LTC3412A 3A, 4MHz, Monolithic Synchronous Step-Down Regulator DESCRIPTION FEATURES n n n n n n n n n n n n n n High Efficiency: Up to 95% 3A Output Current Low Quiescent Current: 64A Low RDS(ON) Internal Switch: 77m 2.25V to 5.5V Input Voltage Range Programmable Frequency: 300kHz to 4MHz 2% Output Voltage Accuracy 0.8V Reference Allows Low Output Voltage Selectable Forced Continuous/Burst Mode(R) Operation with Adjustable Burst Clamp Synchronizable Switching Frequency Low Dropout Operation: 100% Duty Cycle Power Good Output Voltage Monitor Overtemperature Protected Available in 16-Lead Exposed Pad TSSOP and QFN Packages APPLICATIONS n n n n Point-of-Load Regulation Notebook Computers Portable Instruments Distributed Power Systems The LTC(R)3412A is a high efficiency monolithic synchronous, step-down DC/DC converter utilizing a constant frequency, current mode architecture. It operates from an input voltage range of 2.25V to 5.5V and provides a regulated output voltage from 0.8V to 5V while delivering up to 3A of output current. The internal synchronous power switch with 77m on-resistance increases efficiency and eliminates the need for an external Schottky diode. Switching frequency is set by an external resistor or can be synchronized to an external clock. 100% duty cycle provides low dropout operation extending battery life in portable systems. OPTI-LOOP(R) compensation allows the transient response to be optimized over a wide range of loads and output capacitors. The LTC3412A can be configured for either Burst Mode operation or forced continuous operation. Forced continuous operation reduces noise and RF interference while Burst Mode operation provides high efficiency by reducing gate charge losses at light loads. In Burst Mode operation, external control of the burst clamp level allows the output voltage ripple to be adjusted according to the application requirements. L, LT, LTC, LTM, Burst Mode, OPTI-LOOP, Linear Technology and the Linear logo are registered trademarks and ThinSOT is a trademark of Analog Devices, Inc. All other trademarks are the property of their respective owners. Protected by U.S. Patents including 5481178, 6580258, 6304066, 6127815, 6498466, 6611131, 6724174. TYPICAL APPLICATION 22F VIN 3.3V Efficiency and Power Loss 100 PVIN SVIN PGND ITH SGND VFB SYNC/MODE VOUT 2.5V AT 3A COUT 100F x2 820pF 115k 69.8k 10000 90 0.47H SW RUN/SS 100000 EFFICIENCY 85 75 100 70 65 60 392k 1000 80 POWER LOSS POWER LOSS (mW) 12.1k 1000pF PGOOD LTC3412A 294k EFFICIENCY (%) RT 2.2M 95 10 55 3412A F01a 50 0.01 Figure 1. 2.5V/3A Step-Down Regulator 0.1 1 LOAD CURRENT (A) 1 10 3412A F01b 3412aff For more information www.linear.com/LTC3412A 1 LTC3412A ABSOLUTE MAXIMUM RATINGS (Note 1) Input Supply Voltage..................................... -0.3V to 6V ITH, RUN/SS, VFB, PGOOD, SYNC/MODE Voltages.....................................-0.3 to VIN SW Voltages...................................-0.3V to (VIN + 0.3V) Operating Junction Temperature Range (Notes 2, 5) E-, I-Grades........................................- 40C to 125C MP-Grade...........................................- 55C to 125C Storage Temperature Range.....................-65C to150C Lead Temperature (Soldering, 10 sec)................... 300C PIN CONFIGURATION 13 PGND 12 PGND SGND 2 4 RT 5 SYNC/MODE 6 RUN/SS 7 10 SW SGND 8 9 17 PVIN TAPE AND REEL 11 SVIN 17 10 PVIN SW 4 FE PACKAGE 16-LEAD PLASTIC TSSOP TJMAX = 125C, JA = 38C/W, JC = 10C/W EXPOSED PAD (PIN 17) IS SGND, MUST BE SOLDERED TO PCB LEAD FREE FINISH 12 PGOOD PVIN 3 11 SW ORDER INFORMATION ITH 16 15 14 13 RUN/SS 1 VFB VFB 14 SW 9 5 6 7 8 SW 3 PGND 15 SW ITH SYNC/MODE 16 PVIN 2 SW 1 PGND SVIN PGOOD RT TOP VIEW TOP VIEW SW UF PACKAGE 16-LEAD (4mm x 4mm) PLASTIC QFN TJMAX = 125C, JA = 37C/W, JC = 5C/W EXPOSED PAD (PIN 17) IS GND, MUST BE CONNECTED TO PCB http://www.linear.com/product/LTC3412A#orderinfo PART MARKING* PACKAGE DESCRIPTION TEMPERATURE RANGE LTC3412AEFE#PBF LTC3412AEFE#TRPBF 3412AEFE 16-Lead Plastic TSSOP -40C to 125C LTC3412AIFE#PBF LTC3412AIFE#TRPBF 3412AIFE 16-Lead Plastic TSSOP -40C to 125C LTC3412AEUF#PBF LTC3412AEUF#TRPBF 3412A 16-Lead (4mm x 4mm) Plastic QFN -40C to 125C LTC3412AIUF#PBF LTC3412AIUF#TRPBF 3412A 16-Lead (4mm x 4mm) Plastic QFN -40C to 125C LEAD BASED FINISH TAPE AND REEL PART MARKING* PACKAGE DESCRIPTION TEMPERATURE RANGE LTC3412AEFE LTC3412AEFE#TR 3412AEFE 16-Lead Plastic TSSOP -40C to 125C LTC3412AIFE LTC3412AIFE#TR 3412AIFE 16-Lead Plastic TSSOP -40C to 125C LTC3412AMPFE LTC3412AMPFE#TR 3412AMPFE 16-Lead Plastic TSSOP -55C to 125C LTC3412AEUF LTC3412AEUF#TR 3412A 16-Lead (4mm x 4mm) Plastic QFN -40C to 125C LTC3412AIUF LTC3412AIUF#TR 3412A 16-Lead (4mm x 4mm) Plastic QFN -40C to 125C Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container. For more information on lead free part marking, go to: http://www.linear.com/leadfree/ For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/. Some packages are available in 500 unit reels through designated sales channels with #TRMPBF suffix. 2 3412aff For more information www.linear.com/LTC3412A LTC3412A ELECTRICAL CHARACTERISTICS The l denotes the specifications which apply over the full operating junction temperature range, otherwise specifications are at TA TJ = 25C. VIN = 3.3V unless otherwise specified. SYMBOL PARAMETER SVIN Signal Input Voltage Range VFB Regulated Feedback Voltage CONDITIONS MIN TYP 2.25 (Note 3) E-, I-Grades MP-Grade l l 0.784 0.780 MAX UNITS 5.5 V 0.800 0.800 0.816 0.816 V V 0.1 0.2 A IFB Voltage Feedback Leakage Current VFB Reference Voltage Line Regulation VIN = 2.7V to 5.5V (Note 3) l 0.04 0.2 %V VLOADREG Output Voltage Load Regulation Measured in Servo Loop, VITH = 0.36V Measured in Servo Loop, VITH = 0.84V l l 0.02 -0.02 0.2 -0.2 % % VPGOOD Power Good Range 7.5 9 % RPGOOD Power Good Pull-Down Resistance 120 200 IQ Input DC Bias Current Active Current Sleep Shutdown (Note 4) VFB = 0.78V, VITH = 1V VFB = 1V, VITH = 0V VRUN = 0V, VMODE = 0V 250 64 0.02 330 80 1 A A A fOSC Switching Frequency Switching Frequency Range ROSC = 294k (Note 6) 0.88 0.3 1 1.1 4 MHz MHz fSYNC SYNC Capture Range (Note 6) 0.3 4 MHz RPFET RDS(ON) of P-Channel FET ISW = 1A (Note 7) 77 110 m RNFET RDS(ON) of N-Channel FET ISW = -1A (Note 7) 65 90 m ILIMIT Peak Current Limit VUVLO Undervoltage Lockout Threshold ILSW SW Leakage Current VRUN RUN Threshold IRUN RUN/SS Leakage Current 4.5 1.75 VRUN = 0V, VIN = 5.5V 0.5 Note 1: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to any Absolute Maximum Rating condition for extended periods may affect device reliability and lifetime. Note 2: The LTC3412AE is guaranteed to meet performance specifications from 0C to 85C. Specifications over the - 40C to 125C operating junction temperature range are assured by design, characterization and correlation with statistical process controls. The LTC3412AI is guaranteed to meet performance specifications over the -40C to 125C operating junction temperature range. The LTC3412AMP is guaranteed and tested to meet performance specifications over the full -55C to 125C operating junction temperature range. Note that the maximum ambient temperature consistent with these specifications is determined by specific operating conditions in conjunction with board layout, the rated package thermal resistance and other environmental factors. 6 A 2 2.25 V 0.1 1 A 0.65 0.8 V 1 A Note 3: The LTC3412A is tested in a feedback loop that adjusts VFB to achieve a specified error amplifier output voltage (ITH). Note 4: Dynamic supply current is higher due to the internal gate charge being delivered at the switching frequency. Note 5: TJ is calculated from the ambient temperature TA and power dissipation as follows: LTC3412AFE: TJ = TA + PD (38C/W) LTC3412AUF: TJ = TA + PD (34C/W) Note 6: 4MHz operation is guaranteed by design and not production tested. Note 7: Switch on resistance is guaranteed by design and test condition in the UF package and by final test correlation in the FE package. 3412aff For more information www.linear.com/LTC3412A 3 LTC3412A TYPICAL PERFORMANCE CHARACTERISTICS Efficiency vs Load Current, Burst Mode Operation Efficiency vs Load Current 100 90 Burst Mode 80 OPERATION 95 70 85 50 40 30 0 0.01 75 70 65 50 0.01 FIGURE 4 CIRCUIT 95 1A EFFICIENCY (%) EFFICIENCY (%) 0.1A 86 3A 3.5 4.0 INPUT VOLTAGE (V) 4.5 5.0 93 0.47H 91 90 10 3412A GO3 0 FIGURE 4 CIRCUIT VIN = 3.3V -0.1 -0.2 -0.3 -0.4 -0.5 0 0.5 1.0 1.5 2.0 2.5 3.0 FREQUENCY (MHz) 3.5 4.0 -0.6 0 0.5 1.0 1.5 2.0 LOAD CURRENT (A) 3412A GO5 Burst Mode Operation 2.5 3.0 3412A GO6 Load Step Transient Burst Mode Operation Output Voltage Ripple BURST MODE 20mV/DIV VOUT 20mV/DIV 0.1 1 LOAD CURRENT (A) Load Regulation 92 87 VOUT = 2.5V FIGURE 4 CIRCUIT 0.22H 3412A GO4 VOUT 100mV/DIV PULSE SKIPPING 20mV/DIV INDUCTOR CURRENT 1A/DIV FORCED CONTINUOUS 20mV/DIV FIGURE 4 CIRCUIT 5s/DIV 3412A GO7 4 30 3412A GO2 88 3.0 40 0 0.01 10 89 82 80 2.5 50 10 FIGURE 4 CIRCUIT VIN = 3.3V 1H 94 90 84 60 Efficiency vs Frequency 96 92 88 0.1 1 LOAD CURRENT (A) 3412A GO1 Efficiency vs Input Voltage 94 VIN = 5V 70 20 VOUT = 2.5V FIGURE 4 CIRCUIT 55 10 0.1 1 LOAD CURRENT (A) 80 60 VIN = 3.3V VOUT = 2.5V FIGURE 4 CIRCUIT 10 80 VIN = 5V VOUT/VOUT (%) 20 VIN = 3.3V 90 EFFICIENCY (%) FORCED CONTINUOUS 60 100 VIN = 3.3V 90 EFFICIENCY (%) EFFICIENCY (%) 100 Efficiency vs Load Current, Forced Continuous Operation INDUCTOR CURRENT 2A/DIV VIN = 3.3V 5s/DIV VOUT = 2.5V FIGURE 4 CIRCUIT 3412A GO8 VIN = 3.3V 40s/DIV VOUT = 2.5V F = 1MHz LOAD STEP = 50mA TO 2A FIGURE 4 CIRCUIT 3412A GO9 3412aff For more information www.linear.com/LTC3412A LTC3412A TYPICAL PERFORMANCE CHARACTERISTICS Load Step Transient Forced Continuous Start-Up Transient VREF vs Temperature 0.7975 VOUT 100mV/DIV VIN = 3.3V 0.7970 VOUT 2V/DIV 0.7965 VREF (V) 0.7960 RUN/SS 2V/DIV INDUCTOR CURRENT 2A/DIV 0.7955 0.7950 0.7945 INDUCTOR CURRENT 2A/DIV 0.7940 0.7935 40s/DIV VIN = 3.3V VOUT =2.5V f = 1MHz LOAD STEP = 0A TO 3A FIGURE 4 CIRCUIT 3412A G10 Switch On-Resistance vs Input Voltage 120 PFET 80 75 70 NFET 65 60 80 NFET 40 20 55 50 2.5 3.0 4.0 4.5 3.5 INPUT VOLTAGE (V) 0 20 40 60 80 TEMPERATURE (C) Frequency vs ROSC VIN = 3.3V 3500 3000 2500 2000 1500 1000 15 10 40 140 240 340 440 540 640 740 840 940 ROSC (k) 3412A G16 NFET 2.5 3.0 4.0 4.5 3.5 INPUT VOLTAGE (V) 5.5 Frequency vs Temperature VIN = 3.3V 1015 ROSC = 294k ROSC = 294k 1010 1040 1030 1020 1010 990 2.5 5.0 1020 1005 1000 995 990 985 980 1000 500 PFET 20 3412A G15 1050 FREQUENCY (kHz) FREQUENCY (kHz) 25 Frequency vs Input Voltage 1060 4000 0 30 3412A G14 FREQUENCY (kHz) 4500 35 0 100 120 3412A G13 5000 40 5 0 -40 -20 5.0 115 45 PFET 60 95 50 SWITCH LEAKAGE CURRENT (nA) ON-RESISTANCE (m) 85 15 35 55 75 TEMPERATURE (C) Switch Leakage Current vs Input Voltage 100 90 -5 3412A G12 VIN = 3.3V 95 -45 -25 3412A G11 Switch On-Resistance vs Temperature 100 ON-RESISTANCE (m) 0.7930 1ms/DIV VIN = 3.3V VOUT =2.5V LOAD STEP = 2A FIGURE 4 CIRCUIT 975 3.0 4.0 4.5 3.5 INPUT VOLTAGE (V) 5.0 5.5 3412A G17 970 -40 -20 0 20 40 60 80 TEMPERATURE (C) 100 120 3412A G18 3412aff For more information www.linear.com/LTC3412A 5 LTC3412A TYPICAL PERFORMANCE CHARACTERISTICS Quiescent Current vs Input Voltage Quiescent Current vs Temperature 350 350 VIN = 3.3V 300 ACTIVE QUIESCENT CURRENT (A) QUIESCENT CURRENT (A) 300 250 200 150 100 SLEEP 50 ACTIVE 250 200 150 100 SLEEP 50 0 2.5 3.0 3.5 4.0 4.5 INPUT VOLTAGE (V) 5.0 0 -40 -20 5.5 0 20 40 60 80 3412A G20 3412A G19 Peak Current vs Input Voltage 4000 8.0 3500 7.5 PEAK INDUCTOR CURRENT (A) MAXIMUM PEAK INDUCTOR CURRENT (mA) Minimum Peak Inductor Current vs Burst Clamp Voltage 3000 2500 2000 1500 1000 500 0 0.1 7.0 6.5 6.0 5.5 5.0 4.5 0.2 0.3 0.4 0.5 0.6 0.7 VBURST (V) 4.0 2.25 2.75 3412A G21 6 100 120 TEMPERATURE (C) 3.25 3.75 4.25 INPUT VOLTAGE (V) 4.75 3412A G22 3412aff For more information www.linear.com/LTC3412A LTC3412A PIN FUNCTIONS (FE/UHF) SVIN (Pin 1/Pin 11): Signal Input Supply. Decouple this pin to SGND with a capacitor. PGOOD (Pin 2/Pin 12): Power Good Output. Open-drain logic output that is pulled to ground when the output voltage is not within 7.5% of regulation point. ITH (Pin 3/Pin 13): Error Amplifier Compensation Point. The current comparator threshold increases with this control voltage. Nominal voltage range for this pin is from 0.2V to 1.4V with 0.4V corresponding to the zero-sense voltage (zero current). VFB (Pin 4/Pin 14): Feedback Pin. Receives the feedback voltage from a resistive divider connected across the output. RT (Pin 5/Pin 15): Oscillator Resistor Input. Connecting a resistor to ground from this pin sets the switching frequency. SYNC/MODE (Pin 6/Pin 16): Mode Select and External Clock Synchronization Input. To select forced continuous, tie to SVIN. Connecting this pin to a voltage between 0V and 1V selects Burst Mode operation with the burst clamp set to the pin voltage. RUN/SS (Pin 7/Pin 1): Run Control and Soft-Start Input. Forcing this pin below 0.5V shuts down the LTC3412A. In shutdown all functions are disabled drawing <1A of supply current. A capacitor to ground from this pin sets the ramp time to full output current. SGND (Pin 8/Pin 2): Signal Ground. All small-signal components, compensation components and the exposed pad on the bottom side of the IC should connect to this ground, which in turn connects to PGND at one point. PVIN (Pins 9, 16/Pins 3, 10): Power Input Supply. Decouple this pin to PGND with a capacitor. SW (Pins 10, 11, 14, 15/Pins 4, 5, 8, 9): Switch Node Connection to the Inductor. This pin connects to the drains of the internal main and synchronous power MOSFET switches. PGND (Pins 12, 13/Pins 6, 7): Power Ground. Connect this pin close to the (-) terminal of CIN and COUT . Exposed Pad (Pin 17/Pin 17): Signal Ground. Must be soldered to PCB for electrical connection and rated thermal performance. 3412aff For more information www.linear.com/LTC3412A 7 LTC3412A FUNCTIONAL BLOCK DIAGRAM SVIN SGND ITH 1 8 3 PVIN 9 SLOPE COMPENSATION RECOVERY VOLTAGE REFERENCE 0.8V PMOS CURRENT COMPARATOR + BCLAMP + - - VFB 4 0.74V + - RUN/SS 7 RUN 0.86V ERROR AMPLIFIER SYNC/MODE + - + 16 - P-CH BURST COMPARATOR 10 SLOPE COMPENSATION OSCILLATOR 11 14 SW 15 + N-CH LOGIC - + PGOOD 2 NMOS CURRENT COMPARATOR REVERSE CURRENT COMPARATOR 5 6 RT SYNC/MODE - - + 12 13 PGND 3412 FBD OPERATION Main Control Loop The LTC3412A is a monolithic, constant-frequency, current mode step-down DC/DC converter. During normal operation, the internal top power switch (P-channel MOSFET) is turned on at the beginning of each clock cycle. Current in the inductor increases until the current comparator trips and turns off the top power MOSFET. The peak inductor current at which the current comparator shuts off the top power switch is controlled by the voltage on the ITH pin. The error amplifier adjusts the voltage on the ITH pin by 8 comparing the feedback signal from a resistor divider on the VFB pin with an internal 0.8V reference. When the load current increases, it causes a reduction in the feedback voltage relative to the reference. The error amplifier raises the ITH voltage until the average inductor current matches the new load current. When the top power MOSFET shuts off, the synchronous power switch (N-channel MOSFET) turns on until either the bottom current limit is reached or the beginning of the next clock cycle. The bottom current limit is set at -1.3A for forced continuous mode and 0A for Burst Mode operation. 3412aff For more information www.linear.com/LTC3412A LTC3412A OPERATION The operating frequency is externally set by an external resistor connected between the RT pin and ground. The practical switching frequency can range from 300kHz to 4MHz. Overvoltage and undervoltage comparators will pull the PGOOD output low if the output voltage comes out of regulation by 7.5%. In an overvoltage condition, the top power MOSFET is turned off and the bottom power MOSFET is switched on until either the overvoltage condition clears or the bottom MOSFET's current limit is reached. Pulse-skipping operation is implemented by connecting the SYNC/MODE pin to ground. This forces the burst clamp level to be at 0V. As the load current decreases, the peak inductor current will be determined by the voltage on the ITH pin until the ITH voltage drops below 400mV. At this point, the peak inductor current is determined by the minimum on-time of the current comparator. If the load demand is less than the average of the minimum on-time inductor current, switching cycles will be skipped to keep the output voltage in regulation. Frequency Synchronization Forced Continuous Mode Connecting the SYNC/MODE pin to SVIN will disable Burst Mode operation and force continuous current operation. At light loads, forced continuous mode operation is less efficient than Burst Mode operation, but may be desirable in some applications where it is necessary to keep switching harmonics out of a signal band. The output voltage ripple is minimized in this mode. Burst Mode Operation Connecting the SYNC/MODE pin to a voltage in the range of 0V to 1V enables Burst Mode operation. In Burst Mode operation, the internal power MOSFETs operate intermittently at light loads. This increases efficiency by minimizing switching losses. During Burst Mode operation, the minimum peak inductor current is externally set by the voltage on the SYNC/MODE pin and the voltage on the ITH pin is monitored by the burst comparator to determine when sleep mode is enabled and disabled. When the average inductor current is greater than the load current, the voltage on the ITH pin drops. As the ITH voltage falls below 150mV, the burst comparator trips and enables sleep mode. During sleep mode, the top power MOSFET is held off and the ITH pin is disconnected from the output of the error amplifier. The majority of the internal circuitry is also turned off to reduce the quiescent current to 64A while the load current is solely supplied by the output capacitor. When the output voltage drops, the ITH pin is reconnected to the output of the error amplifier and the top power MOSFET along with all the internal circuitry is switched back on. This process repeats at a rate that is dependent on the load demand. The internal oscillator of the LTC3412A can be synchronized to an external clock connected to the SYNC/MODE pin. The frequency of the external clock can be in the range of 300kHz to 4MHz. For this application, the oscillator timing resistor should be chosen to correspond to a frequency that is 25% lower than the synchronization frequency. During synchronization, the burst clamp is set to 0V, and each switching cycle begins at the falling edge of the clock signal. Dropout Operation When the input supply voltage decreases toward the output voltage, the duty cycle increases toward the maximum on-time. Further reduction of the supply voltage forces the main switch to remain on for more than one cycle eventually reaching 100% duty cycle. The output voltage will then be determined by the input voltage minus the voltage drop across the internal P-channel MOSFET and the inductor. Low Supply Operation The LTC3412A is designed to operate down to an input supply voltage of 2.25V. One important consideration at low input supply voltages is that the RDS(ON) of the P-channel and N-channel power switches increases. The user should calculate the power dissipation when the LTC3412A is used at 100% duty cycle with low input voltages to ensure that thermal limits are not exceeded. 3412aff For more information www.linear.com/LTC3412A 9 LTC3412A APPLICATIONS INFORMATION Slope Compensation and Inductor Peak Current Slope compensation provides stability in constant frequency architectures by preventing subharmonic oscillations at duty cycles greater than 50%. It is accomplished internally by adding a compensating ramp to the inductor current signal at duty cycles in excess of 40%. Normally, the maximum inductor peak current is reduced when slope compensation is added. In the LTC3412A, however, slope compensation recovery is implemented to keep the maximum inductor peak current constant throughout the range of duty cycles. This keeps the maximum output current relatively constant regardless of duty cycle. Short-Circuit Protection When the output is shorted to ground, the inductor current decays very slowly during a single switching cycle. To prevent current runaway from occurring, a secondary current limit is imposed on the inductor current. If the inductor valley current increases larger than 4.4A, the top power MOSFET will be held off and switching cycles will be skipped until the inductor current is reduced. The basic LTC3412A application circuit is shown in Figure 1. External component selection is determined by the maximum load current and begins with the selection of the operating frequency and inductor value followed by CIN and COUT. Operating Frequency Selection of the operating frequency is a trade-off between efficiency and component size. High frequency operation allows the use of smaller inductor and capacitor values. Operation at lower frequencies improves efficiency by reducing internal gate charge losses but requires larger inductance values and/or capacitance to maintain low output ripple voltage. The operating frequency of the LTC3412A is determined by an external resistor that is connected between pin RT and ground. The value of the resistor sets the ramp current that is used to charge and discharge an internal timing capacitor within the oscillator and can be calculated by using the following equation: 3.08 * 1011 ROSC = () - 10k f 10 Although frequencies as high as 4MHz are possible, the minimum on-time of the LTC3412A imposes a minimum limit on the operating duty cycle. The minimum on-time is typically 110ns; therefore, the minimum duty cycle is equal to 100 * 110ns * f(Hz). Inductor Selection For a given input and output voltage, the inductor value and operating frequency determine the ripple current. The ripple current IL increases with higher VIN or VOUT and decreases with higher inductance. V V IL = OUT 1- OUT VIN fL Having a lower ripple current reduces the core losses in the inductor, the ESR losses in the output capacitors, and the output voltage ripple. Highest efficiency operation is achieved at low frequency with small ripple current. This, however, requires a large inductor. A reasonable starting point for selecting the ripple current is IL = 0.4(IMAX). The largest ripple current occurs at the highest VIN. To guarantee that the ripple current stays below a specified maximum, the inductor value should be chosen according to the following equation: V VOUT OUT L= 1- fIL(MAX) VIN(MAX) The inductor value will also have an effect on Burst Mode operation. The transition to low current operation begins when the peak inductor current falls below a level set by the burst clamp. Lower inductor values result in higher ripple current which causes this to occur at lower load currents. This causes a dip in efficiency in the upper range of low current operation. In Burst Mode operation, lower inductance values will cause the burst frequency to increase. Inductor Core Selection Once the value for L is known, the type of inductor must be selected. Actual core loss is independent of core size for a fixed inductor value, but it is very dependent on the inductance selected. As the inductance increases, core losses decrease. Unfortunately, increased inductance requires more turns of wire and therefore copper losses will increase. 3412aff For more information www.linear.com/LTC3412A LTC3412A APPLICATIONS INFORMATION Ferrite designs have very low core losses and are preferred at high switching frequencies, so design goals can concentrate on copper loss and preventing saturation. Ferrite core material saturates "hard," which means that inductance collapses abruptly when the peak design current is exceeded. This results in an abrupt increase in inductor ripple current and consequent output voltage ripple. Do not allow the core to saturate! Different core materials and shapes will change the size/current and price/current relationship of an inductor. Toroid or shielded pot cores in ferrite or permalloy materials are small and don't radiate much energy, but generally cost more than powdered iron core inductors with similar characteristics. The choice of which style inductor to use mainly depends on the price verus size requirements and any radiated field/EMI requirements. New designs for surface mount inductors are available from Coiltronics, Coilcraft, Toko and Sumida. CIN and COUT Selection The input capacitance, CIN, is needed to filter the trapezoidal wave current at the source of the top MOSFET. To prevent large voltage transients from occurring, a low ESR input capacitor sized for the maximum RMS current should be used. The maximum RMS current is given by: IRMS =IOUT(MAX) VOUT VIN VIN -1 VOUT capacitance that is necessary to ensure that the control loop is stable. Loop stability can be checked by viewing the load transient response as described in a later section. The output ripple, VOUT, is determined by: 1 VOUT IL ESR + 8fCOUT The output ripple is highest at maximum input voltage since IL increases with input voltage. Multiple capacitors placed in parallel may be needed to meet the ESR and RMS current handling requirements. Dry tantalum, special polymer, aluminum electrolytic, and ceramic capacitors are all available in surface mount packages. Special polymer capacitors offer very low ESR but have lower capacitance density than other types. Tantalum capacitors have the highest capacitance density but it is important to only use types that have been surge tested for use in switching power supplies. Aluminum electrolytic capacitors have significantly higher ESR, but can be used in cost-sensitive applications provided that consideration is given to ripple current ratings and long-term reliability. Ceramic capacitors have excellent low ESR characteristics but can have a high voltage coefficient and audible piezoelectric effects. The high Q of ceramic capacitors with trace inductance can also lead to significant ringing. Using Ceramic Input and Output Capacitors This formula has a maximum at VIN = 2VOUT, where IRMS = IOUT/2. This simple worst-case condition is commonly used for design because even significant deviations do not offer much relief. Note that ripple current ratings from capacitor manufacturers are often based on only 2000 hours of life which makes it advisable to further derate the capacitor, or choose a capacitor rated at a higher temperature than required. Several capacitors may also be paralleled to meet size or height requirements in the design. For low input voltage applications, sufficient bulk input capacitance is needed to minimize transient effects during output load changes. The selection of COUT is determined by the effective series resistance (ESR) that is required to minimize voltage ripple and load step transients as well as the amount of bulk Higher values, lower cost ceramic capacitors are now becoming available in smaller case sizes. Their high ripple current, high voltage rating and low ESR make them ideal for switching regulator applications. However, care must be taken when these capacitors are used at the input and output. When a ceramic capacitor is used at the input and the power is supplied by a wall adapter through long wires, a load step at the output can induce ringing at the input, VIN. At best, this ringing can couple to the output and be mistaken as loop instability. At worst, a sudden inrush of current through the long wires can potentially cause a voltage spike at VIN large enough to damage the part. When choosing the input and output ceramic capacitors, choose the X5R or X7R dielectric formulations. These dielectrics have the best temperature and voltage characteristics of all the ceramics for a given value and size. 3412aff For more information www.linear.com/LTC3412A 11 LTC3412A APPLICATIONS INFORMATION Output Voltage Programming The output voltage is set by an external resistive divider according to the following equation: R2 VOUT = 0.8V 1+ R1 The resistive divider allows pin VFB to sense a fraction of the output voltage as shown in Figure 2. VOUT R2 VFB LTC3412A R1 SGND Pulse skipping, which is a compromise between low output voltage ripple and efficiency, can be implemented by connecting pin SYNC/MODEto ground. This sets IBURST to 0A. In this condition, the peak inductor current is limited by the minimum on-time of the current comparator. The lowest output voltage ripple is achieved while still operating discontinuously. During very light output loads, pulse skipping allows only a few switching cycles to be skipped while maintaining the output voltage in regulation. Frequency Synchronization 3412A F02 Figure 2. Setting the Output Voltage Burst Clamp Programming If the voltage on the SYNC/MODE pin is less than VIN by 1V, Burst Mode operation is enabled. During Burst Mode Operation, the voltage on the SYNC/MODE pin determines the burst clamp level, which sets the minimum peak inductor current, IBURST. To select the burst clamp level, use the graph of Minimum Peak Inductor Current vs Burst Clamp Voltage in the Typical Performance Characteristics section. VBURST is the voltage on the SYNC/MODE pin. IBURST can only be programmed in the range of 0A to 6A. For values of VBURST greater than 1V, IBURST is set at 6A. For values of VBURST less than 0.4V, IBURST is set at 0A. As the output load current drops, the peak inductor currents decrease to keep the output voltage in regulation. When the output load current demands a peak inductor current that is less than IBURST, the burst clamp will force the peak inductor current to remain equal to IBURST regardless of further reductions in the load current. Since the average inductor current is greater than the output load current, the voltage on the ITH pin will decrease. When the ITH voltage drops to 150mV, sleep mode is enabled in which both power MOSFETs are shut off along with most of the circuitry to minimize power consumption. All circuitry is turned back on and the power MOSFETs begin switching again when the output voltage drops out of regulation. 12 The value for IBURST is determined by the desired amount of output voltage ripple. As the value of IBURST increases, the sleep period between pulses and the output voltage ripple increase. The burst clamp voltage, VBURST, can be set by a resistor divider from the VFB pin to the SGND pin as shown in Figure 1. The LTC3412A's internal oscillator can be synchronized to an external clock signal. During synchronization, the top MOSFET turn-on is locked to the falling edge of the external frequency source. The synchronization frequency range is 300kHz to 4MHz. Synchronization only occurs if the external frequency is greater than the frequency set by the external resistor. Because slope compensation is generated by the oscillator's RC circuit, the external frequency should be set 25% higher than the frequency set by the external resistor to ensure that adequate slope compensation is present. Soft-Start The RUN/SS pin provides a means to shut down the LTC3412A as well as a timer for soft-start. Pulling the RUN/SS pin below 0.5V places the LTC3412A in a low quiescent current shutdown state (IQ < 1A). The LTC3412A contains an internal soft-start clamp that gradually raises the clamp on ITH after the RUN/SS pin is pulled above 2V. The full current range becomes available on ITH after 1024 switching cycles. If a longer soft-start period is desired, the clamp on ITH can be set externally with a resistor and capacitor on the RUN/SS pin as shown in Figure 1. The soft-start duration can be calculated by using the following formula: VIN (SECONDS) t SS = RSS CSS ln VIN - 1.8V 3412aff For more information www.linear.com/LTC3412A LTC3412A APPLICATIONS INFORMATION Efficiency Considerations The efficiency of a switching regulator is equal to the output power divided by the input power times 100%. It is often useful to analyze individual losses to determine what is limiting the efficiency and which change would produce the most improvement. Efficiency can be expressed as: Efficiency = 100% - (L1 + L2 + L3 + ...) where L1, L2, etc. are the individual losses as a percentage of input power. Although all dissipative elements in the circuit produce losses, two main sources usually account for most of the losses: VIN quiescent current and I2R losses. The VIN quiescent current loss dominates the efficiency loss at very low load currents whereas the I2R loss dominates the efficiency loss at medium to high load currents. In a typical efficiency plot, the efficiency curve at very low load currents can be misleading since the actual power lost is of no consequence. 1. The VIN quiescent current is due to two components: the DC bias current as given in the electrical characteristics and the internal main switch and synchronous switch gate charge currents. The gate charge current results from switching the gate capacitance of the internal power MOSFET switches. Each time the gate is switched from high to low to high again, a packet of charge dQ moves from VIN to ground. The resulting dQ/dt is the current out of VIN that is typically larger than the DC bias current. In continuous mode, IGATECHG = f(QT + QB) where QT and QB are the gate charges of the internal top and bottom switches. Both the DC bias and gate charge losses are proportional to VIN; thus, their effects will be more pronounced at higher supply voltages. 2. I2R losses are calculated from the resistances of the internal switches, RSW, and external inductor RL. In continuous mode the average output current flowing through inductor L is "chopped" between the main switch and the synchronous switch. Thus, the series resistance looking into the SW pin is a function of both top and bottom MOSFET RDS(ON) and the duty cycle (DC) as follows: RSW = (RDS(ON)TOP)(DC) + (RDS(ON)BOT)(1 - DC) The RDS(ON) for both the top and bottom MOSFETs can be obtained from the Typical Performance Characteristics curves. To obtain I2R losses, simply add RSW to RL and multiply the result by the square of the average output current. Other losses including CIN and COUT ESR dissipative losses and inductor core losses generally account for less than 2% of the total loss. Thermal Considerations In most applications, the LTC3412A does not dissipate much heat due to its high efficiency. However, in applications where the LTC3412A is running at high ambient temperature with low supply voltage and high duty cycles, such as in dropout, the heat dissipated may exceed the maximum junction temperature of the part. If the junction temperature reaches approximately 150C, both power switches will be turned off and the SW node will become high impedance. To avoid the LTC3412A from exceeding the maximum junction temperature, the user will need to do some thermal analysis. The goal of the thermal analysis is to determine whether the power dissipated exceeds the maximum junction temperature of the part. The temperature rise is given by: tr = (PD)(JA) where PD is the power dissipated by the regulator and JA is the thermal resistance from the junction of the die to the ambient temperature. For the 16-lead exposed TSSOP package, the JA is 38C/W. For the 16-lead QFN package the JA is 34C/W. The junction temperature, TJ, is given by: TJ = TA + tr where TA is the ambient temperature. Note that at higher supply voltages, the junction temperature is lower due to reduced switch resistance (RDS(ON)). To maximize the thermal performance of the LTC3412A, the Exposed Pad should be soldered to a ground plane. Checking Transient Response The regulator loop response can be checked by looking at the load transient response. Switching regulators take several cycles to respond to a step in load current. 3412aff For more information www.linear.com/LTC3412A 13 LTC3412A APPLICATIONS INFORMATION When a load step occurs, VOUT immediately shifts by an amount equal to ILOAD(ESR), where ESR is the effective series resistance of COUT. ILOAD also begins to charge or discharge COUT generating a feedback error signal used by the regulator to return VOUT to its steady-state value. During this recovery time, VOUT can be monitored for overshoot or ringing that would indicate a stability problem. The ITH pin external components and output capacitor shown in Figure 1 will provide adequate compensation for most applications. Decoupling the PVIN and SVIN pins with two 22F capacitors is adequate for most applications. The burst clamp and output voltage can now be programmed by choosing the values of R1, R2 and R3. The voltage on pin MODE will be set to 0.50V by the resistor divider consisting of R2 and R3. According to the graph of Minimum Peak Inductor Current vs Burst Clamp Voltage in the Typical Performance Characteristics section, a burst clamp voltage of 0.5V will set the minimum inductor current, IBURST, to approximately 1.1A. Design Example If we set the sum of R2 and R3 to 185k, then the following equations can be solved: As a design example, consider using the LTC3412A in an application with the following specifications: VIN = 3.3V, VOUT = 2.5V, IOUT(MAX) = 3A, IOUT(MIN) = 100mA, f = 1MHz. Because efficiency is important at both high and low load current, Burst Mode operation will be utilized. First, calculate the timing resistor: ROSC = 3.08 * 1011 1* 106 - 10k = 298k Use a standard value of 294k. Next, calculate the inductor value for about 40% ripple current at maximum VIN: 2.5V 2.5V L= 1- = 0.51H (1MHz)(1.2A) 3.3V Using a 0.47H inductor results in a maximum ripple current of: 2.5V 2.5V 1- IL = = 1.29A (1MHz)(0.47H) 3.3V COUT will be selected based on the ESR that is required to satisfy the output voltage ripple requirement and the bulk capacitance needed for loop stability. For this design, two 100F ceramic capacitors will be used. CIN should be sized for a maximum current rating of: 2.5V IRMS = (3A) 3.3V 14 3.3V - 1= 1.29ARMS 2.5V R2 + R3 = 185k R2 0.8V 1+ = R3 0.50V The two equations shown above result in the following values for R2 and R3: R2 = 69.8k , R3 = 115k. The value of R1 can now be determined by solving the following equation. 2.5V R1 = 1+ 185k 0.8V R1 = 392k A value of 392k will be selected for R1. Figure 4 shows the complete schematic for this design example. PC Board Layout Checklist When laying out the printed circuit board, the following checklist should be used to ensure proper operation of the LTC3412A. Check the following in your layout: 1. A ground plane is recommended. If a ground plane layer is not used, the signal and power grounds should be segregated with all small signal components returning to the SGND pin at one point which is then connected to the PGND pin close to the LTC3412A. 2. Connect the (+) terminal of the input capacitor(s), CIN, as close as possible to the PVIN pin. This capacitor provides the AC current into the internal power MOSFETs. 3412aff For more information www.linear.com/LTC3412A LTC3412A APPLICATIONS INFORMATION 3. Keep the switching node, SW, away from all sensitive small-signal nodes. 5. Connect the VFB pin directly to the feedback resistors. The resistor divider must be connected between VOUT and SGND. 4. Flood all unused areas on all layers with copper. Flooding with copper will reduce the temperature rise of power components. You can connect the copper areas to any DC net (PVIN, SVIN, VOUT, PGND, SGND, or any other DC rail in your system). Top Bottom Figure 3. LTC3412A Layout Diagram VIN 3.3V CFF 22pF X5R CIN3** 100F R1 392k 1 PGOOD RPG 100k CITH 330pF X7R RITH 17.4k 2 3 CC 47pF 4 R3 115k RSS 2.2M SVIN PVIN PGOOD ITH VFB SW CIN1 22F 15 14 SW LTC3412A 13 EFE PGND R2 69.8k 5 ROSC 294k 6 SYNC/MODE RT 7 RUN CSS 1000pF X7R 8 SGND 16 PGND SW SW PVIN L1* 0.47H VOUT 2.5V 3A 12 11 COUT** 100F x2 10 9 CIN2 22F X5R 6.3V *VISHAY IHLP-2525CZ-01 **TDK 4532X5R0J107M GND 3412 F04 Figure 4. 3.3V to 2.5V, 3A Regulator at 1MHz, Burst Mode Operation 3412aff For more information www.linear.com/LTC3412A 15 LTC3412A TYPICAL APPLICATIONS 1.2V, 3A, 1.5MHz 1mm Height Regulator Using All Ceramic Capacitors VIN 3.3V C1 22pF X5R R1 95.3k 11 RPG 100k PGOOD CITH 1000pF X7R RITH 6.34k 12 13 CC 22pF 14 RSS 2.2M R2 187k 15 ROSC 196k 16 1 CSS 1000pF X7R 2 SVIN PVIN PGOOD SW ITH SW VFB 10 CIN1 10F X5R 6.3V 9 8 LTC3412A 7 EUF PGND PGND RT SYNC/MODE SW RUN SW SGND PVIN L1* 0.47H VOUT 1.2V 3A 6 5 COUT** 22F X3 4 3 CIN2 10F X5R 6.3V GND 3412 TA01 *COOPER SD10-R47 **TAIYO YUDEN AMK212BJ226MD-B 1.8V, 3A Step-Down Regulator at 1MHz, Burst Mode Operation R1 232k 1 PGOOD CITH 820pF X7R RITH 15k RPG 100k 2 3 C2 47pF 4 R3 115k RSS 2.2M VIN 2.5V C1 47pF X5R CIN3** 100F R2 69.8k 5 ROSC 294k 6 7 CSS 1000pF X7R 8 SVIN PVIN PGOOD ITH VFB SW 16 15 CIN1 22F X5R 6.3V 14 SW LTC3412A 13 EFE PGND RT SYNC/MODE PGND SW RUN SW SGND PVIN L1 0.47H* VOUT 1.8V 3A 12 11 COUT** 100F x3 10 9 CIN2 22F X5R 6.3V 3412 TA02 GND *VISHAY IHLP-2525CZ-01 **TDK C4532X5R0J107M 16 3412aff For more information www.linear.com/LTC3412A LTC3412A TYPICAL APPLICATIONS 3.3V, 3A Step-Down Regulator at 2MHz, Forced Continuous Mode Operation CIN3** 100F C1 22pF X5R VIN 5V R1 634k 1 PGOOD RPG 100k CITH 820pF X7R RITH 7.5k 2 3 CC 47pF PVIN PGOOD SW ITH SW VFB R2 200k 5 ROSC 137k 6 7 16 CIN1 22F X5R 6.3V 15 14 LTC3412A 13 EFE PGND 4 CSS 1000pF X7R 8 RSS 2.2M SVIN PGND RT SYNC/MODE SW RUN SW SGND PVIN L1* 0.47H VOUT 3.3V 3A 12 11 COUT** 100F x2 10 9 CIN2 22F X5R 6.3V GND 3412 TA03 *VISHAY IHLP-2525CZ-01 **TDK C4532X5R0J107M 2.5V, 3A Step-Down Regulator Synchronized to 1.8MHz VIN 3.3V C1 22pF X5R R1 392k 1 PGOOD CITH 220pF X7R RPG 100k 2 RITH 6.49k 3 SVIN PGOOD SW ITH SW CC 22pF 4 R2 162k 5 ROSC 182k RSS 2.2M PVIN VFB 16 CIN1 22F X5R 6.3V 15 14 LTC3412A 13 EFE PGND RT 1.8MHz 6 SYNC/MODE EXT CLOCK 7 RUN CSS 1000pF X7R 8 SGND PGND SW SW PVIN L1* 0.47H VOUT 1.5V 3A 12 11 + 10 COUT** 150F 9 CIN2 22F X5R 6.3V *COOPER SD20-R47 **SANYO POSCAP 4TPE150MAZB GND 3412 TA04 3412aff For more information www.linear.com/LTC3412A 17 LTC3412A PACKAGE DESCRIPTION Please refer to http://www.linear.com/product/LTC3412A#packaging for the most recent package drawings. FE Package 16-Lead Plastic TSSOP (4.4mm) (Reference LTC DWG # 05-08-1663 Rev L) Exposed Pad Variation BA 4.90 - 5.10* (.193 - .201) 2.74 (.108) 2.74 (.108) 16 1514 13 12 1110 6.60 0.10 9 2.74 (.108) 4.50 0.10 2.74 6.40 (.108) (.252) BSC SEE NOTE 4 0.45 0.05 1.05 0.10 0.65 BSC 1 2 3 4 5 6 7 8 RECOMMENDED SOLDER PAD LAYOUT 4.30 - 4.50* (.169 - .177) 0.09 - 0.20 (.0035 - .0079) 0.25 REF 1.10 (.0433) MAX 0 - 8 0.65 (.0256) BSC 0.50 - 0.75 (.020 - .030) NOTE: 1. CONTROLLING DIMENSION: MILLIMETERS MILLIMETERS 2. DIMENSIONS ARE IN (INCHES) 3. DRAWING NOT TO SCALE 0.195 - 0.30 (.0077 - .0118) TYP 0.05 - 0.15 (.002 - .006) FE16 (BA) TSSOP REV L 0117 4. RECOMMENDED MINIMUM PCB METAL SIZE FOR EXPOSED PAD ATTACHMENT *DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH SHALL NOT EXCEED 0.150mm (.006") PER SIDE UF Package 16-Lead Plastic QFN (4mm x 4mm) (Reference LTC DWG # 05-08-1692 Rev O) BOTTOM VIEW--EXPOSED PAD 4.00 0.10 (4 SIDES) 0.72 0.05 R = 0.115 TYP 0.75 0.05 1 2.15 0.10 (4-SIDES) PACKAGE OUTLINE 18 2 (UF16) QFN 10-04 0.200 REF 0.30 0.05 0.65 BSC RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS 16 0.55 0.20 PIN 1 TOP MARK (NOTE 6) 4.35 0.05 2.15 0.05 2.90 0.05 (4 SIDES) 15 PIN 1 NOTCH R = 0.20 TYP OR 0.35 x 45 CHAMFER 0.00 - 0.05 0.30 0.05 0.65 BSC NOTE: 1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION (WGGC) 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE 3412aff For more information www.linear.com/LTC3412A LTC3412A REVISION HISTORY (Revision history begins at Rev E) REV DATE DESCRIPTION E 03/10 Changed Temperature Range for E- and I-Grades to -40C to 125C in Absolute Maximum Ratings and Order Information Sections 2 F 05/17 PAGE NUMBER Changed from TA = 25C to TA TJ = 25C in the Electrical Characteristics Heading 3 Updated Note 2 3 Add Storage Temperature to Absolute Maximum Ratings 2 3412aff Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of itsinformation circuits as described herein will not infringe on existing patent rights. For more www.linear.com/LTC3412A 19 LTC3412A RELATED PARTS PART NUMBER DESCRIPTION COMMENTS LTC1878 600mA (IOUT), 550kHz, Synchronous Step-Down DC/DC Converter 96% Efficiency, VIN: 2.7V to 6V, VOUT(MIN) = 0.8V, IQ = 10A ISD <1A, MS8 Package LTC1879 1.20A (IOUT), 550kHz, Synchronous Step-Down DC/DC Converter 95% Efficiency, VIN: 2.7V to 10V, VOUT(MIN) = 0.8V, IQ = 15A, ISD <1A, TSSOP16 Package LT1934/LT1934-1 300mA (IOUT), Constant Off-Time, High Efficiency Step-Down DC/DC Converter 90% Efficiency, VIN: 3.2V to 34V, VOUT(MIN) = 1.25V, IQ = 14A, ISD <1A, ThinSOT TM Package LTC3404 600mA (IOUT), 1.4MHz, Synchronous Step-Down DC/DC Converter 95% Efficiency, VIN: 2.7V to 6V, VOUT(MIN) = 0.8V, IQ = 10A, ISD <1A, MS8 Package LTC3405/LTC3405A 300mA (IOUT), 1.5MHz, Synchronous Step-Down DC/DC Converter 95% Efficiency, VIN: 2.5V to 5.5V, VOUT(MIN) = 0.8V, IQ = 20A, ISD <1A, ThinSOT Package LTC3406/LTC3406B 600mA (IOUT), 1.5MHz, Synchronous Step-Down DC/DC Converter 96% Efficiency, VIN: 2.5V to 5.5V, VOUT(MIN) = 0.6V, IQ = 20A, ISD <1A, ThinSOT Package LTC3407 Dual 600mA (IOUT), 1.5MHz, Synchronous Step-Down DC/DC Converter 95% Efficiency, VIN: 2.5V to 5.5V, VOUT(MIN) = 0.6V, IQ = 40A, ISD <1A, MS10E and 3mm x 3mm DFN Packages LTC3411 1.25A (IOUT), 4MHz, Synchronous Step-Down DC/DC Converter 95% Efficiency, VIN: 2.5V to 5.5V, VOUT(MIN) = 0.8V, IQ = 60A, ISD <1A, MS10 and 3mm x 3mm DFN Packages LTC3412 2.5A (IOUT), 4MHz, Synchronous Step-Down DC/DC Converter 95% Efficiency, VIN: 2.5V to 5.5V, VOUT(MIN) = 0.8V, IQ = 60A, ISD <1A, TSSOP16E Package LTC3413 3A (IOUT Sink/Source), 2MHz, Monolithic Synchronous Regulator for DDR/QDR Memory Termination 90% Efficiency, VIN: 2.25V to 5.5V, VOUT(MIN) = VREF/2, IQ = 280A, ISD <1A, TSSOP16E Package LTC3414 4A (IOUT), 4MHz, Synchronous Step-Down DC/DC Converter 95% Efficiency, VIN: 2.25V to 5.5V, VOUT(MIN) = 0.8V, IQ = 64A, ISD <1A, TSSOP20E Package LTC3416 4A (IOUT), 4MHz, Synchronous Step-Down DC/DC Converter 95% Efficiency, VIN: 2.25V to 5.5V, VOUT(MIN) = 0.8V, IQ = 64A, ISD <1A, TSSOP20E Package LTC3418 8A (IOUT), 4MHz, Synchronous Step-Down DC/DC Converter 95% Efficiency, VIN: 2.25V to 5.5V, VOUT(MIN) = 0.8V, IQ = 380A, ISD <1A, QFN Package LT3430 60V, 2.75A (IOUT), 200kHz, High Efficiency Step-Down DC/DC Converter 90% Efficiency, VIN: 5.5V to 60V, VOUT(MIN) = 1.20V, IQ = 2.5mA, ISD 25A, TSSOP16E Package LTC3440 600mA (IOUT), 2MHz, Synchronous Buck-Boost DC/DC Converter 95% Efficiency, VIN: 2.5V to 5.5V, VOUT: 2.5V to 5.5V, IQ = 25A, ISD <1A, DFN Package LTC3441 1.2A (IOUT), 1MHz, Synchronous Buck-Boost DC/DC Converter 95% Efficiency, VIN: 2.4V to 5.5V, VOUT: 2.4V to 5.25V, IQ = 25A, ISD <1A, DFN Package LTC3548 400mA/800mA Dual Synchronous Step-Down DC/DC Converter 95% Efficiency, VIN: 2.5V to 5.5V, VOUT(MIN) = 0.6V, IQ <40A, ISD <1A, MS8E and DFN Packages 20 3412aff LT 0517 REV F * PRINTED IN USA For more information www.linear.com/LTC3412A www.linear.com/LTC3412A LINEAR TECHNOLOGY CORPORATION 2005