74LVT245PW,118 - NXP Semiconductors / Philips Semiconductors

1. General description

The 74LVT245 is a high-performance BiCMOS product designed for VCC operation at

3.3 V.

This device is an octal transceiver featuring non-inverting 3-state bus compatible outputs

in both send and receive directions. The control function implementation minimizes

external timing requirements. It features an output enable (OE) input for easy cascading

and a direction (DIR) input for direction control.

2. Features

n3-state buffers

nOctal bidirectional bus interface

nInput and output interface capability to systems at 5 V supply

nTTL input and output switching levels

nOutput capability: +64 mA/−32 mA

nLatch-up protection exceeds 500 mA per JESD78 class II level A

nESD protection:

uHBM JESD22-A114E exceeds 2000 V

uMM JESD22-A115-A exceeds 200 V

nBus-hold data inputs eliminate the need for external pull-up resistors for unused inputs

nLive insertion/extraction permitted

nPower-up 3-state

nNo bus current loading when output is tied to 5 V bus

3. Ordering information

74LVT245

3.3 V octal transceiver with direction pin (3-state)

Rev. 03 — 8 May 2008 Product data sheet

Table 1. Ordering information

Type number Package

Temperature range Name Description Version

74LVT245D −40 °Cto+85°C SO20 plastic small outline package; 20 leads;

body width 7.5 mm SOT163-1

74LVT245DB −40 °Cto+85°C SSOP20 plastic shrink small outline package; 20 leads;

body width 5.3 mm SOT339-1

74LVT245PW −40 °Cto+85°C TSSOP20 plastic thin shrink small outline package; 20 leads;

body width 4.4 mm SOT360-1

74LVT245BQ −40 °Cto+85°C DHVQFN20 plastic dual in-line compatible thermal enhanced very

thin quad ﬂat package; no leads; 20 terminals;

body 2.5 ×4.5 ×0.85 mm

SOT764-1

Product data sheet Rev. 03 — 8 May 2008 2 of 15

NXP Semiconductors 74LVT245

3.3 V octal transceiver with direction pin (3-state)

4. Functional diagram

Fig 1. Logic diagram Fig 2. IEC logic symbol

1DIR

mna174

173

119

3EN1

3EN2

mna175

Product data sheet Rev. 03 — 8 May 2008 3 of 15

NXP Semiconductors 74LVT245

3.3 V octal transceiver with direction pin (3-state)

5. Pinning information

5.1 Pinning

5.2 Pin description

(1) The die substrate is attached to this pad using a

conductive die attach material. It can not be used as a

supply pin or input.

Fig 3. Pin conﬁguration for SO20 and (T)SSOP20 Fig 4. Pin conﬁguration for DHVQFN20

74LVT245

DIR VCC

A0 OE

A1 B0

A2 B1

A3 B2

A4 B3

A5 B4

A6 B5

A7 B6

GND B7

001aah721

001aah722

74LVT245

GND(1)

Transparent top view

A5 B4

A4 B3

A3 B2

A2 B1

A1 B0

A0 OE

GND

DIR

VCC

912

8 13

7 14

6 15

5 16

4 17

3 18

2 19

terminal 1

index area

Table 2. Pin description

Symbol Pin Description

DIR 1 direction control

A0 to A7 2, 3, 4, 5, 6, 7, 8, 9 data input/output

GND 10 ground (0 V)

B0 to B7 18, 17, 16, 15, 14, 13, 12, 11 data input/output

OE 19 output enable input (active LOW)

VCC 20 supply voltage

Product data sheet Rev. 03 — 8 May 2008 4 of 15

NXP Semiconductors 74LVT245

3.3 V octal transceiver with direction pin (3-state)

6. Functional description

[1] H = HIGH voltage level;

L = LOW voltage level;

X = don’t care;

Z = high impedance OFF-state.

7. Limiting values

[1] Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the

device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to

absolute-maximum-rated conditions for extended periods may affect device reliability.

[2] The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction

temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150 °C.

[3] The input and output negative voltage ratings may be exceeded if the input and output clamp current ratings are observed.

[4] For SO20 packages: above 70 °C derate linearly with 8 mW/K.

For SSOP20 and TSSOP20 packages: above 60 °C derate linearly with 5.5 mW/K.

For DHVQFN20 packages: above 60 °C derate linearly with 4.5 mW/K.

8. Recommended operating conditions

Table 3. Function selection

Inputs Inputs/outputs

OE DIR An Bn

L L An = Bn inputs

L H inputs Bn = An

HXZZ

Table 4. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).

[1][2]

Symbol Parameter Conditions Min Max Unit

VCC supply voltage −0.5 +4.6 V

VIinput voltage [3] −0.5 7.0 V

VOoutput voltage output in OFF or HIGH state [3] −0.5 +7 V

IIK input clamping current VI < 0 V −50 - mA

IOK output clamping current VO < 0 V −50 - mA

IOoutput current output in LOW state - 128 mA

output in HIGH state −64 - mA

Tstg storage temperature −65 +150 °C

Tjjunction temperature - +150 °C

Ptot total power dissipation Tamb = −40 °C to +85 °C[4] - 500 mW

Table 5. Recommended operating conditions

Symbol Parameter Conditions Min Max Unit

VCC supply voltage 2.7 3.6 V

VIinput voltage 0 5.5 V

IOH HIGH-level output current - −32 mA

Product data sheet Rev. 03 — 8 May 2008 5 of 15

NXP Semiconductors 74LVT245

3.3 V octal transceiver with direction pin (3-state)

9. Static characteristics

IOL LOW-level output current - 32 mA

current duty cycle ≤ 50 %; fi≥1 kHz - 64 mA

Tamb ambient temperature in free air −40 +85 °C

∆t/∆V input transition rise and fall rate output enabled - 10 ns/V

Table 5. Recommended operating conditions

…continued

Symbol Parameter Conditions Min Max Unit

Table 6. Static characteristics

At recommended operating conditions. Voltages are referenced to GND (ground = 0 V).

Symbol Parameter Conditions −40 °C to +85 °C Unit

Min Typ[1] Max

VIK input clamping voltage VCC = 2.7 V; IIK = –18 mA −1.2 −0.9 - V

VIH HIGH-level input voltage 2.0 - - V

VIL LOW-level input voltage - - 0.8

VOH HIGH-level output voltage VCC = 2.7 V to 3.6 V; IOH =−100 µAV

CC − 0.2 VCC − 0.1 - V

VCC = 2.7 V; IOH =−8 mA 2.4 2.5 -

VCC = 3.0 V; IOH =−32 mA 2.0 2.2 - V

VOL LOW-level output voltage VCC = 2.7 V; IOL = 100 µA 0.1 0.2 V

VCC = 2.7 V; IOL = 24 mA - 0.3 0.5 V

VCC = 3.0 V; IOL = 16 mA - 0.25 0.4 V

VCC = 3.0 V; IOL = 32 mA - 0.3 0.5 V

VCC = 3.0 V; IOL = 64 mA - 0.4 0.55 V

IIinput leakage current control pins

VCC = 0 V or 3.6 V; VI= 5.5 V - 1 10 µA

VCC = 3.6 V; VI=V

CC or GND - ±0.1 ±1µA

I/O data pins [2]

VCC = 3.6 V; VI= 5.5 V - 1 20 µA

VCC = 3.6 V; VI=V

CC - 0.1 1 µA

VCC = 3.6 V; VI=0V −5−1-µA

IOFF power-off leakage current VCC = 0 V; VIor VO= 0 V to 4.5 V - 1 ±100 µA

ILO output leakage current VO = 5.5 V; VCC = 3.6 V; output HIGH - 60 125 µA

IO(pu/pd) power-up/power-down

output current VCC ≤1.2 V VO = 0.5 V to VCC;

VI= GND or VCC; OE = don’t care [3] -15±100 µA

IBHL bus hold LOW current VCC = 3.0 V; VI= 0.8 V 75 150 - µA

IBHH bus hold HIGH current VCC = 3.0 V; VI= 2.0 V −150 −75 - µA

IBHLO bus hold LOW

overdrive current VCC = 0 V to 3.0 V; VI= 3.6 V [4] 500 - - µA

IBHHO bus hold HIGH

overdrive current VCC = 0 V to 3.0 V; VI= 3.6 V [4] --−500 µA

Product data sheet Rev. 03 — 8 May 2008 6 of 15

NXP Semiconductors 74LVT245

3.3 V octal transceiver with direction pin (3-state)

[1] All typical values are measured at VCC = 3.3 V (unless stated otherwise) and Tamb =25°C.

[2] Unused pins at VCC or GND.

[3] This parameter is valid for any VCC between 0 V and 1.2 V with a transition time of up to 10 ms. From VCC =1.2VtoV

CC = 3.3 V ±0.3 V

a transition time of 100 ms is permitted. This parameter is valid for Tamb = +25 °C only.

[4] This is the bus hold overdrive current required to force the input to the opposite logic state.

[5] This is the increase in supply current for each input at the speciﬁed voltage level other than VCC or GND.

10. Dynamic characteristics

ICC supply current VCC = 3.6 V; VI=V

CC or GND; IO=0A

outputs HIGH - 0.13 0.19 mA

outputs LOW - 3 12 mA

outputs disabled - 0.13 0.19 mA

∆ICC additional supply current per input pin; VCC = 3.0 V to 3.6 V;

one input = VCC −0.6 V;

other inputs at VCC or GND

[5] - 0.1 0.2 mA

CIinput capacitance DIR and OE inputs; outputs disabled;

VI= 0 Vor 3.0 V -4-pF

CI/O input/output capacitance at input/outputdatapins,outputsdisabled;

VI/O = 0 Vor 3.0 V -10-pF

Table 6. Static characteristics

…continued

At recommended operating conditions. Voltages are referenced to GND (ground = 0 V).

Symbol Parameter Conditions −40 °C to +85 °C Unit

Min Typ[1] Max

Table 7. Dynamic characteristics

Voltages are referenced to GND (ground = 0 V). For test circuit see Figure 7.

Symbol Parameter Conditions −40 °C to +85 °C Unit

Min Typ[1] Max

tPLH LOW to HIGH propagation delay An to Bn or Bn to An

VCC = 2.7 V - - 4.7 ns

VCC = 3.3 V ± 0.3 V 1.0 2.4 4.0 ns

tPHL HIGH to LOW propagation delay An to Bn or Bn to An

VCC = 2.7 V - - 4.6 ns

VCC = 3.3 V ± 0.3 V 1.0 2.4 4.0 ns

tPZH OFF-state to HIGH propagation delay see Figure 6

VCC = 2.7 V - - 7.1 ns

VCC = 3.3 V ± 0.3 V 1.1 3.3 5.5 ns

tPZL OFF-state to LOW propagation delay see Figure 6

VCC = 2.7 V - - 6.5 ns

VCC = 3.3 V ± 0.3 V 1.1 3.3 5.5 ns

tPHZ HIGH to OFF-state propagation delay see Figure 6

VCC = 2.7 V - - 6.5 ns

VCC = 3.3 V ± 0.3 V 2.2 3.6 5.9 ns

Product data sheet Rev. 03 — 8 May 2008 7 of 15

NXP Semiconductors 74LVT245

3.3 V octal transceiver with direction pin (3-state)

[1] Typical values are measured at Tamb =25°C and VCC = 3.3 V.

11. Waveforms

tPLZ LOW to OFF-state propagation delay see Figure 6

VCC = 2.7 V - - 4.8 ns

VCC = 3.3 V ± 0.3 V 2.0 3.4 4.8 ns

Table 7. Dynamic characteristics

…continued

Voltages are referenced to GND (ground = 0 V). For test circuit see Figure 7.

Symbol Parameter Conditions −40 °C to +85 °C Unit

Min Typ[1] Max

See Table 8 for measurement points

VOL and VOH are typical output voltage levels that occur with the output load.

Fig 5. Input (An, Bn) to output (Bn, An) propagation delays and output transition times

001aah732

VMVM

An, Bn input

GND

VOH

Bn, An output

VOL

tPHL tPLH

See Table 8 for measurement points

VOL and VOH are typical output voltage levels that occur with the output load.

Fig 6. 3-state output enable and disable times

001aah733

outputs

enabled outputs

enabled

outputs

disabled

GND

3.0 V

VOL

VOH

GND

output

HIGH-to-OFF

OFF-to-HIGH

output

LOW-to-OFF

OFF-to-LOW

tPZH

tPHZ

tPZL

tPLZ

OE input

Product data sheet Rev. 03 — 8 May 2008 8 of 15

NXP Semiconductors 74LVT245

3.3 V octal transceiver with direction pin (3-state)

Table 8. Measurement points

VCC Input Output

VIVMVMVXVY

2.7 V to 3.6 V GND to 2.7 V 1.5 V 1.5 V VOL + 0.3 V VOH − 0.3 V

Test data is given in Table 9.

Deﬁnitions test circuit:

RL = Load resistance.

CL = Load capacitance including jig and probe capacitance.

RT = Termination resistance should be equal to output impedance Zo of the pulse generator.

VEXT = External voltage for measuring switching times.

Fig 7. Test circuit for switching times

VEXT

VCC

VIVO

001aae235

DUT

PULSE

GENERATOR

VMVM

10 %

90 %

0 V

negative

pulse

positive

pulse

0 V

VMVM

90 %

10 %

Table 9. Test data

Input Load VEXT

VIfitWtr, tfRLCLtPHZ, tPZH tPLZ, tPZL tPLH, tPHL

2.7 V ≤10 MHz 500 ns ≤2.5 ns 500 Ω50 pF GND 6 V open

Product data sheet Rev. 03 — 8 May 2008 9 of 15

NXP Semiconductors 74LVT245

3.3 V octal transceiver with direction pin (3-state)

12. Package outline

Fig 8. Package outline SOT163-1 (SO20)

UNIT A

max. A1A2A3bpcD

(1) E(1) (1)

ELL

pQZ

ywv θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

inches

2.65 0.3

0.1 2.45

2.25 0.49

0.36 0.32

0.23 13.0

12.6 7.6

7.4 1.27 10.65

10.00 1.1

1.0 0.9

0.4 8

0.25 0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

1.1

0.4

SOT163-1

detail X

0.25

075E04 MS-013

pin 1 index

0.1 0.012

0.004 0.096

0.089 0.019

0.014 0.013

0.009 0.51

0.49 0.30

0.29 0.05

1.4

0.055

0.419

0.394 0.043

0.039 0.035

0.016

0.01

0.25

0.01 0.004

0.043

0.016

0.01

0 5 10 mm

scale

vMA

(A )

SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1

99-12-27

03-02-19

Product data sheet Rev. 03 — 8 May 2008 10 of 15

NXP Semiconductors 74LVT245

3.3 V octal transceiver with direction pin (3-state)

Fig 9. Package outline SOT339-1 (SSOP20)

UNIT A1A2A3bpcD

(1) E(1) eH

ELL

pQ(1)

Zywv θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

mm 0.21

0.05 1.80

1.65 0.38

0.25 0.20

0.09 7.4

7.0 5.4

5.2 0.65 7.9

7.6 0.9

0.7 0.9

0.5 8

0.131.25 0.2 0.1

DIMENSIONS (mm are the original dimensions)

Note

1. Plastic or metal protrusions of 0.2 mm maximum per side are not included.

1.03

0.63

SOT339-1 MO-150 99-12-27

03-02-19

detail X

vMA

(A )

110

20 11

0.25

pin 1 index

0 2.5 5 mm

scale

SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mm SOT339-1

max.

Product data sheet Rev. 03 — 8 May 2008 11 of 15

NXP Semiconductors 74LVT245

3.3 V octal transceiver with direction pin (3-state)

Fig 10. Package outline SOT360-1 (TSSOP20)

UNIT A1A2A3bpcD

(1) E(2) (1)

ELL

pQZywv θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

mm 0.15

0.05 0.95

0.80 0.30

0.19 0.2

0.1 6.6

6.4 4.5

4.3 0.65 6.6

6.2 0.4

0.3 0.5

0.2 8

0.13 0.10.21

DIMENSIONS (mm are the original dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.

0.75

0.50

SOT360-1 MO-153 99-12-27

03-02-19

0.25

110

20 11

pin 1 index

detail X

(A )

vMA

0 2.5 5 mm

scale

TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm SOT360-1

max.

1.1

Product data sheet Rev. 03 — 8 May 2008 12 of 15

NXP Semiconductors 74LVT245

3.3 V octal transceiver with direction pin (3-state)

Fig 11. Package outline SOT764-1 (DHVQFN20)

terminal 1

index area

0.51

A1Eh

UNIT ye

0.2

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

mm 4.6

4.4

3.15

2.85

2.6

2.4 1.15

0.85

3.5

0.30

0.18

0.05

0.00 0.05 0.1

DIMENSIONS (mm are the original dimensions)

SOT764-1 MO-241 - - -- - -

0.5

0.3

0.1

0.05

0 2.5 5 mm

scale

SOT764-1

DHVQFN20: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads;

20 terminals; body 2.5 x 4.5 x 0.85 mm

A(1)

max.

AA1c

detail X

y1C

19 12

terminal 1

index area

E(1)

Note

1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.

D(1)

02-10-17

03-01-27

Product data sheet Rev. 03 — 8 May 2008 13 of 15

NXP Semiconductors 74LVT245

3.3 V octal transceiver with direction pin (3-state)

13. Abbreviations

14. Revision history

Table 10. Abbreviations

Acronym Description

BiCMOS Bipolar Complementary Metal Oxide Semiconductor

DUT Device Under Test

ESD ElectroStatic Discharge

HBM Human Body Model

MM Machine Model

TTL Transistor-Transistor Logic

Table 11. Revision history

Document ID Release date Data sheet status Change notice Supersedes

74LVT245_3 20080508 Product data sheet ECN07_046 74LVT245_2

Modiﬁcations: •The format of this data sheet has been redesigned to comply with the new identity guidelines of

NXP Semiconductors.

•Legal texts have been adapted to the new company name where appropriate.

•Section 3 “Ordering information” and Section 12 “Package outline” DHVQFN20 package added.

74LVT245_2 19980219 Product speciﬁcation - 74LVT245_1

74LVT245_1 19940520 Product speciﬁcation - -

Product data sheet Rev. 03 — 8 May 2008 14 of 15

NXP Semiconductors 74LVT245

3.3 V octal transceiver with direction pin (3-state)

15. Legal information

15.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Deﬁnitions”.

[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

15.2 Deﬁnitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modiﬁcations or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liability for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and title. A short data sheet is intended

for quick reference only and should not be relied upon to contain detailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

ofﬁce. In case of any inconsistency or conﬂict with the short data sheet, the

full data sheet shall prevail.

15.3 Disclaimers

General — Information in this document is believed to be accurate and

reliable. However, NXP Semiconductors does not give any representations or

warranties, expressed or implied, as to the accuracy or completeness of such

information and shall have no liability for the consequences of use of such

information.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation speciﬁcations and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior

to the publication hereof.

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suitable for use in medical, military, aircraft,

space or life support equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in personal injury, death or severe property or environmental

damage. NXP Semiconductors accepts no liability for inclusion and/or use of

NXP Semiconductors products in such equipment or applications and

therefore such inclusion and/or use is at the customer’s own risk.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

speciﬁed use without further testing or modiﬁcation.

Limiting values — Stress above one or more limiting values (as deﬁned in

the Absolute Maximum Ratings System of IEC 60134) may cause permanent

damage to the device. Limiting values are stress ratings only and operation of

the device at these or any other conditions above those given in the

Characteristics sections of this document is not implied. Exposure to limiting

values for extended periods may affect device reliability.

Terms and conditions of sale — NXP Semiconductors products are sold

subject to the general terms and conditions of commercial sale, as published

at http://www.nxp.com/proﬁle/terms, including those pertaining to warranty,

intellectual property rights infringement and limitation of liability, unless

explicitly otherwise agreed to in writing by NXP Semiconductors. In case of

any inconsistency or conﬂict between information in this document and such

terms and conditions, the latter will prevail.

No offer to sell or license — Nothing in this document may be interpreted

or construed as an offer to sell products that is open for acceptance or the

grant, conveyance or implication of any license under any copyrights, patents

or other industrial or intellectual property rights.

15.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks

are the property of their respective owners.

16. Contact information

For more information, please visit: http://www.nxp.com

For sales ofﬁce addresses, please send an email to: salesaddresses@nxp.com

Document status[1][2] Product status[3] Deﬁnition

Objective [short] data sheet Development This document contains data from the objective speciﬁcation for product development.

Preliminary [short] data sheet Qualiﬁcation This document contains data from the preliminary speciﬁcation.

Product [short] data sheet Production This document contains the product speciﬁcation.

NXP Semiconductors 74LVT245

3.3 V octal transceiver with direction pin (3-state)

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 8 May 2008

Document identifier: 74LVT245_3

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

17. Contents

1 General description. . . . . . . . . . . . . . . . . . . . . . 1

2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

3 Ordering information. . . . . . . . . . . . . . . . . . . . . 1

4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2

5 Pinning information. . . . . . . . . . . . . . . . . . . . . . 3

5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3

6 Functional description . . . . . . . . . . . . . . . . . . . 4

7 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4

8 Recommended operating conditions. . . . . . . . 4

9 Static characteristics. . . . . . . . . . . . . . . . . . . . . 5

10 Dynamic characteristics . . . . . . . . . . . . . . . . . . 6

11 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9

13 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 13

14 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 13

15 Legal information. . . . . . . . . . . . . . . . . . . . . . . 14

15.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 14

15.2 Deﬁnitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

15.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 14

15.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 14

16 Contact information. . . . . . . . . . . . . . . . . . . . . 14

17 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15