TDK item description C0816X7R1C104MT****
Applications Commercial Grade
Feature L⇔WLow ESL Reverse Geometry
Series C0816 [EIA 0306]
Status
EOL announced
Discontinue Issue Date : Apr.28, 2018
Last Purchase Order Date : Oct.31, 2018
Last Shipment Date : Mar.31, 2019
Images are for reference only
and show exemplary products.
Length(L) 0.80mm ±0.10mm
Width(W) 1.60mm ±0.10mm
Thickness(T) 0.50mm ±0.10mm
Terminal Width(B) 0.10mm Min.
Recommended Land Pattern (PA) 0.30mm Nom.
Recommended Land Pattern (PB) 0.35mm Nom.
Recommended Land Pattern (PC) 1.60mm Nom.
Capacitance 100nF ±20%
Rated Voltage 16VDC
Temperature Characteristic X7R(±15%)
Dissipation Factor (Max.) 5%
Insulation Resistance (Min.) 1000MΩ
Soldering Method Reflow
AEC-Q200 No
Packing Blister (Plastic)Taping [180mm Reel]
Package Quantity 4000pcs
Catalog
Specification
RoHS Certificate
SVHC/REACH Certificate
Sample Kits
Characterization Sheet
S-parameter
SPICE Netlist (Simple)
SPICE Netlist (Precision)
Equivalent Circuit Model
DC Bias/Superimpotision Model (HSPICE)
Impedance ESR
Multilayer Ceramic Chip Capacitors
Characteristic Graph (This is reference data, and does not guarantee the products
characteristics.)
Multilayer Ceramic Chip Capacitors
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Size
Electrical Characteristics
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Other
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