LF-IT-AR8033B - Qualcomm - Product.Network

Important notice

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On 7 February 2017 the former NXP Standard Product business became a new company with the

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1. Product profile

1.1 General description

300 W unidirectional Transient Voltage Suppressor (TVS) in a DFN2020-3 (SOT1061)

leadless medium power Surface-Mounted Device (SMD) plastic package, designed for

transient overvoltage protection.

1.2 Features and benefits

1.3 Applications

Power supply protection

Industrial application

Power management

1.4 Quick reference data

[1] In accordance with IEC 61643-321 (10/1000 s current waveform).

[2] Measured from pin 1 and 2 to pin 3.

PTVSxU1UPA series

300 W Transient Voltage Suppressor

Rev. 1 — 6 March 2014 Product data sheet

HUSON3

Rated peak puls e po we r: PPPM = 300 W Reverse current: IRM =1nA

Reverse standoff voltage range:

VRWM =7.5Vto26V

Very low package height: 0.65 mm

AEC-Q101 qualified

Table 1. Quick reference data

Symbol Parameter Conditions Min Typ Max Unit

PPPM rated peak pulse power [1][2] --300W

VRWM reverse standoff voltage 7.5 - 26 V

Product data sheet Rev. 1 — 6 March 2014 2 of 12

NXP Semiconductors PTVSxU1UPA series

300 W Transient Voltage Suppressor

2. Pinning information

3. Ordering information

[1] The series consists of 6 types with reverse standoff voltages from 7.5 V to 26 V.

4. Marking

Table 2. Pinning

Pin Description Simplified outline Graphic symbol

1 and 2 anode

3 cathode

Transparent top view

006aab838

3 1, 2

Table 3. Ordering information

Type number[1] Package

Name Description Version

PTVSxU1UPA series DFN2020-3 plastic thermal enhanced ultra thin small outline

package; no leads; 3 terminals;

body 2  2 0.65 mm

SOT1061

Table 4. Marking codes

Type number Marking code

PTVS7V5U1UPA CX

PTVS10VU1UPA CY

PTVS12VU1UPA CZ

PTVS15VU1UPA D1

PTVS18VU1UPA D2

PTVS26VU1UPA D3

Product data sheet Rev. 1 — 6 March 2014 3 of 12

NXP Semiconductors PTVSxU1UPA series

300 W Transient Voltage Suppressor

5. Limiting values

[1] In accordance with IEC 61643-321 (10/1000 s current waveform).

[2] In accordance with IEC 61000-4-5 and IEC 61643-321 (8/20 s current wavefo rm ).

[3] Measured from pin 1 and 2 to pin 3.

[1] Device stressed with ten non-repetitive ElectroStatic Discharge (ESD) pulses.

[2] Measured from pin 1 and 2 to pin 3.

Table 5. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

PPPM rated peak pulse power [1][3] -300W

[2][3] -3000W

IPPM rated peak pulse current - see Table 8

Tjjunction temperature - 150 C

Tamb ambient temperature 55 +150 C

Tstg storage temperature 65 +150 C

Table 6. ESD maximum ratings

Tamb =25



C unless otherwise specified.

Symbol Parameter Conditions Min Max Unit

VESD electrostatic discharge voltage IEC 61000-4-2

(contact discharge) [1][2] -30kV

IEC 61000-4-2

(air discharge) [1][2] -30kV

Product data sheet Rev. 1 — 6 March 2014 4 of 12

NXP Semiconductors PTVSxU1UPA series

300 W Transient Voltage Suppressor

Fig 1. 10/1000 s puls e wa ve fo rm according to

IEC 61643-321 Fig 2. 8/20 s pulse waveform according to

IEC 61000-4-5 and IEC 61643-321

Fig 3. ESD pulse waveform according to IEC 61000-4-2

tp (ms)

0 4.03.01.0 2.0

006aab319

100

150

IPP

(%)

50 % IPP; 1000 μs

100 % IPP; 10 μs

tp (ms)

0403010 20

001aaa630

120

IPP

(%)

e-t

100 % IPP; 8 µs

50 % IPP; 20 µs

001aaa631

IPP

100 %

90 %

30 ns 60 ns

10 %

tr = 0.6 ns to 1 ns

Product data sheet Rev. 1 — 6 March 2014 5 of 12

NXP Semiconductors PTVSxU1UPA series

300 W Transient Voltage Suppressor

6. Thermal characteristics

[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard

footprint.

[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.

[3] Device mounted on a ceramic PCB, Al2O3, standard footprint.

[4] Soldering point of cathode tab.

7. Characteristics

[1] In accordance with IEC 61000-4-5 and IEC 61643-321 (8/20 s current waveform).

[2] In accordance with IEC 61643-321 (10/1000 s current waveform).

[3] Measured from pin 1 and 2 to pin 3.

Table 7. Thermal characteristics

Symbol Parameter Conditions Min Typ Max Unit

Rth(j-a) thermal resistance from

junction to ambient in free air [1] --240K/W

[2] --120K/W

[3] --65K/W

Rth(j-sp) thermal resistance from

junction to solder point [4] --10K/W

Table 8. Characteristics per type; PTVS7V5U1UPA to PTVS26VU1UPA

Tj=25



C unless otherwise specified.

Type number Reverse

standoff

voltage

VRWM (V)

Breakdown vo ltage

VBR (V)

IR=1mA

Reverse

leakage current

IRM (nA) at VRWM

Rated

peak pulse

current

IPPM (A)

[1][3]

Rated

peak pulse

current

IPPM (A)

[2][3]

Clamping

voltage

VCL (V);

at IPPM

(A)[1][3]

Clamping

voltage

VCL (V);

at IPPM

(A)[2][3]

Max Min Typ Max Typ Max Max Max Max Max

PTVS7V5U1UPA 7.5 8.33 8.77 9.21 200 1000 178 23.3 19.7 12.9

PTVS10VU1UPA 10 11.10 11.70 12.30 2 50 148 17.6 23.0 17.0

PTVS12VU1UPA 12 13.30 14.00 14.70 1 50 131 15.1 25.2 19.9

PTVS15VU1UPA 15 16.70 17.60 18.50 1 50 111 12.3 28.8 24.4

PTVS18VU1UPA 18 20.00 21.00 22.10 1 50 97 10.3 32.0 29.2

PTVS26VU1UPA 26 28.90 30.40 31.90 1 50 69 7.0 43.5 42.1

Product data sheet Rev. 1 — 6 March 2014 6 of 12

NXP Semiconductors PTVSxU1UPA series

300 W Transient Voltage Suppressor

Fig 4. Relative variation of rated peak pulse power as

a function of junction temperature; typ ic al

values

Fig 5. V-I characteristics for a unidirectional TVS

protection diode

Tamb = 25 °C

Fig 6. Rated peak pulse powe r as a function of a pulse duration; typical values

Tj (°C)

0 20015050 100

006aab321

0.4

0.8

1.2

PPPM

PPPM(25°C)

006aab324

−V

RWM

−I

P-N

−+

−I

PPM

aaa-011962

tp (µs)

10 104

103

102

103

102

104

PPPM

(W)

Product data sheet Rev. 1 — 6 March 2014 7 of 12

NXP Semiconductors PTVSxU1UPA series

300 W Transient Voltage Suppressor

8. Application information

9. Test information

9.1 Quality information

This product has been qualified in accordance with the Automotive Electronics Council

(AEC) standard Q101 - Stress test qualifica tion for discrete semiconductors, and is

suitable for use in automotive applications.

10. Package outline

Fig 7. Application diag ram

aaa-004394

GND

line to be protected

(positive signal polarity)

ESD protection diode

unidirectional protection of one line

GND

line to be protected

(negative signal polarity)

ESD protection diode

Fig 8. Package outline DFN2020-3 (SOT1061)

09-11-12Dimensions in mm

0.65

max

2.1

1.9

1.6

1.4

0.35

0.25 0.45

0.35

2.1

1.9

1.1

0.9

0.3

0.2

1.05

0.95

1.3

Product data sheet Rev. 1 — 6 March 2014 8 of 12

NXP Semiconductors PTVSxU1UPA series

300 W Transient Voltage Suppressor

11. Soldering

Fig 9. Reflow soldering footprint DFN2020-3 (SOT1061)

occupied area

solder paste = solder lands Dimensions in mm

sot1061_fr

solder resist

0.4

2.1

1.3

0.25

0.25 0.25

1.1 1.2

0.55

0.6

2.3

0.5 (2×)

0.5 (2×) 0.6 (2×)

0.4 (2×)

0.5

1.6

1.7

1.05

Product data sheet Rev. 1 — 6 March 2014 9 of 12

NXP Semiconductors PTVSxU1UPA series

300 W Transient Voltage Suppressor

12. Revision history

Table 9. Revision history

Document ID Release date Data sheet status Change notice Supersedes

PTVSXU1UPA_SER v.1 20140306 Product data sheet - -

Product data sheet Rev. 1 — 6 March 2014 10 of 12

NXP Semiconductors PTVSxU1UPA series

300 W Transient Voltage Suppressor

13. Legal information

13.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Definitions”.

[3] The product status of de vice(s) descr ibed in th is docume nt may have cha nged since this docume nt was publis hed and ma y dif fer in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

13.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liab ility for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and tit le. A short data sh eet is intended

for quick reference only and shou ld not be rel ied u pon to cont ain det ailed and

full information. For detailed and full informatio n see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall pre vail.

Product specificat io n — The information and data provided in a Product

data sheet shall define the specification of the product as agr eed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to off er functions and qualities beyond those described in the

Product data sheet.

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Limited warr a nty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warranties, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information. NXP Se miconductors takes no

responsibility for the content in this document if provided by an inf ormation

source outside of NXP Semiconductors.

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequ ential damages (including - wit hout limitatio n - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ ag gregate and cumulative l iability towards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all informa tion supplied prior

to the publication hereof .

Suitability for use in automotive applications — This NXP

Semiconductors product has been qualified for use in automotive

applications. Unless ot herwise agreed in writing, the product is not designed,

authorized or warranted to be suitable for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors pro duct can reasonably be expected

to result in perso nal injury, death or severe property or environmental

damage. NXP Semiconductors and its suppliers accept no liability for

inclusion and/or use of NXP Semiconducto rs products in such equipment or

applications an d ther efo re su ch inclusi on a nd/or use is at the cu stome r's own

risk.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty tha t such application s will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and ope ration of their applications

and products using NXP Semiconductors product s, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suit able and fit for the custome r’s applications and

products planned, as well as fo r the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associated with t heir

applications and products.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party customer(s). Customer is responsible for doing all necessa ry

testing for th e customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by cust omer’s third party

customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanent ly and irreversibly affect

the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individua l agreement. In case an individual

agreement is concluded only the ter ms and conditions of the respective

agreement shall apply. NXP Semiconduct ors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contains data from the objective specification for product development.

Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.

Product [short] dat a sheet Production This document contains the product specification.

Product data sheet Rev. 1 — 6 March 2014 11 of 12

NXP Semiconductors PTVSxU1UPA series

300 W Transient Voltage Suppressor

No offer to sell or license — Nothing in this document may be interpret ed or

construed as an of fer to sell product s that is op en for accept ance or the grant ,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from competent authorities.

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

Translations — A non-English (translated) version of a document is for

reference only. The English version shall prevail in case of any discrepancy

between the translated and English versions.

13.4 Trademarks

Notice: All referenced b rands, produc t names, service names and trademarks

are the property of their respect i ve ow ners.

14. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

NXP Semiconductors PTVSxU1UPA series

300 W Transient Voltage Suppressor

For more information, please visit: http://www.nxp.co m

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 6 March 2014

Document identifier: PTVSXU1UPA_SER

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

15. Contents

1 Product profile. . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1 General description . . . . . . . . . . . . . . . . . . . . . 1

1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1

1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1

2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2

3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3

6 Thermal characteristics . . . . . . . . . . . . . . . . . . 5

7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 5

8 Application information. . . . . . . . . . . . . . . . . . . 7

9 Test information. . . . . . . . . . . . . . . . . . . . . . . . . 7

9.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 7

10 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7

11 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

12 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 9

13 Legal information. . . . . . . . . . . . . . . . . . . . . . . 10

13.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10

13.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

13.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 10

13.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11

14 Contact information. . . . . . . . . . . . . . . . . . . . . 11

15 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12