PC123J00000F
Series
1. Recognized by UL1577 (Double protection isolation),
file No. E64380 (as model No. PC123)
2. Approved by BSI, BS-EN60065, file No. 7087, BS-
EN60950 file No. 7409, (as model No. PC123)
3. Approved by SEMKO, EN60065, EN60950, (as mod-
el No. PC123)
4. Approved by DEMKO, EN60065, EN60950 (as mod-
el No. PC123)
5. Approved by NEMKO, EN60065, EN60950, (as mod-
el No. PC123)
6. Approved by FIMKO, EN60065, EN60950, (as mod-
el No. PC123)
7. Recognized by CSA file No. CA95323 (as model No.
PC123)
8. Approved by VDE (DIN EN60747-5-2(∗)) (as an op-
tion), file No. 40008087 (as model No. PC123)
9. Package resin : UL flammability grade (94V - 0)
(∗)DIN EN60747-5-2 : successor standard of DIN VDE0884
■ Features
■ Agency approvals/Compliance
1. I/O isolation for MCUs (Micro Controller Units)
2. Noise suppression in switching circuits
3. Signal transmission between circuits of different po-
tentials and impedances
4. Over voltage detection
■ Applications
DIP 4pin Reinforced Insulation Type
Photocoupler
1. 4-pin DIP package
2. Double transfer mold package (Ideal for Flow Solder-
ing)
3. Current transfer ratio (CTR : MIN. 50% at IF=5 mA,
VCE=5V)
4. Several CTR ranks available
5. Reinforced insulation type (Isolation distance : MIN.
0.4mm)
6. Long creepage distance type (wide lead-form type
only : MIN. 8mm)
7. High isolation voltage between input and output
(Viso(rms) : 5.0 kV)
8. Lead-free and RoHS directive compliant
■ Description
PC123J00000F Series contains an IRED optically
coupled to a phototransistor.
It is packaged in a 4-pin DIP, available in wide-lead
spacing option and SMT gullwing lead-form option.
Input-output isolation voltage(rms) is 5.0kV.
CTR is 50% to 400% at input current of 5mA.
1Sheet No.: D2-A02904EN
Date Sep. 1. 2006
© SHARP Corporation
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
PC123J00000F Series
■ Internal Connection Diagram
Anode
Cathode
Emitter
Collector
11
2
3
4
2
4
3
2
Sheet No.: D2-A02904EN
■ Outline Dimensions (Unit : mm)
1. Through-Hole [ex. PC123J00000F] 2. Through-Hole (VDE option) [ex. PC123YJ0000F]
3. Wide Through-Hole Lead-Form [ex. PC123FJ0000F]4.
Wide Through-Hole Lead-Form (VDE option) [ex. PC123FYJ000F]
PC123
4.58±0.30
0.6±0.2
1.2±0.3
2.54±0.25
6.5±0.3
7.62±0.30
0.26±0.10
4.58±0.30
3.5±0.5
3.0±0.5
2.7±0.5
0.5TYP.
Anode mark
0.5±0.1
θθ
θ : 0 to 13˚
Epoxy resin
1
2
4
3
Rank mark
Factory identification mark
Date code
PC123
4.58±0.30
0.6±0.2
1.2±0.3
2.54±0.25
6.5±0.3
7.62±0.30 4.58±0.30
3.5±0.5
3.0±0.5
2.7±0.5
0.5TYP.
Anode mark
0.5±0.1
θθ
θ : 0 to 13˚
Epoxy resin
1
2
4
3
Rank mark
Factory identification mark
Date code
SHARP mark "S"
VDE
idenfication mark
0.26±0.10
4
PC123
1.2±0.3
0.6±0.2
2.54±0.25
4.58±0.30
3.5±0.5
1.0±0.1
6.5±0.3
7.62±0.30
Epoxy resin
4.58±0.30
0.26±0.10
10.16±0.50
2.7MIN.
Anode mark
1
23
4
0.5±0.1
Rank mark Factory identification mark
Date code
PC123
1.2±0.3
0.6±0.2
2.54±0.25
4.58±0.30
3.5±0.5
1.0±0.1
6.5±0.3
7.62±0.30
Epoxy resin
4.58±0.30
0.26±0.10
10.16±0.50
2.7MIN.
Anode mark
1
23
4
0.5±0.1
Rank mark Factory identification mark
Date code
SHARP mark "S"
VDE
idenfication mark
4
PC123J00000F Series
Product mass : approx. 0.23gProduct mass : approx. 0.23g
Product mass : approx. 0.23gProduct mass : approx. 0.23g
3
Sheet No.: D2-A02904EN
(Unit : mm)
5. SMT Gullwing Lead-Form [ex. PC123PJ0000F] 6.
SMT Gullwing Lead-Form (VDE option) [ex. PC123PYJ000F]
7.
Wide SMT Gullwing Lead-Form [ex. PC123FPJ000F]
8.
Wide SMT Gullwing Lead-Form (VDE option) [ex. PC123ZYJ000F]
0.6±0.2
1.2±0.3
6.5±0.3
7.62±0.30
0.26±0.10
4.58±0.30
2.54±0.25
Epoxy resin
3.5±0.5
4.58±0.30
2.54±0.25
4
3
Anode mark
Rank mark Factory identification mark
Date code
1.0+0.4
−0.0
1.0+0.4
−0.0
10.0+0.0
−0.5
1
2PC123
0.35±0.25
0.6±0.2
1.2±0.3
6.5±0.3
7.62±0.30
0.26±0.10
4.58±0.30
2.54±0.25
Epoxy resin
3.5±0.5
4.58±0.30
2.54±0.25
4
3
Anode mark
Rank mark Factory identification mark
Date code
1.0+0.4
−0.0
1.0+0.4
−0.0
10.0+0.0
−0.5
1
2PC123
0.35±0.25
SHARP mark "S"
VDE
idenfication mark
4
PC123
0.6±0.2
1.2±0.3
1.0±0.1
6.5±0.3
10.16±0.50 0.75±0.25
0.75±0.25
4.58±0.30
2.54±0.25
Anode mark
Rank mark
Factory identification mark
Date code
4
3
7.62±0.30
12.0MAX
4.58±0.30
Epoxy resin
3.5±0.5
0.26±0.10
0.5±0.1
0.25±0.25
1
2PC123
0.6±0.2
1.2±0.3
1.0±0.1
6.5±0.3
10.16±0.50 0.75±0.25
0.75±0.25
4.58±0.30
2.54±0.25
Anode mark
Rank mark
Factory identification mark
Date code
4
3
7.62±0.30
12.0MAX
4.58±0.30
Epoxy resin
3.5±0.5
0.26±0.10
0.5±0.1
0.25±0.25
1
2
SHARP mark "S"
VDE
idenfication mark
4
PC123J00000F Series
Product mass : approx. 0.22gProduct mass : approx. 0.22g
Product mass : approx. 0.22gProduct mass : approx. 0.22g
Date code (2 digit)
Rank mark
Refer to the Model Line-up table
A.D.
1990
1991
1992
1993
1994
1995
1996
1997
1998
1999
2000
2001
Mark
A
B
C
D
E
F
H
J
K
L
M
N
Mark
P
R
S
T
U
V
W
X
A
B
C
Mark
1
2
3
4
5
6
7
8
9
O
N
D
Month
January
February
March
April
May
June
July
August
September
October
November
December
A.D
2002
2003
2004
2005
2006
2007
2008
2009
2010
2011
2012
·
·
··
·
·
2nd digit
Month of production
1st digit
Year of production
Factory identification mark and Plating material
Factory identification Mark
no mark
Country of origin
Japan
Indonesia
China
Plating material
SnCu (Cu : TYP. 2%)
SnBi (Bi : TYP. 2%)
SnCu (Cu : TYP. 2%)
or SnCu (Cu : TYP. 2%)*
* Up to Date code "T4" (April 2005), SnBi (Bi : TYP. 2%).
** This factory making is for identification purpose only.
Please contact the local SHARP sales representative to see the actual status of the production.
4
repeats in a 20 year cycle
Sheet No.: D2-A02904EN
PC123J00000F Series
Sheet No.: D2-A02904EN
■ Electro-optical Characteristics
Parameter Conditions
Forward voltage
Reverse current
Terminal capacitance
Collector dark current
Collector-emitter breakdown voltage
Emitter-collector breakdown voltage
Transfer
charac-
teristics
Collector current
Collector-emitter saturation voltage
Isolation resistance
Floating capacitance
Cut-off frequency
MIN.
−
−
−
−
70
6
2.5
−
5×1010
−
−
−
−
TYP.
1.2
−
30
−
−
−
−
0.1
1×1011
0.6
80
4
3
MAX.
1.4
10
250
100
−
−
20
0.2
−
1.0
−
18
18
Unit
V
µA
pF
nA
V
nA
mA
V
Ω
pF
kHz
µs
µs
Symbol
VF
IR
Ct
ICEO
BVCEO
BVECO
IC
VCE (sat)
RISO
fc
tr
tf
Cf
Response time Rise time
Fall time
Input
Output
IF=20mA
VR=4V
V=0, f=1kHz
VCE=50V, IF=0
IC=0.1mA, IF=0
IE=10µA, IF=0
IF=5mA, VCE=5V
IF=20mA, IC=1mA
V=0, f=1MHz
VCE=2V, IC=2mA, RL=100Ω
VCE=5V, IC=2mA, RL=100Ω, −3dB
DC500V, 40 to 60%RH
(Ta=25˚C)
■ Absolute Maximum Ratings (Ta=25˚C)
Parameter Symbol Unit
Input
Forward current mA
*1 Peak forward current A
Power dissipation mW
Output
Collector-emitter voltage
V
Emitter-collector voltage
V
Collector current mA
Collector power dissipation
mW
Total power dissipation mW
*2 Isolation voltage
Operating temperature ˚C
Storage temperature ˚C
*3 Soldering temperature
IF
IFM
P
VCEO
VECO
IC
PC
Ptot
Viso (rms)
Topr
Tstg
Tsol ˚C
*1 Pulse width≤100µs, Duty ratio : 0.001
*2 40 to 60%RH, AC for 1 minute, f = 60Hz
*3 For 10s
Rating
50
1
70
Reverse voltage VVR6
70
6
50
150
200
−30 to +100
−55 to +125
260
5.0 kV
5
PC123J00000F Series
Sheet No.: D2-A02904EN
■ Model Line-up
Sleeve
100pcs/sleeve
IC [mA]
(I
F
=5mA, V
CE
=5V, T
a
=25˚C)
Rank mark
with or without
A
B
No mark
S
2.5 to 20.0
2.5 to 7.5
5.0 to 12.5
10.0 to 20.0
5.0 to 10.0
Lead Form
Package
DIN EN60747-5-2
Model No.
Through-Hole
PC123J00000F
PC123AJ0000F
PC123BJ0000F
PC123CJ0000F
PC123SJ0000F
PC123YJ0000F
PC123Y1J000F
PC123Y2J000F
PC123Y5J000F
PC123YSJ000F
PC123FJ0000F
PC123F1J000F
PC123F2J000F
PC123F5J000F
PC123FSJ000F
PC123FYJ000F
PC123FY1J00F
PC123FY2J00F
PC123FY5J00F
PC123FY8J00F
Wide Through-Hole
−−−−−− Approved −−−−−− Approved
Taping
2 000pcs/reel
IC [mA]
(I
F
=5mA, V
CE
=5V, T
a
=25˚C)
Rank mark
with or without
A
B
No mark
S
2.5 to 20.0
2.5 to 7.5
5.0 to 12.5
10.0 to 20.0
5.0 to 10.0
Lead Form
Package
DIN EN60747-5-2
Model No.
PC123PYJ000F
PC123PY1J00F
PC123PY2J00F
PC123PY5J00F
PC123PY8J00F
PC123FPJ000F
PC123FP1J00F
PC123FP2J00F
PC123FP5J00F
PC123FP8J00F
PC123ZYJ000F
PC123ZY1J00F
PC123ZY2J00F
PC123ZY5J00F
PC123ZY8J00F
Wide SMT Gullwing
PC123PJ0000F
PC123P1J000F
PC123P2J000F
PC123P5J000F
PC123PSJ000F
−−−−−− Approved −−−−−− Approved
SMT Gullwing
6
Please contact a local SHARP sales representative to inquire about production status.
PC123J00000F Series
Sheet No.: D2-A02904EN
Fig.6 Forward Current vs. Forward Voltage
Duty ratio
Pulse width≤100µs
Ta=25˚C
10
100
10−310−210−1
Peak forward current IFM (mA)
10 000
1 000
1
Fig.5 Peak Forward Current vs. Duty Ratio
7
PC123J00000F Series
50˚C 25˚C
0˚C
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5
10
100
1
−25˚C
Ta=75˚C
Forward current IF (mA)
Forward voltage VF (V)
Forward current IF (mA)
Ambient temperature Ta (˚C)
0
50
40
30
20
10
−30 0 25 50 55 75 100 125
Fig.1 Forward Current vs. Ambient
Temperature
Diode power dissipation P (mW)
Ambient temperature Ta (˚C)
0
100
80
70
60
40
20
−30 0 25 50 55 75 100 125
Fig.2 Diode Power Dissipation vs.
Ambient Temperature
Collector power dissipation PC (mW)
Ambient temperature Ta (˚C)
0
250
200
150
100
50
−30 0 25 50 75 100 125
Fig.3 Collector Power Dissipation vs.
Ambient Temperature
Fig.4 Total Power Dissipation vs. Ambient
Temperature
Total Power dissipation Ptot (mW)
Ambient temperature Ta (˚C)
0
250
200
150
100
50
−30 0 25 50 75 100 125
Sheet No.: D2-A02904EN
Ambient temperature Ta (˚C)
Collector dark current ICEO (A)
−30 0 20 40 60 80 100
10−11
10−10
10−9
10−8
10−7
10−6
10−5
VCE=50V
Fig.11 Collector Dark Current vs. Ambient
Temperature
Response time (µs)
0.01 0.1 1 10 100
0.1
1
10
100
VCE=2V
IC=2mA
Ta=25˚C
tr
tf
td
ts
1 000
Load resistance (kΩ)
Fig.12 Response Time vs. Load Resistance
50
0
100
150
0255075100
Relative current transfer ratio (%)
−30
IF=5mA
VCE=5V
Ambient temperature Ta (˚C)
Fig.9 Relative Current Transfer Ratio vs.
Ambient Temperature
Ambient temperature Ta (˚C)
Collector-emitter saturation voltage VCE (sat) (V)
−30 0 20 406080100
0.00
0.02
0.04
0.06
0.08
0.10
0.12
0.14
0.16 IF=20mA
IC=1mA
Fig.10 Collector - emitter Saturation Voltage
vs. Ambient Temperature
8
Forward current IF (mA)
Current transfer ratio CTR (%)
0.1 1 10 100
0
50
100
150
200
250
300
VCE=5V
Ta=25˚C
Fig.7 Current Transfer Ratio vs. Forward
Current
Collector-emitter voltage VCE (V)
012345678910
0
6
12
18
24
30
36
42
48
54
60 Ta=25˚C
I
F
=30mA
I
F
=20mA
I
F
=10mA
I
F
=5mA
Collector current IC (mA)
PC (MAX.)
Fig.8 Collector Current vs. Collector-emitter
Voltage
PC123J00000F Series
Sheet No.: D2-A02904EN
Frequency (kHz)
Voltage gain Av (dB)
0.1 10 100
−20
1
−15
−10
−5
0
5VCE=5V
IC=2mA
Ta=25˚C
RL=10kΩ1kΩ100Ω
1 000
Fig.14 Frequency Response
Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.
9
Forward current IF (mA)
Collector-emitter saturation voltage VCE (sat) (V)
02468101214 16 18 20
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0 Ta=25˚C
IC=0.5mA
1mA
3mA
7mA
5mA
Fig.15 Collector-emitter Saturation Voltage
vs. Forward Current
VCC
90%
10%
Output
Input
RL
Input Output
VCE
RD
tf
tr
ts
td
Please refer to the conditions in Fig.12.
Fig.13 Test Circuit for Response Time
PC123J00000F Series
Sheet No.: D2-A02904EN
■ Design Considerations
While operating at IF<1.0mA, CTR variation may increase.
Please make design considering this fact.
This product is not designed against irradiation and incorporates non-coherent IRED.
● Degradation
In general, the emission of the IRED used in photocouplers will degrade over time.
In the case of long term operation, please take the general IRED degradation (50% degradation over 5years)
into the design consideration.
● Recommended Foot Print (reference)
✩ For additional design assistance, please review our corresponding Optoelectronic Application Notes.
10
SMT Gullwing lead-form Wide SMT Gullwing lead-form
10.2
2.54
1.7
2.2
8.2
2.54
1.7
2.2
(Unit : mm)
● Design guide
■ Design Considerations
PC123J00000F Series
Sheet No.: D2-A02904EN
■ Manufacturing Guidelines
Reflow Soldering:
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more than twice.
● Soldering Method
Flow Soldering :
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below
listed guidelines.
Flow soldering should be completed below 270˚C and within 10s.
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.
Please don't solder more than twice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.
Please don't solder more than twice.
Other notices
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.
11
1234
300
200
100
00
(˚C)
Terminal : 260˚C peak
( package surface : 250˚C peak)
Preheat
150 to 180˚C, 120s or less
Reflow
220˚C or more, 60s or less
(min)
PC123J00000F Series
Sheet No.: D2-A02904EN
Solvent cleaning:
Solvent temperature should be 45˚C or below Immersion time should be 3minutes or less
Ultrasonic cleaning:
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,
size of PCB and mounting method of the device.
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of
mass production.
Recommended solvent materials:
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol
In case the other type of solvent materials are intended to be used, please make sure they work fine in ac-
tual using conditions since some materials may erode the packaging resin.
● Cleaning instructions
This product shall not contain the following materials.
And they are not used in the production process for this product.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specific brominated flame retardants such as the PBB and PBDE are not used in this product at all.
This product shall not contain the following materials banned in the RoHS Directive.
•Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated
diphenyl ethers (PBDE).
● Presence of ODC
12
PC123J00000F Series
Sheet No.: D2-A02904EN
■ Package specification
13
12.0
6.7
5.8
10.8
15.0
6.35
5.9
10.8
520
±2
520
±2
PC123J00000F Series
● Sleeve package
1. Through-Hole
Package materials
Sleeve : HIPS (with anti-static material)
Stopper : Styrene-Elastomer
Package method
MAX. 100pcs of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless
stoppers.
The product shall be arranged in the sleeve with its anode mark on the tabless stopper side.
MAX. 20 sleeves in one case.
Sleeve outline dimensions
(Unit : mm)
(Unit : mm)
2. Wide Through-Hole
Package materials
Sleeve : HIPS (with anti-static material)
Stopper : Styrene-Elastomer
Package method
MAX. 100pcs of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless
stoppers.
The product shall be arranged in the sleeve with its anode mark on the tabless stopper side.
MAX. 20 sleeves in one case.
Sleeve outline dimensions
Sheet No.: D2-A02904EN
14
● Tape and Reel package
1. SMT Gullwing
Package materials
Carrier tape : PS
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
F
K
EI
D J
G
B
H
H
A
C
5˚MAX.
Dimensions List (Unit : mm)
A
16.0±0.3
B
7.5±0.1
C
1.75±0.10
D
8.0±0.1
E
2.0±0.1
H
10.4±0.1
I
0.40±0.05
J
4.2±0.1
K
5.1±0.1
F
4.0±0.1
G
φ1.5+0.1
−0.0
a
φ330
b
17.5±1.5
c
φ100±1
d
φ13.0±0.5
e
φ23±1
f
2.0±0.5
g
2.0±0.5
a
c
e
g
f
b
d
Dimensions List (Unit : mm)
Pull-out direction
[Packing : 2 000pcs/reel]
Reel structure and Dimensions
Direction of product insertion
PC123J00000F Series
Sheet No.: D2-A02904EN
2. Wide SMT Gullwing
Package materials
Carrier tape : PS
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
15
Dimensions List
A
24.0±0.3
B
11.5±0.1
C
1.75±0.10
D
8.0±0.1
E
2.0±0.1
H
12.4±0.1
I
0.40±0.05
J
4.1±0.1
K
5.1±0.1
F
4.0±0.1
G
φ1.5+0.1
−0.0
(Unit : mm)
J
GI
EC
B
A
H
H
5˚MAX.
F D
K
a
φ330
b
25.5±1.5
c
φ100±1
d
φ13.0±0.5
e
φ23±1
f
2.0±0.5
g
2.0±0.5
a
c
e
g
f
b
d
Dimensions List (Unit : mm)
Pull-out direction
[Packing : 2 000pcs/reel]
Reel structure and Dimensions
Direction of product insertion
PC123J00000F Series
· The circuit application examples in this publication are
provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems rela-
ted to any intellectual property right of a third party re-
sulting from the use of SHARP's devices.
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the spec-
ifications, characteristics, data, materials, structure,
and other contents described herein at any time without
notice in order to improve design or reliability. Manufac-
turing locations are also subject to change without no-
tice.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specified in the relevant specification
sheet nor meet the following conditions:
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in connec-
tion with equipment that requires an extremely high lev-
el of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.,
scuba).
· If the SHARP devices listed in this publication fall with-
in the scope of strategic products described in the For-
eign Exchange and Foreign Trade Law of Japan, it is
necessary to obtain approval to export such SHARP de-
vices.
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under the
copyright laws, no part of this publication may be repro-
duced or transmitted in any form or by any means, elec-
tronic or mechanical, for any purpose, in whole or in
part, without the express written permission of SHARP.
Express written permission is also required before any
use of this publication may be made by a third party.
· Contact and consult with a SHARP representative if
there are any questions about the contents of this pub-
lication.
16
Sheet No.: D2-A02904EN
■ Important Notices
PC123J00000F Series
[E180]
