Datasheet Nano EnergyTM Ultra Low Iq Buck Converter For Low Power Applications BD70522GUL General Description Key Specifications The BD70522GUL is a Buck Converter featuring 180nA quiescent current and supports output current up to 500mA. The Constant ON-Time (COT) control with ULP (Ultra Low Power) mode provides superior transient response and extends battery life by providing excellent light load efficiency below 10A load range. The output voltage can be selected from 9 pre-set voltages by VSEL pins. When the input voltage gets close to the output voltage, the IC enters 100%ON mode where the switching operation stops. Input Voltage Range: Output Voltage Range: Maximum Output Current: Operating Quiescent Current: Standby Current: Operating Temperature Range: Package VCSP50L1C 2.5V to 5.5V 1.2V to 3.3V 500mA 180nA (Typ) 50nA (Typ) -40C to +85C W(Typ) x D(Typ) x H(Max) 1.76mm x 1.56mm x 0.57mm Features Nano EnergyTM 180nA (Typ) Quiescent Current Up to 90% Efficiency at 10A Output Current Up to 500mA Output Current 9 Selectable Output Voltages (1.2V, 1.5V, 1.8V, 2.0V, 2.5V, 2.8V, 3.0V, 3.2V, 3.3V) Power Good Output 100%ON Mode for Low Input Voltage Discharge Function on VOUT Applications Smoke Detector Thermostat Portable Devices Wearable Devices Low-Iq Applications without Standby Switcher Energy Harvesting Typical Application Circuit L1 2.2H CIN 10F VEN VSEL1 VSEL2 VIN LX EN VOUT PG VSEL1 AGND VSEL2 VOUT 1.2V-3.3V COUT 22F RPULLUP VIN 2.5V-5.5V VPG PGND Figure 1. Typical Application Circuit Nano EnergyTMis a trademark of Rohm Co., Ltd. Product structure : Silicon monolithic integrated circuit .www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 * 14 * 001 This product has no designed protection against radioactive rays 1/24 TSZ02201-0Q1Q0AJ00400-1-2 21.Aug.2017 Rev.002 BD70522GUL Contents General Description ........................................................................................................................................................................ 1 Features.......................................................................................................................................................................................... 1 Applications .................................................................................................................................................................................... 1 Key Specifications .......................................................................................................................................................................... 1 Package .......................................................................................................................................................................................... 1 Typical Application Circuit ............................................................................................................................................................... 1 Contents ......................................................................................................................................................................................... 2 Pin Configuration ............................................................................................................................................................................ 3 Pin Descriptions .............................................................................................................................................................................. 3 Block Diagram ................................................................................................................................................................................ 3 Absolute Maximum Ratings ............................................................................................................................................................ 4 Thermal Resistance ........................................................................................................................................................................ 4 Recommended Operating Conditions ............................................................................................................................................. 4 Electrical Characteristics................................................................................................................................................................. 4 Electrical Characteristics - continued .............................................................................................................................................. 5 Detailed Descriptions ...................................................................................................................................................................... 6 Typical Performance Curves........................................................................................................................................................... 8 Figure 7-10. Efficiency vs Output Current ................................................................................................................................... 8 Figure 11-14. Output Voltage vs Output Current ......................................................................................................................... 9 Figure 15-18. Switching Frequency vs Output Current ............................................................................................................. 10 Figure 19-22. Output Ripple Voltage vs Output Current ............................................................................................................ 11 Figure 23-26. Load Transient Response ................................................................................................................................... 12 Figure 27-30. Line Transient Response .................................................................................................................................... 13 Figure 31-34. Line Transient Response .................................................................................................................................... 14 Figure 35-36. Startup................................................................................................................................................................. 15 Figure 37-38. Shutdown ............................................................................................................................................................ 15 Figure 39-42. Input Voltage Ramp Up/Down ............................................................................................................................. 16 Timing Chart ................................................................................................................................................................................. 17 Application Examples ................................................................................................................................................................... 18 I/O Equivalence Circuits................................................................................................................................................................ 19 Operational Notes ......................................................................................................................................................................... 20 Ordering Information ..................................................................................................................................................................... 22 Marking Diagram .......................................................................................................................................................................... 22 Physical Dimension and Packing Information ............................................................................................................................... 23 Revision History ............................................................................................................................................................................ 24 www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 2/24 TSZ02201-0Q1Q0AJ00400-1-2 21.Aug.2017 Rev.002 BD70522GUL Pin Configuration 1 2 3 A PGND LX VIN B VOUT AGND EN C PG VSEL2 VSEL1 Top View Figure 2. Pin Configuration Pin Descriptions Pin No. Pin Name A1 PGND Description Power Ground Pin A2 LX Switching Pin. Connect an inductor to this pin. A3 VIN B1 VOUT B2 AGND B3 EN C1 PG C2 VSEL2 C3 VSEL1 Power Supply Input Pin. Connect an input capacitor close to this pin. Feedback Pin for internal feedback divider network and regulation loop. This pin is also used for VOUT discharge while EN pin is set to low. Analog Ground Pin Enable Pin. This pin must be terminated. High : Enable Low : Shutdown Do not pull up EN terminal higher than VIN voltage. Power Good Open Drain Output Pin. PG remains low while the VOUT pin voltage is lower than the threshold voltage. If not used, this pin can be left open. Do not pull up PG terminal to a voltage which is higher than VIN voltage. Output Voltage Selection Pins. These pins have three states : High = VIN (Connect these pins to VIN directly without pull up resistors) Low = GND (Connect these pins to GND directly without pull down resistors) OPEN = No Connection (PCB:C<50pF, R>1Mohm) The setting of these pins cannot be changed while the IC is operating. Block Diagram EN Ultra Low Power Reference VSEL1 VFB VOUT UVLO EN Soft Start Internal Feedback Network VSEL2 100% ON Mode Comp UVLO Comp VIN Main Ref PG PG Comp ULP Ref VIN VIN VTH_UVLO AGND VOUT Discharge V100TH_REF Main Comp UVLO Current Limit Comp ULP Comp Control Logic LX Zero Cross Comp VTH_PG EN Limit High Side Current Limit Comp Limit Low Side PGND Figure 3. Block Diagram www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 3/24 TSZ02201-0Q1Q0AJ00400-1-2 21.Aug.2017 Rev.002 BD70522GUL Absolute Maximum Ratings (Ta=25C) Parameter Symbol Rating Unit VIN -0.3 to +6 V LX Voltage VLX -0.3 to VIN+0.3V V EN Voltage VEN -0.3 to VIN+0.3V V PG Voltage VPG -0.3 to VIN+0.3V V VSEL1, 2 Voltage VSEL -0.3 to VIN+0.3V V PG Sink Current IPG 10 mA Power Dissipation Pd 0.592 (Note 1) Tjmax 150 W C Tstg - 55 to + 150 C Supply Voltage Maximum Junction Temperature Storage Temperature Range Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, design a PCB boards with power dissipation taken into consideration by increasing board size and copper area so as not to exceed the maximum junction temperature rating. (Note 1) The derating is 4.74 mW/C while the device is operating above Ta25C (Mounted on 4-layer 50.0mm x 58.0mm x 1.6mm FR-4 board) Thermal Resistance Parameter Symbol Thermal Resistance (Typ) Unit JA 168.8 C/W VCSP50L1C Junction to Ambient Layer Number of Measurement Board 4 Layers Material Board Size FR-4 50.0mm x 58.0mm x 1.6mmt Recommended Operating Conditions Parameter Supply Voltage(Note 2) Output Current Inductance(Note 3) Output Capacitance(Note 4) Operating Temperature Symbol Min Typ Max Unit VIN 2.5 3.6 5.5 V IOUT - - 500 mA L - 2.2 - H COUT 10 22 100 F Topr -40 +25 +85 C (Note 2) Initial startup voltage is over 2.6V (Max) (Note 3) The effective inductance should be kept in the specified range from 1.5H to 3.5H, including the variety of tolerance, temperature, current derating. (Note 4) The effective capacitance should be kept this specified range including variety of tolerance, temperature, bias voltage derating. Electrical Characteristics (Unless otherwise specified VIN=3.6V Ta=25C) Parameter Symbol Min Typ Max Unit Conditions Shutdown Current IST - 50 1000 nA Operating Quiescent Current IQ - 180 1000 nA No switching, VEN= VIN VSEL=VIN Include VSEL, EN pin current UVLO Detection Threshold VUVLO 2.30 2.40 2.50 V VIN falling UVLO Release Threshold VUVLORLS 2.40 2.50 2.60 V VIN rising Circuit Current Under Voltage Lockout www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 4/24 TSZ02201-0Q1Q0AJ00400-1-2 21.Aug.2017 Rev.002 BD70522GUL Electrical Characteristics - continued (Unless otherwise specified VIN=3.6V Ta=25C) Parameter Symbol Min Typ Max Unit EN High Level VENH 1.1 EN Low Level VENL - EN Input Current IEN VSEL High Level VSEL Low Level VSEL Input Current Conditions - - V - 0.3 V - 0 1 A VSELH VIN-0.3 - VIN+0.3 V VSELL -0.3 - +0.3 V IVSEL - 0 1 A RONH - 0.30 0.45 ILX =50mA ILX=-50mA Control Power Switch High-side FET On-Resistance RONL - 0.15 0.23 ILIMITH1 1225 1750 2275 mA Peak current of inductor Low-side FET Switch Current Limit ILIMITL 680 970 1260 mA Bottom current of inductor High-side FET Switch Current Limit 2 ILIMITH2 680 970 1260 mA 100%ON Mode VOUT Discharge FET On-Resistance RDISCH 50 100 200 IOUT=-10mA Power Good Detection Threshold VPGTH - 95 - % VOUT rising Power Good Hysteresis VPGHYS - -5 - % PG Low Level Output Voltage VOLPG -0.3 - 0.3 V PG Output Off Leak Current IOFFPG - 0 1 A 100% ON Mode Detection Threshold V100THM 100 200 300 mV VIN falling, VIN = VOUT + V100THM 100% ON Mode Release Threshold V100THP 150 250 350 mV VIN rising, VIN = VOUT + V100THP Output Voltage Range VOUTRG 1.2 - 3.3 V Refer to Table 1 Output Voltage Accuracy 1 VOACC1 -2.0 0.0 2.0 % IOUT=10mA Output Voltage Accuracy 2 VOACC2 -2.5 0.0 2.5 % IOUT=100mA Startup Delay Time tSDELAY 2.5 5.0 10.0 ms tSS 1.5 3.0 6.0 ms Low-side FET On-Resistance High-side FET Switch Current Limit 1 Power Good Output IPG=-1mA 100% ON Mode Transition Output Soft-Start Time VSET Table 1. Output Voltage Settings (Note 5) VSEL1 VSEL2 1.2V GND OPEN 1.5V OPEN GND 1.8V GND GND 2.0V VIN GND 2.5V OPEN VIN 2.8V VIN OPEN 3.0V OPEN OPEN 3.2V GND VIN 3.3V VIN VIN (Note 5) The output voltage is only determined by the states of VSEL1 and VSEL2 during the startup delay. In order to reduce the current consumption, the output voltage cannot be changed by changing the states of VSEL1 and VSEL2 after the startup delay. www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 5/24 TSZ02201-0Q1Q0AJ00400-1-2 21.Aug.2017 Rev.002 BD70522GUL Detailed Descriptions 1. Constant ON-Time (COT) Control The COT control topology supports CCM (Continuous Current Mode) for medium and high load conditions and DCM (Discontinuous Current Mode) for light load conditions. The ON-Time is set in proportion to the output voltage (VOUT), and in inverse proportion to power supply voltage (VIN). Therefore, when in CCM, even if VIN or VOUT settings changes, the IC always operates in a constant frequency 1MHz (Typ) approximately. If the load current decreases, the IC enters DCM seamlessly to maintain high efficiency down to very light loads, and the switching frequency varies approximately linearly with the load current. 2. 100%ON Mode When VIN gets close to VOUT, the IC stops switching and starts 100% duty cycle operation. It connects the output to the input via the inductor and the internal high side MOSFET switch, when VIN falls below the 100%ON Mode Enter Threshold (V100THM). And when VIN increases and exceeds the 100%ON Mode Release Threshold (V100THP), the IC starts to switch again. VIN VOUT Soft 100% Start MODE 100% MODE 250mV(Typ) V100THP V100THM 200mV(Typ) VPGTH 95%(Typ) VPGHYS 5%(Typ) VUVLORLS 2.5V(Typ) VUVLO 2.4V(Typ) PG : Soft Start End : VINV100THP ' VINV100THM t ' High Low Low t Figure 4. 100% ON Mode Transition 3. Ultra Low Power (ULP) Mode 2 comparators are used in this IC for monitoring VOUT. One is main comparator (Main Comp) and the other is ULP comparator (ULP Comp). The transition from normal mode to ULP mode is judged pulse by pulse. While the Main Comp or the ULP Comp detects the decrease in VOUT, the LX node switches for one pulse, then becomes high impedance. If the high impedance state lasts over 8s, the IC transits from normal mode to ULP mode. In ULP mode, the Main Comp and the Power Good comparator (PG Comp) are disabled to reduce the current consumption. And when the ULP Comp detects the decrease in VOUT, the Main Comp and the PG Comp are enabled, and the IC transits from ULP mode to normal mode. 8us 8us 8us normal mode ULP mode normal mode ULP mode normal mode Main Comp: ON PG Comp: ON Main Comp: OFF PG Comp: OFF Main Comp: ON PG Comp: ON Main Comp: OFF PG Comp: OFF Main Comp: ON PG Comp: ON Figure 5. Transition between Normal Mode and ULP Mode www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 6/24 TSZ02201-0Q1Q0AJ00400-1-2 21.Aug.2017 Rev.002 BD70522GUL 4. On-Time Extension The On-Time is extended automatically to get the best transient response in the case of high duty cycle operation. If the Main Comp Output does not return to high level within Constant On-Time, the On-Time is extended until the Main Comp Output returns to high, and the maximum On-Time is limited to 16s. FB + Ramp Compensator VREF Main Comp Output LX Constant On-Time On-Time Extension with delay shot IL Figure 6. On-Time Extension 5. 6. 7. Discharge for VOUT VOUT pin has a MOSFET for discharge which connects VOUT pin to GND when the IC is in standby state. (EN=Low or UVLO state or TSD state) Power Good (PG) Output PG pin is an open-drain output. The PG Comp is active when EN pin is set to high and VIN is above the threshold VUVLORLS. PG pin remains low when the VOUT is lower than the PG detection threshold (VPGTH) or during the soft-start time. PG pin goes to high impedance when VOUT exceeds VPGTH. And it is pulled to low level once VOUT falls below the PG release threshold (VPGTH-VPGHYS). Under Voltage Lock Out (UVLO) UVLO function prevents the malfunction of the internal circuit when VIN is too low. If VIN falls lower than 2.4V (Typ), the IC turns off. In order to prevent from the misdetection of UVLO, it is necessary to set VIN higher than 2.5V (Typ). 8. Over Current Limit (OCL) BD70522GUL employs a bottom inductor current limit function which is achieved by using the low side MOSFET. Turning on the high side MOSFET is prohibited while the inductor current is higher than the low side OCL (ILIMITL). This function keeps the inductor peak current lower than the sum of ILIMITL and the inductor ripple current. However, the low side OCL function does not work if the VOUT pin is directly shorted to GND. Thus, a high side OCL is implemented for such case. The high side MOSFET turns off when the inductor current exceeds the high side OCL (ILIMITH1). Furthermore, the peak current is limited to ILIMITH1x0.67 under the On-Time extension state. The inductor current is also limited to ILIMITH2 under 100%ON mode, and the high side MOSFET is used to sense the current in this case. 9. Thermal Shutdown (TSD) BD70522GUL stops the switching operation when the device temperature exceeds the TSD detection threshold 130C (Typ) for protecting the IC from overheat. After the device temperature falls below the TSD release threshold 115C (Typ), the IC starts the soft-start operation and recovers to the normal operation. www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 7/24 TSZ02201-0Q1Q0AJ00400-1-2 21.Aug.2017 Rev.002 BD70522GUL 95.0 95.0 90.0 90.0 85.0 85.0 80.0 80.0 75.0 75.0 E fficiency: [% ] E fficiency: [% ] Typical Performance Curves (Unless otherwise specified Ta=25C) 70.0 65.0 60.0 65.0 60.0 VIN=2.6V VIN=3.6V 55.0 70.0 VIN=2.6V VIN=3.6V 55.0 VIN=4.2V 50.0 VIN=4.2V 50.0 VIN=5.0V VIN=5.0V VIN=5.5V 45.0 0.001 0.01 0.1 1 10 100 VIN=5.5V 45.0 0.001 1000 0.01 Output Current: I OUT[mA] 100.0 95.0 95.0 90.0 90.0 85.0 85.0 80.0 80.0 E fficiency: [% ] E fficiency: [% ] 10 100 1000 Figure 8. Efficiency vs Output Current (VOUT=1.8V) 100.0 75.0 70.0 75.0 70.0 65.0 VIN=2.8V VIN=3.6V VIN=3.6V 60.0 1 Output Current: I OUT[mA] Figure 7. Efficiency vs Output Current (VOUT=1.2V) 65.0 0.1 60.0 VIN=4.2V 55.0 VIN=5.0V VIN=4.2V 55.0 VIN=5.0V VIN=5.5V VIN=5.5V 50.0 0.001 0.01 0.1 1 10 100 50.0 0.001 1000 Output Current: I OUT[mA] 0.1 1 10 100 1000 Output Current: I OUT[mA] Figure 9. Efficiency vs Output Current (VOUT=2.5V) www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 0.01 Figure 10. Efficiency vs Output Current (VOUT=3.3V) 8/24 TSZ02201-0Q1Q0AJ00400-1-2 21.Aug.2017 Rev.002 BD70522GUL 1.236 1.854 1.224 1.836 1.212 1.818 Output Voltag e: V OUT[V] Output Voltage: V OUT[V] Typical Performance Curves - continued (Unless otherwise specified Ta=25C) 1.200 1.188 VIN=2.6V 1.800 1.782 VIN=2.6V VIN=3.6V 1.176 VIN=3.6V 1.764 VIN=4.2V VIN=4.2V VIN=5.0V VIN=5.0V VIN=5.5V 1.164 0.001 0.01 0.1 1 10 100 VIN=5.5V 1.746 0.001 1000 0.01 Output Current: I OUT[mA] Figure 11. Output Voltage vs Output Current (Load Regulation, VOUT=1.2V) 1 10 2.575 3.399 2.550 3.366 2.525 3.333 2.500 2.475 VIN=2.8V 3.267 VIN=3.6V VIN=4.2V 3.234 VIN=4.2V VIN=5.0V VIN=5.0V VIN=5.5V VIN=5.5V 2.425 0.001 0.01 0.1 1 10 100 3.201 0.001 1000 Output Current: I OUT[mA] 0.01 0.1 1 10 100 1000 Output Current: I OUT[mA] Figure 13. Output Voltage vs Output Current (Load Regulation, VOUT=2.5V) www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 1000 3.300 VIN=3.6V 2.450 100 Figure 12. Output Voltage vs Output Current (Load Regulation, VOUT=1.8V) Output Voltage: V OUT[V] Output Voltage: V OUT[V] 0.1 Output Current: I OUT[mA] Figure 14. Output Voltage vs Output Current (Load Regulation, VOUT=3.3V) 9/24 TSZ02201-0Q1Q0AJ00400-1-2 21.Aug.2017 Rev.002 BD70522GUL 1200 1200 1100 1100 1000 1000 900 900 800 800 Switching Frequency: F SW [kHz] Switching Frequency: F SW [kHz] Typical Performance Curves - continued (Unless otherwise specified Ta=25C) 700 600 500 400 300 200 VIN=3.6V 0 100 200 300 400 500 400 300 VIN=2.6V VIN=3.6V 100 VIN=5.5V 0 600 200 VIN=2.6V 100 700 VIN=5.5V 0 500 0 100 Output Current: I OUT[mA] 1200 1200 1100 1100 1000 1000 900 900 800 800 700 600 500 400 300 100 200 300 400 600 500 400 300 VIN=5.5V 0 500 0 Output Current: I OUT[mA] 100 200 300 400 500 Output Current: I OUT[mA] Figure 17. Switching Frequency vs Output Current (VOUT=2.5V) www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 700 100 VIN=5.5V 0 500 VIN=3.6V VIN=3.6V 0 400 200 VIN=2.8V 100 300 Figure 16. Switching Frequency vs Output Current (VOUT=1.8V) Switching Frequency: F SW [kHz] Switching Frequency: F OSW [kHz] Figure 15. Switching Frequency vs Output Current (VOUT=1.2V) 200 200 Output Current: I OUT[mA] Figure 18. Switching Frequency vs Output Current (VOUT=3.3V) 10/24 TSZ02201-0Q1Q0AJ00400-1-2 21.Aug.2017 Rev.002 BD70522GUL Typical Performance Curves - continued (Unless otherwise specified Ta=25C) 50.0 50.0 VIN=2.6V VIN=3.6V 45.0 VIN=2.6V VIN=3.6V 45.0 VIN=5.5V VIN=5.5V 40.0 Output Ripple Voltage: VRIP[m Vpp] Output R ipple Voltage: V R IP [mVpp] 40.0 35.0 30.0 25.0 20.0 15.0 35.0 30.0 25.0 20.0 15.0 10.0 10.0 5.0 5.0 0.0 0.0 0 100 200 300 400 500 0 100 Output Current: I OUT[mA] 200 300 500 Output Current: I OUT[mA] Figure 19. Output Ripple Voltage vs Output Current (Peak to Peak Output Ripple Voltage, VOUT=1.2V) Figure 20. Output Ripple Voltage vs Output Current (Peak to Peak Output Ripple Voltage, VOUT=1.8V) 50.0 50 VIN=2.8V VIN=3.6V VIN=3.6V 45.0 45 VIN=5.5V VIN=5.5V 40 Output Ripple Voltage: VRIP[m Vpp] 40.0 Output Ripple Voltage: VRIP[m Vpp] 400 35.0 30.0 25.0 20.0 15.0 35 30 25 20 15 10.0 10 5.0 5 0.0 0 0 100 200 300 400 500 0 Output Current: I OUT[mA] 200 300 400 500 Output Current: I OUT[mA] Figure 21. Output Ripple Voltage vs Output Current (Peak to Peak Output Ripple Voltage, VOUT=2.5V) www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 100 Figure 22. Output Ripple Voltage vs Output Current (Peak to Peak Output Ripple Voltage, VOUT=3.3V) 11/24 TSZ02201-0Q1Q0AJ00400-1-2 21.Aug.2017 Rev.002 BD70522GUL Typical Performance Curves - continued (Unless otherwise specified Ta=25C) Droop=137.5mV Overshoot=66.9mV Droop=113.9mV Overshoot=65.1mV VOUT VOUT IOUT IOUT Figure 23. Load Transient Response (VIN=3.6V, VOUT=1.2V, IOUT=1uA500mA, tr=tf=1s) Figure 24. Load Transient Response (VIN=3.6V, VOUT=1.8V, IOUT=1uA500mA, tr=tf=1s) Droop=174.9mV Overshoot=85.6mV Droop=260.2mV Overshoot=88.1mV VOUT VOUT IOUT IOUT Figure 25. Load Transient Response (VIN=3.6V, VOUT=2.5V, IOUT=1uA500mA, tr=tf=1s) www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 Figure 26. Load Transient Response (VIN=3.6V, VOUT=3.3V, IOUT=1uA500mA, tr=tf=1s) 12/24 TSZ02201-0Q1Q0AJ00400-1-2 21.Aug.2017 Rev.002 BD70522GUL Typical Performance Curves - continued (Unless otherwise specified Ta=25C) VIN VIN Droop=22.0mV Overshoot=22.8mV Droop=30.4mV Overshoot=29.6mV VOUT VOUT Figure 27. Line Transient Response (VIN=2.6V5.5V, tr=tf=48s, VOUT=1.2V, IOUT=1mA) Figure 28. Line Transient Response (VIN=2.6V5.5V, tr=tf=48s, VOUT=1.2V, IOUT=500mA) VIN VIN Droop=18.8mV Overshoot=20.0mV VOUT VOUT Figure 29. Line Transient Response (VIN=2.6V5.5V, tr=tf=48s, VOUT=1.8V, IOUT=1mA) www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 Droop=32.8mV Overshoot=30.4mV Figure 30. Line Transient Response (VIN=2.6V5.5V, tr=tf=48s, VOUT=1.8V, IOUT=500mA) 13/24 TSZ02201-0Q1Q0AJ00400-1-2 21.Aug.2017 Rev.002 BD70522GUL Typical Performance Curves - continued (Unless otherwise specified Ta=25C) VIN VIN Droop=20.0mV Overshoot=28.0mV VOUT Droop=54.0mV Overshoot=48.4mV VOUT Figure 31. Line Transient Response (VIN=2.8V5.5V, tr=tf=45s, VOUT=2.5V, IOUT=1mA) Figure 32. Line Transient Response (VIN=2.8V5.5V, tr=tf=45s, VOUT=2.5V, IOUT=500mA) VIN VIN Droop=24.4mV Overshoot=30.4mV VOUT VOUT Figure 33. Line Transient Response (VIN=3.7V5.5V, tr=tf=30s, VOUT=3.3V, IOUT=1mA) www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 Droop=50.8mV Overshoot=48.4mV Figure 34. Line Transient Response (VIN=3.7V5.5V, tr=tf=30s, VOUT=3.3V, IOUT=500mA) 14/24 TSZ02201-0Q1Q0AJ00400-1-2 21.Aug.2017 Rev.002 BD70522GUL Typical Performance Curves - continued (Unless otherwise specified Ta=25C) VEN VEN VLX VLX VPG tSDELAY=4.50ms tSS=2.54ms VOUT VPG VOUT Figure 35. Startup (VIN=3.6V, VOUT=2.5V, IOUT=0mA, EN=0VIN) Figure 36. Startup (VIN=3.6V, VOUT=2.5V, IOUT=500mA, EN=0VIN) VEN VEN VOUT VOUT tSD=2.45ms (50%EN20%VOUT) Figure 37. Shutdown (VIN=3.6V, VOUT=2.5V, IOUT=0mA, EN=VIN0) www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 tSDELAY=4.51ms tSS=2.57ms tSD=134.2us (50%EN20%VOUT) Figure 38. Shutdown (VIN=3.6V, VOUT=2.5V, IOUT=500mA, EN=VIN0) 15/24 TSZ02201-0Q1Q0AJ00400-1-2 21.Aug.2017 Rev.002 BD70522GUL Typical Performance Curves - continued (Unless otherwise specified Ta=25C) VPG VPG VIN VIN VOUT VOUT VLX VLX Figure 39. Input Voltage Ramp Up/Down (VIN=0V5.0 V, VOUT=1.2V, IOUT=500mA, PG=VOUT) Figure 40. Input Voltage Ramp Up/Down (VIN=0V5.0V, VOUT=1.8V, IOUT=500mA, PG=VOUT) VPG VPG VIN VIN 100%ON Mode Operation 100%ON Mode Operation VOUT VOUT VLX VLX Figure 41. Input Voltage Ramp Up/Down (VIN=0V5.0V, VOUT=2.5V, IOUT=500mA, PG=VOUT) www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 Figure 42. Input Voltage Ramp Up/Down (VIN=0V5.0V, VOUT=3.3V, IOUT=500mA, PG=VOUT) 16/24 TSZ02201-0Q1Q0AJ00400-1-2 21.Aug.2017 Rev.002 BD70522GUL Timing Chart After BD70522GUL is enabled, the internal reference voltage is booted up. When the startup delay time tSDELAY has expired, the switching is started by the soft-start operation, and the output voltage is ramped up to the set voltage (VOUTSET) which is determined by the states of VSEL1 and VSEL2 during the startup delay in normal operation. VEN VLX VOUTSET VOUT tSDELAY tSS Figure 43. Timing Chart www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 17/24 TSZ02201-0Q1Q0AJ00400-1-2 21.Aug.2017 Rev.002 BD70522GUL Application Examples L1 VIN LX EN VOUT VEN VSEL1 PG VSEL2 AGND VOUT COUT 22F 1.2M CIN 10F 2.2H RPULLUP VIN VPG PGND Figure 44. Application Example (VOUT=1.2V) L1 VIN LX EN VOUT COUT 22F VEN VSEL1 PG VSEL2 AGND VOUT 1.8M CIN 10F 2.2H RPULLUP VIN VPG PGND Figure 45. Application Example (VOUT=1.8V) L1 VIN LX EN VOUT COUT 22F VEN VSEL1 PG VSEL2 AGND VOUT 2.4M CIN 10F 2.2H RPULLUP VIN VPG PGND Figure 46. Application Example (VOUT=2.5V) L1 VEN VIN LX EN VOUT VSEL1 PG VSEL2 AGND VOUT COUT 22F 3.3M CIN 10F 2.2H RPULLUP VIN VPG PGND Figure 47. Application Example (VOUT=3.3V) www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 18/24 TSZ02201-0Q1Q0AJ00400-1-2 21.Aug.2017 Rev.002 BD70522GUL I/O Equivalence Circuits A1: PGND, A2: LX, A3: VIN, B2: AGND B1: VOUT VIN VOUT LX PGND AGND B3: EN C1: PG VIN EN VIN PG C2: VSEL2, C3: VSEL1 VIN VIN VSEL2, VSEL1 www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 19/24 TSZ02201-0Q1Q0AJ00400-1-2 21.Aug.2017 Rev.002 BD70522GUL Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC's power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Recommended Operating Conditions The function and operation of the IC are guaranteed within the range specified by the recommended operating conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical characteristics. 6. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 7. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 8. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC's power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 9. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 10. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 20/24 TSZ02201-0Q1Q0AJ00400-1-2 21.Aug.2017 Rev.002 BD70522GUL 11. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C E Pin A N P+ P N N P+ N Pin B B Parasitic Elements N P+ N P N P+ B N C E Parasitic Elements P Substrate P Substrate GND GND Parasitic Elements GND Parasitic Elements GND N Region close-by Figure xx. Example of monolithic IC structure 12. Ceramic Capacitor When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 13. Area of Safe Operation (ASO) Operate the IC such that the output voltage, output current, and the maximum junction temperature rating are all within the Area of Safe Operation (ASO). 14. Thermal Shutdown Circuit(TSD) This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the IC's maximum junction temperature rating. If however the rating is exceeded for a continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. 15. Over Current Protection Circuit (OCP) This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should not be used in applications characterized by continuous operation or transitioning of the protection circuit. 16. Disturbance Light In a device where a portion of silicon is exposed to light such as in a WL-CSP and chip products, IC characteristics may be affected due to photoelectric effect. For this reason, it is recommended to come up with countermeasures that will prevent the chip from being exposed to light. www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 21/24 TSZ02201-0Q1Q0AJ00400-1-2 21.Aug.2017 Rev.002 BD70522GUL Ordering Information B D 7 0 5 Part Number 2 2 G U L - E 2 Package Packaging and forming specification GUL: VCSP50L1C E2: Embossed tape and reel Marking Diagram VCSP50L1C (TOP VIEW) 1PIN MARK Part Number Marking 0522 www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 LOT Number 22/24 TSZ02201-0Q1Q0AJ00400-1-2 21.Aug.2017 Rev.002 BD70522GUL Physical Dimension and Packing Information Package Name VCSP50L1C < Tape and Reel Information > Tape Embossed carrier tape Quantity 3,000pcs/Reel Direction of feed E2 The direction is the pin 1 of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 1234 1234 Reel www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 1234 1234 1pin 23/24 1234 1234 Direction of feed TSZ02201-0Q1Q0AJ00400-1-2 21.Aug.2017 Rev.002 BD70522GUL Revision History Date Revision 10.Aug.2017 001 21.Aug.2017 002 www.rohm.com (c) 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 Changes New Release Corrected the limits of "ILIMITL" and "ILIMITH2" in Electrical Characteristics. Improved the description of OCL. Improved Figure 5, Marking Diagram. 24/24 TSZ02201-0Q1Q0AJ00400-1-2 21.Aug.2017 Rev.002 Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) intend to use our Products in devices requiring extremely high reliability (such as medical equipment , transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property ("Specific Applications"), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM's Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASS CLASSb CLASS CLASS CLASS CLASS 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM's Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E (c) 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM's internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PGA-E (c) 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Datasheet General Precaution 1. Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any ROHM's Products against warning, caution or note contained in this document. 2. All information contained in this document is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM's Products, please confirm the latest information with a ROHM sales representative. 3. The information contained in this document is provided on an "as is" basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or concerning such information. Notice - WE (c) 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet BD70522GUL - Web Page Buy Distribution Inventory Part Number Package Unit Quantity Minimum Package Quantity Packing Type Constitution Materials List RoHS BD70522GUL VCSP50L1C 3000 3000 Taping inquiry Yes