DATA SHEET PHOTOCOUPLER PS8101 1 Mbps HIGH CMR ANALOG OUTPUT TYPE 5-PIN SOP PHOTOCOUPLER -NEPOC Series- DESCRIPTION The PS8101 is an optically coupled isolator containing a GaAlAs LED on the light emitting diode (input side) and a PIN photodiode and a high-speed amplifier transistor on the output side on one chip. This is a plastic SOP (Small Out-line Package) type for high density applications. FEATURES * High common mode transient immunity (CMH, CML = 10 kV/s MIN.) * Small package (5-pin SOP) PIN CONNECTION (Top View) * High supply voltage (VCC = 35 V) * High isolation voltage (BV = 2 500 Vr.m.s.) 5 4 3 * High-speed response (tPHL = 0.8 s MAX., tPLH = 1.2 s MAX.) 1. Anode 2. Cathode 3. GND 4. VO 5. VCC * Ordering number of taping product: PS8101-F3, F4: 2 500 pcs/reel * Pb-Free product * Safety standards * UL approved: File No. E72422 1 2 * DIN EN60747-5-2 (VDE0884 Part2) approved: No. 40008902 (Option) APPLICATIONS * Computer and peripheral manufactures * General purpose inverter * Substitutions for relays and pulse transformers * Power supply The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices representative for availability and additional information. Document No. PN10260EJ02V0DS (2nd edition) Date Published February 2005 CP(K) Printed in Japan The mark shows major revised points. NEC Compound Semiconductor Devices, Ltd. 2003, 2005 PS8101 PACKAGE DIMENSIONS (UNIT: mm) 3.4 +0.3 -0.1 7.00.3 2.60.2 0.15 +0.10 -0.05 4.4 0.50.3 0.10.1 1.27 0.4 +0.10 -0.05 0.25 M MARKING EXAMPLE 8101 N234 No. 1 pin Mark Initial of NEC (Engraved mark) Assembly Lot N *1 N 2 34 Week Assembled Year Assembled (Last 1 Digit) Rank Code *1 2 Bar : Pb-Free Data Sheet PN10260EJ02V0DS PS8101 ORDERING INFORMATION Part Number Order Number Solder Plating Packing Style Safety Standard Application Part Approval Number Specification PS8101 PS8101-A PS8101-F3 PS8101-F3-A PS8101-F4 PS8101-F4-A PS8101-V *2 Pb-Free Magazine case 100 pcs Standard products Embossed Tape 2 500 pcs/reel (UL approved) PS8101-V-A Magazine case 100 pcs DIN EN60747-5-2 PS8101-V-F3 PS8101-V-F3-A Embossed Tape 2 500 pcs/reel (VDE0884 Part2) PS8101-V-F4 PS8101-V-F4-A *1 PS8101 Approved (Option) *1 For the application of the Safety Standard, following part number should be used. *2 With regards to terminal solder (the solder contains lead) plated products (conventionally plated), contact your nearby sales office. ABSOLUTE MAXIMUM RATINGS (TA = 25C, unless otherwise specified) Parameter Symbol Ratings Unit IF 25 mA VR 5.0 V PD 45 mW Supply Voltage VCC 35 V Output Voltage VO 35 V Output Current IO 8.0 mA PC 100 mW BV 2 500 Vr.m.s. Operating Ambient Temperature TA -55 to +100 C Storage Temperature Tstg -55 to +125 C Diode Forward Current Reverse Voltage Power Dissipation Detector Power Dissipation Isolation Voltage *1 *2 *3 *1 Reduced to 0.45 mW/C at TA = 25C or more. *2 Reduced to 1.00 mW/C at TA = 25C or more. *3 AC voltage for 1 minute at TA = 25C, RH = 60 % between input and output. Pins 1-2 shorted together, 3-4 shorted together. Data Sheet PN10260EJ02V0DS 3 PS8101 ELECTRICAL CHARACTERISTICS (TA = 25 C) Parameter Diode Symbol Forward Voltage VF IF = 16 mA Reverse Current IR VR = 3 V Forward Voltage Temperature Coefficient Terminal Capacitance Detector Coupled Conditions VF/T Ct TYP. MAX. Unit 1.7 2.2 V 10 A -2.1 mV/C V = 0 V, f = 1 MHz 30 pF 3 IF = 16 mA High Level Output Current IOH (1) IF = 0 mA, VCC = VO = 5.5 V High Level Output Current IOH (2) IF = 0 mA, VCC = VO = 30 V Low Level Output Voltage VOL IF = 16 mA, VCC = 4.5 V, IO = 1.2 mA 0.1 Low Level Supply Current ICCL IF = 16 mA, VO = open, VCC = 30 V 50 High Level Supply Current ICCH IF = 0 mA, VO = open, VCC = 30 V 0.01 2 CTR IF = 16 mA, VCC = 4.5 V, VO = 0.4 V 20 35 Current Transfer Ratio *1 15 500 nA 100 A 0.4 V A RI-O VI-O = 1 kVDC, RH = 40 to 60% Isolation Capacitance CI-O V = 0 V, f = 1 MHz 0.4 Propagation Delay Time *2 (H L) tPHL IF = 16 mA, VCC = 5 V, RL = 2.2 k, CL = 15 pF 0.5 0.8 Propagation Delay Time *2 (L H) tPLH 0.6 1.2 Common Mode Transient Immunity at *3 High Level Output CMH IF = 0 mA, VCC = 5 V, RL = 4.1 k, VCM = 1.5 kV 10 Common Mode Transient Immunity at *3 Low Level Output CML IF = 16 mA, VCC = 5 V, RL = 4.1 k, VCM = 1.5 kV -10 K : 20 to 35 (%) N : 15 to 35 (%) Data Sheet PN10260EJ02V0DS % 11 Isolation Resistance *1 CTR rank 4 MIN. 10 pF s kV/s PS8101 *2 Test circuit for propagation delay time Pulse input 0.1 F (Pulse width = 100 s, Duty cycle = 1/10) Input (Monitor) VCC = 5 V RL = 2.2 k VO (Monitor) CL = 15 pF Input 50 % 5V Output 1.5 V VOL 47 tPHL tPLH CL is approximately 15 pF which includes probe and stray wiring capacitance *3 Test circuit for common mode transient immunity 1.5 kV VCM 90 % IF 0.1 F VCC = 5 V RL = 4.1 k VO (Monitor) 10 % tr VO (IF = 0 mA) VCM VO (IF = 16 mA) 0V tf 5V 2V 0.8 V VOL USAGE CAUTIONS 1. This product is weak for static electricity by designed with high-speed integrated circuit so protect against static electricity when handling. 2. By-pass capacitor of 0.1 F is used between VCC and GND near device. Also, ensure that the distance between the leads of the photocoupler and capacitor is no more than 10 mm. 3. Avoid storage at a high temperature and high humidity. Data Sheet PN10260EJ02V0DS 5 PS8101 TYPICAL CHARACTERISTICS (TA = 25C, unless otherwise specified) TRANSISTOR POWER DISSIPATION vs. AMBIENT TEMPERATURE DIODE POWER DISSIPATION vs. AMBIENT TEMPERATURE Transistor Power Dissipation PC (mW) 40 30 20 10 25 0 50 75 60 40 20 50 75 100 FORWARD CURRENT vs. FORWARD VOLTAGE HIGH LEVEL OUTPUT CURRENT vs. AMBIENT TEMPERATURE TA = +100C +50C +25C 1 0C -25C 0.1 1.2 1.4 1.6 1.8 2.0 2.2 IF = 0 mA 100 VCC = VO = 30 V VCC = VO = 5.5 V 10 1 0.1 -25 2.4 0 25 50 75 100 Forward Voltage VF (V) Ambient Temperature TA (C) CURRENT TRANSFER RATIO vs. FORWARD CURRENT NORMALIZED CURRENT TRANSFER RATIO vs. AMBIENT TEMPERATURE 80 VCC = 4.5 V, VO = 0.4 V 70 60 50 40 30 20 10 0 0.5 1 5 10 50 1.6 Remark Normalized to 1.0 at TA = 25 C, IF = 16 mA, VCC = 4.5 V, VO = 0.4 V 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 -50 -25 0 25 50 75 Ambient Temperature TA (C) Forward Current IF (mA) 6 25 Ambient Temperature TA (C) High Level Output Current IOH (nA) Forward Current IF (mA) 80 1 000 0.01 1.0 Current Transfer Ratio CTR (%) 100 Ambient Temperature TA (C) 100 10 120 0 100 Normalized Current Transfer Raio CTR Diode Power Dissipation PD (mW) 50 The graphs indicate nominal characteristics. Data Sheet PN10260EJ02V0DS 100 PS8101 OUTPUT VOLTAGE vs. FORWARD CURRENT OUTPUT CURRENT vs. OUTPUT VOLTAGE 6 5 IF = 25 mA 6 20 mA 15 mA 4 10 mA 5 mA 2 0 Propagation Delay Time tPHL, tPLH (s) Output Voltage VO (V) 8 2 4 6 8 4 3 10 12 14 16 0 18 20 5.6 k 2 4 6 8 10 12 14 16 18 20 Output Voltage VO (V) Forward Current IF (mA) PROPAGATION DELAY TIME vs. FORWARD CURRENT PROPAGATION DELAY TIME vs. LOAD RESISTANCE 3.0 VCC = 5 V, RL = 2.2 k 2.0 tPHL 1.0 tPLH 0 5 10 15 20 25 10 VCC = 5 V, IF = 16 mA tPLH 1 tPHL 0.1 1k Forward Current IF (mA) Normalized Propagation Delay Time tPHL, tPLH RL = 2.2 k 2 1 Propagation Delay Time tPHL, tPLH (s) Output Current IO (mA) 10 10 k 100 k Load Resistance RL () NORMALIZED PROPAGATION DELAY TIME vs. AMBIENT TEMPERATURE 5 Normalized to 1.0 at TA = 25C, IF = 16 mA, VCC = 5 V, RL = 2.2 k 4 3 2 tPLH tPHL 1 0 -50 -25 0 25 50 75 100 Ambient Temperature TA (C) Remark The graphs indicate nominal characteristics. Data Sheet PN10260EJ02V0DS 7 PS8101 TAPING SPECIFICATIONS (UNIT: mm) 1.550.1 7.40.1 5.50.1 1.5+0.1 -0 12.00.2 2.00.05 4.00.1 1.750.1 Outline and Dimensions (Tape) 3.45 MAX. 3.00.1 3.90.1 8.00.1 0.30.05 Taping Direction PS8101-F4 PS8101-F3 Outline and Dimensions (Reel) 2.00.5 1001.0 21.00.8 13.00.2 R 1.0 3302.0 2.00.5 13.00.2 13.51.0 17.51.0 Packing: 2 500 pcs/reel 8 Data Sheet PN10260EJ02V0DS 11.9 to 15.4 Outer edge of flange PS8101 NOTES ON HANDLING 1. Recommended soldering conditions (1) Infrared reflow soldering * Peak reflow temperature 260C or below (package surface temperature) * Time of peak reflow temperature 10 seconds or less * Time of temperature higher than 220C 60 seconds or less * Time to preheat temperature from 120 to 180C 12030 s * Number of reflows Three * Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) Package Surface Temperature T (C) Recommended Temperature Profile of Infrared Reflow (heating) to 10 s 260C MAX. 220C to 60 s 180C 120C 12030 s (preheating) Time (s) (2) Wave soldering * Temperature 260C or below (molten solder temperature) * Time 10 seconds or less * Preheating conditions 120C or below (package surface temperature) * Number of times One (Allowed to be dipped in solder including plastic mold portion.) * Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) (3) Soldering by Soldering Iron * Peak Temperature (lead part temperature) 350C or below * Time (each pins) 3 seconds or less * Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) (a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead (b) Please be sure that the temperature of the package would not be heated over 100C Data Sheet PN10260EJ02V0DS 9 PS8101 (4) Cautions * Fluxes Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent. 2. Cautions regarding noise Be aware that when voltage is applied suddenly between the photocoupler's input and output or between collector-emitters at startup, the output transistor may enter the on state, even if the voltage is within the absolute maximum ratings. USAGE CAUTIONS 1. Protect against static electricity when handling. 2. Avoid storage at a high temperature and high humidity. 10 Data Sheet PN10260EJ02V0DS PS8101 When the product(s) listed in this document is subject to any applicable import or export control laws and regulation of the authority having competent jurisdiction, such product(s) shall not be imported or exported without obtaining the import or export license. * The information in this document is current as of February, 2005. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. * No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document. * NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC or others. * Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. * While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. * NEC semiconductor products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. The recommended applications of a semiconductor product depend on its quality grade, as indicated below. Customers must check the quality grade of each semiconductor product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness to support a given application. (Note) (1) "NEC" as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd. and also includes its majority-owned subsidiaries. (2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for NEC (as defined above). M8E 00. 4 - 0110 Data Sheet PN10260EJ02V0DS 11 PS8101 Caution GaAs Products This product uses gallium arsenide (GaAs). GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. * Follow related laws and ordinances when disposing of the product. If there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. Commission a disposal company able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. Exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to special control) up until final disposal. * Do not burn, destroy, cut, crush, or chemically dissolve the product. * Do not lick the product or in any way allow it to enter the mouth. For further information, please contact NEC Compound Semiconductor Devices, Ltd. http://www.ncsd.necel.com/ E-mail: salesinfo@ml.ncsd.necel.com (sales and general) techinfo@ml.ncsd.necel.com (technical) Sales Division TEL: +81-44-435-1588 FAX: +81-44-435-1579 NEC Compound Semiconductor Devices Hong Kong Limited E-mail: ncsd-hk@elhk.nec.com.hk (sales, technical and general) FAX: +852-3107-7309 TEL: +852-3107-7303 Hong Kong Head Office TEL: +886-2-8712-0478 FAX: +886-2-2545-3859 Taipei Branch Office FAX: +82-2-558-5209 TEL: +82-2-558-2120 Korea Branch Office NEC Electronics (Europe) GmbH http://www.ee.nec.de/ TEL: +49-211-6503-0 FAX: +49-211-6503-1327 California Eastern Laboratories, Inc. http://www.cel.com/ TEL: +1-408-988-3500 FAX: +1-408-988-0279 0406