TGL2205
S and C-Band 100 W VPIN Limiter
Preliminary Datasheet: Rev - 09-21-13
- 1 of 6 -
Disclaimer: Subject to change without notice
© 2013 TriQuint www.triquint.com
Applications
• Receive Chain Protection
• Commercial and Military Radar
Ordering Information
Part ECCN Description
TGL2205
EAR99
S and C-Band 100W
VPIN Limiter
Product Features
• Frequency Range: 1 to 6 GHz
• Insertion Loss: < 0.5 dB
• Peak Power Handling: 100W (pulsed)
• Flat Leakage: ≤ 16 dBm
• Return Loss: 12 dB
• Passive (no DC bias required)
• Integrated DC Block on output
• Chip Dimensions: 2.0 x 2.0 x 0.1 mm
Functional Block Diagram
Pad Configuration
Pad No. Symbol
1 RF In
2 RF Out
General Description
The TriQuint TGL2205 is a high power, wideband
MMIC
GaAs VPIN
limiter capable of protecting sensitive
receive channel components against high power incident
signals. The TGL2205 does not require DC
bias and
achieves a low insertion loss a
ll in a small form factor.
These features allow for simple integration with mi
nimal
impact to system performance.
The TGL2205 operates from 1 to 6
GHz and achieves
low insertion loss of 0.5 dB and return loss of 12
dB. It
can limit up to 100 W incident pulsed-
power with a low
flat leakage of 16 dBm.
The TGL2205 has a protective
surface passivation layer
providing environmental robustness and is ideally suited
to support both commercial and defense related
applications.
Lead-free and RoHS compliant.
2
RF In RF Out
1
TGL2205
S and C-Band 100 W VPIN Limiter
Preliminary Datasheet: Rev - 09-21-13
- 2 of 6 -
Disclaimer: Subject to change without notice
© 2013 TriQuint www.triquint.com
Absolute Maximum Ratings
Parameter Value
Incident Power, CW or Pulsed, 50Ω, 25C
100W
Incident Power, CW or Pulsed, 50Ω, 85C
50W
Mounting Temperature
(30 Seconds) 320C
Storage Temperature −40 to
150C
Operation of this device outside the parameter ranges
given above may cause permanent damage. These are
stress ratings
only, and functional operation of the device at
these conditions is not implied.
Recommended Operating Conditions
Parameter Value
Passive – No bias
Electrical specifications are measured at specified test
conditions. Specifications are not
guaranteed over all
recommended operating conditions.
Electrical Specifications
Test conditions unless otherwise noted: T = 25°C
Parameter Conditions Min Typ Max Units
Operational Frequency Range 1 6 GHz
Insertion Loss < 0.5 dB
Input Return Loss 12 dB
Output Return Loss 12 dB
Flat Leakage Power at P
IN
> 30 dBm ≤ 16 dBm
Insertion Loss Temperature Coefficient
0.003 dB/°C
Thermal and Reliability Information
Parameter Test Conditions Value Units
Incident Power
(RF Operational Life Test 168 Hours
(1)
)
Frequency = 4.5 GHz, CW, 50Ω, 25C 31 W
Frequency = 4.5 GHz, Pulsed, PW=10us, DC=10%,
50Ω, 25C 100 W
Notes:
1. Test was terminated at 168 hours. Insertion Loss remained ≤ 1 dB for device under test.
TGL2205
S and C-Band 100 W VPIN Limiter
Preliminary Datasheet: Rev - 09-21-13
- 3 of 6 -
Disclaimer: Subject to change without notice
© 2013 TriQuint www.triquint.com
Typical Performance
0
5
10
15
20
25
30
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1234567
Return Loss (dB)
Insertion Loss (dB)
Frequency (GHz)
S-Parameters vs. Frequency
+25C
IL
IRL
ORL
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1234567
Insertion Loss (dB)
Frequency (GHz)
Insertion Loss vs. Frequency vs. Temp
Temp varies
-
40C
+25C
+85C
14.0
14.5
15.0
15.5
16.0
16.5
17.0
30 32 34 36 38 40 42 44 46 48 50
Pout (dBm)
Pin (dBm)
Output Power vs. Pin vs. Frequency
CW, +25
0
C
1.0 GHz
2.1 GHz
3.0 GHz
3.5 GHz
3.7 GHz
14.0
14.5
15.0
15.5
16.0
16.5
17.0
30 32 34 36 38 40 42 44 46 48 50
Pout (dBm)
Pin (dBm)
Output Power vs. Pin vs. Frequency
Pulse: PW = 10 us, DC = 10%, +25
0
C
4.0 GHz
4.5 GHz
5.5 GHz
6.0 GHz
7.0 GHz
14.0
14.5
15.0
15.5
16.0
16.5
17.0
30 32 34 36 38 40 42 44 46 48 50
Pout (dBm)
Pin (dBm)
Output Power vs. Pin vs. Frequency
CW, -40
0
C
3.0 GHz
3.5 GHz
3.7 GHz
14.0
14.5
15.0
15.5
16.0
16.5
17.0
30 32 34 36 38 40 42 44 46 48 50
Pout (dBm)
Pin (dBm)
Output Power vs. Pin vs. Frequency
CW, +85
0
C
3.0 GHz
3.5 GHz
3.7 GHz
TGL2205
S and C-Band 100 W VPIN Limiter
Preliminary Datasheet: Rev - 09-21-13
- 4 of 6 -
Disclaimer: Subject to change without notice
© 2013 TriQuint www.triquint.com
Assembly Drawing
Mechanical Information and Pad Description
Unit: millimeters
Thickness: 0.10
Die x, y size tolerance: ± 0.050
Chip edge to bond pad dimensions are shown to center of pad
Ground is backside of die
Pad Number Symbol Description Pad Size
1 RF In Input; matched to 50 Ω. 0.100 x 0.200
2 RF Out
Output; matched to 50 Ω. 0.100 x 0.150
1
2
TGL2205
S and C-Band 100 W VPIN Limiter
Preliminary Datasheet: Rev - 09-21-13
- 5 of 6 -
Disclaimer: Subject to change without notice
© 2013 TriQuint www.triquint.com
Assembly Notes
Component placement and adhesive attachment assembly notes:
• Vacuum pencils and/or vacuum collets are the preferred method of pick up.
• Air bridges must be avoided during placement.
• The force impact is critical during auto placement.
• Solder or Organic Adhesive attachment can be used for TGL2205.
• Curing should be done in a convection oven; proper exhaust is a safety concern.
Solder attachment reflow process assembly notes:
• Use AuSn (80/20) solder and limit exposure to temperatures above 300°C to 3 to 4 minutes, maximum.
• An alloy station or conveyor furnace with reducing atmosphere should be used.
• Do not use any kind of flux.
• Coefficient of thermal expansion matching is critical for long-term reliability.
• Devices must be stored in a dry nitrogen atmosphere.
Organic adhesive attachment assembly notes:
• The organics such as epoxy or polyimide can be used.
• Epoxies cure at temperatures of 100 to 200°C.
Interconnect process assembly notes:
• Thermosonic ball bonding is the preferred interconnect technique.
• Force, time, and ultrasonics are critical parameters.
• Aluminum wire should not be used.
• Devices with small pad sizes should be bonded with 0.0007-inch wire.
TGL2205
S and C-Band 100 W VPIN Limiter
Preliminary Datasheet: Rev - 09-21-13
- 6 of 6 -
Disclaimer: Subject to change without notice
© 2013 TriQuint www.triquint.com
Product Compliance Information
ESD Sensitivity Ratings
Caution! ESD-Sensitive Device
ESD Rating: TBD
Value: TBD
Test: Human Body Model (HBM)
Standard: JEDEC Standard JESD22-A114
Solderability
This part is compliant with EU 2002/95/EC RoHS
directive (Restrictions on the Use of Certain Hazardous
Substances in Electrical and Electronic Equipment).
This product also has the following attributes:
• Lead Free
• Halogen Free (Chlorine, Bromine)
• Antimony Free
• TBBP-A (C
15
H
12
Br
4
0
2
) Free
• PFOS Free
• SVHC Free
ECCN
US Department of Commerce: EAR99
Contact Information
For the latest specifications, additional product information, worldwide sales and distribution locations, and
information about TriQuint:
Web: www.triquint.com Tel: +1.972.994.8465
Email: info-sales@triquint.com Fax: +1.972.994.8504
For technical questions and application information: Email: info-products@triquint.com
Important Notice
The information contained herein is believed to be reliable.
TriQuint makes no warranties regarding the information
contained herein.
TriQuint assumes no responsibility or liability whatsoever for any of the information contained
herein. TriQuint assumes no responsibility or liability whatsoever for the use of the information contained herein.
The
information contained herein is provid
ed "AS IS, WHERE IS" and with all faults, and the entire risk associated with
such information is entirely with the user.
All information contained herein is subject to change without notice.
Customers should obtain and verify the latest relevant informa
tion before placing orders for TriQuint products. The
information contained herein or any use of such information does not grant, explicitly or implicitly, to any party any
patent rights, licenses, or any other intellectual property rights, whether with r
egard to such information itself or
anything described by such information.
TriQuint products are not warranted or authorized for use as critical components in medical, life-saving, or life-
sustaining applications, or other applications where a failure w
ould reasonably be expected to cause severe personal
injury or death.
