TLP701HF(TP,F) - Toshiba America Electronic Components, Inc.

TLP701HF

Photocouplers GaAℓAs Infrared LED & Photo IC

TLP701HF

1. Applications

Applications

• Transistor Inverters

• MOSFET Gate Drivers

• IGBT Gate Drivers

• Induction Cooktop and Home Appliances

2. General

General

The TLP701HF is a photocoupler in a SDIP6 package that consists of a GaAℓAs infrared light-emitting diode

(LED) optically coupled to an integrated high-gain, high-speed photodetector IC chip. It provides guaranteed

performance and specifications at temperatures up to 125.

The TLP701HF is physically smaller than the one in an 8-pin DIP package and compliant with international

safety standards for reinforced insulation. It thus provides a smaller footprint solution for applications that

require safety standard certification. The TLP701HF has an internal Faraday shield that provides a guaranteed

Common-mode transient immunity of 20 kV/µs. It has a totem-pole output that can both sink and source current.

It is ideal for IGBT and power MOSFET gate drive.

Leads of the TLP701HF is bend to satisfy 8 mm PC board spacing requirements. Absolute maximum ratings and

electrical characteristics are the same as in the TLP701H.

3. Features

Features

(1) Output peak current: ±0.6 A (max)

(2) Operating temperature: -40 to 125

(3) Supply current: 2 mA (max)

(4) Supply voltage: 10 to 30 V

(5) Threshold input current: 5 mA (max)

(6) Propagation delay time: tpHL/tpLH = 700 ns (max)

(7) Common-mode transient immunity: ±20 kV/µs (min)

(8) Isolation voltage: 5000 Vrms (min)

(9) Safety standards

UL-approved: UL1577 File No.E67349

cUL-approved: CSA Component Acceptance Service No.5A, File No.E67349

VDE-approved: Option (D4) EN60747-5-2 (Note)

(Note)

Note: When an EN60747-5-2 approved type is needed, please designate the Option (D4)

Option (D4)

Option (D4).

4. Packaging and Pin Configuration

Packaging and Pin Configuration

1: Anode

2: N.C.

3: Cathode

4: GND

5: VO(Output)

6: VCC

11-5J101S

2012-01-11

Rev.1.0

TLP701HF

5. Internal Circuit (Note)

Internal Circuit (Note)

Fig.

Fig. 5.1

5.1

5.1 Internal Circuit

Internal Circuit

Note: A 0.1-µF bypass capacitor must be connected between pin 6 and pin 4.

6. Principle of Operation

Principle of Operation

6.1.

6.1. Truth Table

Truth Table

Input

LED

OFF

Output

6.2.

6.2. Mechanical Parameters

Mechanical Parameters

Characteristics

Creepage distances

Clearance distances

Internal isolation thickness

7.62-mm Pitch

TLP701H

7.0 (min)

0.4 (min)

10.16-mm Pitch

TLP701HF

8.0 (min)

0.4 (min)

Unit

2012-01-11

Rev.1.0

TLP701HF

7. Absolute Maximum Ratings (Note) (Unless otherwise specified, T

Absolute Maximum Ratings (Note) (Unless otherwise specified, T

Absolute Maximum Ratings (Note) (Unless otherwise specified, Ta

a = 25

= 25

= 25



)

)

LED

Detector

Common

Characteristics

Input forward current

Input forward current derating

Peak transient input forward

current

Peak transient input forward

current derating

Input reverse voltage

Input power dissipation

derating

Peak high-level output current

Peak low-level output current

Output voltage

Supply voltage

Operating temperature

Storage temperature

Lead soldering temperature

Isolation voltage

(Ta ≥ 110)

(Ta = -40 to 125)

(10 s)

AC, 1 min,

R.H. ≤ 60%, Ta = 25

Symbol

∆IF/∆Ta

IFPT

∆IFPT/∆Ta

∆PD/∆Ta

IOPH

IOPL

VCC

Topr

Tstg

Tsol

BVS

Note

(Note 1)

(Note 2)

(Note 3)

(Note 4)

Rating

-0.67

-25

-1.0

-0.6

+0.6

-40 to 125

-55 to 150

260

5000

Unit

mA/

mW/



Vrms

Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the

significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even

if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum

ratings.

Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook

("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test

report and estimated failure rate, etc).

Note 1: Pulse width (PW) ≤ 1 µs, 300 pps

Note 2: Exponential waveform. Pulse width ≤ 2 µs, f ≤ 15 kHz

Note 3: ≥ 2 mm below seating plane.

Note 4: This device is considered as a two-terminal device: Pins 1, 2 and 3 are shorted together, and pins 4, 5 and 6

are shorted together.

8. Recommended Operating Conditions (Note)

Recommended Operating Conditions (Note)

Characteristics

Input on-state current

Input off-state voltage

Supply voltage

Peak high-level output current

Peak low-level output current

Operating frequency

Symbol

IF(ON)

VF(OFF)

VCC

IOPH

IOPL

Note

(Note 1)

(Note 2)

(Note 3)

Min

6.5



Typ.



Max

0.8

-0.2

+0.2

Unit

kHz

Note: The recommended operating conditions are given as a design guide necessary to obtain the intended

performance of the device. Each parameter is an independent value. When creating a system design using

this device, the electrical characteristics specified in this datasheet should also be considered.

Note: A ceramic capacitor (0.1 µF) should be connected between pin 6 and pin 4 to stabilize the operation of a high-

gain linear amplifier. Otherwise, this photocoupler may not switch properly. The bypass capacitor should be

placed within 1 cm of each pin.

Note 1: The rise and fall times of the input on-current should be less than 0.5 µs.

Note 2: Denotes the operating range, not the recommended operating condition.

Note 3: Exponential waveform. IOPH ≥ -0.3 A (≤ 2.0 µs), IOPL ≤ 0.3 A (≤ 2.0 µs), Ta = 125

2012-01-11

Rev.1.0

TLP701HF

9. Electrical Characteristics (Note)

Electrical Characteristics (Note)

(Unless otherwise specified, T

(Unless otherwise specified, Ta

a = -40 to 125

= -40 to 125

= -40 to 125



)

)

Characteristics

Input forward voltage

temperature coefficient

Input reverse current

Input capacitance

Peak high-level output current

Peak low-level output current

High-level output voltage

Low-level output voltage

High-level supply current

Low-level supply current

Threshold input current (L/H)

Threshold input voltage (H/L)

Supply voltage

Symbol

∆VF/∆Ta

IOPH

IOPL

VOH

VOL

ICCH

ICCL

IFLH

VFHL

VCC

Note

(Note 1)

Test

Circuit



Fig.

12.1.1

Fig.

12.1.2

Fig.

12.1.3

Fig.

12.1.4

Fig.

12.1.5

Fig.

12.1.6



Test Condition

IF = 10 mA, Ta = 25

IF = 10 mA

VR = 5 V, Ta = 25

V = 0 V, f = 1 MHz, Ta = 25

IF = 5 mA, VCC = 15 V,

V6-5 = 4 V

IF = 5 mA, VCC = 15 V,

V6-5 = 10 V

IF = 0 mA, VCC = 15 V,

V5-4 = 2 V

IF = 0 mA, VCC = 15 V,

V5-4 = 10 V

IF = 5 mA, VCC = 10 V,

IO = -100 mA

VF = 0.8 V, VCC = 10 V,

IO = 100 mA

IF = 10 mA, VCC = 10 to 30 V,

VO = Open

IF = 0 mA, VCC = 10 to 30 V,

VO = Open

VCC = 15 V, VO > 1 V

VCC = 15 V, VO < 1 V



Min

1.40



0.2

0.4

6.0



0.8

Typ.

1.57

-1.8



-0.38

-0.6

0.36

0.62

8.5

0.4

1.4

1.3

2.5



Max

1.80



-0.2

-0.4



1.0

2.0



Unit

mV/

µA

Note: All typical values are at Ta = 25.

Note: This device is designed for low power consumption, making it more sensitive to ESD than its predecessors.

Extra care should be taken in the design of circuitry and pc board implementation to avoid ESD problems.

Note 1: IO application time ≤ 50 µs, single pulse.

10.

10. Isolation Characteristics (Unless otherwise specified, T

Isolation Characteristics (Unless otherwise specified, T

Isolation Characteristics (Unless otherwise specified, Ta

a = 25

= 25

= 25



)

)

Characteristics

Total capacitance (input to output)

Isolation resistance

Isolation voltage

Symbol

BVS

Note

(Note 1)

Test Conditions

VS = 0 V, f = 1 MHz

VS = 500 V, R.H. ≤ 60%

AC, 1 min

AC, 1 s, in oil

DC, 1 min, in oil

Min



1×1012

5000



Typ.

1.0

1014



10000

Max



Unit

Ω

Vrms

Vdc

Note 1: This device is considered as a two-terminal device: Pins 1, 2 and 3 are shorted together, and pins 4, 5 and 6

are shorted together.

2012-01-11

Rev.1.0

TLP701HF

11.

11. Switching Characteristics (Note)

Switching Characteristics (Note)

(Unless otherwise specified, T

(Unless otherwise specified, Ta

a = -40 to 125

= -40 to 125

= -40 to 125



)

)

Characteristics

Propagation delay time

(L/H)

Propagation delay time

(H/L)

Rise time

Fall time

Pulse width distortion

Common-mode transient

immunity at output high

Common-mode transient

immunity at output low

Symbol

tpLH

tpHL

|tpHL-tpLH|

CMH

CML

Note

(Note 1)

(Note 2)

(Note 3)

Test

Circuit

Fig.

12.1.7

Fig.

12.1.8

Test Condition

IF = 0 → 5 mA, VCC = 30 V,

Rg = 47 Ω, Cg = 3 nF

IF = 5 → 0 mA, VCC = 30 V,

Rg = 47 Ω, Cg = 3 nF

IF = 0 → 5 mA, VCC = 30 V,

Rg = 47 Ω, Cg = 3 nF

IF = 5 → 0 mA, VCC = 30 V,

Rg = 47 Ω, Cg = 3 nF

IF = 0 ←→ 5 mA, VCC = 30 V,

Rg = 47 Ω, Cg = 3 nF

VCM = 1000 Vp-p, IF = 5 mA,

VCC = 30 V, Ta = 25,

VO(min) = 26 V

VCM = 1000 Vp-p, IF = 0 mA,

VCC = 30 V, Ta = 25,

VO(max) = 1 V

Min



±20

Typ.



±25

Max

700



500



Unit

kV/µs

Note: All typical values are at Ta = 25.

Note 1: Input signal ( f = 25 kHz, duty = 50%, tr = tf = 5 ns or less ).

CL is approximately 15 pF which includes probe and stray wiring capacitance.

Note 2: CMH is the maximum rate of rise of the common mode voltage that can be sustained with the output voltage

in the logic high state (VO > 26 V).

Note 3: CML is the maximum rate of fall of the common mode voltage that can be sustained with the output voltage in

the logic low state (VO < 1 V).

2012-01-11

Rev.1.0

TLP701HF

12.

12. Test Circuits and Characteristics Curves

Test Circuits and Characteristics Curves

12.1.

12.1. Test Circuits

Test Circuits

Fig.

Fig. 12.1.1

12.1.1

12.1.1 I

IOPH

OPH

OPH Test Circuit

Test Circuit

Test Circuit Fig.

Fig.

Fig. 12.1.2

12.1.2

12.1.2 I

IOPL

OPL

OPL Test Circuit

Test Circuit

Fig.

Fig. 12.1.3

12.1.3

12.1.3 V

VOH

OH Test Circuit

Test Circuit

Test Circuit Fig.

Fig.

Fig. 12.1.4

12.1.4

12.1.4 V

VOL

OL Test Circuit

Test Circuit

Fig.

Fig. 12.1.5

12.1.5

12.1.5 I

ICCH

CCH

CCH Test Circuit

Test Circuit

Test Circuit Fig.

Fig.

Fig. 12.1.6

12.1.6

12.1.6 I

ICCL

CCL

CCL Test Circuit

Test Circuit

Fig.

Fig. 12.1.7

12.1.7

12.1.7 Switching Time Test Circuit

Switching Time Test Circuit

Fig.

Fig. 12.1.8

12.1.8

12.1.8 Common-Mode Transient Immunity

Common-Mode Transient Immunity

2012-01-11

Rev.1.0

TLP701HF

13.

13. Soldering and Storage

Soldering and Storage

13.1.

13.1. Precautions for Soldering

Precautions for Soldering

The soldering temperature should be controlled as closely as possible to the conditions shown below, irrespective

of whether a soldering iron or a reflow soldering method is used.

• When using soldering reflow (See Fig. 13.1.1 and 13.1.2)

Reflow soldering must be performed once or twice.

The mounting should be completed with the interval from the first to the last mountings being 2 weeks.

Fig.

Fig. 13.1.1

13.1.1

13.1.1 An example of a temperature profile

An example of a temperature profile

when Sn-Pb eutectic solder is used

Fig.

Fig. 13.1.2

13.1.2

13.1.2 An example of a temperature profile

An example of a temperature profile

when lead(Pb)-free solder is used

• When using soldering flow (Applicable to both eutectic solder and Lead(Pb)-Free solder)

Apply preheating of 150 for 60 to 120 seconds.

Mounting condition of 260 within 10 seconds is recommended.

Flow soldering must be performed once.

• When using soldering Iron (Applicable to both eutectic solder and Lead(Pb)-Free solder)

Complete soldering within 10 seconds for lead temperature not exceeding 260 or within 3 seconds not

exceeding 350

Heating by soldering iron must be done only once per lead.

13.2.

13.2. Precautions for General Storage

Precautions for General Storage

• Avoid storage locations where devices may be exposed to moisture or direct sunlight.

• Follow the precautions printed on the packing label of the device for transportation and storage.

• Keep the storage location temperature and humidity within a range of 5 to 35 and 45% to 75%,

respectively.

• Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty

conditions.

• Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during

storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the

solderability of the leads.

• When restoring devices after removal from their packing, use anti-static containers.

• Do not allow loads to be applied directly to devices while they are in storage.

• If devices have been stored for more than two years under normal storage conditions, it is recommended

that you check the leads for ease of soldering prior to use.

2012-01-11

Rev.1.0

TLP701HF

14.

14. Land Pattern Dimensions for Reference Only

Land Pattern Dimensions for Reference Only

Fig.

Fig. 14.1

14.1

14.1 7.62 mm Pitch (unit: mm)

7.62 mm Pitch (unit: mm)

7.62 mm Pitch (unit: mm) Fig.

Fig.

Fig. 14.2

14.2

14.2 10.16 mm Pitch (unit: mm)

10.16 mm Pitch (unit: mm)

15.

15. Marking

Marking

Fig.

Fig. 15.1

15.1

15.1 Marking

Marking

2012-01-11

Rev.1.0

TLP701HF

16.

16. EN60747-5-2 Option (D4) Specification

EN60747-5-2 Option (D4) Specification

• Part number: TLP701H, TLP701HF (Note)

(Note)

• The following part naming conventions are used for the devices that have been qualified according to

option (D4) of EN60747.

Example: TLP701H(D4-TP, F)

D4: EN60747 option

TP: Tape type

F: [[G]]/RoHS COMPATIBLE (Note 1)

(Note 1)

Note: Use TOSHIBA standard type number for safety standard application.

e.g., TLP701H(D4-TP,F) → TLP701H

Note 1: Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS

compatibility of Product.

RoHS is the Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on the

restriction of the use of certain hazardous substances in electrical and electronics equipment.

Fig.

Fig. 16.1

16.1

16.1 EN60747 Isolation Characteristics

EN60747 Isolation Characteristics

2012-01-11

Rev.1.0

TLP701HF

Fig.

Fig. 16.2

16.2

16.2 Insulation Related Specifications (Note)

Insulation Related Specifications (Note)

Note: If a printed circuit is incorporated, the creepage distance and clearance may be reduced below this value. (e.

g., at a standard distance between soldering eye centers of 7.5 mm). If this is not permissible, the user shall

take suitable measures.

Note: This photocoupler is suitable for safe electrical isolation

safe electrical isolation

safe electrical isolation only within the safety limit data.

Maintenance of the safety data shall be ensured by means of protective circuits.

Fig.

Fig. 16.3

16.3

16.3 Marking Example (Note)

Marking Example (Note)

Note: The above marking is applied to the photocouplers that have been qualified according to option (D4) of EN60747.

2012-01-11

Rev.1.0

TLP701HF

Fig.

Fig. 16.4

16.4

16.4 Measurement Procedure

Measurement Procedure

2012-01-11

Rev.1.0

TLP701HF

Package Dimensions

Package Dimensions Unit: mm

Weight: 0.26 g (typ.)

Package Name(s)

TOSHIBA: 11-5J101S

2012-01-11

Rev.1.0

TLP701HF

RESTRICTIONS ON PRODUCT USE

• Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information

in this document, and related hardware, software and systems (collectively "Product") without notice.

• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's

written permission, reproduction is permissible only if reproduction is without alteration/omission.

• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible

for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which

minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage

to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate

the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA

information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the

precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application

with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications,

including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating

and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample

application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications.

TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.

• Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring

equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document. Product

is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or reliability and/

or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious public impact

("Unintended Use"). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace

industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment,

equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and

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• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE

ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE

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INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING

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(2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT,

OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR

PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.

• GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor.

Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.

• Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation,

for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products

(mass destruction weapons). Product and related software and technology may be controlled under the Japanese Foreign Exchange

and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology

are strictly prohibited except in compliance with all applicable export laws and regulations.

• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.

Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,

including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of

noncompliance with applicable laws and regulations.

2012-01-11

Rev.1.0