SI4730-D60-GMR - SILICON LABS

Si4730/31/34/35-D60

BROADCAST AM/FM/SW/LW RADIO RECEIVER

Features

Applications

Description

The Si473x-D60 digital CMOS AM/FM radio receiver IC integrates the complete

broadcast tuner and receiver function from antenna input to digital audio output.

The device leverages the Silicon Labs broadcast proven digital low-IF

architecture, enabling a cost-effective, digital audio platform for consumer

electronic applications with high TDMA noise immunity, superior radio

performance, and high fidelity audio power amplification.

Functional Block Diagram

Worldwide FM band support

(64–108 MHz)

Worldwide AM band support

(520–1710 kHz)

SW band support (Si4734/35)

(2.3–26.1 MHz)

LW band support (Si4734/35)

(153–279 kHz)

Excellent real-world performance

Integrated VCO

Advanced AM/FM seek tuning

Automatic frequency control (AFC)

Automatic gain control (AGC)

Digital FM stereo decoder

Programmable de-emphasis

Advanced Audio Processing

Seven selectable AM channel filters

AM/FM/SW/LW digital tuning

EN55020 compliant

No manual alignment necessary

Programmable reference clock

Adjustable soft mute control

RDS/RBDS processor (Si4731/35)

Digital audio out

2-wire and 3-wire control interface

Integrated LDO regulator

Wide range of ferrite loop sticks and

air loop antennas supported

QFN and SSOP packages

RoHS compliant

Table and portable radios

Mini/micro systems

CD/DVD and Blu-ray players

Stereo boom boxes

Modules for consumer electronics

Clock radios

Mini HiFi and docking stations

Entertainment systems

ADC

Si473x-D60

DSP

DAC

LOUT

ROUT

AFC

GPO/DCLK

LDO

2.7~5.5 V (QFN )

2.0~5.5 V (SSO P)

RDS

(Si4731/

35)

AMI

1.62 -3.6 V

SEN

CONTROL

INTERFACE

SCLK

LNA

AGC

LNA

AGC

GND

ADC

Mux

Mux DAC

LOW-IF

SDIO

RST

DIGITAL

AUDIO DFS

DOUT

RCLK

AM / LW

ANT RFGND

FMI

FM / SW

ANT

This product, its features, and/or its

architecture is covered by one or more of

the following patents, as well as other

patents, pending and issued, both

foreign and domestic: 7,127,217;

7,272,373; 7,272,375; 7,321,324;

7,355,476; 7,426,376; 7,471,940;

7,339,503; 7,339,504.

Ordering Information:

See page 31.

Pin Assignments

Si473x-D60(SSOP)

Si473x-D60 (QFN)

GND

PAD

17181920

6789

GPO2/[INT]

DOUT

LOUT/[DFS]

ROUT/[DOUT]

GNDRST

AMI

RCLK

SDIO

FMI

RFGND

GPO3/[DCLK]

GPO1

DFS

SCLK

SEN

LOUT/[DFS]

ROUT/[DOUT]

DBYP

GPO2/[INT]

GPO3/[DCLK]

DOUT

DFS

GPO1

SDIO

RCLK

SEN

FMI

RFGND

SCLK

GND

RST

GND

AMI

Si4730/31/34/35-D60

2 Rev. 1.2

Si4730/31/34/35-D60

Rev. 1.2 3

TABLE OF CONTENTS

Section Page

1. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5

2. Typical Application Schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18

2.1. QFN Typical Application Schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18

2.2. SSOP Typical Application Schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19

3. Bill of Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20

3.1. QFN/SSOP Bill of Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20

4. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21

4.1. Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21

4.2. Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22

4.3. FM Receiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22

4.4. AM Receiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22

4.5. SW Receiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22

4.6. LW Receiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22

4.7. Digital Audio Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23

4.8. Stereo Audio Processing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25

4.9. Received Signal Qualifiers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25

4.10. Volume Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25

4.11. Stereo DAC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25

4.12. Soft Mute . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25

4.13. FM Hi-Cut Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25

4.14. De-emphasis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26

4.15. RDS/RBDS Processor (Si4731/35 Only) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26

4.16. Tuning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26

4.17. Seek . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26

4.18. Reference Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26

4.19. Control Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27

4.20. GPO Outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28

4.21. Firmware Upgrades . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28

4.22. Reset, Powerup, and Powerdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28

4.23. 2 V Operation (SSOP Only) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28

4.24. Programming with Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28

5. Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29

5.1. Si473x-D60-GM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29

5.2. Si473x-D60-GU . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30

6. Ordering Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31

7. Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32

7.1. Si473x-D60 QFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32

7.2. Si473x-D60 SSOP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33

8. PCB Land Pattern . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34

8.1. Si473x-D60 QFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34

8.2. Si473x-D60 SSOP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36

Si4730/31/34/35-D60

4 Rev. 1.2

9. Top Markings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37

9.1. Si473x-D60 Top Marking (QFN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37

9.2. Top Marking Explanation (QFN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37

9.3. Si473x-D60 Top Marking (SSOP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38

9.4. Top Marking Explanation (SSOP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38

10. Additional Reference Resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39

Document Change List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40

Contact Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .42

Si4730/31/34/35-D60

Rev. 1.2 5

1. Electrical Specifications

Table 1. Recommended Operating Conditions1

Parameter Symbol Test Condition Min Typ Max Unit

Analog Supply Voltage VA2.72—5.5 V

Digital and I/O Supply Voltage VD1.62 — 3.6 V

Power Supply Powerup Rise Time VDDRISE 10 — — µs

Interface Power Supply Powerup Rise Time VIORISE 10 — — µs

Ambient Temperature TA–20 25 85 C

Notes:

1. All minimum and maximum specifications apply across the recommended operating conditions. Typical values apply at

VA= 3.3 V and 25 C unless otherwise stated.

2. SSOP devices operate down to 2 V at 25 °C. See section “4.23. 2 V Operation (SSOP Only)” for details.

Si4730/31/34/35-D60

6 Rev. 1.2

Table 2. DC Characteristics

(VA= 2.7 to 5.5 V, VD= 1.62 to 3.6 V, TA= –20 to 85 °C)

Parameter Symbol Test Condition Min Typ Max Unit

FM Mode

VAQFN Supply Current IFMVA

Digital Output Mode1

—8.29.5

VDQFN Supply Current IFMVD — 10.5 13.5

VASSOP Supply Current IFMVA — 18.5 21.5

VDSSOP Supply Current IFMVD — 0.15 0.6

VAQFN Supply Current IFMVA

Analog Output Mode2

—9.110.3

VDQFN Supply Current IFMVD —9.912.8

VASSOP Supply Current IFMVA — 19.1 21.3

VDSSOP Supply Current IFMVD 0.1 0.6

AM Mode

VAQFN Supply Current IAMVA

Digital Output Mode

—6.57.5

VDQFN Supply Current IAMVD — 8.5 11.0

VASSOP Supply Current IAMVA — 14.5 16.5

VDSSOP Supply Current IAMVD — 0.15 0.50

VAQFN Supply Current IAMVA

Analog Output Mode

—7.58.5

VDQFN Supply Current IAMVD —810.2

VASSOP Supply Current IAMVA — 15.3 17.2

VDSSOP Supply Current IAMVD —0.10.4

Powerdown

VAQFN Powerdown Current IAPD

—415

µA

VASSOP Powerdown Current — 9.5 15

VDQFN Powerdown Current IDPD

SCLK, RCLK inactive — 3 10 µA

VDSSOP Powerdown Current SCLK, RCLK inactive — 3 10

High Level Input Voltage3VIH 0.7 x VD—V

D+0.3 V

Low Level Input Voltage3VIL –0.3 — 0.3 x VDV

High Level Input Current3IIH VIN =V

D=3.6V –10 — 10 µA

Low Level Input Current3IIL VIN =0V,

VD=3.6V

–10 — 10 µA

High Level Output Voltage4VOH IOUT = 500 µA 0.8 x VD——V

Low Level Output Voltage4VOL IOUT = –500 µA — — 0.2 x VDV

Notes:

1. Guaranteed by characterization.

2. Backwards compatible mode to rev B and rev C. Additional features on this device may increase typical supply current.

3. For input pins SCLK, SEN, SDIO, RST, RCLK, DCLK, DFS, GPO1, GPO2, and GPO3.

4. For output pins SDIO, DOUT, GPO1, GPO2, and GPO3.

Si4730/31/34/35-D60

Rev. 1.2 7

Figure 1. Reset Timing Parameters for Busmode Select

Table 3. Reset Timing Characteristics1,2,3

(VA= 2.7 to 5.5 V, VD= 1.62 to 3.6 V, TA= –20 to 85 °C)

Parameter Symbol Min Typ Max Unit

RST Pulse Width and GPO1, GPO2/INT Setup to RSTtSRST 100 — — µs

GPO1, GPO2/INT Hold from RSTtHRST 30 — — ns

RST Pulse Release time before VDD/VIO turn off tRRST 30 — — ns

Important Notes:

1. When selecting 2-wire mode, the user must ensure that a 2-wire start condition (falling edge of SDIO while SCLK is

high) does not occur within 300 ns before the rising edge of RST.

2. When selecting 2-wire mode, the user must ensure that SCLK is high during the rising edge of RST, and stays high until

after the first start condition.

3. When selecting 3-wire mode, the user must ensure that a rising edge of SCLK does not occur within 300 ns before the

rising edge of RST.

4. If GPO1 and GPO2 are actively driven by the user, then minimum tSRST is only 30 ns. If GPO1 or GPO2 is hi-Z, then

minimum tSRST is 100 µs, to provide time for on-chip 1 M devices (active while RST is low) to pull GPO1 high and

GPO2 low.

5. RST must be held low for at least 100 µs after all voltage supplies have been ramped up.

6. RST needs to be asserted (pulled low) prior to any supply voltage being ramped down.

Si4730/31/34/35-D60

8 Rev. 1.2

Table 4. 2-Wire Control Interface Characteristics1,2,3

(VA= 2.7 to 5.5 V, VD= 1.62 to 3.6 V, TA= –20 to 85 °C)

Parameter Symbol Test Condition Min Typ Max Unit

SCLK Frequency fSCL 0—400kHz

SCLK Low Time tLOW 1.3 — — µs

SCLK High Time tHIGH 0.6 — — µs

SCLK Input to SDIO  Setup

(START)

tSU:STA 0.6 — — µs

SCLK Input to SDIO  Hold

(START)

tHD:STA 0.6 — — µs

SDIO Input to SCLK  Setup tSU:DAT 100 — — ns

SDIO Input to SCLK  Hold4,5 tHD:DAT 0—900ns

SCLK input to SDIO  Setup

(STOP)

tSU:STO 0.6 — — µs

STOP to START Time tBUF 1.3 — — µs

SDIO Output Fall Time tf:OUT —250ns

SDIO Input, SCLK Rise/Fall Time tf:IN

tr:IN

—300ns

SCLK, SDIO Capacitive Loading Cb——50pF

Input Filter Pulse Suppression tSP — — 50 ns

Notes:

1. When VD= 0 V, SCLK and SDIO are low impedance.

2. When selecting 2-wire mode, the user must ensure that a 2-wire start condition (falling edge of SDIO while SCLK is

high) does not occur within 300 ns before the rising edge of RST.

3. When selecting 2-wire mode, the user must ensure that SCLK is high during the rising edge of RST, and stays high

until after the first start condition.

4. The Si473x-D60 delays SDIO by a minimum of 300 ns from the VIH threshold of SCLK to comply with the minimum

tHD:DAT specification.

5. The maximum tHD:DAT has only to be met when fSCL = 400 kHz. At frequencies below 400 KHz, tHD:DAT may be

violated as long as all other timing parameters are met.

20 0.1 Cb

1pF

-----------

20 0.1 Cb

1pF

-----------

Si4730/31/34/35-D60

Rev. 1.2 9

Figure 2. 2-Wire Control Interface Read and Write Timing Parameters

Figure 3. 2-Wire Control Interface Read and Write Timing Diagram

SCLK 70%

30%

SDIO 70%

30%

START STARTSTOP

tf:IN

tr:IN

tLOW tHIGH

tHD:STA

tSU:STA tSU:STO

tSP tBUF

tSU:DAT

tr:IN tHD:DAT tf:IN,

tf:OUT

SCLK

SDIO

START STOPADDRESS + R/W ACK DATA ACK DATA ACK

A6-A0,

R/W D7-D0 D7-D0

Si4730/31/34/35-D60

10 Rev. 1.2

Figure 4. 3-Wire Control Interface Write Timing Parameters

Figure 5. 3-Wire Control Interface Read Timing Parameters

Table 5. 3-Wire Control Interface Characteristics

(VA= 2.7 to 5.5 V, VD= 1.62 to 3.6 V, TA= –20 to 85 °C)

Parameter Symbol Test Co ndit io n Min Typ Max Unit

SCLK Frequency fCLK 0—2.5MHz

SCLK High Time tHIGH 25 — — ns

SCLK Low Time tLOW 25 — — ns

SDIO Input, SEN to SCLKSetup tS20 — — ns

SDIO Input to SCLKHold tHSDIO 10 — — ns

SEN Input to SCLKHold tHSEN 10 — — ns

SCLKto SDIO Output Valid tCDV Read 2 — 25 ns

SCLKto SDIO Output High Z tCDZ Read 2 — 25 ns

SCLK, SEN, SDIO, Rise/Fall time tR, tF— — 10 ns

Note: When selecting 3-wire mode, the user must ensure that a rising edge of SCLK does not occur within 300 ns before the

rising edge of RST.

SCLK 70%

30%

SEN 70%

30%

SDIO A7 A0

70%

30%

tHSDIO tHSEN

A6-A5,

R/W,

A4-A1

Address In Data In

D15 D14-D1 D0

tHIGH tLOW

tRtF

½ Cycle Bus

Turnaround

SCLK 70%

30%

SEN 70%

30%

SDIO 70%

30%

tHSDIO tCDV tCDZ

Address In Data Out

A7 A0

A6-A5,

R/W,

A4-A1 D15 D14-D1 D0

tStHSEN

Si4730/31/34/35-D60

Rev. 1.2 11

Figure 6. Digital Audio Interface Timing Parameters, I2S Mode

Table 6. Digital Audio Interface Characteristics

(VA= 2.7 to 5.5 V, VD= 1.62 to 3.6 V, TA= –20 to 85 °C)

Parameter Symbol Test Condition Min Typ Max Unit

DCLK Cycle Time tDCT 26 — 1000 ns

DCLK Pulse Width High tDCH 10 — — ns

DCLK Pulse Width Low tDCL 10 — — ns

DFS Set-up Time to DCLK Rising Edge tSU:DFS 5—— ns

DFS Hold Time from DCLK Rising Edge tHD:DFS 5—— ns

DOUT Propagation Delay from DCLK Falling

Edge

tPD:DOUT 0—50ns

DCLK

DFS

tDCT

tPD:OUT

tSU:DFS

tHD:DFS

DOUT

tDCH tDCL

Si4730/31/34/35-D60

12 Rev. 1.2

Table 7. FM Receiver Characteristics1,2

(VA= 2.7 to 5.5 V, VD= 1.62 to 3.6 V, TA= –20 to 85 °C)

Parameter Symbol Test Condition Min Typ Max Unit

Input Frequency fRF 76 — 108 MHz

Sensitivity3,4,5,6 (S+N)/N = 26 dB — 2.2 3.5 µV EMF

RDS Sensitivity6,7 f = 2 kHz,

RDS BLER < 5%

—10—µV EMF

LNA Input Resistance7,8 345 k

LNA Input Capacitance7,8 456 pF

Input IP37,9 100 105 — dBµV EMF

AM Suppression3,4,7,8 m = 0.3 40 50 — dB

Adjacent Channel Selectivity ±200 kHz 35 50 — dB

Alternate Channel Selectivity ±400 kHz 60 70 — dB

Spurious Response Rejection7In-band 35 — — dB

Audio Output Voltage3,4,8 72 80 90 mVRMS

Audio Output L/R Imbalance3,8,10 —— 1 dB

Audio Frequency Response Low7–3 dB — — 30 Hz

Audio Frequency Response High7–3 dB 15 — — kHz

Audio Stereo Separation8,10 35 42 — dB

Audio Mono S/N3,4,5,8 55 63 — dB

Audio Stereo S/N4,5,7,8 —58— dB

Audio THD3,8,10 —0.10.5 %

De-emphasis Time Constant7FM_DEEMPHASIS = 2 70 75 80 µs

FM_DEEMPHASIS = 1 45 50 54 µs

Blocking Sensitivity3,4,5,6,7,11,12 f = ±400 kHz — 34 — dBµV

f = ±4 MHz — 30 — dBµV

Notes:

1. Additional testing information is available in “AN388: Si470x/1x/2x/3x/4x Evaluation Board Test Procedure.”

Volume = maximum for all tests. Tested at RF = 98.1 MHz.

2. To ensure proper operation and receiver performance, follow the guidelines in “AN383: Si47xx Antenna, Schematic,

Layout, and Design Guidelines.” Silicon Laboratories will evaluate schematics and layouts for qualified customers.

3. FMOD =1kHz, 75µs de-emphasis, MONO = enabled, and L = R unless noted otherwise.

4. f = 22.5 kHz.

5. BAF = 300 Hz to 15 kHz, A-weighted.

6. Analog audio output mode.

7. Guaranteed by characterization.

8. VEMF =1 mV.

9. |f2 – f1| > 2 MHz, f0=2xf

1 – f2. AGC is disabled.

10. f = 75 kHz.

11. Sensitivity measured at (S+N)/N = 26 dB.

12. Blocker Amplitude = 100 dBuV.

13. At temperature (25 °C).

14. At LOUT and ROUT pins.

Si4730/31/34/35-D60

Rev. 1.2 13

Intermod Sensitivity3,4,5,6,7,11,12 f = ±400 kHz, ±800 kHz — 40 — dBµV

f = ±4 MHz, ±8 MHz — 35 — dBµV

Audio Output Load Resistance7,11,14 RLSingle-ended 10 — — k

Audio Output Load Capaci-

tance7,11,14 CLSingle-ended — — 50 pF

Seek/Tune Time7RCLK tolerance

=100ppm

— — 60 ms/channel

Powerup Time7From powerdown — — 110 ms

RSSI Offset12,13 Input levels of 8 and

60 dBµV at RF Input

–3 — 3 dB

Table 7. FM Receiver Characteristics1,2 (Continued)

(VA= 2.7 to 5.5 V, VD= 1.62 to 3.6 V, TA= –20 to 85 °C)

Parameter Symbol Test Condition Min Typ Max Unit

Notes:

1. Additional testing information is available in “AN388: Si470x/1x/2x/3x/4x Evaluation Board Test Procedure.”

Volume = maximum for all tests. Tested at RF = 98.1 MHz.

2. To ensure proper operation and receiver performance, follow the guidelines in “AN383: Si47xx Antenna, Schematic,

Layout, and Design Guidelines.” Silicon Laboratories will evaluate schematics and layouts for qualified customers.

3. FMOD =1kHz, 75µs de-emphasis, MONO = enabled, and L = R unless noted otherwise.

4. f = 22.5 kHz.

5. BAF = 300 Hz to 15 kHz, A-weighted.

6. Analog audio output mode.

7. Guaranteed by characterization.

8. VEMF =1 mV.

9. |f2 – f1| > 2 MHz, f0=2xf

1 – f2. AGC is disabled.

10. f = 75 kHz.

11. Sensitivity measured at (S+N)/N = 26 dB.

12. Blocker Amplitude = 100 dBuV.

13. At temperature (25 °C).

14. At LOUT and ROUT pins.

Si4730/31/34/35-D60

14 Rev. 1.2

Table 8. 64–75.9 MHz Input Frequency FM Receiver Characteristics1,2,3

(VA= 2.7 to 5.5 V, VD= 1.62 to 3.6 V, TA= –20 to 85 °C)

Parameter Symbol Test Condition Min Typ Max Unit

Input Frequency fRF 64 — 75.9 MHz

Sensitivity4,5,6,8(S+N)/N = 26 dB — 3.5 — µV EMF

LNA Input Resistance3,7 345 k

LNA Input Capacitance3,7 456 pF

Input IP39— 105 — dBµV EMF

AM Suppression3,4,5,7 m = 0.3 — 50 — dB

Adjacent Channel Selectivity ±200 kHz — 50 — dB

Alternate Channel Selectivity ±400 kHz — 70 — dB

Audio Output Voltage4,5,7 72 80 90 mVRMS

Audio Output L/R Imbalance4,7,10 —— 1 dB

Audio Frequency Response Low3–3 dB — — 30 Hz

Audio Frequency Response High3–3 dB 15 — — kHz

Audio Mono S/N4,3,5,7,11 —63— dB

Audio THD4,7,10 —0.1— %

De-emphasis Time Constant FM_DEEMPHASIS = 2 70 75 80 µs

FM_DEEMPHASIS = 1 45 50 54 µs

Audio Output Load Resistance3,11 RLSingle-ended 10 — — k

Audio Output Load Capacitance3,11 CLSingle-ended — — 50 pF

Seek/Tune Time3RCLK tolerance

=100ppm

— — 60 ms/channel

Powerup Time3From powerdown — — 110 ms

RSSI Offset12 Input levels of 8 and

60 dBµV EMF

–3 — 3 dB

Notes:

1. Additional testing information is available in “AN388: Si470x/1x/2x/3x/4x Evaluation Board Test Procedure.”

Volume = maximum for all tests. Tested at RF = 98.1 MHz.

2. To ensure proper operation and receiver performance, follow the guidelines in “AN383: Si47xx Antenna, Schematic,

Layout, and Design Guidelines.” Silicon Laboratories will evaluate schematics and layouts for qualified customers.

3. Guaranteed by characterization.

4. FMOD =1kHz, 75µs de-emphasis, MONO = enabled, and L = R unless noted otherwise.

5. f = 22.5 kHz.

6. BAF = 300 Hz to 15 kHz, A-weighted.

7. VEMF =1 mV.

8. Analog output mode.

9. |f2 – f1| > 2 MHz, f0=2xf

1 – f2. AGC is disabled.

10. f = 75 kHz.

11. At LOUT and ROUT pins.

12. At temperature (25 °C).

Si4730/31/34/35-D60

Rev. 1.2 15

Table 9. AM/SW/LW Receiver Characteristics1,2

(VA = 2.7 to 5.5 V, VA = 1.62 to 3.6 V, TA = –20 to 85 °C)

Parameter Symbol Test Condition Min Typ Max Unit

Input Frequency fRF Long Wave (LW) 153 — 279 kHz

Medium Wave (AM) 520 — 1710 kHz

Short Wave (SW) 2.3 — 26.1 MHz

Sensitivity3,4,5 (S+N)/N = 26 dB — 25 35 µV EMF

Large Signal Voltage Handling5,6 THD < 8% — 300 — mVRMS

Power Supply Rejection Ratio5∆VDD =100 mV

RMS, 100 Hz — 40 — dB

Audio Output Voltage3,7 54 60 67 mVRMS

Audio S/N3,4,7 —60— dB

Audio THD3,7 — 0.1 0.5 %

Antenna Inductance5,8 Long Wave (LW) — 2800 — µH

Medium Wave (AM) 180 — 450 µH

Powerup Time5From powerdown — — 110 ms

Notes:

1. Additional testing information is available in “AN388: Si470x/1x/2x/3x/4x Evaluation Board Test Procedure.”

Volume = maximum for all tests. Tested at RF = 520 kHz.

2. To ensure proper operation and receiver performance, follow the guidelines in “AN383: Si47xx Antenna, Schematic,

Layout, and Design Guidelines.” Silicon Laboratories will evaluate schematics and layouts for qualified customers.

3. FMOD = 1 kHz, 30% modulation, 2 kHz channel filter.

4. BAF = 300 Hz to 15 kHz, A-weighted.

5. Guaranteed by characterization.

6. See “AN388: Si470x/1x/2x/3x/4x Evaluation Board Test Procedure” for evaluation method.

7. VIN = 5 mVrms.

8. Stray capacitance on antenna and board must be < 10 pF to achieve full tuning range at higher inductance levels.

Si4730/31/34/35-D60

16 Rev. 1.2

Table 10. Reference Clock and Crystal Characteristics

(VA= 2.7 to 5.5 V, VD= 1.62 to 3.6 V, TA = –20 to 85 °C)

Parameter Symbol Test Condition Min Typ Max Unit

Reference Clo c k

RCLK Supported Frequencies131.130 32.768 40,000 kHz

RCLK Frequency Tolerance2–100 — 100 ppm

REFCLK_PRESCALE 1 — 4095

REFCLK 31.130 32.768 34.406 kHz

Crystal Oscillator

Crystal Oscillator Frequency — 32.768 — kHz

Crystal Frequency Tolerance2–100 — 100 ppm

Board Capacitance — — 3.5 pF

ESR — — 50 

CL371222pF

CL–single ended314 24 44 pF

Notes:

1. The Si473x-D60 divides the RCLK input by REFCLK_PRESCALE to obtain REFCLK. There are some RCLK

frequencies between 31.130 kHz and 40 MHz that are not supported. For more details, see Table 6 of “AN332: Si47xx

Programming Guide”.

2. A frequency tolerance of ±50 ppm is required for FM seek/tune using 50 kHz channel spacing and AM seek/tune in SW

frequencies.

3. Guaranteed by characterization.

Table 11. Thermal Conditions

Parameter Symbol Min Typ Max Unit

Thermal Resistance* JA —80—°C/W

Ambient Temperature TA–20 25 85 °C

Junction Temperature TJ——92°C

*Note: Thermal resistance assumes a multi-layer PCB with the exposed pad soldered to a topside PCB pad.

Si4730/31/34/35-D60

Rev. 1.2 17

Table 12. Absolute Maximum Ratings1,2

Parameter Symbol Value Unit

Analog Supply Voltage VA –0.5 to 5.8 V

Digital and I/O Supply Voltage VD–0.5 to 3.9 V

Input Current3IIN 10 mA

Input Voltage3VIN –0.3 to (VIO + 0.3) V

Operating Temperature TOP –40 to 95 C

Storage Temperature TSTG –55 to 150 C

RF Input Level40.4 Vpk

Notes:

1. Permanent device damage may occur if the above Absolute Maximum Ratings are exceeded. Functional operation

should be restricted to the conditions as specified in the operational sections of this data sheet. Exposure beyond

recommended operating conditions for extended periods may affect device reliability.

2. The Si473x-D60 devices are high-performance RF integrated circuits with certain pins having an ESD rating of < 2 kV

HBM. Handling and assembly of these devices should only be done at ESD-protected workstations.

3. For input pins DFS, SCLK, SEN, SDIO, RST, RCLK, GPO1, GPO2, GPO3, and DCLK.

4. At RF input pins FMI and AMI.

Si4730/31/34/35-D60

18 Rev. 1.2

2. Typical Application Schematic

2.1. QFN Typical Application Schematic

Notes:

1. Place C1 close to VA pin and C4 close to VD pin.

2. All grounds connect directly to GND plane on PCB.

3. Pins 1 and 20 are no connects, leave floating.

4. To ensure proper operation and receiver performance, follow the guidelines in “AN383: Si47xx Antenna, Schematic,

Layout, and Design Guidelines.” Silicon Laboratories will evaluate schematics and layouts for qualified customers.

5. Pin 2 connects to the FM antenna interface, and pin 4 connects to the AM antenna interface.

6. Place Si473x-D60 as close as possible to antenna and keep the FMI and AMI traces as short as possible.







































1&

)0,

5)*1'

$0,

567%

6(1%

6&/.

6',2

5&/.

*1'

5287

/287

'287

*32

*32,17

*32'&/.

')6

6L[

&

&

&

5

5

5

&

&

7

1&

/

;





&

/

&

5)*1'

$0,

*32 5&/.

WR9

WR9

2SWLRQDO'LJLWDO$XGLR2XW

2302'([%[%

567%

6&/.

6',2

5&/.

5287

/287

'287

')6

*32'&/.

*32,17

*32

'

2SWLRQDO$0$LU/RRS$QWHQQD

)0$QWHQQD

2SWLRQDO)RU&U\VWDO26&

6(1%

Si4730/31/34/35-D60

Rev. 1.2 19

2.2. SSOP Typical Application Schematic

Notes:

1. Place C1 close to VA and C4 close to VD pin.

2. All grounds connect directly to GND plane on PCB.

3. Pins 6 and 7 are no connects, leave floating.

4. Pins 10 and 11 are unused. Tie these pins to GND.

5. To ensure proper operation and receiver performance, follow the guidelines in “AN383: Si47xx Antenna, Schematic,

Layout, and Design Guidelines.” Silicon Laboratories will evaluate schematics and layouts for qualified customers.

6. Pin 8 connects to the FM antenna interface, and pin 12 connects to the AM antenna interface.

7. Place Si473x-D60 as close as possible to antenna and keep the FMI and AMI traces as short as possible.















































'287

')6

*32'&/.

*32,17

*32

)0,

5)*1'

$0,

/287

5287

'%<3

5&/.

6',2

6&/.

6(1%

567%

*1'

6L[

&

&

;





&

&

&

&

/

7

/

&

5

5

&

5

5)*1'

$0,

*32 5&/.

'287

9$ WR9

'

WR9

)0$QWHQQD

2SWLRQDO)RU&U\VWDO26&

2SWLRQDO$0$LU/RRS$QWHQQD

2302'([%[%

2SWLRQDO'LJLWDO$XGLR2XW

')6

*32'&/.

/287

5287

5&/.

6',2

6&/.

6(1%

567%

*32

*32,17

Si4730/31/34/35-D60

20 Rev. 1.2

3. Bill of Materials

3.1. QFN/SSOP Bill of Materials

Table 13. Si473x-D60 QFN/SSOP Bill of Materials

Component(s) Value/Description Supplier

C1 Supply bypass capacitor, 22 nF, ±20%, Z5U/X7R Murata

C2 Coupling capacitor, 1 nF, ±20%, Z5U/X7R Murata

C3 Coupling capacitor, 0.47 μF, ±20%, Z5U/X7R Murata

C4 Supply bypass capacitor, 100 nF, 10%, Z5U/X7R Murata

L1 Ferrite loop stick, 180–450 μHJiaxin

U1 Si47xx AM/FM Radio Tuner Silicon Laboratories

Optional Components

C5, C6 Crystal load capacitors, 22 pF, ±5%, COG

(Optional for crystal oscillator)

Venkel

C9 Noise mitigating capacitor, 2~5 pF

(Optional for digital audio)

Murata

R1 Resistor, 600 Ω

(Optional for digital audio)

Venkel

R2 Resistor, 2 kΩ

(Optional for digital audio)

Venkel

R3 Resistor, 2 kΩ

(Optional for digital audio)

Venkel

L2 Air Loop, 10-20 µH

(Optional for AM Input)

Jiaxin

T1 Transformer, 1:5 turns ratio

(Optional for AM Input)

Jiaxin, UMEC

X1 32.768 kHz crystal

(Optional for crystal oscillator)

Epson

Si4730/31/34/35-D60

Rev. 1.2 21

4. Functional Description

4.1. Overview

Figure 7. Functional Block Diagram

The Si473x-D60 digital CMOS AM/FM radio receiver IC

integrates the complete broadcast tuner and receiver

function from antenna input to digital audio output. The

device leverages the Silicon Labs broadcast proven

digital low-IF architecture, enabling a cost-effective

digital audio platform for consumer electronic

applications with high TDMA noise immunity, superior

radio performance, and high fidelity audio power

amplification. Offering unmatched integration and PCB

space savings, the Si473x-D60 requires only a few

external components and less than 15 mm2 of board

area, excluding the antenna inputs. The Si473x-D60

AM/FM radio provides the space savings and low power

consumption necessary for portable devices while

delivering the high performance and design simplicity

desired for all AM/FM solutions.

Leveraging Silicon Laboratories' proven and patented

Si4700/01 FM tuner's digital low intermediate frequency

(low-IF) receiver architecture, the Si473x-D60 delivers

superior RF performance and interference rejection in

the AM, FM, SW, and LW bands. The high level of

integration and complete system production test

simplifies design-in, increases system quality, and

improves reliability and manufacturability.

The Si473x-D60 is a feature-rich solution that includes

advanced seek algorithms, soft mute, auto-calibrated

digital tuning, FM stereo processing and advanced

audio processing.

In addition, the Si473x-D60 provides analog and digital

audio outputs and a programmable reference clock. The

device supports I2C-compatible 2-wire control interface,

and a Si4700/01 backwards-compatible 3-wire control

interface.

The Si473x-D60 utilizes digital signal processing to

achieve high fidelity, optimal performance, and design

flexibility. The chip provides excellent pilot rejection,

selectivity, and unmatched audio performance, and

offers both the manufacturer and the end-user

extensive programmability and a better listening

experience.

The Si4731/35 incorporates a digital signal processor

for the European Radio Data System (RDS) and the

North American Radio Broadcast Data System (RBDS)

including all required symbol decoding, block

synchronization, error detection, and error correction

functions. Using this feature, the Si4731/35 enables

broadcast data such as station identification and song

name to be displayed to the user.

ADC

Si473x-D60

DSP

DAC

LOUT

ROUT

AFC

GPO/DCLK

LDO

2.7~5.5 V (Q FN)

2.0~5.5 V (SS OP )

RDS

(Si4731/

35)

AMI

1.62 - 3.6 V

SEN

CONTROL

INTERFACE

SCLK

LNA

AGC

LNA

AGC

GND

ADC

Mux

Mux DAC

LOW-IF

SDIO

RST

DIGITAL

AUDIO DFS

DOUT

RCLK

AM / LW

ANT RFGND

FMI

FM / SW

ANT

Si4730/31/34/35-D60

22 Rev. 1.2

4.2. Operating Modes

The Si473x-D60 operates in either an FM receive or AM

receive modes. In FM mode, radio signals are received

on FMI and processed by the FM front-end circuitry. In

AM mode, radio signals are received on AMI and

processed by the AM front-end circuitry. In addition to

the receiver mode, there is a clocking mode to choose

to clock the Si473x-D60 from a reference clock or

crystal. On the Si473x-D60, there is an audio output

mode to choose between an analog and/or digital audio

output. In the analog audio output mode, ROUT and

LOUT are used for the audio output pins. In the digital

audio mode, DOUT, DFS, and DCLK pins are used.

Concurrent analog/digital audio output mode is also

available requiring all five pins.

4.3. FM Receiver

The Si473x-D60 FM receiver is based on the proven

Si4700/01 FM tuner. The receiver uses a digital low-IF

architecture allowing the elimination of external

components and factory adjustments. The Si473x-D60

integrates a low noise amplifier (LNA) supporting the

worldwide FM broadcast band (64 to 108 MHz). An

AGC circuit controls the gain of the LNA to optimize

sensitivity and rejection of strong interferers. An image-

reject mixer downconverts the RF signal to low-IF. The

quadrature mixer output is amplified, filtered, and

digitized with high resolution analog-to-digital

converters (ADCs). This advanced architecture allows

the Si473x-D60 to perform channel selection, FM

demodulation, and stereo audio processing to achieve

superior performance compared to traditional analog

architectures.

4.4. AM Receiver

The highly-integrated Si473x-D60 supports worldwide

AM band reception from 520 to 1710 kHz using a digital

low-IF architecture with a minimum number of external

components and no manual alignment required. This

digital low-IF architecture allows for high-precision

filtering offering excellent selectivity and SNR with

minimum variation across the AM band. The DSP also

provides adjustable channel step sizes in 1 kHz

increments, AM demodulation, soft mute, seven

different channel bandwidth filters, and additional

features, such as a programmable automatic volume

control (AVC) maximum gain allowing users to adjust

the level of background noise.

Similar to the FM receiver, the integrated LNA and AGC

optimize sensitivity and rejection of strong interferers

allowing better reception of weak stations.

The Si473x-D60 provides highly-accurate digital AM

tuning without factory adjustments. To offer maximum

flexibility, the receiver supports a wide range of ferrite

loop sticks from 180–450 µH. An air loop antenna is

supported by using a transformer to increase the

effective inductance from the air loop. Using a 1:5 turn

ratio inductor, the inductance is increased by 25 times

and easily supports all typical AM air loop antennas

which generally vary between 10 and 20 µH.

4.5. SW Receiver

The Si4734/35 is the first fully integrated IC to support

AM and FM, as well as short wave (SW) band reception

from 2.3 to 26.1 MHz fully covering the 120 meter to

11 meter bands. The Si4734/35 offers extensive

shortwave features such as continuous digital tuning

with minimal discrete components and no factory

adjustments. Other SW features include adjustable

channel step sizes in 1 kHz increments, adjustable

channel bandwidth settings, advanced seek algorithm,

and soft mute.

The Si4734/35 uses the FM antenna to capture short

wave signals. These signals are then fed directly into

the AMI pin in a wide band configuration. See "AN332:

Si47xx Programming Guide” and “AN383: Si47xx

Antenna and Schematic Guidelines" for more details.

4.6. LW Receiver

The Si4734/35 supports the long wave (LW) band from

153 to 279 kHz. The highly integrated Si4734/35 offers

continuous digital tuning with minimal discrete

components and no factory adjustments. The Si4734/35

also offers adjustable channel step sizes in 1 kHz

increments, adjustable channel bandwidth settings,

advanced seek algorithm, and soft mute.

The Si4734/35 uses a separate ferrite bar antenna to

capture long wave signals.

Si4730/31/34/35-D60

Rev. 1.2 23

4.7. Digital Audio Interface

The digital audio interface operates in slave mode and

supports a variety of MSB-first audio data formats

including I2S and left-justified modes. The interface has

three pins: digital data input (DIN), digital frame

synchronization input (DFS), and a digital bit

synchronization input clock (DCLK). The Si473x-D60

supports a number of industry-standard sampling rates

including 32, 44.1, and 48 kHz. The digital audio

interface enables low-power operation by eliminating

the need for redundant DACs and ADCs on the audio

baseband processor.

4.7.1. Audio Data Formats

The digital audio interface operates in slave mode and

supports three different audio data formats:

I2S

Left-Justified

DSP Mode

In I2S mode, by default the MSB is captured on the

second rising edge of DCLK following each DFS

transition. The remaining bits of the word are sent in

order, down to the LSB. The left channel is transferred

first when the DFS is low, and the right channel is

transferred when the DFS is high.

In left-justified mode, by default the MSB is captured on

the first rising edge of DCLK following each DFS

transition. The remaining bits of the word are sent in

order, down to the LSB. The left channel is transferred

first when the DFS is high, and the right channel is

transferred when the DFS is low.

In DSP mode, the DFS becomes a pulse with a width of

1DCLK period. The left channel is transferred first,

followed right away by the right channel. There are two

options in transferring the digital audio data in DSP

mode: the MSB of the left channel can be transferred on

the first rising edge of DCLK following the DFS pulse or

on the second rising edge.

In all audio formats, depending on the word size, DCLK

frequency, and sample rates, there may be unused

DCLK cycles after the LSB of each word before the next

DFS transition and MSB of the next word. In addition, if

preferred, the user can configure the MSB to be

captured on the falling edge of DCLK via properties.

The number of audio bits can be configured for 8, 16,

20, or 24 bits.

4.7.2. Audio Sample Rates

The device supports a number of industry-standard

sampling rates including 32, 44.1, and 48 kHz. The

digital audio interface enables low-power operation by

eliminating the need for redundant DACs on the audio

baseband processor.

Si4730/31/34/35-D60

24 Rev. 1.2

Figure 8. I2S Digital Audio Format

Figure 9. Left-Justified Digital Audio Format

Figure 10. DSP Digital Audio Format

LEFT CHANNEL RIGHT CHANNEL

1 DCLK 1 DCLK

132nn-1

n-2 132n

n-1n-2

LSBMSB

DCLK

DOUT

DFS

INVERTED

DCLK

(OFALL = 1)

(OFALL = 0)

I2S

(OMODE = 0000 )

LEFT CHANNEL RIGHT CHANNEL

132nn-1n-2 132nn-1

n-2

LSBMSB

DCLK

DOUT

DFS

INVERTED

DCLK

(OFALL = 1)

(OFALL = 0)

Left-Justified

(OMODE = 0110)

132nn-1n-2 nn-1n-2

LSBMSB

DCLK

DOUT

(MSB at 1st rising edge)

DFS

132

LEFT CHANNEL RIGHT CHANNEL

1 DCLK

(OFALL = 0)

(OMODE = 1100)

132nn-1n-2 nn-1n-2

LSBMSB

132

LEFT CHANNEL RIGHT CHANNEL

DOUT

(MSB at 2nd rising edge)

(OMODE = 1000)

Si4730/31/34/35-D60

Rev. 1.2 25

4.8. Stereo Audio Processing

The output of the FM demodulator is a stereo

multiplexed (MPX) signal. The MPX standard was

developed in 1961, and is used worldwide. Today's

MPX signal format consists of left + right (L+R) audio,

left – right (L–R) audio, a 19 kHz pilot tone, and

RDS/RBDS data as shown in Figure 11 below.

Figure 11. MPX Signal Spectrum

4.8.1. Stereo Decoder

The Si473x-D60's integrated stereo decoder

automatically decodes the MPX signal using DSP

techniques. The 0 to 15 kHz (L+R) signal is the mono

output of the FM tuner. Stereo is generated from the

(L+R), (L–R), and a 19 kHz pilot tone. The pilot tone is

used as a reference to recover the (L–R) signal. Output

left and right channels are obtained by adding and

subtracting the (L+R) and (L–R) signals respectively.

4.8.2. Stereo-Mono Blending

Adaptive noise suppression is employed to gradually

combine the stereo left and right audio channels to a

mono (L+R) audio signal as the signal quality degrades

to maintain optimum sound fidelity under varying

reception conditions. Three metrics, received signal

strength indicator (RSSI), signal-to-noise ratio (SNR),

and multipath interference, are monitored

simultaneously in forcing a blend from stereo to mono.

The metric which reflects the minimum signal quality

takes precedence and the signal is blended

appropriately.

All three metrics have programmable stereo/mono

thresholds and attack/release rates. If a metric falls

below its mono threshold, the signal is blended from

stereo to full mono. If all metrics are above their

respective stereo thresholds, then no action is taken to

blend the signal. If a metric falls between its mono and

stereo thresholds, then the signal is blended to the level

proportional to the metric’s value between its mono and

stereo thresholds, with an associated attack and

release rate.

4.9. Received Signal Qualifiers

The quality of a tuned signal can vary depending on

many factors including environmental conditions, time of

day, and position of the antenna. To adequately manage

the audio output and avoid unpleasant audible effects to

the end-user, the Si473x-D60 monitors and provides

indicators of the signal quality, allowing the host

processor to perform additional processing if required

by the customer. The Si473x-D60 monitors signal

quality metrics including RSSI, SNR, and multipath

interference on FM signals. These metrics are used to

optimize signal processing and are also reported to the

host processor. The signal processing algorithms can

use either Silicon Labs' optimized settings

(recommended) or be customized to modify

performance.

4.10. Volume Control

The audio output may be muted. Volume is adjusted

digitally by the RX_VOLUME property.

4.11. Stereo DAC

High-fidelity stereo digital-to-analog converters (DACs)

drive analog audio signals onto the LOUT and ROUT

pins. The audio output may be muted.

4.12. Soft Mute

The soft mute feature is available to attenuate the audio

outputs and minimize audible noise in very weak signal

conditions. The soft mute feature is triggered by the

SNR metric. The SNR threshold for activating soft mute

is programmable, as are soft mute attenuation levels

and attack and release rates.

4.13. FM Hi-Cut Control

Hi-cut control is employed on audio outputs with

degradation of the signal due to low SNR and/or

multipath interference. Two metrics, SNR and multipath

interference, are monitored concurrently in forcing hi-cut

of the audio outputs. Programmable minimum and

maximum thresholds are available for both metrics. The

transition frequency for hi-cut is also programmable with

up to seven hi-cut filter settings. A single set of attack

and release rates for hi-cut are programmable for both

metrics from a range of 2 ms to 64 s. The level of hi-cut

applied can be monitored with the FM_RSQ_STATUS

command. Hi-cut can be disabled by setting the hi-cut

filter to audio bandwidth of 15 kHz.

0575338231915

Frequency (kHz)

Modulation Level

Stereo Audio

Left - Right

RDS/

RBDS

Mono Audio

Left + Right Stereo

Pilot

Si4730/31/34/35-D60

26 Rev. 1.2

4.14. De-emphasis

Pre-emphasis and de-emphasis is a technique used by

FM broadcasters to improve the signal-to-noise ratio of

FM receivers by reducing the effects of high-frequency

interference and noise. When the FM signal is

transmitted, a pre-emphasis filter is applied to

accentuate the high audio frequencies. The Si473x-D60

incorporates a de-emphasis filter which attenuates high

frequencies to restore a flat frequency response. Two

time constants are used in various regions. The de-

emphasis time constant is programmable to 50 or 75 µs

and is set by the FM_DEEMPHASIS property.

4.15. RDS/RBDS Processor

(Si4731/35 Only)

The Si4731/35 implements an RDS/RBDS* processor

for symbol decoding, block synchronization, error

detection, and error correction.

The Si4731/35 device is user configurable and provides

an optional interrupt when RDS is synchronized, loses

synchronization, and/or the user configurable RDS

FIFO threshold has been met.

The Si4731/35 reports RDS decoder synchronization

status and detailed bit errors in the information word for

each RDS block with the FM_RDS_STATUS command.

The range of reportable block errors is 0, 1–2, 3–5, or

6+. More than six errors indicates that the

corresponding block information word contains six or

more non-correctable errors or that the block checkword

contains errors. The pilot does not have to be present to

decode RDS/RBDS.

*Note: RDS/RBDS is referred to only as RDS throughout the

remainder of this document.

4.16. Tuning

The tuning frequency is directly programmed using the

FM_TUNE_FREQ and AM_TUNE_FREQ commands.

The Si473x-D60 supports channel spacing steps of

10 kHz in FM mode and 1 kHz in AM mode.

4.17. Seek

The Si473x-D60 seek functionality is performed

completely on-chip and will search up or down the

selected frequency band for a valid channel. A valid

channel is qualified according to a series of

programmable signal indicators and thresholds. The

seek function can be made to stop at the band edge and

provide an interrupt, or wrap the band and continue

seeking until arriving at the original departure frequency.

The device sets interrupts with found valid stations or, if

the seek results in zero found valid stations, the device

indicates failure and again sets an interrupt. Refer to

“AN332: Si47xx Programming Guide”.

The Si473x-D60 uses RSSI, SNR, and AFC to qualify

stations. Most of these variables have programmable

thresholds for modifying the seek function according to

customer needs.

RSSI is employed first to screen all possible candidate

stations. SNR and AFC are subsequently used in

screening the RSSI qualified stations. The more

thresholds the system engages, the higher the

confidence that any found stations will indeed be valid

broadcast stations. The Si473x-D60 defaults set RSSI

to a mid-level threshold and add an SNR threshold set

to a level delivering acceptable audio performance. This

trade-off will eliminate very low RSSI stations while

keeping the seek time to acceptable levels. Generally,

the time to auto-scan and store valid channels for an

entire FM band with all thresholds engaged is very short

depending on the band content. Seek is initiated using

the FM_SEEK_START command. The RSSI, SNR, and

AFC threshold settings are adjustable using properties.

4.18. Reference Clock

The Si473x-D60 reference clock is programmable,

supporting RCLK frequencies listed in Table 10,

“Reference Clock and Crystal Characteristics,” on

page 16. Refer to Table 2, “DC Characteristics,” on

page 6 for switching voltage levels and Table 10 for

frequency tolerance information.

An onboard crystal oscillator is available to generate the

32.768 kHz reference when an external crystal and load

capacitors are provided. Refer to "2. Typical Application

Schematic" on page 18. This mode is enabled using the

POWER_UP command. Refer to “AN332: Si47xx

Programming Guide”.

The Si473x-D60 performance may be affected by data

activity on the SDIO bus when using the integrated

internal oscillator. SDIO activity results from polling the

tuner for status or communicating with other devices

that share the SDIO bus. If there is SDIO bus activity

while the Si473x-D60 is performing the seek/tune

function, the crystal oscillator may experience jitter,

which may result in mistunes, false stops, and/or lower

SNR.

For best seek/tune results, Silicon Laboratories

recommends that all SDIO data traffic be suspended

during Si473x-D60 seek and tune operations. This is

achieved by keeping the bus quiet for all other devices

on the bus, and delaying tuner polling until the tune or

seek operation is complete. The seek/tune complete

(STC) interrupt should be used instead of polling to

determine when a seek/tune operation is complete.

Si4730/31/34/35-D60

Rev. 1.2 27

4.19. Control Interface

A serial port slave interface is provided, which allows an

external controller to send commands to the Si473x-

D60 and receive responses from the device. The serial

port can operate in two bus modes: 2-wire mode and 3-

wire mode. The Si473x-D60 selects the bus mode by

sampling the state of the GPO1 and GPO2 pins on the

rising edge of RST. The GPO1 pin includes an internal

pull-up resistor, which is connected while RST is low,

and the GPO2 pin includes an internal pull-down

resistor, which is connected while RST is low.

Therefore, it is only necessary for the user to actively

drive pins which differ from these states. See Table 14.

After the rising edge of RST, the pins GPO1 and GPO2

are used as general purpose output (O) pins, as

described in Section “4.20. GPO Outputs”. In any bus

mode, commands may only be sent after VD and VA

supplies are applied.

In any bus mode, before sending a command or reading

a response, the user must first read the status byte to

ensure that the device is ready (CTS bit is high).

4.19.1. 2-Wire C on t rol Interface Mode

When selecting 2-wire mode, the user must ensure that

SCLK is high during the rising edge of RST, and stays

high until after the first start condition. Also, a start

condition must not occur within 300 ns before the rising

edge of RST.

The 2-wire bus mode uses only the SCLK and SDIO

pins for signaling. A transaction begins with the START

condition, which occurs when SDIO falls while SCLK is

high. Next, the user drives an 8-bit control word serially

on SDIO, which is captured by the device on rising

edges of SCLK. The control word consists of a 7-bit

device address, followed by a read/write bit (read = 1,

write = 0). The Si473x-D60 acknowledges the control

word by driving SDIO low on the next falling edge of

SCLK.

Although the Si473x-D60 will respond to only a single

device address, this address can be changed with the

SEN pin (note that the SEN pin is not used for signaling

in 2-wire mode). Refer to “AN332: Si47xx Programming

Guide”

For write operations, the user then sends an 8-bit data

byte on SDIO, which is captured by the device on rising

edges of SCLK. The Si473x-D60 acknowledges each

data byte by driving SDIO low for one cycle, on the next

falling edge of SCLK. The user may write up to 8 data

bytes in a single 2-wire transaction. The first byte is a

command, and the next seven bytes are arguments.

For read operations, after the Si473x-D60 has

acknowledged the control byte, it will drive an 8-bit data

byte on SDIO, changing the state of SDIO on the falling

edge of SCLK. The user acknowledges each data byte

by driving SDIO low for one cycle, on the next falling

edge of SCLK. If a data byte is not acknowledged, the

transaction will end. The user may read up to 16 data

bytes in a single 2-wire transaction. These bytes contain

the response data from the Si473x-D60.

A 2-wire transaction ends with the STOP condition,

which occurs when SDIO rises while SCLK is high.

For details on timing specifications and diagrams, refer

to Table 4, “2-Wire Control Interface Characteristics” on

page 8; Figure 2, “2-Wire Control Interface Read and

Write Timing Parameters,” on page 9, and Figure 3, “2-

Wire Control Interface Read and Write Timing Diagram,”

on page 9.

4.19.2. 3-Wire Control Interface Mode

When selecting 3-wire mode, the user must ensure that

a rising edge of SCLK does not occur within 300 ns

before the rising edge of RST

The 3-wire bus mode uses the SCLK, SDIO, and SEN_

pins. A transaction begins when the user drives SEN

low. Next, the user drives a 9-bit control word on SDIO,

which is captured by the device on rising edges of

SCLK. The control word consists of a 9-bit device

address (A7:A5 = 101b), a read/write bit (read = 1, write

= 0), and a 5-bit register address (A4:A0).

For write operations, the control word is followed by a

16-bit data word, which is captured by the device on

rising edges of SCLK.

For read operations, the control word is followed by a

delay of one-half SCLK cycle for bus turn-around. Next,

the Si473x-D60 will drive the 16-bit read data word

serially on SDIO, changing the state of SDIO on each

rising edge of SCLK.

A transaction ends when the user sets SEN high, then

pulses SCLK high and low one final time. SCLK may

either stop or continue to toggle while SEN is high.

In 3-wire mode, commands are sent by first writing each

argument to register(s) 0xA1–0xA3, then writing the

command word to register 0xA0. A response is

retrieved by reading registers 0xA8–0xAF.

For details on timing specifications and diagrams, refer

to Table 5, “3-Wire Control Interface Characteristics,” on

page 10; Figure 4, “3-Wire Control Interface Write

Table 14. Bus Mode Select on Rising Edge of

RST

Bus Mode GPO1 GPO2

2-Wire 1 0

3-Wire 0 (must drive) 0

Si4730/31/34/35-D60

28 Rev. 1.2

Timing Parameters,” on page 10, and Figure 5, “3-Wire

Control Interface Read Timing Parameters,” on page

10.

4.20. GPO Outputs

The Si473x-D60 provides three general-purpose output

pins. The GPO pins can be configured to output a

constant low, constant high, or high-impedance. The

GPO pins can be reconfigured as specialized functions.

4.21. Firmware Upgrades

The Si473x-D60 contains on-chip program RAM to

accommodate minor changes to the firmware. This

allows Silicon Labs to provide future firmware updates

to optimize the characteristics of new radio designs and

those already deployed in the field.

4.22. Reset, Powerup, and Powerdown

Setting the RST pin low will disable analog and digital

circuitry, reset the registers to their default settings, and

disable the bus. Setting the RST pin high will bring the

device out of reset.

The Si473x-D60 contains an on-board non-volatile

memory for storing its operational firmware. Proper

timing as specified in this data sheet, particularly with

respect to keeping RST pin low during any power

supply transitions, must be honored to avoid the risk of

corrupting the contents of this memory, which can

render the device permanently non-functional.

A powerdown mode is available to reduce power

consumption when the part is idle. Putting the device in

powerdown mode will disable analog and digital circuitry

while keeping the bus active.

4.23. 2 V Operation (SSOP Only)

The Si473x-D60 is capable of operating down to 2 V as

the battery drains in an application. Any power-up or

reset is not guaranteed to work below the DC

characteristics defined in Table 2. This capability

enables a much longer run time in battery operated

devices.

4.24. Programming with Commands

To ease development time and offer maximum

customization, the Si473x-D60 provides a simple yet

powerful software interface to program the receiver. The

device is programmed using commands, arguments,

properties, and responses.

To perform an action, the user writes a command byte

and associated arguments, causing the chip to execute

the given command. Commands control an action such

as powerup the device, shut down the device, or tune to

a station. Arguments are specific to a given command

and are used to modify the command.

Properties are a special command argument used to

modify the default chip operation and are generally

configured immediately after powerup. Examples of

properties are de-emphasis level, RSSI seek threshold,

and soft mute attenuation threshold.

Responses provide the user information and are

echoed after a command and associated arguments are

issued. All commands provide a 1-byte status update,

indicating interrupt and clear-to-send status information.

For a detailed description of the commands and

properties for the Si473x-D60, see “AN332: Si47xx

Programming Guide.”

Si4730/31/34/35-D60

Rev. 1.2 29

5. Pin Descriptions

5.1. Si473x-D60-GM

Pin Number(s) Name Description

1, 20 NC No connect. Leave floating.

2 FMI FM RF inputs. FMI should be connected to the antenna trace.

3 RFGND RF ground. Connect to ground plane on PCB.

4 AMI AM RF input. AMI should be connected to the AM antenna.

5RST Device reset input (active low).

6SEN Serial enable input (active low).

7 SCLK Serial clock input.

8 SDIO Serial data input/output.

9 RCLK External reference oscillator input.

10 VDDigital and I/O supply voltage.

11 VAAnalog supply voltage. May be connected directly to battery.

12, GND PAD GND Ground. Connect to ground plane on PCB.

13 ROUT/[DOUT] Right audio line output for analog output mode.

14 LOUT/[DFS] Left audio line output for analog output mode.

15 DOUT Digital output data for digital output mode.

16 DFS Digital frame synchronization input for digital output mode.

17 GPO3/[DCLK] General purpose output, crystal oscillator, or digital bit synchronous clock input

in digital output mode.

18 GPO2/[INT] General purpose output or interrupt pin.

19 GPO1 General purpose output.

GND

PAD

17181920

67 8 9

GPO2/[INT]

DOUT

LOUT/[DFS]

ROUT/[DOUT]

GNDRST

AMI

RCLK

SDIO

FMI

RFGND

GPO3/[DCLK]

GPO1

DFS

SCLK

SEN

Si4730/31/34/35-D60

30 Rev. 1.2

5.2. Si473x-D60-GU

Pin Number(s) Name Description

1 DOUT Digital output data for digital output mode.

2 DFS Digital frame synchronization input for digital output mode.

3 GPO3/[DCLK] General purpose output, crystal oscillator, or digital bit synchronous clock input

in digital output mode.

4 GPO2/[INT] General purpose output or interrupt pin.

5 GPO1 General purpose output.

6,7 NC No connect. Leave floating.

8 FMI FM RF inputs. FMI should be connected to the antenna trace.

9 RFGND RF ground. Connect to ground plane on PCB.

10,11 NC Unused. Tie these pins to GND.

12 AMI AM/SW/LW RF input.

13,14 GND Ground. Connect to ground plane on PCB.

15 RST Device reset input (active low).

16 SEN Serial enable input (active low).

17 SCLK Serial clock input.

18 SDIO Serial data input/output.

19 RCLK External reference oscillator input.

20 VDDigital and I/O supply voltage.

21 VAAnalog supply voltage. May be connected directly to battery.

22 DBYP Bypass capacitor.

23 ROUT/[DOUT] Right audio line output in analog output mode.

24 LOUT/[DFS] Left audio line output in analog output mode.

LOUT/[DFS]

ROUT/[DOUT]

DBYP

GPO2/[INT]

GPO3/[DCLK]

DOUT

DFS

GPO1

SDIO

RCLK

SEN

FMI

RFGND

SCLK

GND

RST

GND

AMI

Si4730/31/34/35-D60

Rev. 1.2 31

6. Ordering Guide

Part Number1Description Package

Type Operating

Temperature/Voltage

Si4730-D60-GM

AM/FM Broadcast Radio Receiver

QFN

Pb-free –20 to 85 °C

2.7 to 5.5 V

Si4730-D60-GU2SSOP

Pb-free

Si4731-D60-GM

AM/FM Broadcast Radio Receiver with

RDS/RBDS

QFN

Pb-free –20 to 85 °C

2.7 to 5.5 V

Si4731-D60-GU2SSOP

Pb-free

Si4734-D60-GM

AM/FM/SW/LW Broadcast Radio Receiver

QFN

Pb-free –20 to 85 °C

2.7 to 5.5 V

Si4734-D60-GU2SSOP

Pb-free

Si4735-D60-GM

AM/FM/SW/LW Broadcast Radio Receiver

with RDS/RBDS

QFN

Pb-free –20 to 85 °C

2.7 to 5.5 V

Si4735-D60-GU2SSOP

Pb-free

Notes:

1. Add an “(R)” at the end of the device part number to denote tape and reel option.

2. SSOP devices operate down to VA = 2 V at 25 °C.

Si4730/31/34/35-D60

32 Rev. 1.2

7. Package Outline

7.1. Si473x-D60 QFN

Figure 12 illustrates the package details for the Si473x. Table 15 lists the values for the dimensions shown in the

illustration.

Figure 12. 20-Pin Quad Flat No-Lead (QFN)

Table 15. Package Dimensions

Symbol Millimeters Symbol Millimeters

Min Nom Max Min Nom Max

A 0.50 0.55 0.60 f 2.53 BSC

A1 0.00 0.02 0.05 L 0.35 0.40 0.45

b 0.200.250.30 L1 0.00 — 0.10

c 0.27 0.32 0.37 aaa — — 0.05

D 3.00 BSC bbb — — 0.05

D2 1.65 1.70 1.75 ccc — — 0.08

e 0.50 BSC ddd — — 0.10

E 3.00 BSC eee — — 0.10

E2 1.65 1.70 1.75

Notes:

1. All dimensions are shown in millimeters (mm) unless otherwise noted.

2. Dimensioning and tolerancing per ANSI Y14.5M-1994.

Si4730/31/34/35-D60

Rev. 1.2 33

7.2. Si473x-D60 SSOP

Figure 13 illustrates the package details for the Si473x. Table 16 lists the values for the dimensions shown in the

illustration.

Figure 13. 24-Pin SSOP

Table 16. Package Dimensions

Dimension Min Nom Max

A——1.75

A1 0.10 — 0.25

b0.20—0.30

c0.10—0.25

D 8.65 BSC

E 6.00 BSC

E1 3.90 BSC

e 0.635 BSC

L0.40—1.27

L2 0.25 BSC

θ0° — 8°

aaa 0.20

bbb 0.18

ccc 0.10

ddd 0.10

Notes:

1. All dimensions shown are in millimeters (mm) unless otherwise noted.

2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.

3. This drawing conforms to the JEDEC Solid State Outline MO-137, Variation AE.

4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification

for Small Body Components.

Si4730/31/34/35-D60

34 Rev. 1.2

8. PCB Land Pattern

8.1. Si473x-D60 QFN

Figure 14 illustrates the PCB land pattern details for the Si473x-D60-GM QFN. Table 17 lists the values for the

dimensions shown in the illustration.

Figure 14. PCB Land Pattern

Si4730/31/34/35-D60

Rev. 1.2 35

Table 17. PCB Land Pattern Dimensions

Symbol Millimeters Symbol Millimeters

Min Max Min Max

D 2.71 REF GE 2.10 —

D2 1.60 1.80 W — 0.34

e 0.50 BSC X — 0.28

E 2.71 REF Y 0.61 REF

E2 1.60 1.80 ZE — 3.31

f 2.53 BSC ZD — 3.31

GD 2.10 —

Notes: General

1. All dimensions shown are in millimeters (mm) unless otherwise noted.

2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification.

3. This Land Pattern Design is based on IPC-SM-782 guidelines.

4. All dimensions shown are at Maximum Material Condition (MMC). Least Material

Condition (LMC) is calculated based on a Fabrication Allowance of 0.05 mm.

Notes: Solder Mask Design

1. All metal pads are to be non-solder mask defined (NSMD). Clearance between the

solder mask and the metal pad is to be 60 µm minimum, all the way around the pad.

Notes: Stencil Design

1. A stainless steel, laser-cut, and electro-polished stencil with trapezoidal walls should

be used to assure good solder paste release.

2. The stencil thickness should be 0.125 mm (5 mils).

3. The ratio of stencil aperture to land pad size should be 1:1 for the perimeter pads.

4. A 1.45 x 1.45 mm square aperture should be used for the center pad. This provides

approximately 70% solder paste coverage on the pad, which is optimum to assure

correct component stand-off.

Notes: Card Assembly

1. A No-Clean, Type-3 solder paste is recommended.

2. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification

for Small Body Components.

Si4730/31/34/35-D60

36 Rev. 1.2

8.2. Si473x-D60 SSOP

Figure 15 illustrates the PCB land pattern details for the Si473x-D60-GU SSOP. Table 18 lists the values for the

dimensions shown in the illustration.

Figure 15. PCB Land Pattern

Table 18. PCB Land Pattern Dimensions

Dimension Min Max

C5.205.30

E 0.635 BSC

X0.300.40

Y1 1.50 1.60

General:

1. All dimensions shown are in millimeters (mm) unless otherwise noted.

2. This land pattern design is based on the IPC-7351 guidelines.

Solder Mask Design:

3. All metal pads are to be non-solder mask defined (NSMD). Clearance between the

solder mask and the metal pad is to be 60 µm minimum, all the way around the pad.

Stencil Design:

4. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should

be used to assure good solder paste release.

5. The stencil thickness should be 0.125 mm (5 mils).

6. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pads.

Card Assembly:

7. A No-Clean, Type-3 solder paste is recommended.

8. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification

for Small Body Components.



Si4730/31/34/35-D60

Rev. 1.2 37

9. Top Markings

9.1. Si473x-D60 Top Marking (QFN)

9.2. Top Marking Explanation (QFN)

Mark Method: YAG Laser

Line 1 Marking: Part Number 30 = Si4730, 31 = Si4731, 34 = Si4734, 35 = Si4735.

Firmware Revision 60 = Firmware Revision 6.0.

Line 2 Marking: Die Revision D = Revision D Die.

TTT = Internal Code Internal tracking code.

Line 3 Marking: Circle = 0.5 mm Diameter

(Bottom-Left Justified)

Pin 1 Identifier.

Y = Year

WW = Workweek

Assigned by the Assembly House. Corresponds to the last

significant digit of the year and work week of the mold date.

3060

DTTT

YWW

3160

DTTT

YWW

3460

DTTT

YWW

3560

DTTT

YWW

Si4730/31/34/35-D60

38 Rev. 1.2

9.3. Si473x-D60 Top Marking (SSOP)

9.4. Top Marking Explanation (SSOP)

Mark Method: YAG Laser

Line 1 Marking:

Part Number 4730 = Si4730; 4731 = Si4731; 4734 = Si4734;

4735 = Si4735.

Die Revision D = Revision D die.

Firmware Revision 60 = Firmware Revision 6.0.

Package Type GU = 24-pin SSOP Pb-free package

Line 2 Marking: YY = Year

WW = Work week

TTTTTT = Manufacturing code

Assigned by the Assembly House.

473XD60GU

YYWWTTTTTT

Si4730/31/34/35-D60

Rev. 1.2 39

10. Additional Reference Resources

Contact your local sales representatives for more information or to obtain copies of the following references:

EN55020 Compliance Test Certificate

AN332: Si47xx Programming Guide

AN383: Si47xx Antenna, Schematic, Layout, and Design Guidelines

AN388: Si470x/1x/2x/3x/4x Evaluation Board Test Procedure

Si47xx EVB User’s Guide

Customer Support Site: www.silabs.com

This site contains all application notes, evaluation board schematics and layouts, and evaluation software. NDA

is required for complete access. Please visit the Silicon Labs Technical Support web page:

https://www.silabs.com/support/pages/contacttechnicalsupport.aspx and register to submit a technical support

request.

Si4730/31/34/35-D60

40 Rev. 1.2

DOCUMENT CHANGE LIST

Revision 1.0 to Revision 1.1

Updated part number throughout.

Updated pin assignments on front page.

Updated block diagram on front page.

Updated Table 6, “Digital Audio Interface

Characteristics,” on page 11.

Updated Table 10, “Reference Clock and Crystal

Characteristics,” on page 16.

Added Table 11, “Thermal Conditions,” on page 16.

Updated Section "2. Typical Application Schematic"

on page 18.

Updated Section "4. Functional Description" on page

21.

Updated Section "5. Pin Descriptions" on page 29.

Revision 1.1 to Revision 1.2

Deleted the AUXIN feature.

Updated Table 3, “Reset Timing Characteristics.”

Updated Table 11, “Thermal Conditions.”

Updated Section 4.22, “Reset, Powerup, and

Powerdown.”

Si4730/31/34/35-D60

Rev. 1.2 41

NOTES:

Disclaimer

Silicon Laboratories intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers

using or intending to use the Silicon Laboratories products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific

device, and "Typical" parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Laboratories

reserves the right to make changes without further notice and limitation to product information, specifications, and descriptions herein, and does not give warranties as to the accuracy

or completeness of the included information. Silicon Laboratories shall have no liability for the consequences of use of the information supplied herein. This document does not imply

or express copyright licenses granted hereunder to design or fabricate any integrated circuits. The products must not be used within any Life Support System without the specific

written consent of Silicon Laboratories. A "Life Support System" is any product or system intended to support or sustain life and/or health, which, if it fails, can be reasonably expected

to result in significant personal injury or death. Silicon Laboratories products are generally not intended for military applications. Silicon Laboratories products shall under no

circumstances be used in weapons of mass destruction including (but not limited to) nuclear, biological or chemical weapons, or missiles capable of delivering such weapons.

Trademark Information

Silicon Laboratories Inc., Silicon Laboratories, Silicon Labs, SiLabs and the Silicon Labs logo, CMEMS®, EFM, EFM32, EFR, Energy Micro, Energy Micro logo and combinations

thereof, "the world’s most energy friendly microcontrollers", Ember®, EZLink®, EZMac®, EZRadio®, EZRadioPRO®, DSPLL®, ISOmodem ®, Precision32®, ProSLIC®, SiPHY®,

USBXpress® and others are trademarks or registered trademarks of Silicon Laboratories Inc. ARM, CORTEX, Cortex-M3 and THUMB are trademarks or registered trademarks of

ARM Holdings. Keil is a registered trademark of ARM Limited. All other products or brand names mentioned herein are trademarks of their respective holders.

http://www.silabs.com

Silicon Laboratories Inc.

400 West Cesar Chavez

Austin, TX 78701

USA

Smart.

Connected.

Energy-Friendly

Products

www.silabs.com/products Quality

www.silabs.com/quality Support and Community

community.silabs.com