Datasheet Automotive IPS series 1ch High-side switch BD1Hx500 Series Features Built-in overcurrent protection circuit Built-in Thermal Shut Down(TSD) Built-in Open Load Detection circuit(When Output is OFF) Possibility to control directly from CMOS logic IC Low standby current Built-in Under Voltage Lock Out circuit Built-in diagnostic(ST) output function Low On resistance of RDS(ON)=500m(Typ) (VDD=12V, Ta=25C, Io=0.25A) Monolithic power IC that has a built in control part (CMOS) and a power MOS FET on 1chip 1ch High-side switch for the mechanical relay coil drive AEC-Q100 qualified (1) Product Summary Operating voltage On-state resistance (25C, Typ) Overcurrent limit (Typ) Active clamp energy (25C) Package HTSOP-J8 HSON8 MSOP8 4V to 18V 500m 1.45A 33mJ 4.90mm x 6.00mm x 1.00mm 2.90mm x 3.00mm x 0.60mm 2.90mm x 4.00mm x 0.90mm (1) Grade 1 General Description BD1HC/D500 Series is an Automotive 1ch High-Side switch. It has a built-in overcurrent protection circuit, Thermal Shut Down (TSD) circuit, Open Load Detection circuit, Under Voltage Lock Out circuit, and has diagnostic (ST) output function at the time during abnormal detection. HTSOP-J8 HSON 8 MSOP 8 Application For automotive (Air conditioner, body equipment, and meter, etc.) Typical Application Circuit Product structureSilicon monolithic integrated circuit www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211114001 This product is not designed protection against radioactive rays 1/18 TSZ02201-0G3G0BD00070-1-2 2015.04.15 Rev.002 Datasheet BD1Hx500 Series Pin Descriptions Pin Symbol 1 IN 2 GND Earth terminal. 3, 4 OUT Output terminal. When the load becomes in a short-circuit state and if the current exceeds overcurrent detection value of 0.8A (Min) the current flowing in the output pin will be limited due IC protection. 5, 6 VDD Power-supply terminal. 7 N.C N.C 8 ST Cooling Tab (1) TAB Function Input terminal. The pull-down resistor is internally connected. Self-diagnostic output terminal. "L" is becomes the output state during overcurrent, overheating and open load detection conditions. Please refer to Diagnostic Output Truth Table on page 5. The circuit is composed of an open drain N channel MOS. Since it has connected with sub of IC, please connect the heat dissipation metal to external GND potential. (HTSOP-J8,HSON8) (1)MSOP8 does not have Cooling Tab. Pin Configurations HTSOP-J8 (TOP VIEW) HSON8 (TOP VIEW) 1.IN 8. ST 2.GND 7. N.C 3.OUT 6. VDD 4.OUT 5. VDD MSOP8 (TOP VIEW) 1.IN 8. ST 1.IN 8. ST 2.GND 7. N.C 2.GND 7. N.C 3.OUT 6. VDD 3.OUT 6. VDD 4.OUT 5. VDD 4.OUT 5. VDD Product Line-up Product Name BD1HC500EFJ-C PKG On-state Resistance (25C, Typ) HTSOP-J8 BD1HC500HFN-C HSON 8 BD1HC500FVM-C MSOP 8 BD1HD500EFJ-C BD1HD500HFN-C HTSOP-J8 HSON 8 BD1HD500FVM-C MSOP 8 www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 TSD Function Off-latch 500m Self-restart 2/18 TSZ02201-0G3G0BD00070-1-2 2015.04.15 Rev.002 Datasheet BD1Hx500 Series Absolute Maximum Ratings Parameter Symbol Rating Unit Voltage between drain and source V DS 44.5 (Internal limitation) V Power supply voltage V DD Input voltage V IN -0.3 to +12 (1) Diagnostic output voltage V ST -0.3 to +15 (1) Output current (DC) Output current (Pulse) I OD 0.8 I OP Internal limitation Diagnostic output current I ST 40 V V V (2) A (3) mA 2.100 (HTSOP-J8) Power Consumption A 1 Pd 1.750(HSON 8) (5) 0.587 (MSOP 8) (6) (4) W Operating temperature range T opr -40 Topr < +150 C Storage temperature range T stg -55 to +150 C Maximum junction temperature T jmax 150 C E AV 33 mJ Symbol Rating Unit V DD 4 to 18 V Active clamp energy (single pulse) Operating Voltage Ratings Parameter Operating voltage (1) However, V D D VIN (2) However, exceed neither Pd nor ASO. (3) Because of overcurrent protection circuit. (Refer to P11 Figure 20) (4) IC mounted on ROHM standard board (70x70x1.6[mm], copper area 70x70[mm], glass epoxy 2 layer board). Derate by 16.8mW above 25C (5) IC mounted on ROHM standard board (70x70x1.6[mm], copper area 70x70[mm], glass epoxy 2 layer board). Derate by 14.0mW above 25C (6) IC mounted on ROHM standard board (70x70x1.6[mm], copper area 70x70[mm], glass epoxy 1 layer board). Derate by 4.7mW above 25C. Heat Dissipation Characteristic 4.00 3.750 W (1) (2) (3) (4) 3.50 3.00 (1) HTSOP-J8 2.50 Pd [W] HTSOP-J8(glass epoxy 4 layer board) HTSOP-J8(glass epoxy 2 layer board) HSON8 (glass epoxy 2 layer board) MSOP8 (glass epoxy 1 layer board) 2.100 W 2.00 1.750 W (2) HTSOP-J8 1.50 (3) HSON8 1.00 0.587 W 0.50 (4) MSOP8 0.00 0 25 50 75 100 125 150 Ta [C] (HTSOP-J8) (1)IC mounted on ROHM standard board (70x70x1.6[mm], copper area 70x70[mm], glass epoxy 4 layer board). Derate by 30mW/C above 25C. (2)IC mounted on ROHM standard board (70x70x1.6[mm], copper area 70x70[mm], glass epoxy 2 layer board). Derate by 16.8mW/C above 25C. (HSON 8) (3)IC mounted on ROHM standard board (70x70x1.6[mm], copper area 70x70[mm], glass epoxy 2 layer board). Derate by 14.0mW/C above 25C. (MSOP 8) (4)IC mounted on ROHM standard board (70x70x1.6[mm],copper area 70x70[mm], glass epoxy 1 layer board). Derate by 4.7mW/C above 25C. www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 3/18 TSZ02201-0G3G0BD00070-1-2 2015.04.15 Rev.002 Datasheet BD1Hx500 Series Electrical Characteristics (unless otherwise specified, VDD=4V to 18V, -40C Tj +150C) Target value Parameter Symbol Unit Min Typ Max Conditions [Power Supply Block] VDD=12V,VIN=0V, VOUT=0V,Tj=25C VDD=12V,VIN=0V, VOUT=0V,Tj=150C IDDS1 - 0.1 10 A IDDS2 - - 220 A IDD - 1.5 3.0 mA VUVLO - 3.0 3.6 V H level input voltage VIN(H) 3.0 - - V L level input voltage VIN(L) - - 1.0 V VIN(HYS) - 0.3 - V H level input current IIN(H) - 50 100 A VIN=5V L level input current IIN(L) -10 - 10 A VIN=0V RDS(ON) RDS(ON) - 500 900 650 1200 m m VDD=12V,IOUT=0.25A,Tj=25C VDD=12V,IOUT=0.25A,Tj=150C Standby current Operating current Under Voltage Lock Out (UVLO) Threshold VDD=12V,VIN=5VVOUT=open [Input Block] Input hysteresis [Power MOS Output] Output ON resistance IL(OFF) - - 5 A VIN=0V, Tj=25C IL(OFF) - - 200 A VIN=0V, Tj=150C tON - 13 25 s tOFF - 9 25 s Slew rate on dV/dtON - 3 6 V/s Slew rate off -dV/dtOFF - 3 6 V/s VCL -8 -6.0 -4.5 V "L" level VSTL - - 0.4 V VIN=5V,IST=0.1mA "H" level ISTH - - 10 A VIN=0V,VST=12V Output leak current Switching time Output clamp voltage VDD=12V ,RL=47,Tj=25C Figure16 VDD=12V ,RL=47,Tj=25C Figure16 VDD=12V ,RL=47,Tj=25C Figure16 VDD=12V ,RL=47,Tj=25C Figure16 VIN =0V,IOUT=100mA Figure17 [Diagnostic Output] Diagnostic output voltage Diagnostic output current www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 4/18 TSZ02201-0G3G0BD00070-1-2 2015.04.15 Rev.002 Datasheet BD1Hx500 Series Electrical Characteristics (unless otherwise specified, VDD=4V to 18V, -40C Tj 150C) Target value Parameter Symbol Unit Min Typ Max Conditions [Protect Circuit] Overcurrent protection ILIM 0.8 1.45 2.0 A ON tDHL - 20 100 s OFF tDLH - 100 200 s (1) VOPEN 1.3 2.8 4.0 V VIN =0V Open Load Detection delay time TOPEN 100 300 1000 s VIN =5V to 0V Diagnostic output delay time(OCP) Open Load Detection threshold Diagnostic output delay time(OCP) Figure20 VDD=12V, RL= to 4 Figure 20 Figure21 (1) In order to detect the voltage, an external resistance (Rext) of 130k (Typ) is required between VDD and OUT pins. At worst condition, the following resistance is recommended. VDD 12 V 6V Rext Under 200k Under 50k 5V Under 25k 5V VDD=12V 100k ST VDD Rext 130k IN OUT GND Terms Figure 1. Terms www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 5/18 TSZ02201-0G3G0BD00070-1-2 2015.04.15 Rev.002 Datasheet BD1Hx500 Series Measuring circuit VDD=12V VDD=12V RDS(ON)=(VDD-VOUT)/IOUT VDD VDD IN IN OUT GND VIN=5V IOUT=0.25A OUT VIN=0V/5V RL=47 GND VOUT Figure 3. Switching time measuring circuit Figure 2. RON measuring circuit 5V VDD=12V VDD=12V 100k VDD ST VDD VST IN Rext OUT IN GND IOUT=100mA VCL 5V to 0V Vopen Figure 5. Open Load Detection threshold measuring circuit Figure 4. Output clamp voltage measuring circuit www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 OUT GND 6/18 TSZ02201-0G3G0BD00070-1-2 2015.04.15 Rev.002 Datasheet BD1Hx500 Series Diagnostic Output Truth Table VIN OUTPUT Tj Mode VST Output state IOUT < 1.45A(Typ) Normal H ON IOUT 1.45A(Typ) Overcurrent protect L OFF (1) - - Overheating protect L OFF(1) H (Over 2.8V(Typ)) - Open protect L OFF(1) L - Stand by H OFF(1) VOUT Tj 175C (Typ) - H Tj > 175C (Typ) L - IOUT (1)OFF : 130k(Typ) is built in between OUT and GND. www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 7/18 TSZ02201-0G3G0BD00070-1-2 2015.04.15 Rev.002 Datasheet BD1Hx500 Series 1200 1200 1000 1000 800 800 Ron [m] RDS(on) [m] Typical Performance Curves (unless otherwise specified, VDD=12V, VIN=5V, Tj=25C) 600 600 (1) 400 400 200 200 0 0 -50 -25 0 25 50 75 100 125 150 4 6 8 Tj [C] 10 12 14 16 18 VDD [V] Figure 6. Output ON Resistance Characteristic [temperature characteristic] Figure 7. Output ON Resistance Characteristic [Power supply voltage characteristic] (1)Since the reference voltage of a charge pump circuit changes at the time of reduced voltage, ON resistance changes about 3% in the 6.5V neighborhood. 10.0 300 250 8.0 6.0 IIN [A] IDDS [A] 200 4.0 Tj=150C 150 Tj=25C 100 2.0 50 Tj=-40C 0 0.0 4 6 8 10 12 14 16 0 18 4 6 8 10 12 VIN [V] VDD [V] Figure 8. Standby Current Characteristic (VIN=0V) www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 2 Figure 9. Input Current Characteristic 8/18 TSZ02201-0G3G0BD00070-1-2 2015.04.15 Rev.002 Datasheet BD1Hx500 Series 25.0 25.0 20.0 20.0 15.0 15.0 tOFF [s] tON [s] Typical Performance Curves (unless otherwise specified, VDD=12V, VIN=5V, Tj=25C) 10.0 10.0 5.0 5.0 0.0 0.0 -50 -25 0 25 50 75 100 125 150 -50 -25 0 25 Tj [C] 75 100 125 150 Tj [C] Figure 10. Switching Time (tON)[temperature characteristic] Figure 11. Switching Time (tOFF)[temperature characteristic] 6.0 6.0 5.0 5.0 4.0 4.0 -dV/dtOFF [V/s] dV/dtON [V/s] 50 3.0 2.0 3.0 2.0 1.0 1.0 0.0 0.0 -50 -25 0 25 50 75 100 125 150 Tj [C] Figure 12. Slew Rate ON [temperature characteristic] www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 9/18 -50 -25 0 25 50 75 100 125 150 Tj [C] Figure 13. Slew Rate OFF [temperature characteristic] TSZ02201-0G3G0BD00070-1-2 2015.04.15 Rev.002 Datasheet BD1Hx500 Series Typical Performance Curves (unless otherwise specified, VDD=12V, VIN=5V, Tj=25C) 30 2.3 2.2 ON threshold 25 2.1 20 IOUT [A] VIN [V] 2.0 1.9 1.8 15 10 1.7 5 OFF threshold 1.6 0 1.5 -50 -25 0 25 50 75 -50 100 125 150 -25 0 25 50 75 100 125 150 Tj [C] Tj [] Figure 14. Input Voltage Threshold Characteristic Figure 15. Output Leak Current [temperature characteristic] VIN=0V Switching time measuring Active clamp energy timing chart Input Voltage VIN Error flag VST t t Output voltage VOUT t VCL Output current IOUT tON Figure 16. Switching time www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 tOFF t Figure 17. Active Clamp Energy Timing Chart 10/18 TSZ02201-0G3G0BD00070-1-2 2015.04.15 Rev.002 Datasheet BD1Hx500 Series Protect function timing chart Input voltage Input voltage VIN VIN t Chip temperature t Chip temperature Tj Tj t Output current t Output current IOUT IOUT t Error flag t Error flag VST t VST t 12.5s(Typ) 12.5s(Typ) Figure 19. BD1HD500 Self-restart Overheat Protection Timing Chart Figure 18. BD1HC500 Off-latch Overheat Protection Timing Chart Input V IN voltage t Input voltage VIN t Output Vout voltage t Output I OUT current Output voltage Vout2.8V(Typ) (VOPEN ) Vout IOCP t t 1ms(Typ) Error flag VST t Error flag VST t 20s(Typ) (tDHL) 100s(Typ) (tDLH) Figure 20. Overcurrent Protect Timing Chart www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 300s(Typ) (TOPEN) 11/18 Figure 21. Open Load Detection Timing Chart TSZ02201-0G3G0BD00070-1-2 2015.04.15 Rev.002 Datasheet BD1Hx500 Series I/O equivalence circuits Pin Symbol 1 IN 2 GND I/O equivalence circuits VDD 3, 4 OUT 5, 6 VDD OUT 130k (Typ) GND 8 Cooling Tab ST TAB www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 12/18 TSZ02201-0G3G0BD00070-1-2 2015.04.15 Rev.002 Datasheet BD1Hx500 Series Ordering Information B D 1 H x 5 0 0 Series C:TSD Off-latch D:TSD Self-restart F V M - PKG EFJ: HTSOP-J8 HFN:HSON8 FVM: MSOP8 CTR Packaging and forming specification E2:Embossed tape and reel (HTSOP-J8) TR:Embossed tape and reel (MSOP 8,HSON 8) C: High reliability Marking Diagram HTSOP-J8 (TOP VIEW) HSON8 (TOP VIEW) Part Number Marking Part Number Marking H x 5 0 0 Hx5 LOT Number 0 LOT Number 0 1PIN MARK 1PIN MARK MSOP8 (TOP VIEW) Part Number Marking H 0 x 5 0 LOT Number 1PIN MARK www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 13/18 TSZ02201-0G3G0BD00070-1-2 2015.04.15 Rev.002 Datasheet BD1Hx500 Series Physical Dimension Tape and Reel Information Package Name HTSOP-J8 <Tape and Reel information> Tape Embossed carrier tape Quantity 2500pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand Direction of feed 1pin Reel www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 ) Order quantity needs to be multiple of the minimum quantity. 14/18 TSZ02201-0G3G0BD00070-1-2 2015.04.15 Rev.002 Datasheet BD1Hx500 Series Package Name HSON8 <Tape and Reel information> Tape Embossed carrier tape Quantity 3000pcs Direction of feed TR The direction is the 1pin of product is at the upper right when you hold ( reel on the left hand and you pull out the tape on the right hand ) 1pin Direction of feed Reel www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 Order quantity needs to be multiple of the minimum quantity. 15/18 TSZ02201-0G3G0BD00070-1-2 2015.04.15 Rev.002 Datasheet BD1Hx500 Series Package Name MSOP8 <Tape and Reel information> Tape Embossed carrier tape Quantity 3000pcs Direction of feed TR The direction is the 1pin of product is at the upper right when you hold ( reel on the left hand and you pull out the tape on the right hand ) 1pin Direction of feed Reel www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 Order quantity needs to be multiple of the minimum quantity. 16/18 TSZ02201-0G3G0BD00070-1-2 2015.04.15 Rev.002 Datasheet BD1Hx500 Series Operational Notes 1) Absolute Maximum Ratings Operating the IC over the absolute maximum ratings may damage the IC. In addition, it is impossible to predict all destructive situations such as short-circuit modes or open circuit modes. Therefore, it is important to consider circuit protection measures, like adding a fuse, in case the IC is expected to be operated in a special mode exceeding the absolute maximum ratings. 2) Reverse connection of power supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC's power supply terminals. 3) Power supply line Design the PCB layout pattern to provide low impedance ground and supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 4) GND voltage The voltage of the ground pin must be the lowest voltage of all pins of the IC at all operating conditions. Ensure that no pins are at a voltage below the ground pin at any time, even during transient condition. 5) Thermal consideration Use a thermal design that allows for a sufficient margin by taking into account the permissible power dissipation (Pd) in actual operating conditions. 6) Short between pins and mounting errors Be careful when mounting the IC on printed circuit boards. The IC may be damaged if it is mounted in a wrong orientation or if pins are shorted together. Short circuit may be caused by conductive particles caught between the pins. 7) TSD (Thermal Shut Down) The IC incorporates a built-in thermal shutdown circuit, which is designed to turn off the IC when the internal temperature of the IC reaches a 175C (with 25C hysteresis). It is not designed to protect the IC from damage or guarantee its operation. Do not continue to operate the IC after this function is activated. Do not use the IC in conditions where this function will always be activated. 8) Overcurrent protection circuit (OCP) The IC incorporates an over-current protection circuit that operates in accordance with the rated output capacity. This circuit protects the IC from damage when the load becomes shorted. It is also designed to limit the output current (without latching) in the event of more than 1.45A (Typ) current flow, such as from a large capacitor or other component connected to the output pin. This protection circuit is effective in preventing damage to the IC in cases of sudden and unexpected current surges. The IC should not be used in applications where the over current protection circuit will be activated continuously. ST (8 PIN) will be set to `L (abnormal condition)' if the current limit state continues to 20s(Typ). Then, ST (8 PIN) will be set to `H (normal condition)' if the current limit release until 1.1ms(Typ). If current limit state continues, generation of heat, degradation, etc. of the IC can be considered. When the state of overcurrent still flows, compensate by setting the IC in standby mode applications using ST (8 PIN). 9) Testing on application boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC's power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10) Regarding input pins of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. 11) FIN (HTSOP-J8,HSON 8) Since it has connected with sub of IC, please connect the heat dissipation metal to external GND potential. Status of this document The Japanese version of this document is the formal datasheet. A customer may use this translation version only as reference to help understand the formal version. If there are any differences, the formal version takes precedence. www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 17/18 TSZ02201-0G3G0BD00070-1-2 2015.04.15 Rev.002 Datasheet BD1Hx500 Series Revision History Date Revision 20.Sep.2013 001 New Release 002 P1. "AEC-Q100 qualified" is added in Features P1. "Product Summary" modify P1. Typical Application Circuit change from "VDD" to "VBAT" P2. Pin Descriptions change from "FIN" to "Cooling Tab" and add Note(1) P3. Absolute Maximum Ratings delete "Ta" P3. Operating Voltage Ratings change Note(1) content P5. Electrical Characteristics modify circuit figure of "Note(1)" P7. Diagnostic Output Truth Table modify P11 . Change from "sec" to "s" at Protect function timing chart P12 . I/O equivalence circuits add "Cooling Tab" 15.Apr.2015 Changes www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 18/18 TSZ02201-0G3G0BD00070-1-2 2015.04.15 Rev.002 Datasheet Notice Precaution on using ROHM Products 1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property ("Specific Applications"), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM's Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASS CLASSb CLASS CLASS CLASS CLASS 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM's Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PAA-E (c) 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM's internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. 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Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PAA-E (c) 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM's Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM's Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an "as is" basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice - WE (c) 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet bd1hd500hfn-c - Web Page Buy Distribution Inventory Part Number Package Unit Quantity Minimum Package Quantity Packing Type Constitution Materials List RoHS bd1hd500hfn-c HSON8 3000 3000 Taping inquiry Yes