVLO function prevents the malfunction of the internal circuit when VIN is too low.
If VIN falls lower than 2.4V (Typ), the IC turns off.
In order to prevent from the misdetection of UVLO, it is necessary to set VIN higher than 2.5V (Typ).
8. Over Current Limit (OCL)
BD70522GUL employs a bottom inductor current limit function which is achieved by using the low side MOSFET.
Turning on the high side MOSFET is prohibited while the inductor current is higher than the low side OCL (ILIMITL).
This function keeps the inductor peak current lower than the sum of ILIMITL and the inductor ripple current.
However, the low side OCL function does not work if the VOUT pin is directly shorted to GND. Thus, a high side
OCL is implemented for such case. The high side MOSFET turns off when the inductor current exceeds the high
side OCL (ILIMITH1). Furthermore, the peak current is limited to ILIMITH1×0.67 under the On-Time extension state.
The inductor current is also limited to ILIMITH2 under 100%ON mode, and the high side MOSFET is used to sense the
current in this case.
9. Thermal Shutdown (TSD)
BD70522GUL stops the switching operation when the device temperature exceeds the TSD detection threshold
130°C (Typ) for protecting the IC from overheat. After the device temperature falls below the TSD release threshold
115°C (Typ), the IC starts the soft-start operation and recovers to the normal operation.
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TSZ22111 • 15 • 001
BD70522GUL
Typical Performance Curves
(Unless otherwise specified Ta=25°C)
45.0
50.0
55.0
60.0
65.0
70.0
75.0
80.0
85.0
90.0
95.0
0.001 0.01 0.1 1 10 100 1000
Efficiency: η[% ]
Output Current: IO UT[mA]
VIN=2.6V
VIN=3.6V
VIN=4.2V
VIN=5.0V
VIN=5.5V
Figure 7. Efficiency vs Output Current
(VOUT=1.2V)
45.0
50.0
55.0
60.0
65.0
70.0
75.0
80.0
85.0
90.0
95.0
0.001 0.01 0.1 1 10 100 1000
Efficiency: η[% ]
Output Current: IO UT[mA]
VIN=2.6V
VIN=3.6V
VIN=4.2V
VIN=5.0V
VIN=5.5V
Figure 8. Efficiency vs Output Current
(VOUT=1.8V)
50.0
55.0
60.0
65.0
70.0
75.0
80.0
85.0
90.0
95.0
100.0
0.001 0.01 0.1 1 10 100 1000
Efficiency: η[% ]
Output Current: IO UT[mA]
VIN=2.8V
VIN=3.6V
VIN=4.2V
VIN=5.0V
VIN=5.5V
Figure 9. Efficiency vs Output Current
(VOUT=2.5V)
50.0
55.0
60.0
65.0
70.0
75.0
80.0
85.0
90.0
95.0
100.0
0.001 0.01 0.1 1 10 100 1000
Efficiency: η[% ]
Output Current: IO UT[mA]
VIN=3.6V
VIN=4.2V
VIN=5.0V
VIN=5.5V
Figure 10. Efficiency vs Output Current
(VOUT=3.3V)
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TSZ22111 • 15 • 001
BD70522GUL
Typical Performance Curves - continued
(Unless otherwise specified Ta=25°C)
1.164
1.176
1.188
1.200
1.212
1.224
1.236
0.001 0.01 0.1 1 10 100 1000
Output Voltag e: VOU T[V]
Output Current: IO UT[mA]
VIN=2.6V
VIN=3.6V
VIN=4.2V
VIN=5.0V
VIN=5.5V
Figure 11. Output Voltage vs Output Current
(Load Regulation, VOUT=1.2V)
1.746
1.764
1.782
1.800
1.818
1.836
1.854
0.001 0.01 0.1 1 10 100 1000
Output Voltag e: VO UT[V]
Output Current: IOU T[mA]
VIN=2.6V
VIN=3.6V
VIN=4.2V
VIN=5.0V
VIN=5.5V
Figure 12. Output Voltage vs Output Current
(Load Regulation, VOUT=1.8V)
2.425
2.450
2.475
2.500
2.525
2.550
2.575
0.001 0.01 0.1 1 10 100 1000
Output Voltag e: VOUT[V]
Output Current: IO U T[mA]
VIN=2.8V
VIN=3.6V
VIN=4.2V
VIN=5.0V
VIN=5.5V
Figure 13. Output Voltage vs Output Current
(Load Regulation, VOUT=2.5V)
3.201
3.234
3.267
3.300
3.333
3.366
3.399
0.001 0.01 0.1 1 10 100 1000
Output Voltag e: VOUT[V]
Output Current: IO UT[mA]
VIN=3.6V
VIN=4.2V
VIN=5.0V
VIN=5.5V
Figure 14. Output Voltage vs Output Current
(Load Regulation, VOUT=3.3V)
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TSZ22111 • 15 • 001
BD70522GUL
Typical Performance Curves - continued
(Unless otherwise specified Ta=25°C)
0
100
200
300
400
500
600
700
800
900
1000
1100
1200
0 100 200 300 400 500
Switching Frequency: FSW [kHz]
Output Current: IO UT[mA]
VIN=2.6V
VIN=3.6V
VIN=5.5V
Figure 15. Switching Frequency vs Output Current
(VOUT=1.2V)
0
100
200
300
400
500
600
700
800
900
1000
1100
1200
0 100 200 300 400 500
Sw itching Frequency: FSW [kHz]
Output Current: IO UT[mA]
VIN=2.6V
VIN=3.6V
VIN=5.5V
Figure 16. Switching Frequency vs Output Current
(VOUT=1.8V)
0
100
200
300
400
500
600
700
800
900
1000
1100
1200
0 100 200 300 400 500
Switching Frequency: FOSW [kHz]
Output Current: IO UT[mA]
VIN=2.8V
VIN=3.6V
VIN=5.5V
Figure 17. Switching Frequency vs Output Current
(VOUT=2.5V)
0
100
200
300
400
500
600
700
800
900
1000
1100
1200
0 100 200 300 400 500
Switching Frequency: FSW [kHz]
Output Current: IO UT[mA]
VIN=3.6V
VIN=5.5V
Figure 18. Switching Frequency vs Output Current
(VOUT=3.3V)
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TSZ22111 • 15 • 001
BD70522GUL
Typical Performance Curves - continued
(Unless otherwise specified Ta=25°C)
0.0
5.0
10.0
15.0
20.0
25.0
30.0
35.0
40.0
45.0
50.0
0 100 200 300 400 500
Output Ripple Voltag e: VRIP[mVpp]
Output Current: IO UT[mA]
VIN=2.6V
VIN=3.6V
VIN=5.5V
Figure 19. Output Ripple Voltage vs Output Current
(Peak to Peak Output Ripple Voltage, VOUT=1.2V)
0.0
5.0
10.0
15.0
20.0
25.0
30.0
35.0
40.0
45.0
50.0
0 100 200 300 400 500
Output Ripple Voltage: VRIP[mVpp]
Output Current: IO UT[mA]
VIN=2.6V
VIN=3.6V
VIN=5.5V
Figure 20. Output Ripple Voltage vs Output Current
(Peak to Peak Output Ripple Voltage, VOUT=1.8V)
0.0
5.0
10.0
15.0
20.0
25.0
30.0
35.0
40.0
45.0
50.0
0 100 200 300 400 500
Output Ripple Voltage: VRIP[mVpp]
Output Current: IO UT[mA]
VIN=2.8V
VIN=3.6V
VIN=5.5V
Figure 21. Output Ripple Voltage vs Output Current
(Peak to Peak Output Ripple Voltage, VOUT=2.5V)
0
5
10
15
20
25
30
35
40
45
50
0 100 200 300 400 500
Output Ripple Voltage: VRIP[mVpp]
Output Current: IO UT[mA]
VIN=3.6V
VIN=5.5V
Figure 22. Output Ripple Voltage vs Output Current
(Peak to Peak Output Ripple Voltage, VOUT=3.3V)
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Typical Performance Curves - continued
(Unless otherwise specified Ta=25°C)
Droop=113.9mV
Overshoot=65.1mV
VOUT
IOUT
Figure 23. Load Transient Response
(VIN=3.6V, VOUT=1.2V, IOUT=1uA⇔500mA, tr=tf=1μs)
Droop=137.5mV
Overshoot=66.9mV
VOUT
IOUT
Figure 24. Load Transient Response
(VIN=3.6V, VOUT=1.8V, IOUT=1uA⇔500mA, tr=tf=1μs)
Droop=174.9mV
Overshoot=85.6mV
VOUT
IOUT
Figure 25. Load Transient Response
(VIN=3.6V, VOUT=2.5V, IOUT=1uA⇔500mA, tr=tf=1μs)
Droop=260.2mV
Overshoot=88.1mV
VOUT
IOUT
Figure 26. Load Transient Response
(VIN=3.6V, VOUT=3.3V, IOUT=1uA⇔500mA, tr=tf=1μs)
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BD70522GUL
Typical Performance Curves - continued
(Unless otherwise specified Ta=25°C)
Droop=22.0mV
Overshoot=22.8mV
VOUT
VIN
Figure 27. Line Transient Response
(VIN=2.6V⇔5.5V, tr=tf=48μs, VOUT=1.2V, IOUT=1mA)
Droop=30.4mV
Overshoot=29.6mV
VOUT
VIN
Figure 28. Line Transient Response
(VIN=2.6V⇔5.5V, tr=tf=48μs, VOUT=1.2V, IOUT=500mA)
Droop=18.8mV
Overshoot=20.0mV
VOUT
VIN
Figure 29. Line Transient Response
(VIN=2.6V⇔5.5V, tr=tf=48μs, VOUT=1.8V, IOUT=1mA)
Droop=32.8mV
Overshoot=30.4mV
VOUT
VIN
Figure 30. Line Transient Response
(VIN=2.6V⇔5.5V, tr=tf=48μs, VOUT=1.8V, IOUT=500mA)
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BD70522GUL
Typical Performance Curves - continued
(Unless otherwise specified Ta=25°C)
VOUT
VIN
Droop=20.0mV
Overshoot=28.0mV
Figure 31. Line Transient Response
(VIN=2.8V⇔5.5V, tr=tf=45μs, VOUT=2.5V, IOUT=1mA)
Droop=54.0mV
Overshoot=48.4mV
VOUT
VIN
Figure 32. Line Transient Response
(VIN=2.8V⇔5.5V, tr=tf=45μs, VOUT=2.5V, IOUT=500mA)
VOUT
VIN
Droop=24.4mV
Overshoot=30.4mV
Figure 33. Line Transient Response
(VIN=3.7V⇔5.5V, tr=tf=30μs, VOUT=3.3V, IOUT=1mA)
Droop=50.8mV
Overshoot=48.4mV
VOUT
VIN
Figure 34. Line Transient Response
(VIN=3.7V⇔5.5V, tr=tf=30μs, VOUT=3.3V, IOUT=500mA)
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TSZ22111 • 15 • 001
BD70522GUL
Typical Performance Curves - continued
(Unless otherwise specified Ta=25°C)
t
SDELAY
=4.50ms
tSS=2.54ms
VEN
VLX
VPG
VOUT
Figure 35. Startup
(VIN=3.6V, VOUT=2.5V, IOUT=0mA, EN=0→VIN)
t
SDELAY
=4.51ms
tSS=2.57ms
VEN
VLX
VPG
VOUT
Figure 36. Startup
(VIN=3.6V, VOUT=2.5V, IOUT=500mA, EN=0→VIN)
VOUT
t
SD
=2.45ms
(50%EN→20%VOUT)
VEN
Figure 37. Shutdown
(VIN=3.6V, VOUT=2.5V, IOUT=0mA, EN=VIN→0)
VOUT
t
SD
=134.2us
(50%EN→20%VOUT)
VEN
Figure 38. Shutdown
(VIN=3.6V, VOUT=2.5V, IOUT=500mA, EN=VIN→0)
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TSZ22111 • 15 • 001
BD70522GUL
Typical Performance Curves - continued
(Unless otherwise specified Ta=25°C)
VIN
VLX
VPG
VOUT
Figure 39. Input Voltage Ramp Up/Down
(VIN=0V⇔5.0 V, VOUT=1.2V, IOUT=500mA, PG=VOUT)
VIN
VLX
VPG
VOUT
Figure 40. Input Voltage Ramp Up/Down
(VIN=0V⇔5.0V, VOUT=1.8V, IOUT=500mA, PG=VOUT)
VIN
VLX
VPG
VOUT
100%ON Mode
Operation
Figure 41. Input Voltage Ramp Up/Down
(VIN=0V⇔5.0V, VOUT=2.5V, IOUT=500mA, PG=VOUT)
VIN
VLX
VPG
VOUT
100%ON Mode
Operation
Figure 42. Input Voltage Ramp Up/Down
(VIN=0V⇔5.0V, VOUT=3.3V, IOUT=500mA, PG=VOUT)
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TSZ22111 • 15 • 001
BD70522GUL
Timing Chart
After BD70522GUL is enabled, the internal reference voltage is booted up.
When the startup delay time tSDELAY has expired, the switching is started by the soft-start operation, and the output
voltage is ramped up to the set voltage (VOUTSET) which is determined by the states of VSEL1 and VSEL2 during the
startup delay in normal operation.
VEN
VOUT
tSDELAY
VOUTSET
VLX
tSS
Figure 43. Timing Chart
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TSZ22111 • 15 • 001
BD70522GUL
Application Examples
VIN
EN
VSEL1
VSEL2
LX
VOUT
PGND
VIN VOUT
CIN
L1
PG
COUT
10μF22μF
2.2μH
VEN
RPULLUP
1.2MΩ
VPG
AGND
Figure 44. Application Example (VOUT=1.2V)
VIN
EN
VSEL1
VSEL2
LX
VOUT
VIN VOUT
CIN
L1
PG
COUT
10μF22μF
2.2μH
VEN
RPULLUP
1.8MΩ
VPG
PGND
AGND
Figure 45. Application Example (VOUT=1.8V)
VPG
VIN
EN
VSEL1
VSEL2
LX
VOUT
VIN VOUT
CIN
L1
PG
COUT
10μF22μF
2.2μH
VEN
RPULLUP
2.4MΩ
PGND
AGND
Figure 46. Application Example (VOUT=2.5V)
VPG
VIN
EN
VSEL1
VSEL2
LX
VOUT
VIN VOUT
CIN
L1
PG
COUT
10μF22μF
2.2μH
VEN
RPULLUP
3.3MΩ
PGND
AGND
Figure 47. Application Example (VOUT=3.3V)
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TSZ22111 • 15 • 001
BD70522GUL
Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
6. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may
flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring,
and routing of connections.
7. Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
8. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
9. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.
10. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
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TSZ22111 • 15 • 001
BD70522GUL
11. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Figure xx. Example of monolithic IC structure
12. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
13. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and the maximum junction temperature rating are all
within the Area of Safe Operation (ASO).
14. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the
junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj
falls below the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
15. Over Current Protection Circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
16. Disturbance Light
In a device where a portion of silicon is exposed to light such as in a WL-CSP and chip products, IC characteristics
may be affected due to photoelectric effect. For this reason, it is recommended to come up with countermeasures
that will prevent the chip from being exposed to light.
N N
P+PN N
P+
P Substrate
GND
NP+N N
P+
NP
P Substrate
GND GND
Parasitic
Elements
Pin A
Pin A
Pin B Pin B
B C
EParasitic
Elements
GND
Parasitic
Elements
CB
E
Transistor (NPN)Resistor
N Region
close-by
Parasitic
Elements
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TSZ22111 • 15 • 001
BD70522GUL
Ordering Information
B
D
7
0
5
2
2
G
U
L
-
E 2
Part Number
Package
GUL: VCSP50L1C
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagram
Part Number Marking
LOT Number
1PIN MARK
VCSP50L1C (TOP VIEW)
0 5 2 2
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TSZ22111 • 15 • 001
BD70522GUL
Physical Dimension and Packing Information
Package Name
VCSP50L1C
< Tape and Reel Information >
Tape
Embossed carrier tape
Quantity
3,000pcs/Reel
Direction of feed
E2
The direction is the pin 1 of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
Reel Direction of feed
1pin
1234
1234
1234
1234
1234
1234
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TSZ22111 • 15 • 001
BD70522GUL
Revision History
Date
Revision
Changes
10.Aug.2017
001
New Release
21.Aug.2017
002
Corrected the limits of “ILIMITL” and “ILIMITH2” in Electrical Characteristics.
Improved the description of OCL.
Improved Figure 5, Marking Diagram.
Notice-PGA-E Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅣ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
DatasheetDatasheet
Notice – WE Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or
concerning such information.
