○Product structure：Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays
1/18 TSZ02201-0G3G0BD00070-1-2
© 2015 ROHM Co., Ltd. All rights reserved. 2015.04.15 Rev.002
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TSZ22111・14・001
Automotive IPS series
1ch High-side switch
BD1Hx500 Series
Features
■ Built-in overcurrent protection circuit
■ Built-in Thermal Shut Down(TSD)
■ Built-in Open Load Detection circuit(When Output is
OFF)
■ Possibility to control directly from CMOS logic IC
■ Low standby current
■ Built-in Under Voltage Lock Out circuit
■ Built-in diagnostic(ST) output function
■ Low On resistance of RDS(ON)=500mΩ(Typ) (VDD=12V,
Ta=25°C, Io=0.25A)
■ Monolithic power IC that has a built in control part
(CMOS) and a power MOS FET on 1chip
■ 1ch High-side switch for the mechanical relay coil
drive
■ AEC-Q100 qualified (1)
(1) Grade 1
General Description
BD1HC/D500 Series is an Automotive 1ch High-Side
switch.
It has a built-in overcurrent protection circuit, Thermal
Shut Down (TSD) circuit, Open Load Detection circuit,
Under Voltage Lock Out circuit, and has diagnostic (ST)
output function at the time during abnormal detection.
Application
■ For automotive (Air conditioner, body equipment, and
meter, etc.)
Product Summary
Operating voltage 4V to 18V
On-state resistance
(25°C, Typ) 500mΩ
Overcurrent limit (Typ) 1.45A
Active clamp energy (25°C) 33mJ
Package
HTSOP-J8 4.90mm x 6.00mm x 1.00mm
HSON8 2.90mm x 3.00mm x 0.60mm
MSOP8 2.90mm x 4.00mm x 0.90mm
Typical Application Circuit
MSOP 8
HSON 8
HTSOP-J8
Datashee
t
Datasheet
Datasheet
2/18
BD1Hx500 Series
TSZ02201-0G3G0BD00070-1-2
© 2015 ROHM Co., Ltd. All rights reserved. 2015.04.15 Rev.002
www.rohm.com
TSZ22111・15・001
1.IN
2.GND
3.OUT
4.OUT 5. VDD
6. VDD
7. N.C
8. ST
Pin Descriptions
Pin Symbol Function
1 IN Input terminal. The pull-down resistor is internally connected.
2 GND Earth terminal.
3, 4 OUT
Output terminal. When the load becomes in a short-circuit state and if the current
exceeds overcurrent detection value of 0.8A (Min) the current flowing in the
output pin will be limited due IC protection.
5, 6 VDD Power-supply terminal.
7 N.C N.C
8 ST
Self-diagnostic output terminal. "L" is becomes the output state during overcurrent,
overheating and open load detection conditions.
Please refer to Diagnostic Output Truth Table on page 5. The circuit is composed of
an open drain N channel MOS.
Cooling Tab (1) TAB
Since it has connected with sub of IC, please connect the heat dissipation metal to
external GND potential. (HTSOP-J8,HSON8)
(1)MSOP8 does not have Cooling Tab.
Pin Configurations
Product Line-up
Product Name PKG TSD Function
On-state
Resistance
(25°C, Typ)
BD1HC500EFJ-C HTSOP-J8
Off-latch
500mΩ
BD1HC500HFN-C HSON 8
BD1HC500FVM-C MSOP 8
BD1HD500EFJ-C HTSOP-J8
Self-restart
BD1HD500HFN-C HSON 8
BD1HD500FVM-C MSOP 8
HTSOP-J8
(TOP VIEW)
1.IN
2.GND
3.OUT
4.OUT 5. VDD
6. VDD
7. N.C
8. ST
HSON8
(TOP VIEW)
1.IN
2.GND
3.OUT
4.OUT 5. VDD
6. VDD
7. N.C
8. ST
MSOP8
(TOP VIEW)
Datasheet
Datasheet
3/18
BD1Hx500 Series
TSZ02201-0G3G0BD00070-1-2
© 2015 ROHM Co., Ltd. All rights reserved. 2015.04.15 Rev.002
www.rohm.com
TSZ22111・15・001
Absolute Maximum Ratings
Parameter Symbol Rating Unit
Voltage between drain and source VDS 44.5 (Internal limitation) V
Power supply voltage VDD 40 V
Input voltage VIN -0.3 to +12 (1) V
Diagnostic output voltage VST -0.3 to +15 (1) V
Output current (DC) IOD 0.8 (2) A
Output current (Pulse) IOP Internal limitation (3) A
Diagnostic output current IST 1 mA
Power Consumption Pd
2.100 (HTSOP-J8) (4)
1.750(HSON 8) (5) W
0.587 (MSOP 8) (6)
Operating temperature range Topr -40 ≤ Topr < +150 °C
Storage temperature range Tstg -55 to +150 °C
Maximum junction temperature Tjmax 150 °C
Active clamp energy (single pulse) EAV 33 mJ
Operating Voltage Ratings
Parameter Symbol Rating Unit
Operating voltage VDD 4 to 18 V
(1) However, VDD ≥ VIN
(2) However, exceed neither Pd nor ASO.
(3) Because of overcurrent protection circuit. (Refer to P11 Figure 20)
(4) IC mounted on ROHM standard board (70×70×1.6[mm], copper area 70×70[mm], glass epoxy 2 layer board).
Derate by 16.8mW above 25°C
(5) IC mounted on ROHM standard board (70×70×1.6[mm], copper area 70×70[mm], glass epoxy 2 layer board).
Derate by 14.0mW above 25°C
(6) IC mounted on ROHM standard board (70×70×1.6[mm], copper area 70×70[mm], glass epoxy 1 layer board).
Derate by 4.7mW above 25°C.
Heat Dissipation Characteristic
(HTSOP-J8) (1)IC mounted on ROHM standard board (70×70×1.6[mm], copper area 70×70[mm],
glass epoxy 4 layer board). Derate by 30mW/°C above 25°C.
(2)IC mounted on ROHM standard board (70×70×1.6[mm], copper area 70×70[mm],
glass epoxy 2 layer board). Derate by 16.8mW/°C above 25°C.
(HSON 8) (3)IC mounted on ROHM standard board (70×70×1.6[mm], copper area 70×70[mm],
glass epoxy 2 layer board). Derate by 14.0mW/°C above 25°C.
(MSOP 8) (4)IC mounted on ROHM standard board (70×70×1.6[mm],copper area 70×70[mm],
glass epoxy 1 layer board). Derate by 4.7mW/°C above 25°C.
0.00
0.50
1.00
1.50
2.00
2.50
3.00
3.50
4.00
0 25 50 75 100 125 150
Ta [°C]
Pd [W]
0.587 W
2.100 W
3.750 W
(1) HTSOP-J8
(2) HTSOP-J8
(4) MSOP8
1.750 W
(3) HSON8
(1) HTSOP-J8(glass epoxy 4 layer board)
(2) HTSOP-J8(glass epoxy 2 layer board)
(3) HSON8 (glass epoxy 2 layer board)
(4) MSOP8 (glass epoxy 1 layer board)
Datasheet
Datasheet
4/18
BD1Hx500 Series
TSZ02201-0G3G0BD00070-1-2
© 2015 ROHM Co., Ltd. All rights reserved. 2015.04.15 Rev.002
www.rohm.com
TSZ22111・15・001
Electrical Characteristics (unless otherwise specified, VDD=4V to 18V, -40°C ≤ Tj ≤ +150°C)
Parameter Symbol
Target value Unit Conditions
Min Typ Max
[Power Supply Block]
Standby current
IDDS1 - 0.1 10 μA VDD=12V,VIN=0V,
VOUT=0V,Tj=25°C
IDDS2 - - 220 μA VDD=12V,VIN=0V,
VOUT=0V,Tj=150°C
Operating current IDD - 1.5 3.0 mA VDD=12V,VIN=5V，VOUT=open
Under Voltage Lock Out (UVLO)
Threshold VUVLO - 3.0 3.6 V
[Input Block]
H level input voltage VIN(H) 3.0 - - V
L level input voltage VIN(L) - - 1.0 V
Input hysteresis VIN(HYS) - 0.3 - V
H level input current IIN(H) - 50 100 μA VIN=5V
L level input current IIN(L) -10 - 10 μA VIN=0V
[Power MOS Output]
Output ON resistance RDS(ON) - 500 650 mΩ V
DD=12V,IOUT=0.25A,Tj=25°C
RDS(ON) - 900 1200 mΩ V
DD=12V,IOUT=0.25A,Tj=150°C
Output leak current IL(OFF) - - 5 μA VIN=0V, Tj=25°C
IL(OFF) - - 200 μA VIN=0V, Tj=150°C
Switching time
tON - 13 25 μs VDD=12V ,RL=47Ω,Tj=25°C
Figure16
tOFF - 9 25 μs VDD=12V ,RL=47Ω,Tj=25°C
Figure16
Slew rate on dV/dtON - 3 6 V/μs VDD=12V ,RL=47Ω,Tj=25°C
Figure16
Slew rate off -dV/dtOFF - 3 6 V/μs VDD=12V ,RL=47Ω,Tj=25°C
Figure16
Output clamp voltage VCL -8 -6.0 -4.5 V
VIN =0V,IOUT=100mA
Figure17
[Diagnostic Output]
Diagnostic
output voltage “L” level VSTL - - 0.4 V VIN=5V,IST=0.1mA
Diagnostic
output current “H” level ISTH - - 10 μA VIN=0V,VST=12V
Datasheet
Datasheet
5/18
BD1Hx500 Series
TSZ02201-0G3G0BD00070-1-2
© 2015 ROHM Co., Ltd. All rights reserved. 2015.04.15 Rev.002
www.rohm.com
TSZ22111・15・001
Electrical Characteristics (unless otherwise specified, VDD=4V to 18V, -40°C ≤ Tj ≤ 150°C)
Parameter Symbol
Target value Unit Conditions
Min Typ Max
[Protect Circuit]
Overcurrent protection ILIM 0.8 1.45 2.0 A
Diagnostic output
delay time(OCP)
ON tDHL - 20 100 μs Diagnostic output
delay time(OCP) Figure20
OFF tDLH - 100 200 μs VDD=12V, RL=∞ to 4Ω
Figure 20
Open Load Detection threshold
(1) VOPEN 1.3 2.8 4.0 V VIN =0V
Open Load Detection delay time TOPEN 100 300 1000 μs VIN =5V to 0V Figure21
(1) In order to detect the voltage, an external resistance (Rext) of 130kΩ (Typ) is required between VDD and OUT pins.
At worst condition, the following resistance is recommended.
VDD Rext
12 V Under 200kΩ
6 V Under 50kΩ
5 V Under 25kΩ
Terms
Figure 1. Terms
V
DD
ST
IN OUT
GND
100kΩ
5V
VDD=12V
Rext
130kΩ
Datasheet
Datasheet
6/18
BD1Hx500 Series
TSZ02201-0G3G0BD00070-1-2
© 2015 ROHM Co., Ltd. All rights reserved. 2015.04.15 Rev.002
www.rohm.com
TSZ22111・15・001
Measuring circuit
Figure 3. Switching time measuring circuit
Figure 2. RON measuring circuit
Figure 4. Output clamp voltage measuring circuit Figure 5. Open Load Detection threshold
measuring circuit
VDD
OUTIN
GND R
L
=47Ω
V
IN
=0V/5V
V
DD
=12V
V
OUT
VDD
OUTIN
GND I
OUT
=0.25A
V
IN
=5V
V
DD
=12V
R
DS(ON)
=(V
DD
-V
OUT
)/I
OUT
VDD
OUTIN
GND
IOUT=100mA
V
DD
=12V
V
CL
V
DD
ST
IN OUT
GND
100kΩ
5V V
DD
=12V
Rext
V
ST
V
op en
5V to 0V
Datasheet
Datasheet
7/18
BD1Hx500 Series
TSZ02201-0G3G0BD00070-1-2
© 2015 ROHM Co., Ltd. All rights reserved. 2015.04.15 Rev.002
www.rohm.com
TSZ22111・15・001
Diagnostic Output Truth Table
VIN Tj OUTPUT Mode VST Output state
VOUT I
OUT
H
Tj ≤ 175°C (Typ) -
IOUT < 1.45A(Typ) Normal H ON
IOUT ≥ 1.45A(Typ) Overcurrent
protect L OFF
(1)
Tj > 175°C (Typ) - - Overheating
protect L OFF(1)
L -
H
(Over 2.8V(Typ)) - Open protect L OFF(1)
L - Stand by H OFF(1)
(1)OFF : 130kΩ(Typ) is built in between OUT and GND.
Datasheet
Datasheet
8/18
BD1Hx500 Series
TSZ02201-0G3G0BD00070-1-2
© 2015 ROHM Co., Ltd. All rights reserved. 2015.04.15 Rev.002
www.rohm.com
TSZ22111・15・001
Typical Performance Cur ves (unless otherwise specified, VDD=12V, VIN=5V, Tj=25°C)
Figure 6. Output ON Resistance Characteristic
[temperature characteristic]
Figure 7. Output ON Resistance Characteristic
[Power supply voltage characteristic]
Figure 8. Standby Current Characteristic
(VIN=0V)
Figure 9. Input Current Characteristic
0
200
400
600
800
1000
1200
-50 -25 0 25 50 75 100 125 150
Tj [°C]
RDS(on) [mΩ]
0
200
400
600
800
1000
1200
4 6 8 10 12 14 16 18
V
DD
[V]
Ron [mΩ]
(1)
0.0
2.0
4.0
6.0
8.0
10.0
4 6 8 10 12 14 16 18
VDD [V]
IDDS [µA]
0
50
100
150
200
250
300
024681012
VIN [V]
IIN [µA]
Tj=150°C
Tj=25°C
Tj=-40°C
(1)Since the reference voltage of a charge
pump circuit changes at the time of reduced
voltage, ON resistance changes about 3% in
the 6.5V neighborhood.
Datasheet
Datasheet
9/18
BD1Hx500 Series
TSZ02201-0G3G0BD00070-1-2
© 2015 ROHM Co., Ltd. All rights reserved. 2015.04.15 Rev.002
www.rohm.com
TSZ22111・15・001
Typical Performance Cur ves (unless otherwise specified, VDD=12V, VIN=5V, Tj=25°C)
Figure 10. Switching Time (tON)[temperature characteristic] Figure 11. Switching Time (tOFF)[temperature characteristic]
Figure 12. Slew Rate ON [temperature characteristic] Figure 13. Slew Rate OFF [temperature characteristic]
0.0
5.0
10.0
15.0
20.0
25.0
-50 -25 0 25 50 75 100 125 150
Tj [°C]
tON [μs]
0.0
5.0
10.0
15.0
20.0
25.0
-50-25 0 25 50 75100125150
Tj [°C]
t
OFF
[μs]
0.0
1.0
2.0
3.0
4.0
5.0
6.0
-50 -25 0 25 50 75 100 125 150
Tj [°C]
dV/dt
ON
[V/μs]
0.0
1.0
2.0
3.0
4.0
5.0
6.0
-50-25 0 25 50 75100125150
Tj [°C]
-dV/dtOFF [V/μs]
Datasheet
Datasheet
10/18
BD1Hx500 Series
TSZ02201-0G3G0BD00070-1-2
© 2015 ROHM Co., Ltd. All rights reserved. 2015.04.15 Rev.002
www.rohm.com
TSZ22111・15・001
Typical Performance Cur ves (unless otherwise specified, VDD=12V, VIN=5V, Tj=25°C)
Switching time measuring Active clamp energy timing chart
1.5
1.6
1.7
1.8
1.9
2.0
2.1
2.2
2.3
-50 -25 0 25 50 75 100 125 150
Tj [℃]
VIN [V]
ON threshold
OFF threshold
Figure 14. Input Voltage Threshold Characteristic Figure 15. Output Leak Current [temperature characteristic]
（VIN=0V）
Figure 17. Active Clamp Energy Timing Chart Figure 16. Switching time
0
5
10
15
20
25
30
-50-250 255075100125150
Tj [°C]
IOUT [μA]
VIN
VST
VOUT
IOUT
t
t
t
t
tON tOFF
VCL
Input
Voltage
Error
flag
Output
voltage
Output
current
Datasheet
Datasheet
11/18
BD1Hx500 Series
TSZ02201-0G3G0BD00070-1-2
© 2015 ROHM Co., Ltd. All rights reserved. 2015.04.15 Rev.002
www.rohm.com
TSZ22111・15・001
Protect function timing chart
Figure 18. BD1HC500 Off-latch Overheat Protection
Timing Chart
Figure 20. Overcurrent Protect Timing Chart
Figure 19. BD1HD500 Self-restart Overheat Protection
Timing Chart
Figure 21. Open Load Detection Timing Chart
t
t
t
t
12.5μs(Typ)
Input
voltage
Chip
temperature
Tj
Output
current
Error
flag V
ST
I
OUT
V
IN
Input
voltage
Chip
temperature
Tj
Output
current
Error
flag V
ST
t
t
t
t
I
OUT
V
IN
12.5μs(Typ)
V
IN
Vout
V
ST
Input
voltage
Output
voltage
Error
flag
t
t
t
300μs(Typ)
Vout ≥ 2.8V(Typ)
(V
OPEN
)
(T
OPEN
)
V
IN
Vout
I
OUT
V
ST
20μs(Typ)
(t
DHL
)
1ms(Typ)
t
t
t
t
100μs(Typ)
(t
DLH
)
I
OCP
Input
voltage
Output
voltage
Output
current
Error
flag
Datasheet
Datasheet
12/18
BD1Hx500 Series
TSZ02201-0G3G0BD00070-1-2
© 2015 ROHM Co., Ltd. All rights reserved. 2015.04.15 Rev.002
www.rohm.com
TSZ22111・15・001
I/O equivalence circuits
Pin Symbol I/O equivalence circuits
1 IN
2 GND
3, 4
5, 6
OUT
VDD
VDD
130kΩ
(Typ)
GND
OUT
8 ST
Cooling Tab TAB
Datasheet
Datasheet
13/18
BD1Hx500 Series
TSZ02201-0G3G0BD00070-1-2
© 2015 ROHM Co., Ltd. All rights reserved. 2015.04.15 Rev.002
www.rohm.com
TSZ22111・15・001
Ordering Information
BD1Hx500FVM - CTR
Series PKG
EFJ: HTSOP-J8
HFN:HSON8
FVM: MSOP8
Packaging and forming specification
E2:Embossed tape and reel
(HTSOP-J8)
TR:Embossed tape and reel
(MSOP 8,HSON 8)
C: High reliability
C:TSD Off-latch
D:TSD Self-restart
Marking Diagram
MSOP8 (TOP VIEW)
Hx5 Part Number Marking
LOT Number
1PIN MARK
0 0
HTSOP-J8 (TOP VIEW)
Hx500
Part Number Marking
LOT Number
1PIN MARK
HSON8 (TOP VIEW)
00
Part Number Marking
LOT Number
1PIN MARK
Hx5
Datasheet
Datasheet
14/18
BD1Hx500 Series
TSZ02201-0G3G0BD00070-1-2
© 2015 ROHM Co., Ltd. All rights reserved. 2015.04.15 Rev.002
www.rohm.com
TSZ22111・15・001
Physical Dimension Tape and Reel Information
Package Name HTSOP-J8
∗
Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
Embossed carrier tapeTape
Quantity
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
2500pcs
E2
()
Direction of feed
Reel 1pin
Datasheet
Datasheet
15/18
BD1Hx500 Series
TSZ02201-0G3G0BD00070-1-2
© 2015 ROHM Co., Ltd. All rights reserved. 2015.04.15 Rev.002
www.rohm.com
TSZ22111・15・001
Package Name HSON8
Direction of feed
Reel
∗
Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
Embossed carrier tapeTape
Quantity
Direction
of feed
The direction is the 1pin of product is at the upper right when you hold
reel on the left hand and you pull out the tape on the right hand
3000pcs
TR
()
1pin
Datasheet
Datasheet
16/18
BD1Hx500 Series
TSZ02201-0G3G0BD00070-1-2
© 2015 ROHM Co., Ltd. All rights reserved. 2015.04.15 Rev.002
www.rohm.com
TSZ22111・15・001
Package Name MSOP8
Direction of feed
Reel
∗
Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
Embossed carrier tapeTape
Quantity
Direction
of feed
The direction is the 1pin of product is at the upper right when you hold
reel on the left hand and you pull out the tape on the right hand
3000pcs
TR
()
1pin
Datasheet
Datasheet
17/18
BD1Hx500 Series
TSZ02201-0G3G0BD00070-1-2
© 2015 ROHM Co., Ltd. All rights reserved. 2015.04.15 Rev.002
www.rohm.com
TSZ22111・15・001
Operational Notes
1) Absolute Maximum Ratings
Operating the IC over the absolute maximum ratings may damage the IC. In addition, it is impossible to predict all
destructive situations such as short-circuit modes or open circuit modes. Therefore, it is important to consider circuit
protection measures, like adding a fuse, in case the IC is expected to be operated in a special mode exceeding the
absolute maximum ratings.
2) Reverse connection of power supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
terminals.
3) Power supply line
Design the PCB layout pattern to provide low impedance ground and supply lines. Separate the ground and supply
lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting
the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of
temperature and aging on the capacitance value when using electrolytic capacitors.
4) GND voltage
The voltage of the ground pin must be the lowest voltage of all pins of the IC at all operating conditions. Ensure that no
pins are at a voltage below the ground pin at any time, even during transient condition.
5) Thermal consideration
Use a thermal design that allows for a sufficient margin by taking into account the permissible power dissipation (Pd) in
actual operating conditions.
6) Short between pins and mounting errors
Be careful when mounting the IC on printed circuit boards. The IC may be damaged if it is mounted in a wrong
orientation or if pins are shorted together. Short circuit may be caused by conductive particles caught between the pins.
7) TSD (Thermal Shut Down)
The IC incorporates a built-in thermal shutdown circuit, which is designed to turn off the IC when the internal
temperature of the IC reaches a 175°C (with 25°C hysteresis). It is not designed to protect the IC from damage or
guarantee its operation. Do not continue to operate the IC after this function is activated. Do not use the IC in
conditions where this function will always be activated.
8) Overcurrent protection circuit (OCP)
The IC incorporates an over-current protection circuit that operates in accordance with the rated output capacity. This
circuit protects the IC from damage when the load becomes shorted. It is also designed to limit the output current
(without latching) in the event of more than 1.45A (Typ) current flow, such as from a large capacitor or other component
connected to the output pin. This protection circuit is effective in preventing damage to the IC in cases of sudden and
unexpected current surges. The IC should not be used in applications where the over current protection circuit will be
activated continuously.
ST (8 PIN) will be set to ‘L (abnormal condition)’ if the current limit state continues to 20μs(Typ). Then, ST (8 PIN) will
be set to ‘H (normal condition)’ if the current limit release until 1.1ms(Typ).
If current limit state continues, generation of heat, degradation, etc. of the IC can be considered. When the state of
overcurrent still flows, compensate by setting the IC in standby mode applications using ST (8 PIN).
9) Testing on application boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.
10) Regarding input pins of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
11) FIN (HTSOP-J8,HSON 8)
Since it has connected with sub of IC, please connect the heat dissipation metal to external GND potential.
Status of this document
The Japanese version of this document is the formal datasheet. A customer may use this translation version only as
reference to help understand the formal version. If there are any differences, the formal version takes precedence.
Datasheet
Datasheet
18/18
BD1Hx500 Series
TSZ02201-0G3G0BD00070-1-2
© 2015 ROHM Co., Ltd. All rights reserved. 2015.04.15 Rev.002
www.rohm.com
TSZ22111・15・001
Revision History
Date Revision Changes
20.Sep.2013 001
New Release
15.Apr.2015 002
・P1. “AEC-Q100 qualified” is added in Features
・P1. “Product Summary” modify
・P1. Typical Application Circuit change from ”VDD” to ”VBAT”
・P2. Pin Descriptions change from ”FIN” to ”Cooling Tab” and add Note(1)
・P3. Absolute Maximum Ratings delete “Ta”
・P3. Operating Voltage Ratings change Note(1) content
・P5. Electrical Characteristics modify circuit figure of “Note(1)”
・P7. Diagnostic Output Truth Table modify
・P11 . Change from “µsec” to ”µs” at Protect function timing chart
・P12 . I/O equivalence circuits add “Cooling Tab”
Datasheet
Datasheet
Notice-PAA-E Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
Notice
Precaution on using ROHM Products
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1),
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred b y you or thir d parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN USA EU CHINA
CLASSⅢ CLASSⅢ CLASSⅡb CLASSⅢ
CLASSⅣ CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe d esign against the physical injur y, damage to any property, which
a failure or malfunction of our Products may cause. T he following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expens es or losses arising from the
use of any ROHM’s Products under an y special or extraordinary envir onments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product perfor mance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlig ht or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing comp onents, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flu x (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in usin g the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Po wer Dissipation (P d) dependi ng on Ambient temp erature (T a). When used i n sealed area, confirm the actual
ambient temperature.
8. Confirm that operation temperature is within the specified range d escribed in the product specification.
9. ROHM shall not be in any way responsible or lia ble for failure induced under deviant conditio n from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. W hen a highly active halogen ous (chlori ne, bromin e, etc.) flux is used, the residue of flux may negativel y affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM represe ntative in advance.
For details, please refer to ROHM Mounting specification
Datasheet
Datasheet
Notice-PAA-E Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise you r own indepen dent verificati on and judgme nt in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please t ake special care under dry condit ion (e.g. Grounding of human body / equipment / sol der iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportati on
1. Product performance and soldered connections may deter iorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to di rect sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage c ondition, solderabil ity of products out of recommended storage time perio d
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommen de d storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive s t ress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time perio d.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products pl ease dispose them properly us ing an authorized industr y waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoi ng information or data will not infringe any int ellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or imp lied, is granted hereby under an y intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained i n this document. Provide d, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including b ut not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
DatasheetDatasheet
Notice – WE Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
