MCP4017/18/19 7-Bit Single I2CTM Digital POT with Volatile Memory in SC70 Package Types Features * Potentiometer or Rheostat configuration options * 7-bit: Resistor Network Resolution - 127 Resistors (128 Steps) * Zero Scale to Full Scale Wiper operation * RAB Resistances: 5 k, 10 k, 50 k, or 100 k * Low Wiper Resistance: 100 (typical) * Low Tempco: - Absolute (Rheostat): 50 ppm typical (0C to 70C) - Ratiometric (Potentiometer): 10 ppm typical * Simple I2C Protocol with read & write commands * Brown-out reset protection (1.5V typical) * Power-on Default Wiper Setting (Mid-scale) * Low-Power Operation: - 2.5 A Static Current (typical) * Wide Operating Voltage Range: - 2.7V to 5.5V - Device Characteristics Specified - 1.8V to 5.5V - Device Operation Rheostat Potentiometer MCP4017 SC70-6 MCP4018 SC70-6 VDD 1 VSS 2 SCL 3 B VDD 1 6 A A W 5 W VSS 2 4 SDA SCL 3 W A B 6 W 5 B 4 SDA MCP4019 SC70-5 VDD 1 VSS 2 SCL 3 5 W W B A 4 SDA * Wide Bandwidth (-3 dB) Operation: - 2 MHz (typical) for 5.0 k device * Extended temperature range (-40C to +125C) * Very small package (SC70) * Lead free (Pb-free) package Control Interface # of Steps Wiper Configuration Memory Type Device Features Options (k) MCP4017 I2C 128 Rheostat RAM 5.0, 10.0, 50.0, 100.0 75 1.8V to 5.5V SC70-6 MCP4018 I2C 128 Potentiometer RAM 5.0, 10.0, 50.0, 100.0 75 1.8V to 5.5V SC70-6 MCP4019 I2C 128 Rheostat RAM 5.0, 10.0, 50.0, 100.0 75 1.8V to 5.5V SC70-5 Device Resistance (typical) Wiper () VDD Operating Range (1) Package Note 1: Analog characteristics only tested from 2.7V to 5.5V (c) 2009 Microchip Technology Inc. DS22147A-page 1 MCP4017/18/19 Device Block Diagram VDD VSS SCL SDA A (2) Power-up/ Brown-out Control W I2C Serial Interface Module, Control Logic, & Memory Resistor Network 0 (Pot 0) B (1, 2) Note 1 Note 1: Some configurations will have this signal internally connected to ground. 2: In some configurations, this signal may not be connected externally (internally floating or grounded). HV Interface WiperLock Technology Comparison of Similar Microchip Devices (1) No No SC70-6 Yes No SOT-23-6 Yes Yes SOT-23-6 Yes No Yes Yes PDIP-8, SOIC-8, MSOP-8, DFN-8 Control Interface # of Steps Wiper Configuration Memory Type Resistance (typical) Options (k) MCP4017 I2C 128 Rheostat RAM 5.0, 10.0, 50.0, 100.0 1.8V to 5.5V MCP4012 U/D 64 Rheostat RAM 2.1, 5.0, 10.0, 50.0 1.8V to 5.5V MCP4022 U/D 64 Rheostat EE 2.1, 5.0, 10.0, 50.0 2.7V to 5.5V MCP4132 SPI 129 Rheostat RAM 5.0, 10.0, 50.0, 100.0 1.8V to 5.5V MCP4142 SPI 129 Rheostat EE 5.0, 10.0, 50.0, 100.0 2.7V to 5.5V MCP4152 SPI 257 Rheostat RAM 5.0, 10.0, 50.0, 100.0 1.8V to 5.5V Yes No MCP4162 SPI 257 Rheostat EE 5.0, 10.0, 50.0, 100.0 2.7V to 5.5V Yes Yes MCP4532 I2C 129 Rheostat RAM 5.0, 10.0, 50.0, 100.0 1.8V to 5.5V Yes No MCP4542 I2C 129 Rheostat EE 5.0, 10.0, 50.0, 100.0 2.7V to 5.5V Yes Yes MCP4552 I2C 257 Rheostat RAM 5.0, 10.0, 50.0, 100.0 1.8V to 5.5V Yes No MCP4562 I2C 257 Rheostat EE 5.0, 10.0, 50.0, 100.0 2.7V to 5.5V Yes Yes MCP4018 I2C 128 Potentiometer RAM 5.0, 10.0, 50.0, 100.0 1.8V to 5.5V No No SC70-6 MCP4013 U/D 64 Potentiometer RAM 2.1, 5.0, 10.0, 50.0 1.8V to 5.5V Yes No SOT-23-6 Device VDD Operating Range (2) Package MSOP-8, DFN-8 MCP4023 U/D 64 Potentiometer EE 2.1, 5.0, 10.0, 50.0 2.7V to 5.5V Yes Yes SOT-23-6 MCP4019 I2C 128 Rheostat RAM 5.0, 10.0, 50.0, 100.0 1.8V to 5.5V No No SC70-5 MCP4014 U/D 64 Rheostat RAM 2.1, 5.0, 10.0, 50.0 1.8V to 5.5V Yes No SOT-23-5 MCP4024 U/D 64 Rheostat EE 2.1, 5.0, 10.0, 50.0 2.7V to 5.5V Yes Yes SOT-23-5 Note 1: 2: This table is broken into three groups by a thick line (and color coding). The unshaded devices in this table are the devices described in this data sheet, while the shaded devices offer a comparable resistor network configuration. Analog characteristics only tested from 2.7V to 5.5V DS22147A-page 2 (c) 2009 Microchip Technology Inc. MCP4017/18/19 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings Voltage on VDD with respect to VSS ..... -0.6V to +7.0V Voltage on SCL, and SDA with respect to VSS ............................................................................. -0.6V to 12.5V Voltage on all other pins (A, W, and B) with respect to VSS ............................ -0.3V to VDD + 0.3V Input clamp current, IIK (VI < 0, VI > VDD, VI > VPP ON HV pins) ........... 20 mA Output clamp current, IOK (VO < 0 or VO > VDD) ....................................... 20 mA Maximum output current sunk by any Output pin ........................................................................... 25 mA Maximum output current sourced by any Output pin ........................................................................... 25 mA Maximum current out of VSS pin ...................... 100 mA Maximum current into VDD pin ......................... 100 mA Maximum current into A, W and B pins........... 2.5 mA Package power dissipation (TA = +50C, TJ = +150C) Notice: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. SC70-5 ............................................................ 302 mW SC70-6 .................................................................. TBD Storage temperature .......................... -65C to +150C Ambient temperature with power applied ........................................................... -40C to +125C ESD protection on all pins ........................ 4 kV (HBM) ........................................................................ 400V (MM) Maximum Junction Temperature (TJ) .............. +150C (c) 2009 Microchip Technology Inc. DS22147A-page 3 MCP4017/18/19 AC/DC CHARACTERISTICS Standard Operating Conditions (unless otherwise specified) Operating Temperature -40C TA +125C (extended) DC Characteristics All parameters apply across the specified operating ranges unless noted. VDD = +2.7V to 5.5V, 5 k, 10 k, 50 k, 100 k devices. Typical specifications represent values for VDD = 5.5V, TA = +25C. Parameters Sym Min Typ Max Units Conditions Supply Voltage VDD 2.7 -- 5.5 V Analog Characteristics specified 1.8 -- 5.5 V Digital Characteristics specified -- -- 1.65 V RAM retention voltage (VRAM) < VBOR VDD Start Voltage to ensure Wiper Reset VBOR VDD Rise Rate to ensure Power-on Reset VDDRR Delay after device exits the reset state (VDD > VBOR) TBORD -- 10 20 S IDD -- 45 80 A Serial Interface Active, Write all 0's to Volatile Wiper VDD = 5.5V, FSCL = 400 kHz -- 2.5 5 A Serial Interface Inactive, (Stop condition, SCL = SDA = VIH), Wiper = 0, VDD = 5.5V Supply Current (Note 8) Note 1: 2: 3: 4: 5: 6: 7: 8: (Note 7) V/ms Resistance is defined as the resistance between terminal A to terminal B. INL and DNL are measured at VW with VA = VDD and VB = VSS. MCP4018 device only, includes VWZSE and VWFSE. Resistor terminals A, W and B's polarity with respect to each other is not restricted. This specification by design. Non-linearity is affected by wiper resistance (RW), which changes significantly over voltage and temperature. POR/BOR is not rate dependent. Supply current is independent of current through the resistor network DS22147A-page 4 (c) 2009 Microchip Technology Inc. MCP4017/18/19 AC/DC CHARACTERISTICS (CONTINUED) Standard Operating Conditions (unless otherwise specified) Operating Temperature -40C TA +125C (extended) DC Characteristics Parameters Resistance ( 20%) All parameters apply across the specified operating ranges unless noted. VDD = +2.7V to 5.5V, 5 k, 10 k, 50 k, 100 k devices. Typical specifications represent values for VDD = 5.5V, TA = +25C. Sym RAB Resolution N Step Resistance RS Wiper Resistance RW Nominal Resistance Tempco RAB/T Ratiometeric Tempco VWB/T Resistor Terminal Input Voltage Range (Terminals A, B and W) Maximum current through Terminal (A, W or B) Note 5 Note 1: 2: 3: 4: 5: 6: 7: 8: Min Typ Max Units Conditions 4.0 5 6.0 k -502 devices (Note 1) 8.0 10 12.0 k -103 devices (Note 1) 40.0 50 60.0 k -503 devices (Note 1) 80.0 100 120.0 k -104 devices (Note 1) -- RAB / (127) 128 Taps -- No Missing Codes Note 5 -- 100 170 VDD = 5.5 V, IW = 2.0 mA, code = 00h -- 155 325 VDD = 2.7 V, IW = 2.0 mA, code = 00h -- 50 -- ppm/C TA = -20C to +70C -- 100 -- ppm/C TA = -40C to +85C -- 150 -- ppm/C TA = -40C to +125C -- 15 -- ppm/C Code = Midscale (3Fh) VA,VW,VB Vss -- VDD V IT -- -- 2.5 mA Terminal A IAW, W = Full Scale (FS) -- -- 2.5 mA Terminal B IBW, W = Zero Scale (ZS) -- -- 2.5 mA Terminal W IAW or IBW, W = FS or ZS -- -- 1.38 mA -- -- 0.688 mA -- -- 0.138 mA -- -- 0.069 mA Note 4, Note 5 IAB, VB = 0V, VA = 5.5V, RAB(MIN) = 4000 Terminal A and Terminal B IAB, VB = 0V, VA = 5.5V, RAB(MIN) = 8000 IAB, VB = 0V, VA = 5.5V, RAB(MIN) = 40000 IAB, VB = 0V, VA = 5.5V, RAB(MIN) = 80000 Resistance is defined as the resistance between terminal A to terminal B. INL and DNL are measured at VW with VA = VDD and VB = VSS. MCP4018 device only, includes VWZSE and VWFSE. Resistor terminals A, W and B's polarity with respect to each other is not restricted. This specification by design. Non-linearity is affected by wiper resistance (RW), which changes significantly over voltage and temperature. POR/BOR is not rate dependent. Supply current is independent of current through the resistor network (c) 2009 Microchip Technology Inc. DS22147A-page 5 MCP4017/18/19 AC/DC CHARACTERISTICS (CONTINUED) Standard Operating Conditions (unless otherwise specified) Operating Temperature -40C TA +125C (extended) DC Characteristics Parameters Full Scale Error (MCP4018 only) (code = 7Fh) Zero Scale Error (MCP4018 only) (code = 00h) All parameters apply across the specified operating ranges unless noted. VDD = +2.7V to 5.5V, 5 k, 10 k, 50 k, 100 k devices. Typical specifications represent values for VDD = 5.5V, TA = +25C. Sym Min Typ Max Units VWFSE -3.0 -0.1 -- LSb 5 k 2.7V VDD 5.5V -2.0 -0.1 -- LSb 10 k 2.7V VDD 5.5V -0.5 -0.1 -- LSb 50 k 2.7V VDD 5.5V -0.5 -0.1 -- LSb 100 k 2.7V VDD 5.5V -- +0.1 +3.0 LSb 5 k 2.7V VDD 5.5V -- +0.1 +2.0 LSb 10 k 2.7V VDD 5.5V -- +0.1 +0.5 LSb 50 k 2.7V VDD 5.5V -- +0.1 +0.5 LSb 100 k 2.7V VDD 5.5V VWZSE Conditions Potentiometer Integral Non-linearity INL -0.5 0.25 +0.5 LSb 2.7V VDD 5.5V MCP4018 device only (Note 2) Potentiometer Differential Nonlinearity DNL -0.25 0.125 +0.25 LSb 2.7V VDD 5.5V MCP4018 device only (Note 2) Bandwidth -3 dB (See Figure 2-83, load = 30 pF) BW -- 2 -- MHz 5 k Code = 3Fh Note 1: 2: 3: 4: 5: 6: 7: 8: -- 1 -- MHz 10 k Code = 3Fh -- 260 -- kHz 50 k Code = 3Fh -- 100 -- kHz 100 k Code = 3Fh Resistance is defined as the resistance between terminal A to terminal B. INL and DNL are measured at VW with VA = VDD and VB = VSS. MCP4018 device only, includes VWZSE and VWFSE. Resistor terminals A, W and B's polarity with respect to each other is not restricted. This specification by design. Non-linearity is affected by wiper resistance (RW), which changes significantly over voltage and temperature. POR/BOR is not rate dependent. Supply current is independent of current through the resistor network DS22147A-page 6 (c) 2009 Microchip Technology Inc. MCP4017/18/19 AC/DC CHARACTERISTICS (CONTINUED) Standard Operating Conditions (unless otherwise specified) Operating Temperature -40C TA +125C (extended) DC Characteristics All parameters apply across the specified operating ranges unless noted. VDD = +2.7V to 5.5V, 5 k, 10 k, 50 k, 100 k devices. Typical specifications represent values for VDD = 5.5V, TA = +25C. Parameters Sym Min Typ Max Rheostat Integral Non-linearity MCP4018 (Note 3) MCP4017 and MCP4019 devices only (Note 3) R-INL -2.0 0.5 +2.0 LSb -5.0 +3.5 +5.0 LSb See Section 2.0 1.8V (Note 6) 10 k 5.5V, IW = 450 A LSb -4.0 +2.5 +4.0 LSb 2.7V, IW = 215 A (Note 6) LSb 1.8V (Note 6) 0.5 +1.125 LSb -1.5 +1 +1.5 LSb 2.7V, IW = 43 A (Note 6) LSb 1.8V (Note 6) -0.8 0.5 +0.8 LSb -1.125 +0.25 +1.125 LSb 50 k 5.5V, IW = 90 A -1.125 100 k 5.5V, IW = 45 A 2.7V, IW = 21.5 A (Note 6) LSb 1.8V (Note 6) 0.25 +0.5 LSb -0.75 +0.5 +0.75 LSb 2.7V, IW = 430 A (Note 6) LSb 1.8V (Note 6) See Section 2.0 5 k 5.5V, IW = 900 mA -0.5 -0.5 0.25 +0.5 LSb -0.75 +0.5 +0.75 LSb 2.7V, IW = 215 A (Note 6) LSb 1.8V (Note 6) See Section 2.0 -0.375 0.25 +0.375 LSb -0.375 0.25 +0.375 LSb LSb -0.375 0.25 +0.375 LSb -0.375 0.25 +0.375 LSb See Section 2.0 CAW -- 75 Capacitance (Pw) CW -- 120 Capacitance (PB) CBW -- 75 7: 8: 2.7V, IW = 430 A (Note 6) LSb See Section 2.0 Note 1: 2: 3: 4: 5: 6: 5.5V, IW = 900 A +2.0 See Section 2.0 Capacitance (PA) 5 k 0.5 See Section 2.0 R-DNL Conditions -2.0 See Section 2.0 Rheostat Differential Nonlinearity MCP4018 (Note 3) MCP4017 and MCP4019 devices only (Note 3) Units LSb -- 10 k 50 k 5.5V, IW = 450 A 5.5V, IW = 90 A 2.7V, IW = 43 A (Note 6) 1.8V (Note 6) 100 k 5.5V, IW = 45 A 2.7V, IW = 21.5 A (Note 6) 1.8V (Note 6) pF f =1 MHz, Code = Full Scale -- pF f =1 MHz, Code = Full Scale -- pF f =1 MHz, Code = Full Scale Resistance is defined as the resistance between terminal A to terminal B. INL and DNL are measured at VW with VA = VDD and VB = VSS. MCP4018 device only, includes VWZSE and VWFSE. Resistor terminals A, W and B's polarity with respect to each other is not restricted. This specification by design. Non-linearity is affected by wiper resistance (RW), which changes significantly over voltage and temperature. POR/BOR is not rate dependent. Supply current is independent of current through the resistor network (c) 2009 Microchip Technology Inc. DS22147A-page 7 MCP4017/18/19 AC/DC CHARACTERISTICS (CONTINUED) Standard Operating Conditions (unless otherwise specified) Operating Temperature -40C TA +125C (extended) DC Characteristics All parameters apply across the specified operating ranges unless noted. VDD = +2.7V to 5.5V, 5 k, 10 k, 50 k, 100 k devices. Typical specifications represent values for VDD = 5.5V, TA = +25C. Parameters Sym Min Typ Max Units Conditions Digital Inputs/Outputs (SDA, SCK) Schmitt Trigger High Input Threshold VIH 0.7 VDD -- -- V Schmitt Trigger Low Input Threshold VIL -0.5 -- 0.3VDD V Hysteresis of Schmitt Trigger Inputs (Note 5) VHYS -- 0.1VDD -- V N.A. -- -- V N.A. -- -- V 0.1 VDD -- -- V 0.05 VDD -- -- V VSS -- 0.2VDD V 1.8V VDD 5.5V All inputs except SDA and SCL SDA and SCL 100 kHz 400 kHz VDD < 2.0V VDD 2.0V VDD < 2.0V VDD 2.0V Output Low Voltage (SDA) VOL VSS -- 0.4 V VDD 2.0V, IOL = 3 mA Input Leakage Current IIL -1 -- 1 A VIN = VDD and VIN = VSS CIN, COUT -- 10 -- pF fC = 400 kHz N 0h -- 7Fh hex Pin Capacitance VDD < 2.0V, IOL = 1 mA RAM (Wiper) Value Value Range Wiper POR/BOR Value 3Fh NPOR/BOR hex Power Requirements Power Supply Sensitivity (MCP4018 only) Note 1: 2: 3: 4: 5: 6: 7: 8: PSS -- 0.0005 0.0035 %/% VDD = 2.7V to 5.5V, VA = 2.7V, Code = 3Fh Resistance is defined as the resistance between terminal A to terminal B. INL and DNL are measured at VW with VA = VDD and VB = VSS. MCP4018 device only, includes VWZSE and VWFSE. Resistor terminals A, W and B's polarity with respect to each other is not restricted. This specification by design. Non-linearity is affected by wiper resistance (RW), which changes significantly over voltage and temperature. POR/BOR is not rate dependent. Supply current is independent of current through the resistor network DS22147A-page 8 (c) 2009 Microchip Technology Inc. MCP4017/18/19 1.1 I2C Mode Timing Waveforms and Requirements FIGURE 1-1: I2C Bus Start/Stop Bits Timing sWa/S (c) 2009 Microchip Technology Inc. DS22147A-page 9 MCP4017/18/19 I2C BUS DATA REQUIREMENTS (SLAVE MODE) TABLE 1-2: I2C AC Characteristics Parameter No. Sym Characteristic 100 THIGH Clock high time 101 TLOW Standard Operating Conditions (unless otherwise specified) Operating Temperature -40C TA +125C (Extended) Operating Voltage VDD range is described in AC/DC characteristics Min Max Units 100 kHz mode 4000 -- ns 1.8V-5.5V 600 4700 -- -- ns ns 2.7V-5.5V Clock low time 400 kHz mode 100 kHz mode 1300 -- -- 1000 ns ns 102A (5) TRSCL SCL rise time 400 kHz mode 100 kHz mode 102B (5) TRSDA SDA rise time 400 kHz mode 100 kHz mode 20 + 0.1Cb -- 300 1000 ns ns 103A (5) TFSCL SCL fall time 400 kHz mode 100 kHz mode 20 + 0.1Cb -- 300 300 ns ns (5) TFSDA SDA fall time 400 kHz mode 100 kHz mode 20 + 0.1Cb -- 40 300 ns ns 400 kHz mode 300 ns 100 kHz mode 20 + 0.1Cb (4) 0 -- ns 400 kHz mode 100 kHz mode 0 250 -- -- ns ns 400 kHz mode 100 kHz mode 100 -- -- 3450 ns ns 400 kHz mode 100 kHz mode -- 4700 900 -- ns ns 400 kHz mode 1300 -- ns 103B 106 THD:DAT Data input hold time 107 TSU:DAT 109 TAA 110 TBUF 2: 3: 4: 5: 6: Output valid from clock Bus free time 1.8V-5.5V 2.7V-5.5V Cb is specified to be from 10 to 400 pF Cb is specified to be from 10 to 400 pF Cb is specified to be from 10 to 400 pF Cb is specified to be from 10 to 400 pF 1.8V-5.5V, Note 6 2.7V-5.5V, Note 6 (2) (1) Time the bus must be free before a new transmission can start Philips Spec states N.A. Input filter spike 100 kHz mode -- 50 ns suppression 400 kHz mode -- 50 ns (SDA and SCL) As a transmitter, the device must provide this internal minimum delay time to bridge the undefined region (min. 300 ns) of the falling edge of SCL to avoid unintended generation of START or STOP conditions. A fast-mode (400 kHz) I2C-bus device can be used in a standard-mode (100 kHz) I2C-bus system, but the requirement tsu; DAT 250 ns must then be met. This will automatically be the case if the device does not stretch the LOW period of the SCL signal. If such a device does stretch the LOW period of the SCL signal, it must output the next data bit to the SDA line TR max.+tsu;DAT = 1000 + 250 = 1250 ns (according to the standard-mode I2C bus specification) before the SCL line is released. The MCP4018/MCP4019 device must provide a data hold time to bridge the undefined part between VIH and VIL of the falling edge of the SCL signal. This specification is not a part of the I2C specification, but must be tested in order to guarantee that the output data will meet the setup and hold specifications for the receiving device. Use Cb in pF for the calculations. Not Tested. A Master Transmitter must provide a delay to ensure that difference between SDA and SCL fall times do not unintentionally create a Start or Stop condition. TSP Note 1: Data input setup time Conditions DS22147A-page 10 (c) 2009 Microchip Technology Inc. MCP4017/18/19 TEMPERATURE CHARACTERISTICS Electrical Specifications: Unless otherwise indicated, VDD = +1.8V to +5.5V, VSS = GND. Parameters Sym Min Typ Max Units Specified Temperature Range TA -40 -- +125 C Operating Temperature Range TA -40 -- +125 C Storage Temperature Range TA -65 -- +150 C Thermal Resistance, 5L-SC70 (Note 1) JA -- 331 -- C/W Thermal Resistance, 6L-SC70 JA -- TBD -- C/W Conditions Temperature Ranges Thermal Package Resistances Note 1: Package Power Dissipation (PDIS) is calculated as follows: PDIS = (TJ - TA) / JA, where: TJ = Junction Temperature, TA = Ambient Temperature. (c) 2009 Microchip Technology Inc. DS22147A-page 11 MCP4017/18/19 NOTES: DS22147A-page 12 (c) 2009 Microchip Technology Inc. MCP4017/18/19 2.0 TYPICAL PERFORMANCE CURVES Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Note: Unless otherwise indicated, TA = +25C, VDD = 5V, VSS = 0V. IDD Interface Inactive (A) 60 50 IDD (A) 40 400 kHz, 5.5V 30 20 400 kHz, 2.7V 10 100 kHz, 5.5V 100 kHz, 2.7V 0 -40 0 40 80 Temperature (C) 120 FIGURE 2-1: Interface Active Current (IDD) vs. SCL Frequency (fSCL) and Temperature (VDD = 1.8V, 2.7V and 5.5V). (c) 2009 Microchip Technology Inc. 2 1.8 1.6 1.4 1.2 1 0.8 0.6 0.4 0.2 0 5.5V 2.7V -40 0 40 80 120 Temperature (C) FIGURE 2-2: Interface Inactive Current (ISHDN) vs. Temperature and VDD. (VDD = 1.8V, 2.7V and 5.5V). DS22147A-page 13 MCP4017/18/19 Note: Unless otherwise indicated, TA = +25C, VDD = 5V, VSS = 0V. DNL 0.2 0.1 INL 80 0 60 -0.1 25C -0.2 20 -0.3 260 25C Rw 25C INL 25C DNL 85C Rw 85C INL 85C DNL 125C Rw 125C INL 125C DNL 125C 220 85 INL 180 140 100 RW 60 -40C 25C -0.2 DNL 20 2000 25C Rw 25C INL 25C DNL INL 85C Rw 85C INL 85C DNL DNL 125C Rw 125C INL 125C DNL 0.05 1000 -0.05 -0.15 RW -0.25 0 Note: FIGURE 2-5: 5.0 k : Pot Mode - RW (), INL (LSb), DNL (LSb) vs. Wiper Setting and Temperature (VDD = 1.8V). (A = VDD, B = VSS) -0.1 -0.2 85C Rw 85C INL 85C DNL 125C Rw 125C INL 125C DNL INL 125C 3 2 1 RW 0 60 DNL -40C 20 -1 32 64 96 Wiper Setting (decimal) FIGURE 2-7: 5.0 k : Rheo Mode - RW (), INL (LSb), DNL (LSb) vs. Wiper Setting and Temperature (VDD = 2.7V).(IW = 450uA, B = VSS) -40C Rw -40C INL -40C DNL 2000 25C Rw 25C INL 25C DNL RW 85C Rw 85C INL 85C DNL INL 44 39 34 24 19 1000 14 DNL 500 9 4 0 -1 0 Note: 125C Rw 125C INL 125C DNL 29 1500 32 64 96 Wiper Setting (decimal) Refer to AN1080 for additional information on the characteristics of the wiper resistance (RW) with respect to device voltage and wiper setting value. DS22147A-page 14 85C 25C 25C Rw 25C INL 25C DNL 100 -0.35 0 -40C Rw -40C INL -40C DNL 2500 0.25 0.15 DNL 140 0.35 1500 500 RW -0.3 180 Wiper Resistance (RW) (ohms) -40C Rw -40C INL -40C DNL 25C 32 64 96 Wiper Setting (decimal) 0 Error (LSb) Wiper Resistance (RW) (ohms) 2500 0.1 INL 32 64 96 Wiper Setting (decimal) FIGURE 2-4: 5.0 k : Pot Mode - RW (), INL (LSb), DNL (LSb) vs. Wiper Setting and Temperature (VDD = 2.7V). (A = VDD, B = VSS) 0.2 FIGURE 2-6: 5.0 k : Rheo Mode - RW (), INL (LSb), DNL (LSb) vs. Wiper Setting and Temperature (VDD = 5.5V).(IW = 1.4mA, B = VSS) -0.3 0 -40C 40 220 -0.1 0.3 0 260 0.2 0 125C 60 300 0.3 0.1 125C Rw 125C INL 125C DNL 80 0 Error (LSb) Wiper Resistance (RW) (ohms) -40C Rw -40C INL -40C DNL 85C Rw 85C INL 85C DNL 20 FIGURE 2-3: 5.0 k : Pot Mode - RW (), INL (LSb), DNL (LSb) vs. Wiper Setting and Temperature (VDD = 5.5V). (A = VDD, B = VSS). 300 25C Rw 25C INL 25C DNL 85C 32 64 96 Wiper Setting (decimal) Wiper Resistance (RW) (ohms) 0 -40C Rw -40C INL -40C DNL 100 RW -40C 40 120 0.3 Error (LSb) 125C 125C Rw 125C INL 125C DNL Error (LSb) 85C 85C Rw 85C INL 85C DNL Error (LSb) 100 25C Rw 25C INL 25C DNL Wiper Resistance (RW) (ohms) -40C Rw -40C INL -40C DNL Error (LSb) Wiper Resistance (RW) (ohms) 120 32 64 96 Wiper Setting (decimal) Refer to AN1080 for additional information on the characteristics of the wiper resistance (RW) with respect to device voltage and wiper setting value. FIGURE 2-8: 5.0 k : Rheo Mode - RW (), INL (LSb), DNL (LSb) vs. Wiper Setting and Temperature (VDD = 1.8V). (IW = TBD, B = VSS) (c) 2009 Microchip Technology Inc. MCP4017/18/19 Note: Unless otherwise indicated, TA = +25C, VDD = 5V, VSS = 0V. 0.0 -0.2 -0.4 -0.6 -0.8 -1.0 -1.2 -1.4 -1.6 -1.8 -40 0 40 80 Ambient Temperature (C) 120 FIGURE 2-9: 5.0 k : Full Scale Error (FSE) vs. Temperature (VDD = 5.5V, 2.7V, 1.8V). RWB / T vs. Code. FIGURE 2-12: 5.0 k : RBW Tempco FIGURE 2-10: 5.0 k : Zero Scale Error (ZSE) vs. Temperature (VDD = 5.5V, 2.7V, 1.8V). FIGURE 2-13: Response Time. 5.0 k : Power-Up Wiper FIGURE 2-11: 5.0 k : Nominal Resistance () vs. Temperature and VDD. FIGURE 2-14: 5.0 k : Digital Feedthrough (SCL signal coupling to Wiper pin). (c) 2009 Microchip Technology Inc. DS22147A-page 15 MCP4017/18/19 Note: Unless otherwise indicated, TA = +25C, VDD = 5V, VSS = 0V. FIGURE 2-15: 5.0 k : Write Wiper (40h 3Fh) Settling Time (VDD=5.5V). FIGURE 2-18: 5.0 k : Write Wiper (FFh 00h) Settling Time (VDD=5.5V). FIGURE 2-16: 5.0 k : Write Wiper (40h 3Fh) Settling Time (VDD=2.7V). FIGURE 2-19: 5.0 k : Write Wiper (FFh 00h) Settling Time (VDD=2.7V). FIGURE 2-17: 5.0 k : Write Wiper (40h 3Fh) Settling Time (VDD=1.8V). FIGURE 2-20: 5.0 k : Write Wiper (FFh 00h) Settling Time (VDD=1.8V). DS22147A-page 16 (c) 2009 Microchip Technology Inc. MCP4017/18/19 Note: Unless otherwise indicated, TA = +25C, VDD = 5V, VSS = 0V. -40C Rw -40C INL -40C DNL 25C Rw 25C INL 25C DNL 85C Rw 85C INL 85C DNL 100 125C Rw 125C INL 125C DNL 0.3 0.2 125C 85C 0.1 80 0 60 -0.1 -40C 40 DNL RW INL 25C Error (LSb) Wiper Resistance (RW) (ohms) 120 -0.2 20 -0.3 0 32 64 96 Wiper Setting (decimal) FIGURE 2-21: 10 k Pot Mode : RW (), INL (LSb), DNL (LSb) vs. Wiper Setting and Temperature (VDD = 5.5V). (A = VDD, B = VSS) -40C Rw -40C INL -40C DNL 260 25C Rw 25C INL 25C DNL INL 220 85C Rw 85C INL 85C DNL 125C Rw 125C INL 125C DNL 0.3 0.2 125C 85 0.1 180 0 140 -0.1 DNL 100 RW 25C 60 Error (LSb) Wiper Resistance (RW) (ohms) 300 -0.2 -40C 20 -0.3 0 32 64 96 Wiper Setting (decimal) FIGURE 2-22: 10 k Pot Mode : RW (), INL (LSb), DNL (LSb) vs. Wiper Setting and Temperature (VDD = 2.7V). (A = VDD, B = VSS) -40C Rw -40C INL -40C DNL 3000 25C Rw 25C INL 25C DNL 85C Rw 85C INL 85C DNL 125C Rw 125C INL 125C DNL 0.35 0.25 0.15 DNL 2000 FIGURE 2-25: 10 k Rheo Mode : RW (), INL (LSb), DNL (LSb) vs. Wiper Setting and Temperature (VDD = 2.7V).(IW = 210uA, B = VSS) 0.05 Error (LSb) Wiper Resistance (RW) (ohms) FIGURE 2-24: 10 k Rheo Mode : RW (), INL (LSb), DNL (LSb) vs. Wiper Setting and Temperature (VDD = 5.5V).(IW = 450uA, B = VSS) -0.05 1000 RW -0.15 -0.25 0 -0.35 0 Note: INL 32 64 96 Wiper Setting (decimal) Refer to AN1080 for additional information on the characteristics of the wiper resistance (RW) with respect to device voltage and wiper setting value. FIGURE 2-23: 10 k Pot Mode : RW (), INL (LSb), DNL (LSb) vs. Wiper Setting and Temperature (VDD = 1.8V). (A = VDD, B = VSS) (c) 2009 Microchip Technology Inc. FIGURE 2-26: 10 k Rheo Mode : RW (), INL (LSb), DNL (LSb) vs. Wiper Setting and Temperature (VDD = 1.8V). (IW = TBD, B = VSS) DS22147A-page 17 MCP4017/18/19 0.0 -0.1 -0.2 -0.3 -0.4 -0.5 -0.6 -0.7 -0.8 -0.9 -1.0 100 RBW Tempco (PPM) Full-Scale Error (FSE) (LSb) Note: Unless otherwise indicated, TA = +25C, VDD = 5V, VSS = 0V. 5.5V 2.7 1.8V 80 2.7V 60 40 5.5V 20 0 -40 0 40 80 Ambient Temperature (C) 120 FIGURE 2-27: 10 k : Full Scale Error (FSE) vs. Temperature (VDD = 5.5V, 2.7V, 1.8V). 0 32 64 96 Wiper Setting (decimal) FIGURE 2-30: 10 k : RBW Tempco FIGURE 2-31: Response Time. 10 k : Power-Up Wiper RWB / T vs. Code. Zero-Scale Error (ZSE) (LSb) 0.9 0.8 0.7 0.6 1.8V 0.5 2.7 0.4 0.3 0.2 5.5V 0.1 0.0 -40 0 40 80 Ambient Temperature (C) 120 FIGURE 2-28: 10 k : Zero Scale Error (ZSE) vs. Temperature (VDD = 5.5V, 2.7V, 1.8V). Nominal Resistance (RAB) (Ohms) 10200 10150 10100 Wiper 1.8V 10050 VDD 10000 2.7 9950 5.5V 9900 -40 0 40 80 Ambient Temperature (C) 120 FIGURE 2-29: 10 k : Nominal Resistance () vs. Temperature and VDD. DS22147A-page 18 FIGURE 2-32: 10 k : Digital Feedthrough (SCL signal coupling to Wiper pin). (c) 2009 Microchip Technology Inc. MCP4017/18/19 Note: Unless otherwise indicated, TA = +25C, VDD = 5V, VSS = 0V. FIGURE 2-33: 10 k : Write Wiper (40h 3Fh) Settling Time (VDD=5.5V). FIGURE 2-36: 10 k : Write Wiper (FFh 00h) Settling Time (VDD=5.5V). FIGURE 2-34: 10 k : Write Wiper (40h 3Fh) Settling Time (VDD=2.7V). FIGURE 2-37: 10 k : Write Wiper (FFh 00h) Settling Time (VDD=2.7V). FIGURE 2-35: 10 k : Write Wiper (40h 3Fh) Settling Time (VDD=1.8V). FIGURE 2-38: 10 k : Write Wiper (FFh 00h) Settling Time (VDD=1.8V). (c) 2009 Microchip Technology Inc. DS22147A-page 19 MCP4017/18/19 Note: Unless otherwise indicated, TA = +25C, VDD = 5V, VSS = 0V. -40C Rw -40C INL -40C DNL 100 25C Rw 25C INL 25C DNL 85C 85C Rw 85C INL 85C DNL 125C Rw 125C INL 125C DNL 0.3 0.2 125C 0.1 80 0 60 DNL -0.1 INL -40C 40 Error (LSb) Wiper Resistance (RW) (ohms) 120 RW -0.2 25C 20 -0.3 0 32 64 96 Wiper Setting (decimal) FIGURE 2-39: 50 k Pot Mode : RW (), INL (LSb), DNL (LSb) vs. Wiper Setting and Temperature (VDD = 5.5V). -40C Rw -40C INL -40C DNL 260 25C Rw 25C INL 25C DNL 85C Rw 85C INL 85C DNL 125C 85 220 125C Rw 125C INL 125C DNL 0.3 0.2 0.1 180 0 140 100 DNL INL 25C 60 -40C 20 Error (LSb) Wiper Resistance (RW) (ohms) 300 -0.1 RW -0.2 -0.3 0 32 64 96 Wiper Setting (decimal) FIGURE 2-40: 50 k Pot Mode : RW (), INL (LSb), DNL (LSb) vs. Wiper Setting and Temperature (VDD = 2.7V). Note: FIGURE 2-42: 50 k Rheo Mode : RW (), INL (LSb), DNL (LSb) vs. Wiper Setting and Temperature (VDD = 5.5V).(IW = 90uA, B = VSS) FIGURE 2-43: 50 k Rheo Mode : RW (), INL (LSb), DNL (LSb) vs. Wiper Setting and Temperature (VDD = 2.7V).(IW = 45uA, B = VSS) Refer to AN1080 for additional information on the characteristics of the wiper resistance (RW) with respect to device voltage and wiper setting value. FIGURE 2-41: 50 k Pot Mode : RW (), INL (LSb), DNL (LSb) vs. Wiper Setting and Temperature (VDD = 1.8V). DS22147A-page 20 FIGURE 2-44: 50 k Rheo Mode : RW (), INL (LSb), DNL (LSb) vs. Wiper Setting and Temperature (VDD = 1.8V). (IW = TBD, B = VSS) (c) 2009 Microchip Technology Inc. MCP4017/18/19 Note: Unless otherwise indicated, TA = +25C, VDD = 5V, VSS = 0V. 100 -0.04 RBW Tempco (PPM) Full-Scale Error (FSE) (LSb) 0.00 -0.08 2.7 5.5V -0.12 1.8V -0.16 80 60 2.7V 40 5.5V 20 0 -40 0 40 80 Ambient Temperature (C) 120 FIGURE 2-45: 50 k : Full Scale Error (FSE) vs. Temperature (VDD = 5.5V, 2.7V, 1.8V). 0 32 64 96 Wiper Setting (decimal) FIGURE 2-48: 50 k : RBW Tempco FIGURE 2-49: Response Time. 50 k : Power-Up Wiper RWB / T vs. Code. Zero-Scale Error (ZSE) (LSb) 0.20 0.16 1.8V 0.12 2.7 0.08 0.04 5.5V 0.00 -40 0 40 80 Ambient Temperature (C) 120 FIGURE 2-46: 50 k : Zero Scale Error (ZSE) vs. Temperature (VDD = 5.5V, 2.7V, 1.8V). Nominal Resistance (RAB) (Ohms) 49800 49600 Wiper 49400 49200 VDD 1.8V 49000 2.7V 5.5V 48800 -40 0 40 80 Ambient Temperature (C) 120 FIGURE 2-47: 50 k : Nominal Resistance () vs. Temperature and VDD. (c) 2009 Microchip Technology Inc. FIGURE 2-50: 50 k : Digital Feedthrough (SCL signal coupling to Wiper pin). DS22147A-page 21 MCP4017/18/19 Note: Unless otherwise indicated, TA = +25C, VDD = 5V, VSS = 0V. FIGURE 2-51: 50 k : Write Wiper (40h 3Fh) Settling Time (VDD=5.5V). FIGURE 2-54: 50 k : Write Wiper (FFh 00h) Settling Time (VDD=5.5V). FIGURE 2-52: 50 k : Write Wiper (40h 3Fh) Settling Time (VDD=2.7V). FIGURE 2-55: 50 k : Write Wiper (FFh 00h) Settling Time (VDD=2.7V). FIGURE 2-53: 50 k : Write Wiper (40h 3Fh) Settling Time (VDD=1.8V). FIGURE 2-56: 50 k : Write Wiper (FFh 00h) Settling Time (VDD=1.8V). DS22147A-page 22 (c) 2009 Microchip Technology Inc. MCP4017/18/19 Note: Unless otherwise indicated, TA = +25C, VDD = 5V, VSS = 0V. 85C Rw 85C INL 85C DNL 125C 85C 125C Rw 125C INL 125C DNL DNL 0.2 0.1 80 0 60 INL 40 120 0.3 -0.1 25C -0.2 20 -0.3 0 25C Rw 25C INL 25C DNL DNL 220 85 85C Rw 85C INL 85C DNL 125C Rw 125C INL 125C DNL 0.1 0 60 -0.1 40 INL -0.2 -0.3 32 64 96 Wiper Setting (decimal) FIGURE 2-60: 100 k Rheo Mode : RW (), INL (LSb), DNL (LSb) vs. Wiper Setting and Temperature (VDD = 5.5V). (IW = 45uA, B = VSS) 0.3 0.2 0.1 0 140 -0.1 100 INL 25C 60 RW -40C 20 -0.2 -0.3 0 32 64 96 Wiper Setting (decimal) FIGURE 2-58: 100 k Pot Mode : RW (), INL (LSb), DNL (LSb) vs. Wiper Setting and Temperature (VDD = 2.7V). -40C Rw -40C INL -40C DNL 12500 25C Rw 25C INL 25C DNL 85C Rw 85C INL 85C DNL 0.35 0.25 0.15 DNL 10000 125C Rw 125C INL 125C DNL 0.05 7500 FIGURE 2-61: 100 k Rheo Mode : RW (), INL (LSb), DNL (LSb) vs. Wiper Setting and Temperature (VDD = 2.7V). (IW = 21uA, B = VSS) Error (LSb) 15000 Wiper Resistance (RW) (ohms) 0.2 125C 180 -0.05 5000 -0.15 2500 RW INL 0 -0.25 -0.35 0 Note: 0.3 Error (LSb) Wiper Resistance (RW) (ohms) -40C Rw -40C INL -40C DNL 125C Rw 125C INL 125C DNL 80 0 FIGURE 2-57: 100 k Pot Mode : RW (), INL (LSb), DNL (LSb) vs. Wiper Setting and Temperature (VDD = 5.5V). 260 85C Rw 85C INL 85C DNL 20 32 64 96 Wiper Setting (decimal) 300 25C Rw 25C INL 25C DNL 100 RW -40C -40C Rw -40C INL -40C DNL Error (LSb) 100 25C Rw 25C INL 25C DNL Wiper Resistance (RW) (ohms) -40C Rw -40C INL -40C DNL Error (LSb) Wiper Resistance (RW) (ohms) 120 32 64 96 Wiper Setting (decimal) Refer to AN1080 for additional information on the characteristics of the wiper resistance (RW) with respect to device voltage and wiper setting value. FIGURE 2-59: 100 k Pot Mode : RW (), INL (LSb), DNL (LSb) vs. Wiper Setting and Temperature (VDD = 1.8V). (c) 2009 Microchip Technology Inc. FIGURE 2-62: 100 k Rheo Mode : RW (), INL (LSb), DNL (LSb) vs. Wiper Setting and Temperature (VDD = 1.8V). (IW = TBD, B = VSS) DS22147A-page 23 MCP4017/18/19 Note: Unless otherwise indicated, TA = +25C, VDD = 5V, VSS = 0V. 100 -0.02 RBW Tempco (PPM) Full-Scale Error (FSE) (LSb) 0.00 5.5V -0.04 2.7 -0.06 80 60 2.7V 40 20 5.5V 1.8V -0.08 0 -40 0 40 80 Ambient Temperature (C) 120 FIGURE 2-63: 100 k : Full Scale Error (FSE) vs. Temperature (VDD = 5.5V, 2.7V, 1.8V). 0 32 64 96 Wiper Setting (decimal) FIGURE 2-66: 100 k : RBW Tempco RWB / T vs. Code. Zero-Scale Error (ZSE) (LSb) 0.12 0.08 1.8V 2.7 0.04 5.5V 0.00 -40 0 40 80 Ambient Temperature (C) 120 Nominal Resistance (RAB) (Ohms) FIGURE 2-64: 100 k : Zero Scale Error (ZSE) vs. Temperature (VDD = 5.5V, 2.7V, 1.8V). 99800 99600 99400 99200 99000 98800 98600 98400 98200 98000 97800 FIGURE 2-67: Response Time. 100 k : Power-Up Wiper Wiper VDD 1.8V 2.7V 5.5V -40 0 40 80 Ambient Temperature (C) FIGURE 2-65: 100 k : Nominal Resistance () vs. Temperature and VDD. DS22147A-page 24 120 FIGURE 2-68: 100 k : Digital Feedthrough (SCL signal coupling to Wiper pin). (c) 2009 Microchip Technology Inc. MCP4017/18/19 Note: Unless otherwise indicated, TA = +25C, VDD = 5V, VSS = 0V. FIGURE 2-69: 100 k : Write Wiper (40h 3Fh) Settling Time (VDD = 5.5V). FIGURE 2-72: 100 k : Write Wiper (FFh 00h) Settling Time (VDD = 5.5V). FIGURE 2-70: 100 k : Write Wiper (40h 3Fh) Settling Time (VDD = 2.7V). FIGURE 2-73: 100 k : Write Wiper (FFh 00h) Settling Time (VDD = 2.7V). FIGURE 2-71: 100 k : Write Wiper (40h 3Fh) Settling Time (VDD = 1.8V). FIGURE 2-74: 100 k : Write Wiper (FFh 00h) Settling Time (VDD = 1.8V). (c) 2009 Microchip Technology Inc. DS22147A-page 25 MCP4017/18/19 Note: Unless otherwise indicated, TA = +25C, VDD = 5V, VSS = 0V. 4 0.3 3.5 2.5 VOL (mV) VIH (V) 0.25 5.5V 3 2.7V 2 1.5 1 2.7V (@ 3mA) 0.2 0.15 5.5V (@ 3mA) 0.1 1.8V (@ 1mA) 0.05 0.5 1.8V 0 -40 0 40 80 0 120 -40 0 Temperature (C) FIGURE 2-75: Temperature. VIH (SCL, SDA) vs. VDD and FIGURE 2-77: Temperature. 80 120 VOL (SDA) vs. VDD and 1.2 2 5.5 V 1 5.5V 1.5 2.7V 0.8 VDD (V) VIL (V) 40 Temperature (C) 1 2.7V 0.6 0.4 0.5 1.8V 0.2 0 0 -40 0 40 80 120 -40 0 Temperature (C) FIGURE 2-76: Temperature. DS22147A-page 26 VIL (SCL, SDA) vs. VDD and 40 80 120 Temperature (C) FIGURE 2-78: and Temperature. POR/BOR Trip point vs. VDD (c) 2009 Microchip Technology Inc. MCP4017/18/19 Note: Unless otherwise indicated, TA = +25C, VDD = 5V, VSS = 0V. 10 10 Code = 7Fh Code = 3Fh dB dB -30 Code = 0Fh Code = 3Fh -10 -10 -20 Code = 7Fh 0 0 Code = 1Fh Code = 1Fh -20 Code = 0Fh -30 Code = 01h -40 Code = 01h -40 -50 -50 100 1,000 -60 100 10,000 5 k - Gain vs. Frequency FIGURE 2-79: (-3dB). Test Circuits Code = 7Fh 0 dB -30 +5V Code = 3Fh -10 -20 10,000 FIGURE 2-82: 100 k - Gain vs. Frequency (-3dB). 2.1 10 1,000 Frequency (kHz) Frequency (kHz) Code = 0Fh VIN Code = 1Fh Code = 01h -40 A B -50 -60 100 1,000 W +5V + VOUT - 10,000 Frequency (kHz) FIGURE 2-80: (-3dB). 10 k - Gain vs. Frequency FIGURE 2-83: (-3dB). 10 Gain vs. Frequency Test Code = 7Fh 0 Code = 3Fh dB -10 Code = 1Fh -20 -30 Code = 0Fh Code = 01h -40 -50 -60 100 1,000 10,000 Frequency (kHz) FIGURE 2-81: (-3dB). 50 k - Gain vs. Frequency (c) 2009 Microchip Technology Inc. DS22147A-page 27 MCP4017/18/19 NOTES: DS22147A-page 28 (c) 2009 Microchip Technology Inc. MCP4017/18/19 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 3-1. Additional descriptions of the device pins follow. TABLE 3-1: Pin Name PINOUT DESCRIPTION FOR THE MCP4017/18/19 Pin Number MCP4017 MCP4018 MCP4019 (SC70-6) (SC70-6) (SC70-5) Pin Type Buffer Type Function VDD 1 1 1 P -- Positive Power Supply Input VSS 2 2 2 P -- Ground SCL 3 3 3 I/O ST (OD) I2C Serial Clock pin SDA 4 4 4 I/O ST (OD) I2C Serial Data pin B 5 -- -- I/O A Potentiometer Terminal B W 6 5 5 I/O A Potentiometer Wiper Terminal A -- 6 -- I/O A Potentiometer Terminal A Legend: A = Analog input I = Input (c) 2009 Microchip Technology Inc. ST (OD) = Schmitt Trigger with Open Drain O = Output I/O = Input/Output P = Power DS22147A-page 29 MCP4017/18/19 3.1 Positive Power Supply Input (VDD) The VDD pin is the device's positive power supply input. The input power supply is relative to VSS and can range from 1.8V to 5.5V. A de-coupling capacitor on VDD (to VSS) is recommended to achieve maximum performance. While the device's voltage is in the range of 1.8V VDD < 2.7V, the Resistor Network's electrical performance of the device may not meet the data sheet specifications. 3.2 Ground (VSS) The VSS pin is the device ground reference. 3.3 I2C Serial Clock (SCL) The SCL pin is the serial clock pin of the I2C interface. The MCP401X acts only as a slave and the SCL pin accepts only external serial clocks. The SCL pin is an open-drain output. Refer to Section 5.0 "Serial Interface - I2C Module" for more details of I2C Serial Interface communication. 3.4 W pin can support both positive and negative current. The voltage on terminal W must be between VSS and VDD. 3.7 Potentiometer Terminal A The terminal A pin (available on some devices) is connected to the internal potentiometer's terminal A. The potentiometer's terminal A is the fixed connection to the Full Scale (0x7F tap) wiper value of the digital potentiometer. The terminal A pin is available on the MCP4018 devices. The terminal A pin does not have a polarity relative to the terminal W pin. The terminal A pin can support both positive and negative current. The voltage on Terminal A must be between VSS and VDD. The terminal A pin is not available on the MCP4017 and MCP4019 devices. For these devices, the potentiometer's terminal A is internally floating. I2C Serial Data (SDA) The SDA pin is the serial data pin of the I2C interface. The SDA pin has a Schmitt trigger input and an open-drain output. Refer to Section 5.0 "Serial Interface - I2C Module" for more details of I2C Serial Interface communication. 3.5 Potentiometer Terminal B The terminal B pin (available on some devices) is connected to the internal potentiometer's terminal B. The potentiometer's terminal B is the fixed connection to the Zero Scale (0x00 tap) wiper value of the digital potentiometer. The terminal B pin is available on the MCP4017 device. The terminal B pin does not have a polarity relative to the terminal W pin. The terminal B pin can support both positive and negative current. The voltage on terminal B must be between VSS and VDD. The terminal B pin is not available on the MCP4018 and MCP4019 devices. For these devices, the potentiometer's terminal B is internally connected to VSS. 3.6 Potentiometer Wiper (W) Terminal The terminal W pin is connected to the internal potentiometer's terminal W (the wiper). The wiper terminal is the adjustable terminal of the digital potentiometer. The terminal W pin does not have a polarity relative to terminals A or B pins. The terminal DS22147A-page 30 (c) 2009 Microchip Technology Inc. MCP4017/18/19 4.0 GENERAL OVERVIEW The MCP4017/18/19 devices are general purpose digital potentiometers intended to be used in applications where a programmable resistance with moderate bandwidth is desired. This Data Sheet covers a family of three Digital Potentiometer and Rheostat devices. The MCP4018 device is the Potentiometer configuration, while the MCP4017 and MCP4019 devices are the Rheostat configuration. Applications generally suited for the MCP401X devices include: * * * * Set point or offset trimming Sensor calibration Selectable gain and offset amplifier designs Cost-sensitive mechanical trim pot replacement As the Device Block Diagram shows, there are four main functional blocks. These are: * POR/BOR Operation * Serial Interface - I2C Module * Resistor Network The POR/BOR operation and the Memory Map are discussed in this section and the I2C and Resistor Network operation are described in their own sections. The Serial Commands commands are discussed in Section 5.4. 4.1 POR/BOR Operation The Power-on Reset is the case where the device is having power applied to it from VSS. The Brown-out Reset occurs when a device had power applied to it, and that power (voltage) drops below the specified range. The devices RAM retention voltage (VRAM) is lower than the POR/BOR voltage trip point (VPOR (c) 2009 Microchip Technology Inc. DS22147A-page 31 MCP4017/18/19 TABLE 4-1: VDD Level DEVICE FUNCTIONALITY AT EACH VDD REGION (NOTE 1) Serial Interface Potentiometer Terminals "unknown" VDD < VBOR < 1.8V Ignored VBOR VDD < 1.8V "Unknown" Operational with reduced electrical specs 1.8V VDD < 2.7V Accepted Operational with reduced electrical specs 2.7V VDD 5.5V Accepted Operational Note 1: Wiper Setting Comment Unknown Wiper Register loaded with POR/BOR value Wiper Register Electrical performance may not determines Wiper meet the data sheet specifications. Setting Wiper Register Meets the data sheet specifications determines Wiper Setting For system voltages below the minimum operating voltage, the customer will be recommended to use a voltage supervisor to hold the system in reset. This will ensure that MCP4017/18/19 commands are not attempted out of the operating range of the device. Normal Operation Range VDD Outside Specified AC/DC Range Normal Operation Range 2.7V 1.8V VPOR/BOR VRAM VSS FIGURE 4-1: DS22147A-page 32 Analog Characteristics not specified Analog Characteristics not specified Device's Serial Interface is "Not Operational" VBOR Delay Wiper Forced to Default POR/BOR setting Power-up and Brown-out. (c) 2009 Microchip Technology Inc. MCP4017/18/19 5.0 SERIAL INTERFACE I2C MODULE 5.1 A 2-wire I2C serial protocol is used to write or read the digital potentiometer's wiper register. The I2C protocol utilizes the SCL input pin and SDA input/output pin. The I2C serial interface supports the following features. * Slave mode of operation * 7-bit addressing * The following clock rate modes are supported: - Standard mode, bit rates up to 100 kb/s - Fast mode, bit rates up to 400 kb/s * Support Multi-Master Applications The serial clock is generated by the Master. The I2C Module is compatible with the Phillips I2C specification. Phillips only defines the field types, field lengths, timings, etc. of a frame. The frame content defines the behavior of the device. The frame content for the MCP4017, MCP4018, and MCP4019 devices are defined in this section of the Data Sheet. Figure 5-1 shows a typical I2C bus configurations. Single I2C Bus Configuration Device 1 Device n Host Controller Device 2 FIGURE 5-1: Configurations. I2C specifications require active low, passive high functionality on devices interfacing to the bus. Since devices may be operating on separate power supply sources, ESD clamping diodes are not permitted. The specification recommends using open drain transistors tied to VSS (common) with a pull-up resistor. The specification makes some general recommendations on the size of this pull-up, but does not specify the exact value since bus speeds and bus capacitance impacts the pull-up value for optimum system performance. Common pull-up values range from 1 k to a max of ~10 k. Power sensitive applications tend to choose higher values to minimize current losses during communication but these applications also typically utilize lower VDD. The SDA and SCL float (are not driving) when the device is powered down. A "glitch" filter is on the SCL and SDA pins when the pin is an input. When these pins are an output, there is a slew rate control of the pin that is independent of device frequency. 5.1.1 Device 3 Device 4 I2C I/O Considerations SLOPE CONTROL The device implements slope control on the SDA output. The slope control is defined by the fast mode specifications. For Fast (FS) mode, the device has spike suppression and Schmidt trigger inputs on the SDA and SCL pins. Typical Application I2C Bus Refer to Section 2.0 "Typical Performance Curves", AC/DC Electrical Characteristics table for detailed input threshold and timing specifications. (c) 2009 Microchip Technology Inc. DS22147A-page 33 MCP4017/18/19 5.2 I2C Bit Definitions If the Slave Address is not valid, the Slave Device will issue a Not A (A). The A bit will have the SDA signal high. I2C bit definitions include: * * * * * * Start Bit Data Bit Acknowledge (A) Bit Repeated Start Bit Stop Bit Clock Stretching If an error condition occurs (such as an A instead of A) then an START bit must be issued to reset the command state machine. TABLE 5-1: Figure 5-8 shows the waveform for these states. 5.2.1 START BIT The Start bit (see Figure 5-2) indicates the beginning of a data transfer sequence. The Start bit is defined as the SDA signal falling when the SCL signal is "High". 2nd Bit 1st Bit SDA Acknowledge Bit Response Event General Call Bus Collision Start Bit. DATA BIT The SDA signal may change state while the SCL signal is Low. While the SCL signal is High, the SDA signal MUST be stable (see Figure 5-3). 2nd Bit 1st Bit SDA SCL 5.2.3 Data Bit. ACKNOWLEDGE (A) BIT The A bit (see Figure 5-4) is a response from the Slave device to the Master device. Depending on the context of the transfer sequence, the A bit may indicate different things. Typically the Slave device will supply an A response after the Start bit and 8 "data" bits have been received. The A bit will have the SDA signal low. SDA SCL D0 8 FIGURE 5-4: 5.2.4 N.A. I2C Module Resets, or a "Don't Care" if the collision occurs on the Masters "Start bit". REPEATED START BIT The Repeated Start bit (see Figure 5-5) indicates the current Master Device wishes to continue communicating with the current Slave Device without releasing the I2C bus. The Repeated Start condition is the same as the Start condition, except that the Repeated Start bit follows a Start bit (with the Data bits + A bit) and not a Stop bit. The Start bit is the beginning of a data transfer sequence and is defined as the SDA signal falling when the SCL signal is "High". S FIGURE 5-3: A Slave Address A not valid S 5.2.2 Comment Slave Address A valid SCL FIGURE 5-2: MCP4017/18/19 A / A RESPONSES Note 1: A bus collision during the Repeated Start condition occurs if: * SDA is sampled low when SCL goes from low to high. * SCL goes low before SDA is asserted low. This may indicate that another master is attempting to transmit a data "1". A 9 Acknowledge Waveform. SDA 1st Bit SCL Sr = Repeated Start FIGURE 5-5: Waveform. DS22147A-page 34 Repeat Start Condition (c) 2009 Microchip Technology Inc. MCP4017/18/19 5.2.5 STOP BIT 5.2.7 If any part of the I2C transmission does not meet the command format, it is aborted. This can be intentionally accomplished with a START or STOP condition. This is done so that noisy transmissions (usually an extra START or STOP condition) are aborted before they corrupt the device. The Stop bit (see Figure 5-6) Indicates the end of the I2C Data Transfer Sequence. The Stop bit is defined as the SDA signal rising when the SCL signal is "High". A Stop bit resets the I2C interface of the other devices. SDA A / A 5.2.8 SCL 5.2.6 IGNORING AN I2C TRANSMISSION AND "FALLING OFF" THE BUS The MCP4017/18/19 expects to receive entire, valid I2C commands and will assume any command not defined as a valid command is due to a bus corruption and will enter a passive high condition on the SDA signal. All signals will be ignored until the next valid START condition and CONTROL BYTE are received. P FIGURE 5-6: Transmit Mode. ABORTING A TRANSMISSION Stop Condition Receive or CLOCK STRETCHING "Clock Stretching" is something that the Secondary Device can do, to allow additional time to "respond" to the "data" that has been received. The MCP4017/18/19 will not strech the clock signal (SCL) since memory read accesses occur fast enough. SDA SCL S FIGURE 5-7: 1st 2nd 3rd 4th 5th 6th 7th 8th A/A 1st 2nd 3rd 4th 5th 6th 7th 8th A/A Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit P Typical 16-bit I2C Waveform Format. SDA SCL START Condition FIGURE 5-8: Data allowed to change Data or A valid STOP Condition I2C Data States and Bit Sequence. (c) 2009 Microchip Technology Inc. DS22147A-page 35 MCP4017/18/19 I2C COMMAND PROTOCOL 5.2.9 The MCP4017/18/19 is a slave I2C device which supports 7-bit slave addressing. The slave address contains seven fixed bits. Figure 5-9 shows the control byte format. 5.2.9.1 DEVICE I2C ADDRESS TABLE 5-2: Device I2C Address MCP4017 MCP4018 MCP4019 `0101111' `0101111' `0101111' Comment Control Byte (Slave Address) The Control Byte is always preceded by a START condition. The Control Byte contains the slave address consisting of seven fixed bits and the R/W bit. Figure 59 shows the control byte format and Table 5-2 shows the I2C address for the devices. 5.2.9.2 The MCP4017/MCP4018/MCP4019 does not support hardware address bits. 5.2.10 Start bit GENERAL CALL The General Call is a method that the Master device can communicate with all other Slave devices. Slave Address S A6 A5 A4 A3 A2 A1 A0 R/W "0" "1" "0" "1" "1" "1" "1" Hardware Address Pins A/A The MCP4017/18/19 devices do not respond to General Call address and commands, and therefore the communications are Not Acknowledged. R/W bit R/W = 0 = write R/W = 1 = read A bit (controlled by slave device) A = 0 = Slave Device Acknowledges byte A = 1 = Slave Device does not Acknowledge byte FIGURE 5-9: I2C Control Byte. Slave Address Bits in the Second Byte S 0 0 0 0 0 0 0 0 A x General Call Address x x x X x x 0 A P "7-bit Command" Reserved 7-bit Commands (By I2C Specification - Philips # 9398 393 40011, Ver. 2.1 January 2000) `0000 011'b - Reset and write programmable part of slave address by hardware. `0000 010'b - Write programmable part of slave address by hardware. `0000 000'b - NOT Allowed The Following is a "Hardware General Call" Format Second Byte S 0 0 0 0 0 0 0 0 General Call Address FIGURE 5-10: DS22147A-page 36 A x x x x X "7-bit Command" x n occurrences of (Data + A / A) x 1 A x x x x X x x X A P This indicates a "Hardware General Call" MCP4016/7/8/9 will ignore this byte and all following bytes (and A), until a Stop bit (P) is encountered. General Call Formats. (c) 2009 Microchip Technology Inc. MCP4017/18/19 5.3 Software Reset Sequence Note: This technique should be supported by any I2C compliant device. The 24xxxx I2C Serial EEPROM devices support this technique, which is documented in AN1028. The Stop bit terminates the current I2C bus activity. The MCP4017/18/19 wait to detect the next Start condition. This sequence does not effect any other I2C devices which may be on the bus, as they should disregard this as an invalid command. At times it may become necessary to perform a Software Reset Sequence to ensure the MCP4017/18/ 19 device is in a correct and known I2C Interface state. This only resets the I2C state machine. 5.4 This is useful if the MCP4017/18/19 device powers up in an incorrect state (due to excessive bus noise, etc), or if the Master Device is reset during communication. Figure 5-11 shows the communication sequence to software reset the device. * Write Operation * Read Operations S `1' `1' `1' `1' `1' `1' `1' `1' S Serial Commands The MCP4017/18/19 devices support commands. These commands are: 2 serial P Nine bits of `1' Start bit Start bit Stop bit FIGURE 5-11: Format. Software Reset Sequence The 1st Start bit will cause the device to reset from a state in which it is expecting to receive data from the Master Device.In this mode, the device is monitoring the data bus in Receive mode and can detect the Start bit forces an internal Reset. The nine bits of `1' are used to force a Reset of those devices that could not be reset by the previous Start bit. This occurs only if the MCP4017/18/19 is driving an A on the I2C bus, or is in output mode (from a Read command) and is driving a data bit of `0' onto the I2C bus. In both of these cases, the previous Start bit could not be generated due to the MCP4017/18/19 holding the bus low. By sending out nine `1' bits, it is ensured that the device will see a A (the Master Device does not drive the I2C bus low to acknowledge the data sent by the MCP4017/18/19), which also forces the MCP4017/ 18/19 to reset. The 2nd Start bit is sent to address the rare possibility of an erroneous write. This could occur if the Master Device was reset while sending a Write command to the MCP4017/18/19, AND then as the Master Device returns to normal operation and issues a Start condition while the MCP4017/18/19 is issuing an A. In this case if the 2nd Start bit is not sent (and the Stop bit was sent) the MCP4017/18/19 could initiate a write cycle. Note: The potential for this erroneous write ONLY occurs if the Master Device is reset while sending a Write command to the MCP4017/18/19. (c) 2009 Microchip Technology Inc. DS22147A-page 37 MCP4017/18/19 5.4.1 WRITE OPERATION 5.4.2 The write operation requires the START condition, Control Byte, Acknowledge, Data Byte, Acknowledge and STOP (or RESTART) condition. The Control (Slave Address) Byte requires the R/W bit equal to a logic zero (R/W = "0") to generate a write sequence. The MCP4017/18/19 is responsible for generating the Acknowledge (A) bits. READ OPERATIONS The read operation requires the START condition, Control Byte, Acknowledge, Data Byte, the master generating the A and STOP condition. The Control Byte requires the R/W bit equal to a logic one (R/W = 1) to generate a read sequence. The MCP4017/18/19 will A the Slave Address Byte and A all the Data Bytes. The I2C Master will A the Slave Address Byte and the last Data Byte. If there are multiple Data Bytes, the I2C Master will A all Data Bytes except the last Data Byte (which it will A). Data is written to the MCP4017/18/19 after every byte transfer (during the A bit). If a STOP or RESTART condition is generated during a data transfer (before the A bit), the data will not be written to MCP4017/18/ 19. The MCP4017/18/19 maintains control of the SDA signal until all data bits have been clocked out. Data bytes may be written after each Acknowledge. The command is terminated once a Stop (P) condition occurs. Refer to Figure 5-12 for the write sequence. For a single byte write, the master sends a STOP or RESTART condition after the 1st data byte is sent. The command is terminated once a Stop (P) condition occurs. Refer to Figure 5-13 for the read command sequence. For a single read, the master sends a STOP or RESTART condition after the 1st data byte (and A bit) is sent from the slave. The MSb of each Data Byte is a don't care, since the wiper register is only 7-bits wide. Figure 5-14 shows the I2C communication behavior of the Master Device and the MCP4017/18/19 device and the resultant I2C bus values. Fixed Address S 0 1 0 1 1 Figure 5-14 shows the I2C communication behavior of the Master Device and the MCP4017/18/19 device and the resultant I2C bus values. Read/Write bit ("0" = Write) 1 1 0 A x D6 D5 D4 D3 D2 D1 D0 A x D6 D5 D4 D3 D2 D1 D0 A Slave Address Byte Data Byte Data Byte STOP bit x D6 D5 D4 D3 D2 D1 D0 A x D6 D5 D4 D3 D2 D1 D0 A P Data Byte Data Byte Legend S = Start Condition P = Stop Condition A = Acknowledge X = Don't Care R/W = Read/Write bit D6, D5, D4, D3, D2, D1, D0 = Data bits FIGURE 5-12: DS22147A-page 38 I2C Write Command Format. (c) 2009 Microchip Technology Inc. MCP4017/18/19 Fixed Address S 0 1 0 1 1 Read/Write bit ("1" = Read) 1 1 1 A 0 D6 D5 D4 D3 D2 D1 D0 A(1) 0 D6 D5 D4 D3 D2 D1 D0 A(1) Slave Address Byte Data Byte Data Byte STOP bit (2) 0 D6 D5 D4 D3 D2 D1 D0 A(1)0 D6 D5 D4 D3 D2 D1 D0 A Data Byte P Data Byte Legend S = Start Condition P = Stop Condition A = Acknowledge X = Don't Care R/W = Read/Write bit Note 1 = Data bits Note 1: Master Device is responsible for A / A signal. If a A signal occurs, the MCP4017/18/19 will abort this transfer and release the bus. 2: The Master Device will A, and the MCP4017/18/19 will release the bus so the Master Device can generate a Stop or Repeated Start condition. FIGURE 5-13: I2C Read Command Format. (c) 2009 Microchip Technology Inc. DS22147A-page 39 MCP4017/18/19 Write 1 Byte S Slave Address Master A P S 0 1 0 1 1 1 1 0 1 x d d d d d d d 1 P MCP4017/18/19 I2C Bus R / W A Data Byte (1) 0 0 S 0 1 0 1 1 1 1 0 0 x d d d d d d d 0 P Write 2 Bytes S Slave Address Master A Data Byte (1) A P S 0 1 0 1 1 1 1 0 1 x d d d d d d d 1 x d d d d d d d 1 P MCP4017/18/19 I2C Bus R / W A Data Byte (1) 0 0 0 S 0 1 0 1 1 1 1 0 0 x d d d d d d d 0 x d d d d d d d 1 P Read 1 Byte S Slave Address Master S 0 1 0 1 1 1 1 1 1 MCP4017/18/19 I2C Bus R / W A Data Byte A P 1 P 0 0 d d d d d d d 1 S 0 1 0 1 1 1 1 1 0 0 d d d d d d d 1 P Read 2 Bytes S Slave Address Master MCP4017/18/19 I2C Bus R / W A Data Byte S 0 1 0 1 1 1 1 1 1 A Data Byte A P 0 1 P 0 0 d d d d d d d 1 0 d d d d d d d 1 S 0 1 0 1 1 1 1 1 0 0 d d d d d d d 0 0 d d d d d d d 1 P Note 1: For Write Commands, the MSb of the Data Byte is a don't care since the wiper register is only 7-bits wide. FIGURE 5-14: DS22147A-page 40 I2C Communication Behavior. (c) 2009 Microchip Technology Inc. MCP4017/18/19 6.0 RESISTOR NETWORK A The Resistor Network is made up of two parts. These are: * Resistor Ladder * Wiper Figure 6-1 shows a block diagram for the resistive network. Digital potentiometer applications can be divided into two resistor network categories: * Rheostat configuration * Potentiometer (or voltage divider) configuration RS The MCP4019 device is a Rheostat device with terminal A of the resistor floating, terminal B internally connected to ground, and the wiper (W) available on pin. 6.1 Resistor Ladder Module The resistor ladder is a series of equal value resistors (RS) with a connection point (tap) between the two resistors. The total number of resistors in the series (ladder) determines the RAB resistance (see Figure 61). The end points of the resistor ladder are connected to the device Terminal A and Terminal B pins. The RAB (and RS) resistance has small variations over voltage and temperature. The Resistor Network has 127 resistors in a string between terminal A and terminal B. This gives 7-bits of resolution. The wiper can be set to tap onto any of these 127 resistors thus providing 128 possible settings (including terminal A and terminal B). This allows zero scale to full scale connections. RW (1) RW (1) RW (1) N = 126 RS 7Eh N = 125 RS 7Dh W The MCP4017 is a true rheostat, with terminal B and the wiper (W) of the variable resistor available on pins. The MCP4018 device offers a voltage divider (potentiometer) with terminal B internally connected to ground. 7Fh N = 127 N=1 RS 01h RW (1) RW (1) N=0 B 00h Analog Mux Note 1: The wiper resistance is tap dependent. That is, each tap selection resistance has a small variation. This variation has more effect on devices with smaller RAB resistance (5.0 k). FIGURE 6-1: Diagram. TABLE 6-1: Wiper Setting 07Fh 07Eh - 040h 03Fh 03Eh - 001h 000h Resistor Network Block WIPER SETTING MAP Properties Full Scale (W = A) W=N W = N (Mid Scale) W=N Zero Scale (W = B) A wiper setting of 00h connects the Terminal W (wiper) to Terminal B (Zero Scale). A wiper setting of 3Fh is the Mid scale setting. A wiper setting of 7Fh connects the Terminal W (wiper) to Terminal A (Full Scale). Table 61 illustrates the full wiper setting map. Terminal A and B as well as the wiper W do not have a polarity. These terminals can support both positive and negative current. (c) 2009 Microchip Technology Inc. DS22147A-page 41 MCP4017/18/19 Step resistance (RS) is the resistance from one tap setting to the next. This value will be dependent on the RAB value that has been selected. Equation 6-1 shows the calculation for the step resistance while Table 6-2 shows the typical step resistances for each device. EQUATION 6-1: RS CALCULATION TABLE 6-3: DEFAULT FACTORY SETTINGS SELECTION Resistance Typical Code RAB Value R AB R S = --------127 Equation 6-2 illustrates the calculation used to determine the resistance between the wiper and terminal B. EQUATION 6-2: A POR/BOR event will load the Volatile Wiper register value with the default value. Table 6-3 shows the default values offered. RWB CALCULATION R AB N - + RW R WB = ------------127 N = 0 to 127 (decimal) Default POR Wiper Setting Code (1) -502 5.0 k Mid-scale 3Fh -103 10.0 k Mid-scale 3Fh -503 50.0 k Mid-scale 3Fh -104 100.0 k Mid-scale 3Fh Note 1: Custom POR/BOR Wiper Setting options are available, contact the local Microchip Sales Office for additional information. Custom options have minimum volume requirements. The digital potentiometer is available in four nominal resistances (RAB) where the nominal resistance is defined as the resistance between terminal A and terminal B. The four nominal resistances are 5 k, 10 k, 50 k, and 100 k. The total resistance of the device has minimal variation due to operating voltage (see Figure 2-11, Figure 2-29, Figure 2-47, or Figure 2-65). TABLE 6-2: STEP RESISTANCES Resistance () Part Number Case Min. Total (RAB) Step (RS) 4000 31.496 MCP4017/18/19-502E Typical 5000 39.370 Max. 6000 47.244 Min. 8000 62.992 MCP4017/18/19-103E Typical 10000 78.740 Max. 12000 94.488 Min. 40000 314.961 MCP4017/18/19-503E Typical 50000 393.701 Max. 60000 472.441 Min. 80000 629.921 MCP4017/18/19-104E Typical 100000 Max. DS22147A-page 42 120000 787.402 944.882 (c) 2009 Microchip Technology Inc. MCP4017/18/19 6.2 Resistor Configurations 6.2.1 6.2.2 RHEOSTAT CONFIGURATION When used as a rheostat, two of the three digital potentiometer's terminals are used as a resistive element in the circuit. With terminal W (wiper) and either terminal A or terminal B, a variable resistor is created. The resistance will depend on the tap setting of the wiper (and the wiper's resistance). The resistance is controlled by changing the wiper setting The unused terminal (B or A) should be left floating. Figure 6-2 shows the two possible resistors that can be used. Reversing the polarity of the A and B terminals will not affect operation. POTENTIOMETER CONFIGURATION When used as a potentiometer, all three terminals of the device are tied to different nodes in the circuit. This allows the potentiometer to output a voltage proportional to the input voltage. This configuration is sometimes called voltage divider mode. The potentiometer is used to provide a variable voltage by adjusting the wiper position between the two endpoints as shown in Figure 6-3. Reversing the polarity of the A and B terminals will not affect operation. V1 A V3 W A B RAW or W RBW B Resistor FIGURE 6-2: Rheostat Configuration. This allows the control of the total resistance between the two nodes. The total resistance depends on the "starting" terminal to the Wiper terminal. So at the code 00h, the RBW resistance is minimal (RW), but the RAW resistance in maximized (RAB + RW). Conversely, at the code 3Fh, the RAW resistance is minimal (RW), but the RBW resistance in maximized (RAB + RW). The resistance Step size (RS) equates to one LSb of the resistor. Note: To avoid damage to the internal wiper circuitry in this configuration, care should be taken to insure the current flow never exceeds 2.5 mA. V2 FIGURE 6-3: Configuration. Potentiometer The temperature coefficient of the RAB resistors is minimal by design. In this configuration, the resistors all change uniformly, so minimal variation should be seen. The Wiper resistor temperature coefficient is different to the RAB temperature coefficient. The voltage at node V3 (Figure 6-3) is not dependent on this Wiper resistance, just the ratio of the RAB resistors, so this temperature coefficient in most cases can be ignored. Note: To avoid damage to the internal wiper circuitry in this configuration, care should be taken to insure the current flow never exceeds 2.5 mA. The pinout for the rheostat devices is such that as the wiper register is incremented, the resistance of the resistor will increase (as measured from Terminal B to the W Terminal). (c) 2009 Microchip Technology Inc. DS22147A-page 43 MCP4017/18/19 6.3 Wiper Resistance In a potentiometer configuration, the wiper resistance variation does not effect the output voltage seen on the W pin. Wiper resistance is the series resistance of the analog switch that connects the selected resistor ladder node to the Wiper Terminal common signal (see Figure 6-1). The slope of the resistance has a linear area (at the higher voltages) and a non-linear area (at the lower voltages). In where resistance increases faster then the voltage drop (at low voltages). A value in the volatile wiper register selects which analog switch to close, connecting the W terminal to the selected node of the resistor ladder. The resistance is dependent on the voltages on the analog switch source, gate, and drain nodes, as well as the device's wiper code, temperature, and the current through the switch. As the device voltage decreases, the wiper resistance increases (see Figure 6-4 and Table 6-4). RW The wiper can connect directly to Terminal B or to Terminal A. A zero scale connections, connects the Terminal W (wiper) to Terminal B (wiper setting of 000h). A full scale connections, connects the Terminal W (wiper) to Terminal A (wiper setting of 7Fh). In these configurations the only resistance between the Terminal W and the other Terminal (A or B) is that of the analog switches. VDD Note: The slope of the resistance has a linear area (at the higher voltages) and a non-linear area (at the lower voltages). The wiper resistance is typically measured when the wiper is positioned at either zero scale (00h) or full scale (3Fh). FIGURE 6-4: Relationship of Wiper Resistance (RW) to Voltage. Since there is minimal variation of the total device resistance over voltage, at a constant temperature (see Figure 2-11, Figure 2-29, Figure 2-47, or Figure 2-65), the change in wiper resistance over voltage can have a significant impact on the INL and DNL error. The wiper resistance in potentiometer-generated voltage divider applications is not a significant source of error. The wiper resistance in rheostat applications can create significant nonlinearity as the wiper is moved toward zero scale (00h). The lower the nominal resistance, the greater the possible error. In a rheostat configuration, this change in voltage needs to be taken into account. Particularly for the lower resistance devices. For the 5.0 k device the maximum wiper resistance at 5.5V is approximately 3.2% of the total resistance, while at 2.7V it is approximately 6.5% of the total resistance. TABLE 6-4: TYPICAL STEP RESISTANCES AND RELATIONSHIP TO WIPER RESISTANCE RW / RS (%) (1) Resistance () Typical Total (RAB) Step (RS) Wiper (RW) Typical Max @ Max @ 5.5V 2.7V RW = Typical RW / RAB (%) (2) RW = Max RW = Max @ 5.5V @ 2.7V RW = Typical RW = Max RW = Max @ 5.5V @ 2.7V 5000 39.37 100 170 325 254.00% 431.80% 825.5% 2.00% 3.40% 6.50% 10000 78.74 100 170 325 127.00% 215.90% 412.75% 1.00% 1.70% 3.25% 50000 393.70 100 170 325 25.40% 43.18% 82.55% 0.20% 0.34% 0.65% 100000 787.40 100 170 325 12.70% 21.59% 41.28% 0.10% 0.17% 0.325% Note 1: 2: RS is the typical value. The variation of this resistance is minimal over voltage. RAB is the typical value. The variation of this resistance is minimal over voltage. DS22147A-page 44 (c) 2009 Microchip Technology Inc. MCP4017/18/19 6.4 Operational Characteristics Understanding the operational characteristics of the device's resistor components is important to the system design. 6.4.1 6.4.1.1 6.4.1.2 Differential Non-linearity (DNL) DNL error is the measure of variations in code widths from the ideal code width. A DNL error of zero would imply that every code is exactly 1 LSb wide. ACCURACY 111 Integral Non-linearity (INL) INL error for these devices is the maximum deviation between an actual code transition point and its corresponding ideal transition point after offset and gain errors have been removed. These endpoints are from 0x00 to 0x7F. Refer to Figure 6-5. Positive INL means higher resistance than ideal. Negative INL means lower resistance than ideal. 110 Actual transfer function 101 Digital 100 Input Code 011 Ideal transfer function 010 Wide code, > 1 LSb 001 INL < 0 000 111 110 Digital Pot Output 101 Digital Input Code FIGURE 6-6: 100 6.4.1.3 011 Ideal transfer function 010 001 000 INL < 0 Digital Pot Output FIGURE 6-5: Narrow code < 1 LSb Actual transfer function INL Accuracy. (c) 2009 Microchip Technology Inc. DNL Accuracy. Ratiometric temperature coefficient The ratiometric temperature coefficient quantifies the error in the ratio RAW/RWB due to temperature drift. This is typically the critical error when using a potentiometer device (MCP4018) in a voltage divider configuration. 6.4.1.4 Absolute temperature coefficient The absolute temperature coefficient quantifies the error in the end-to-end resistance (Nominal resistance RAB) due to temperature drift. This is typically the critical error when using a rheostat device (MCP4017 and MCP4019) in an adjustable resistor configuration. DS22147A-page 45 MCP4017/18/19 6.4.2 MONOTONIC OPERATION Monotonic operation means that the device's resistance increases with every step change (from terminal A to terminal B or terminal B to terminal A). The wiper resistances difference at each tap location. When changing from one tap position to the next (either increasing or decreasing), the RW is less then the RS. When this change occurs, the device voltage and temperature are "the same" for the two tap positions. RS63 0x3F RS62 Digital Input Code 0x3E 0x3D RS3 0x03 RS1 0x02 RS0 0x01 0x00 RW (@ tap) n=? RBW = RSn + RW(@ Tap n) n=0 Resistance (RBW) FIGURE 6-7: DS22147A-page 46 RBW. (c) 2009 Microchip Technology Inc. MCP4017/18/19 7.0 DESIGN CONSIDERATIONS In the design of a system with the MCP4017/18/19 devices, the following considerations should be taken into account. These are: * The Power Supply * The Layout In the design of a system with the MCP4017/18/19 devices, the following considerations should be taken into account: * Power Supply Considerations * Layout Considerations 7.1 Power Supply Considerations The typical application will require a bypass capacitor in order to filter high-frequency noise, which can be induced onto the power supply's traces. The bypass capacitor helps to minimize the effect of these noise sources on signal integrity. Figure 7-1 illustrates an appropriate bypass strategy. In this example, the recommended bypass capacitor value is 0.1 F. This capacitor should be placed as close to the device power pin (VDD) as possible (within 4 mm). 7.2 Layout Considerations Inductively-coupled AC transients and digital switching noise can degrade the input and output signal integrity, potentially masking the MCP4017/18/19's performance. Careful board layout will minimize these effects and increase the Signal-to-Noise Ratio (SNR). Bench testing has shown that a multi-layer board utilizing a low-inductance ground plane, isolated inputs, isolated outputs and proper decoupling are critical to achieving the performance that the silicon is capable of providing. Particularly harsh environments may require shielding of critical signals. If low noise is desired, breadboards and wire-wrapped boards are not recommended. 7.2.1 RESISTOR TEMPCO Characterization curves of the resistor temperature coefficient (Tempco) are shown in Figure 2-11, Figure 2-29, Figure 2-47, and Figure 2-65. These curves show that the resistor network is designed to correct for the change in resistance as temperature increases. This technique reduces the end to end change is RAB resistance. The power source supplying these devices should be as clean as possible. If the application circuit has separate digital and analog power supplies, VDD and VSS should reside on the analog plane. VDD 0.1 F VDD W B VSS FIGURE 7-1: Connections. SCL SDA PICmicro(R) Microcontroller A MCP4017/18/19 0.1 F VSS Typical Microcontroller (c) 2009 Microchip Technology Inc. DS22147A-page 47 MCP4017/18/19 NOTES: DS22147A-page 48 (c) 2009 Microchip Technology Inc. MCP4017/18/19 8.0 APPLICATIONS EXAMPLES Digital potentiometers have a multitude of practical uses in modern electronic circuits. The most popular uses include precision calibration of set point thresholds, sensor trimming, LCD bias trimming, audio attenuation, adjustable power supplies, motor control overcurrent trip setting, adjustable gain amplifiers and offset trimming. The MCP4017/18/19 devices can be used to replace the common mechanical trim pot in applications where the operating and terminal voltages are within CMOS process limitations (VDD = 2.7V to 5.5V). 8.1 Set Point Threshold Trimming Applications that need accurate detection of an input threshold event often need several sources of error eliminated. Use of comparators and operational amplifiers (op amps) with low offset and gain error can help achieve the desired accuracy, but in many applications, the input source variation is beyond the designer's control. If the entire system can be calibrated after assembly in a controlled environment (like factory test), these sources of error are minimized if not entirely eliminated. Figure 8-1 illustrates a common digital potentiometer configuration. This configuration is often referred to as a "windowed voltage divider". Note that R1 is not necessary to create the voltage divider, but its presence is useful when the desired threshold has limited range. It is "windowed" because R1 can narrow the adjustable range of VTRIP to a value much less than VDD - VSS. If the output range is reduced, the magnitude of each output step is reduced. This effectively increases the trimming resolution for a fixed digital potentiometer resolution. This technique may allow a lower-cost digital potentiometer to be utilized (64 steps instead of 256 steps). The MCP4018's low DNL performance is critical to meeting calibration accuracy in production without having to use a higher precision digital potentiometer. EQUATION 8-1: CALCULATING THE WIPER SETTING FROM THE DESIRED VTRIP VDD R1 MCP4018 A SDA SCL W VOUT B FIGURE 8-1: Using the Digital Potentiometer to Set a Precise Output Voltage. 8.1.1 TRIMMING A THRESHOLD FOR AN OPTICAL SENSOR If the application has to calibrate the threshold of a diode, transistor or resistor, a variation range of 0.1V is common. Often, the desired a resolution of 2 mV or better is adequate to accurately detect the presence of a precise signal. A "windowed" voltage divider, utilizing the MCP4018, would be a potential solution. Figure 82 illustrates this example application. VDD VDD Rsense VCC+ R1 Comparator MCP4018 A VTRIP SDA W MCP6021 SCL B VCC- 0.1 F FIGURE 8-2: Calibration. Set Point or Threshold R WB V TRIP = V DD ------------------ R1 + R2 RAB = RNominal RWB = RAB * D 127 D= VTRIP VDD * (R1 + RAB ) * 127 D = Digital Potentiometer Wiper Setting (0-127) (c) 2009 Microchip Technology Inc. DS22147A-page 49 MCP4017/18/19 8.2 Operational Amplifier Applications Figure 8-3 and Figure 8-4 illustrate typical amplifier circuits that could replace fixed resistors with the MCP4017/18/19 to achieve digitally-adjustable analog solutions. VIN MCP6291 + Op Amp VDD VOUT - R1 A R3 W B MCP4018 MCP4017 FIGURE 8-3: Trimming Offset and Gain in a Non-Inverting Amplifier. MCP4018 B R4 A W VDD - Op Amp R1 A VIN W B MCP4018 + VOUT MCP6021 1 fc = ----------------------------- 2 R Eq C Thevenin R = ( R 1 + R AB - R WB ) || ( R 2 + R WB ) + R w Equivalent Eq FIGURE 8-4: DS22147A-page 50 Programmable Filter. (c) 2009 Microchip Technology Inc. MCP4017/18/19 8.3 Temperature Sensor Applications Thermistors are resistors with very predictable variation with temperature. Thermistors are a popular sensor choice when a low-cost temperature-sensing solution is desired. Unfortunately, thermistors have non-linear characteristics that are undesirable, typically requiring trimming in an application to achieve greater accuracy. There are several common solutions to trim & linearize thermistors. Figure 8-5 and Figure 8-6 are simple methods for linearizing a 3-terminal NTC thermistor. Both are simple voltage dividers using a Positive Temperature Coefficient (PTC) resistor (R1) with a transfer function capable of compensating for the linearity error in the Negative Temperature Coefficient (NTC) thermistor. The circuit, illustrated by Figure 8-5, utilizes a digital rheostat for trimming the offset error caused by the thermistor's part-to-part variation. This solution puts the digital potentiometer's RW into the voltage divider calculation. The MCP4017/18/19's RAB temperature coefficient is a low 50 ppm (-20C to +70C). RW's error is substantially greater than RAB's error because RW varies with VDD, wiper setting and temperature. For the 50 k devices, the error introduced by RW is, in most cases, insignificant as long as the wiper setting is > 6. For the 2 k devices, the error introduced by RW is significant because it is a higher percentage of RWB. For these reasons, the circuit illustrated in Figure 8-5 is not the most optimum method for "exciting" and linearizing a thermistor. The circuit illustrated by Figure 8-6 utilizes a digital potentiometer for trimming the offset error. This solution removes RW from the trimming equation along with the error associated with RW. R2 is not required, but can be utilized to reduce the trimming "window" and reduce variation due to the digital pot's RAB part-to-part variability. VDD R1 NTC Thermistor VOUT MCP4018 FIGURE 8-6: Thermistor Calibration using a Digital Potentiometer in a Potentiometer Configuration. VDD R1 NTC Thermistor VOUT R2 MCP4017 FIGURE 8-5: Thermistor Calibration using a Digital Potentiometer in a Rheostat Configuration. (c) 2009 Microchip Technology Inc. DS22147A-page 51 MCP4017/18/19 8.4 Wheatstone Bridge Trimming Another common configuration to "excite" a sensor (such as a strain gauge, pressure sensor or thermistor) is the wheatstone bridge configuration. The wheatstone bridge provides a differential output instead of a single-ended output. Figure 8-7 illustrates a wheatstone bridge utilizing one to three digital potentiometers. The digital potentiometers in this example are used to trim the offset and gain of the wheatstone bridge. FIGURE 8-7: DS22147A-page 52 (c) 2009 Microchip Technology Inc. MCP4017/18/19 9.0 DEVELOPMENT SUPPORT 9.1 Development Tools To assist in your design and evaluation of the MCP4017/18/19 devices, a Demo board using the MCP4017 device is in development. Please check the Microchip web site for the release of this board. The board part number is tentatively MCP4XXXDM-PGA, and is expected to be available in the summer of 2009. TABLE 9-1: 9.2 Technical Documentation Several additional technical documents are available to assist you in your design and development. These technical documents include Application Notes, Technical Briefs, and Design Guides. Table 9-1 shows some of these documents. TECHNICAL DOCUMENTATION Application Note Number Title Literature # AN1080 Understanding Digital Potentiometers Resistor Variations DS01080 AN737 Using Digital Potentiometers to Design Low Pass Adjustable Filters DS00737 AN692 Using a Digital Potentiometer to Optimize a Precision Single Supply Photo Detect DS00692 AN691 Optimizing the Digital Potentiometer in Precision Circuits DS00691 AN219 Comparing Digital Potentiometers to Mechanical Potentiometers DS00219 -- Digital Potentiometer Design Guide DS22017 -- Signal Chain Design Guide DS21825 (c) 2009 Microchip Technology Inc. DS22147A-page 53 MCP4017/18/19 NOTES: DS22147A-page 54 (c) 2009 Microchip Technology Inc. MCP4017/18/19 . # #$ # /! - 0 # 1/ %# #!# ## +22--- 2 / D b 3 1 2 E1 E 4 5 e A e A2 c A1 L 3# 4# 5$8 %1 44" " 5 5 56 7 ( 1# 6, : # ; < ; < < !!1/ / #! %% 9()* 6, =!# " ; !!1/=!# " ( ( ( 6, 4# ; ( . 4 9 #4# 4! / 4!=!# ; < 9 8 ( < !"! #$! !% # $ !% # $ !# "'( )*+ ) #&#,$ --# $## #&! ! DS22147A-page 56 - *9) (c) 2009 Microchip Technology Inc. MCP4017/18/19 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging (c) 2009 Microchip Technology Inc. DS22147A-page 57 MCP4017/18/19 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS22147A-page 58 (c) 2009 Microchip Technology Inc. MCP4017/18/19 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging (c) 2009 Microchip Technology Inc. DS22147A-page 59 MCP4017/18/19 NOTES: DS22147A-page 60 (c) 2009 Microchip Technology Inc. MCP4017/18/19 APPENDIX A: REVISION HISTORY Revision A (March 2009) * Original Release of this Document. (c) 2009 Microchip Technology Inc. DS22147A-page 61 MCP4017/18/19 NOTES: DS22147A-page 62 (c) 2009 Microchip Technology Inc. MCP4017/18/19 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device XXX X /XX Resistance Temperature Package Version Range Device: Resistance Version: Single Rheostat with I2C interface MCP4017T: Single Rheostat with I2C interface (Tape and Reel) MCP4018: Single Potentiometer to GND with I2C Interface MCP4018T: Single Potentiometer to GND with I2C Interface (Tape and Reel) MCP4019: Single Rheostat to GND with I2C Interface MCP4019T: Single Rheostat to GND with I2C Interface (Tape and Reel) MCP4017: 502 103 503 104 = = = = 5 k 10 k 50 k 100 k Temperature Range: E = -40C to +125C Package: LT = Plastic Small Outline Transistor (SC70), 5-lead, 6-lead Examples: a) b) c) d) a) b) c) d) a) b) c) d) (c) 2009 Microchip Technology Inc. MCP4017T-502E/LT: 5 k, 6-LD SC-70. MCP4017T-103E/LT: 10 k, 6-LD SC-70. MCP4017T-503E/LT: 50 k, 6-LD SC-70. MCP4017T-104E/LT: 100 k, 6-LD SC-70. MCP4018T-502E/LT: 5 k, 6-LD SC-70. MCP4018T-103E/LT: 10 k, 6-LD SC-70. MCP4018T-503E/LT: 50 k, 6-LD SC-70. MCP4018T-104E/LT: 100 k, 6-LD SC-70. MCP4019T-502E/LT: 5 k, 5-LD SC-70. MCP4019T-103E/LT: 10 k, 5-LD SC-70. MCP4019T-503E/LT: 50 k, 5-LD SC-70. MCP4019T-104E/LT: 100 k, 5-LD SC-70. DS22147A-page 63 MCP4017/18/19 NOTES: DS22147A-page 64 (c) 2009 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: * Microchip products meet the specification contained in their particular Microchip Data Sheet. * Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. * There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. * Microchip is willing to work with the customer who is concerned about the integrity of their code. * Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable." Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, rfPIC, SmartShunt and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, nanoWatt XLP, PICkit, PICDEM, PICDEM.net, PICtail, PIC32 logo, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2009, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company's quality system processes and procedures are for its PIC(R) MCUs and dsPIC(R) DSCs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified. (c) 2009 Microchip Technology Inc. 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