451
Multi Control
Devices
Switch
Type
Variable
Resistor Type
Notes
1. The above temperature shall be measured on the mounting surface of a PC board. There are cases
where the PC
board’s temperature greatly differs from that of the switch, depending on the material, size thickness of PC boards
and others. The above-stated conditions shall also apply to switch surface temperatures.
2. Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering condition is
highly recommended.
Soldering surface temperature
Soldering temperature
Heating time Soldering time No. of solders
RKJXS
RKJXL
RKJXT1F, RKJXM
RKJXT1F, RKJXM, RKJXL,
SLLB, SLLB5, SRBE, SKRH
Series
Series
350±5℃ 3s max. 1 time
10 0℃ m a x . 260±5℃2 min. max. 5 ±1s 2 time max.
3 5 0 ±10 ℃ 3 s 2 time max.
12 0 ℃ m a x . 260℃ max.70s max. 6s max. 2 time max.
Tip temperature Soldering time No. of solders
Preheating Dip soldering
Reference for Dip Soldering
Example of Reflow Soldering Condition
Reference for Manual Soldering
SKRH, SLLB, SRBE
SLLB5
RKJXS
Series
260℃ 230℃ 15 0 ℃ 15 0 ℃ 2 min. ー10 s 40s 4 min. 1 time
250℃ 230℃ 15 0 ℃ 15 0 ℃ ー2 min. ー30s ー1 time
260℃ 230℃ 18 0 ℃ 15 0 ℃ 2 min. ー ー 40s ー1 time
A B C D E F G H I
No. of reflows
1. Heating method: Double heating method with infrared heater.
2. Temperature measurement: Thermocouple φ0.1 to 0.2 CA(K)or CC(T)at soldering portion(copper foil surface).
A heat resisting tape should be used for fixed measurement.
3. Temperature profile
+1
−0
Switch Type / Soldering Conditions
I max.
H max.
300
200
100
Room
temperature
Pre-heating
E max.
Time(s)
Temperature(℃)
A
B
C
D
F max.
G max.