IP4251CZ8-4-TTL - NXP Semiconductors

1. Product profile

1.1 General description

The devices are 4-, 6- and 8-channel RC low-pass filter arrays which are designed to

provide filtering of undesired RF signals on the I/O ports of portable communication or

computing devices. In addition, the devices incorporate di odes to provide protection to

downstream components from ElectroStatic Discharge (ESD) voltages as high as ±30 kV.

The devices are fabricated using monolithic silicon technology and integrate up to eight

resistors and sixt ee n dio d es in a 0. 4 mm pitch 8-, 12- or 16-pin ultra-t hin lead le ss Qu ad

Flat No-leads (QFN) plastic package with a height of 0.55 mm only.

1.2 Features and benefits

Pb-free, Restriction of Hazardous Substances (RoHS) compliant and free of halogen

and antimony (Dark Green compliant)

4-, 6- and 8-channel integrated π-type RC filter network

ESD protection to ±30 kV cont act discharg e according to IEC 61000-4-2 fa r exceeding

level 4

QFN plastic package with 0.4 mm pitch and 0.55 mm height

1.3 Applications

General-purpose ElectroMagnetic Interference (EMI) and Radio-Frequency

Interference (RFI) filtering and downstream ESD protection for:

Cellular phone and Personal Communication System (PCS) mobile handsets

Cordless telephones

Wireless data (WAN/LAN) systems

Mobile Internet Devices (MID)

Portable Media Players (PMP)

IP4251/52/53/54-TTL

Integrated 4-, 6- and 8-channel passive filter network

with ESD protection

Rev. 2 — 5 May 2011 Product data sheet

Product data sheet Rev. 2 — 5 May 2011 2 of 18

NXP Semiconductors IP4251/52/53/54-TTL

Integrated 4-, 6- and 8-channel passive filter network

1.4 Quick reference data

[1] For the total channel.

2. Pinning information

Table 1. Quick reference data

Symbol Parameter Conditions Min Typ Max Unit

IP4251CZ8-4-TTL; IP4251CZ12-6-TTL ; IP4251CZ16-8-TTL

Cch channel capacit ance f = 100 kHz;

Vbias(DC) =2.5V [1] -10-pF

Rs(ch) channel series resistance 80 100 120 Ω

IP4252CZ8-4-TTL; IP4252CZ12-6-TTL ; IP4252CZ16-8-TTL

Cch channel capacit ance f = 100 kHz;

Vbias(DC) =2.5V [1] -12-pF

Rs(ch) channel series resistance 32 40 48 Ω

IP4253CZ8-4-TTL; IP4253CZ12-6-TTL ; IP4253CZ16-8-TTL

Cch channel capacit ance f = 100 kHz;

Vbias(DC) =2.5V [1] -30-pF

Rs(ch) channel series resistance 160 200 240 Ω

IP4254CZ8-4-TTL; IP4254CZ12-6-TTL ; IP4254CZ16-8-TTL

Cch channel capacit ance f = 100 kHz;

Vbias(DC) =2.5V [1] -30-pF

Rs(ch) channel series resistance 80 100 120 Ω

Table 2. Pinning

Pin Description Simplified outline Graphic symbol

IP4251CZ8-4-TTL; IP4252CZ8-4-TTL; IP4253CZ8-4-TTL; IP4254CZ8-4-TTL (SOT1166-1)

1 and 8 filter channel 1

2 and 7 filter channel 2

3 and 6 filter channel 3

4 and 5 filter channel 4

ground pad ground

IP4251CZ12-6-TTL; IP4252CZ12-6-TTL; IP4253CZ12-6-T TL; IP4254CZ12-6-TTL (SOT1167-1)

1 and 12 filter channel 1

2 and 11 filter channel 2

3 and 10 filter channel 3

4 and 9 filter channel 4

5 and 8 filter channel 5

6 and 7 filter channel 6

ground pad ground

Transparent

top view

018aaa07

Rs(ch)

Cch

5 to 81 to 4

GND

Cch

Transparent

top view

018aaa07

Rs(ch)

7 to 121 to 6

GND

Cch

Product data sheet Rev. 2 — 5 May 2011 3 of 18

NXP Semiconductors IP4251/52/53/54-TTL

Integrated 4-, 6- and 8-channel passive filter network

3. Ordering information

IP4251CZ16-8-TTL; IP4252CZ16-8-TTL; IP4253CZ16-8-T TL; IP4254CZ16-8-TTL (SOT1168-1)

1 and 16 filter channel 1

2 and 15 filter channel 2

3 and 14 filter channel 3

4 and 13 filter channel 4

5 and 12 filter channel 5

6 and 11 filter channel 6

7 and 10 filter channel 7

8 and 9 filter channel 8

ground pad ground

Table 2. Pinning …continued

Pin Description Simplified outline Graphic symbol

Transparent

top view

018aaa07

Rs(ch)

9 to 161 to 8

GND

Cch

Table 3. Orderi ng information

Type number Package

Name Description Version

IP4251CZ8-4-TTL HUSON8 plastic, thermal enhanced ultra thin small outline package; no leads;

8 terminals; body 1.35 ×1.7 ×0.55 mm SOT1166-1

IP4251CZ12-6-TTL HUSON12 plastic, thermal enhanced ultra thin small outline package; no leads;

12 terminals; body 1.35 ×2.5 ×0.55 mm SOT1167-1

IP4251CZ16-8-TTL HUSON16 plastic, thermal enhanced ultra thin small outline package; no leads;

16 terminals; body 1.35 ×3.3 ×0.55 mm SOT1168-1

IP4252CZ8-4-TTL HUSON8 plastic, thermal enhanced ultra thin small outline package; no leads;

8 terminals; body 1.35 ×1.7 ×0.55 mm SOT1166-1

IP4252CZ12-6-TTL HUSON12 plastic, thermal enhanced ultra thin small outline package; no leads;

12 terminals; body 1.35 ×2.5 ×0.55 mm SOT1167-1

IP4252CZ16-8-TTL HUSON16 plastic, thermal enhanced ultra thin small outline package; no leads;

16 terminals; body 1.35 ×3.3 ×0.55 mm SOT1168-1

IP4253CZ8-4-TTL HUSON8 plastic, thermal enhanced ultra thin small outline package; no leads;

8 terminals; body 1.35 ×1.7 ×0.55 mm SOT1166-1

IP4253CZ12-6-TTL HUSON12 plastic, thermal enhanced ultra thin small outline package; no leads;

12 terminals; body 1.35 ×2.5 ×0.55 mm SOT1167-1

IP4253CZ16-8-TTL HUSON16 plastic, thermal enhanced ultra thin small outline package; no leads;

16 terminals; body 1.35 ×3.3 ×0.55 mm SOT1168-1

IP4254CZ8-4-TTL HUSON8 plastic, thermal enhanced ultra thin small outline package; no leads;

8 terminals; body 1.35 ×1.7 ×0.55 mm SOT1166-1

IP4254CZ12-6-TTL HUSON12 plastic, thermal enhanced ultra thin small outline package; no leads;

12 terminals; body 1.35 ×2.5 ×0.55 mm SOT1167-1

IP4254CZ16-8-TTL HUSON16 plastic, thermal enhanced ultra thin small outline package; no leads;

16 terminals; body 1.35 ×3.3 ×0.55 mm SOT1168-1

Product data sheet Rev. 2 — 5 May 2011 4 of 18

NXP Semiconductors IP4251/52/53/54-TTL

Integrated 4-, 6- and 8-channel passive filter network

4. Limiting values

[1] Device tested with 1000 pulses of ±15 kV contact discharges, according to the IEC 61000-4-2 model,

far exceeding IEC 61000-4-2 level 4 (8 kV contact discharge).

[2] Device tested with 1000 pulses of ±30 kV contact discharges, according to the IEC 61000-4-2 model,

far exceeding IEC 61000-4-2 level 4 (8 kV contact discharge).

Table 4. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

IP4251CZ8-4-TTL; IP4251CZ12-6-TTL ; IP4251CZ16-8-TTL

VESD electrostatic discharge

voltage all pins to ground;

contact discharge [1] -±15 kV

IP4252CZ8-4-TTL; IP4252CZ12-6-TTL ; IP4252CZ16-8-TTL

VESD electrostatic discharge

voltage all pins to ground;

contact discharge [1] -±15 kV

IP4253CZ8-4-TTL; IP4253CZ12-6-TTL ; IP4253CZ16-8-TTL

VESD electrostatic discharge

voltage all pins to ground [2]

contact discharge - ±30 kV

air discharge - ±30 kV

IP4254CZ8-4-TTL; IP4254CZ12-6-TTL ; IP4254CZ16-8-TTL

VESD electrostatic discharge

voltage all pins to ground [2]

contact discharge - ±30 kV

air discharge - ±30 kV

Per device

VESD electrostatic discharge

voltage IEC 61000-4-2, level 4;

all pins to ground

contact discharge - ±8kV

air discharge - ±15 kV

VCC supply voltage −0.5 +5.6 V

Pch channel power dissipation Tamb =85°C-60mW

Ptot total power dissipation Tamb =85°C-200mW

Tstg storage temperature −55 +150 °C

Tamb ambient temperature −40 +85 °C

Product data sheet Rev. 2 — 5 May 2011 5 of 18

NXP Semiconductors IP4251/52/53/54-TTL

Integrated 4-, 6- and 8-channel passive filter network

5. Characteristics

[1] For the total channel.

[2] Guaranteed by design.

Table 5. Channel characteristics

Tamb =25

C unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

IP4251CZ8-4-TTL; IP4251CZ12-6-TTL ; IP4251CZ16-8-TTL

Cch channel capacit ance f = 100 kHz [1]

Vbias(DC) =2.5V - 10 - pF

Vbias(DC) =0V [2] -15-pF

Rs(ch) channel series resistance 80 100 120 Ω

IP4252CZ8-4-TTL; IP4252CZ12-6-TTL ; IP4252CZ16-8-TTL

Cch channel capacit ance f = 100 kHz [1]

Vbias(DC) =2.5V - 12 - pF

Vbias(DC) =0V [2] -18-pF

Rs(ch) channel series resistance 32 40 48 Ω

IP4253CZ8-4-TTL; IP4253CZ12-6-TTL ; IP4253CZ16-8-TTL

Cch channel capacit ance f = 100 kHz [1]

Vbias(DC) =2.5V - 30 - pF

Vbias(DC) =0V [2] -45-pF

Rs(ch) channel series resistance 160 200 240 Ω

IP4254CZ8-4-TTL; IP4254CZ12-6-TTL ; IP4254CZ16-8-TTL

Cch channel capacit ance f = 100 kHz [1]

Vbias(DC) =2.5V - 30 - pF

Vbias(DC) =0V [2] -45-pF

Rs(ch) channel series resistance 80 100 120 Ω

Per device

ILR reverse leakage curre nt per channel; VI=3.5V --0.1μA

VBR breakdown voltage positive clamp; II=1mA 5.8 - 9 V

VFforward voltage negative clamp; IF= 1 mA 0.4 - 1.5 V

Product data sheet Rev. 2 — 5 May 2011 6 of 18

NXP Semiconductors IP4251/52/53/54-TTL

Integrated 4-, 6- and 8-channel passive filter network

Table 6. Frequency characteristics

Tamb =25

C unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

IP4251CZ8-4-TTL; IP4251CZ12-6-TTL ; IP4251CZ16-8-TTL

αil insertion loss Rsource =50Ω; RL=50Ω

800 MHz < f < 3 GHz - 16 - dB

f=1GHz - 20 - dB

αct crosstalk attenuation Rsource =50Ω; RL=50Ω;

800 MHz < f < 3 GHz -30-dB

IP4252CZ8-4-TTL; IP4252CZ12-6-TTL ; IP4252CZ16-8-TTL

αil insertion loss Rsource =50Ω; RL=50Ω

800 MHz < f < 3 GHz - 12 - dB

f=1GHz - 14 - dB

αct crosstalk attenuation Rsource =50Ω; RL=50Ω;

800 MHz < f < 3 GHz -40-dB

IP4253CZ8-4-TTL; IP4253CZ12-6-TTL ; IP4253CZ16-8-TTL

αil insertion loss Rsource =50Ω; RL=50Ω

800 MHz < f < 3 GHz - 33 - dB

f=1GHz 35--dB

αct crosstalk attenuation Rsource =50Ω; RL=50Ω;

800 MHz < f < 3 GHz -30-dB

IP4254CZ8-4-TTL; IP4254CZ12-6-TTL ; IP4254CZ16-8-TTL

αil insertion loss Rsource =50Ω; RL=50Ω

800 MHz < f < 3 GHz - 28 - dB

f=1GHz 30--dB

αct crosstalk attenuation Rsource =50Ω; RL=50Ω;

800 MHz < f < 3 GHz -30-dB

Product data sheet Rev. 2 — 5 May 2011 7 of 18

NXP Semiconductors IP4251/52/53/54-TTL

Integrated 4-, 6- and 8-channel passive filter network

6. Application information

6.1 Insertion loss

The devices are designed as EMI/RFI filters for multichannel interfaces.

The block schematic for measuring insertion loss in a 50 Ω system is shown in Figure 1.

Typical me a sur e men ts results are shown in Figure 2 to Figure 6 for the differen t devices.

(1) IP4252CZ16-8-TTL - channel 1 to channel 16

(2) IP4251CZ16-8-TTL - channel 1 to channel 16

(3) IP4254CZ16-8-TTL - channel 1 to channel 16

(4) IP4253CZ16-8-TTL - channel 1 to channel 16

Fig 1. Frequency response setup Fig 2. Frequency respon se curves overview

018aaa07

50 Ω

Vgen

50 Ω

DUT

OUTIN

001aaj308

−30

−20

−40

−10

S21

(dB)

−50

f (MHz)

10−1104

103

110

(1)

(2)

(3)

(4)

Product data sheet Rev. 2 — 5 May 2011 8 of 18

NXP Semiconductors IP4251/52/53/54-TTL

Integrated 4-, 6- and 8-channel passive filter network

Due to the optimized silicon dice and package design, all channels in a single package

show a very good matching performa nce as the insertion loss for a channel at the

package side (e.g. channel 1 to channel 16) is nearly identical with the center channels

(e.g. channel 4 to channel 13).

(1) Channel 1 to channel 16

(2) Channel 4 to channel 13 (1) Channel 1 to channel 16

(2) Channel 4 to channel 13

Fig 3. IP4251CZ16-8-TTL: frequency response

curves Fig 4. IP4252CZ16-8-TTL: frequency response

curves

(1) Channel 1 to channel 16

(2) Channel 4 to channel 13 (1) Channel 4 to channel 13

(2) Channel 1 to channel 16

Fig 5. IP4253CZ16-8-TTL: frequency response

curves Fig 6. IP4254CZ16-8-TTL: frequency response

curves

001aaj608

−30

−20

−40

−10

S21

(dB)

−50

f (MHz)

10−1104

103

110

(1)

(2)

001aaj609

−30

−20

−40

−10

S21

(dB)

−50

f (MHz)

10−1104

103

110

(1)

(2)

001aaj610

−30

−20

−40

−10

S21

(dB)

−50

f (MHz)

10−1104

103

110

(1)

(2)

001aaj611

−30

−20

−40

−10

S21

(dB)

−50

f (MHz)

10−1104

103

110

(1)

(2)

Product data sheet Rev. 2 — 5 May 2011 9 of 18

NXP Semiconductors IP4251/52/53/54-TTL

Integrated 4-, 6- and 8-channel passive filter network

6.2 Selection

The selection of one of the filter devices has to be perfo rmed depe nding o n the maximum

clock frequency, driver strength, capacitive load of the sink, and also the maximum

applicable rise and fall times.

6.2.1 SDHC and MMC memory interface

The Secure Digital High Capacity (SDHC) memory card interface standard specification

and the Multi Media Card (MMC) (JESD 84A43) standard specification recommend a rise

and fall time of 25 % to 62.5 % (62.5 % to 25 % respectively) of 3 ns or less for the input

signal of the receiving interface side.

Assuming a typical capacitance of about 20 pF for the SDHC memory card itself, and

approximately 4 pF to 7 pF for the Printed-Circuit Board (PCB) and the card holder,

IP4252CZ12-6-TTL (6 channels, Rs(ch) =40Ω, Cch =12pF at V

bias(DC) =2.5V) is a

matching selection to filter and protect all relevant interface pins such as CLK, CMD, and

DAT0 to DAT3/CD. Please refer to Figure 7 for a general example of the implementation

of the device in an SDHC card interface.

In case additional channels such as write-protect or a mechanical card-detection switch

are used, the IP4252CZ16-8-TTL (8 channels, Rs(ch) =40Ω, Cch =12pF at

Vbias(DC) = 2.5 V) offers two additional channels.

Product data sheet Rev. 2 — 5 May 2011 10 of 18

NXP Semiconductors IP4251/52/53/54-TTL

Integrated 4-, 6- and 8-channel passive filter network

The cap a citance values specif ied for the signal channels of the MMC interface differ from

the SDHC specification. The MMC card-side interface is specified to have an intrinsic

capacitance of 12 pF to 18 pF and the total channel is limited according to the

specification to 30 pF only. Therefore, any filter device capacitance is limited to a

maximum of up to 18 pF, including the card holder and PCB traces.

Please refer to Figure 8 for a general example of the implementation of the IP4252 in an

MMC interface application.

Fig 7. Example of IP4252 in an SDHC card interface

018aaa07

IP4252CZ12-6-TTL

(IP4252CZ16-8-TTL)

DAT1

pull-up resistors

10 kΩ − 100 kΩ

10 kΩ − 90 kΩ

DAT3/CD pull-up

10 kΩ − 100 kΩ

DAT3/CD pull-up

>270 kΩ

exact value

depends on

required

logic levels

DAT1 SD MEMORY

CARD

SET_CLR_

CARD_DETECT

(ACMD42)

to HOST

INTERFACE

DAT0

GND

CLK

VCC(VSD)

DAT3/CD

CMD

DAT2

optional:

2-additional channels

of IP4252CZ16-8-TTL

optional:

write protect switch

optional:

electrical card detect

DAT0

CLK

CMD

DAT3/CD

DAT2

optional:

card detect switch

Product data sheet Rev. 2 — 5 May 2011 11 of 18

NXP Semiconductors IP4251/52/53/54-TTL

Integrated 4-, 6- and 8-channel passive filter network

To generate SDHC and MMC-compliant digital signals, the driver strength should not

significantly undercut 8 mA.

6.2.2 LCD interfaces, medium-speed interfaces

For digital interfaces such as LCD interfaces running at clock speeds between 10 MHz

and 25 MHz or more, IP4251, IP4252 or IP4254 can be used dep ending on the sink load,

clock speed, driver strength and rise and fall time requirements. Also the minimum

EMI filter requirements may be a decision-making factor.

6.2.3 Keypad, low-speed interfaces

Especially for lower-speed interfaces such as keypads, low-speed serial interfaces

(e.g. Recommended Standard (RS) 232) and low-speed control signals,

IP4253 (Rs(ch) =200Ω, Cch =30pF at V

bias(DC) = 2.5 V) offers a very ro bu st

ESD protection and strong suppression of unwanted frequencies (EMI filtering).

Fig 8. Example of IP4252 in an MMC interface

018aaa07

IP4252CZ12-6-TTL

IP4252CZ8-4-TTL

DAT1

pull-up resistors

50 kΩ - 100 kΩ

CMD pull-up

4.7 kΩ - 100 kΩ

DAT1 C8

e.g.

RSMMC

HOST

INTERFACE

DAT0 C7

DAT7 C13

VSS2 C6

DAT6 C12

CLK C5

VCC(VMMC)

VSS1 C3

DAT5 C11

CMD C2

DAT4 C10

DAT3 C1

DAT2

CMD

DAT4

DAT3

DAT2 C9

DAT0

DAT7

DAT6

CLK

DAT5

Product data sheet Rev. 2 — 5 May 2011 12 of 18

NXP Semiconductors IP4251/52/53/54-TTL

Integrated 4-, 6- and 8-channel passive filter network

7. Package outline

Fig 9. Package outline SOT1166-1 (HUSON8)

References

Outline

version

European

projection Issue date

IEC JEDEC JEITA

SOT1166-1 - - -

- - -

sot1166-1_po

10-03-18

10-03-22

Unit(1)

max

nom

min

0.55 0.05

0.00

0.25

0.20

0.15

1.8

1.7

1.6

1.3

1.2

1.1

1.45

1.35

1.25

0.4 1.2

0.30

0.25

0.20

0.05

Dimensions

Note

1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.

USON8: plastic, thermal enhanced ultra thin small outline package; no leads;

terminals; body 1.35 x 1.7 x 0.55 mm SOT1166-

A1c

0.127

bDD

hEE

0.45

0.40

0.35

0.2

0.1

0.05

0 1 2 mm

scale

tiebars are indicated on

arbitrary location and size

detail X

terminal 1

index area

terminal 1

index area

eAC B

Product data sheet Rev. 2 — 5 May 2011 13 of 18

NXP Semiconductors IP4251/52/53/54-TTL

Integrated 4-, 6- and 8-channel passive filter network

Fig 10. Package outline SOT1167-1 (HUSON12)

References

Outline

version

European

projection Issue date

IEC JEDEC JEITA

SOT1167-1 - - -

- - -

sot1167-1_po

10-03-18

10-03-22

Unit(1)

max

nom

min

0.55 0.05

0.00

0.25

0.20

0.15

2.6

2.5

2.4

2.1

2.0

1.9

1.45

1.35

1.25

0.4 2.0

0.30

0.25

0.20

0.05

Dimensions

Note

1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.

USON12: plastic, thermal enhanced ultra thin small outline package; no leads;

2 terminals; body 1.35 x 2.5 x 0.55 mm SOT1167-

A1c

0.127

bDD

hEE

0.45

0.40

0.35

0.2

0.1

0.05

0 1 2 mm

scale

tiebars are indicated on

arbitrary location and size

detail X

terminal 1

index area

terminal 1

index area

eAC B

Product data sheet Rev. 2 — 5 May 2011 14 of 18

NXP Semiconductors IP4251/52/53/54-TTL

Integrated 4-, 6- and 8-channel passive filter network

Fig 11. Package outline SOT1168-1 (HUSON16)

References

Outline

version

European

projection Issue date

IEC JEDEC JEITA

SOT1168-1 - - -

- - -

sot1168-1_po

10-03-18

10-03-22

Unit(1)

max

nom

min

0.55 0.05

0.00

0.25

0.20

0.15

3.4

3.3

3.2

2.9

2.8

2.7

1.45

1.35

1.25

0.4 2.8

0.30

0.25

0.20

0.05

Dimensions

Note

1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.

USON16: plastic, thermal enhanced ultra thin small outline package; no leads;

6 terminals; body 1.35 x 3.3 x 0.55 mm SOT1168-

A1c

0.127

bDD

hEE

0.45

0.40

0.35

0.2

0.1

0.05

0 1 2 mm

scale

tiebars are indicated on

arbitrary location and size

detail X

terminal 1

index area

terminal 1

index area

eAC B

Product data sheet Rev. 2 — 5 May 2011 15 of 18

NXP Semiconductors IP4251/52/53/54-TTL

Integrated 4-, 6- and 8-channel passive filter network

8. Revision history

Table 7. Revision history

Document ID Release date Data sheet status Change notice Supersedes

IP4251_52_53_54-TTL v.2 20110505 Product data sheet - IP4251_52_53_54-TTL v.1

Modifications: •Section 1 “Product profile”: updated.

•Table 2 “Pinning”: updated.

•Deleted section “Thermal characteristics”.

IP4251_52_53_54-TT L v.1 20110131 Objective data sheet - -

Product data sheet Rev. 2 — 5 May 2011 16 of 18

NXP Semiconductors IP4251/52/53/54-TTL

Integrated 4-, 6- and 8-channel passive filter network

9. Legal information

9.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Definitions”.

[3] The product status of de vice(s) descr ibed in th is document m ay have cha nged since thi s document w as publish ed and may di ffe r in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

9.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liab ility for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and tit le. A short data sh eet is intended

for quick reference only and shou ld not b e relied u pon to cont ain det ailed and

full information. For detailed and full informatio n see the relevant full data

sheet, which is available on request via the local NXP Semicond uctors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall pre va il.

Product specificatio n — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to off er functions and qualities beyon d those described in the

Product data sheet.

9.3 Disclaimers

Limited warr a nty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warrant ies, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information.

In no event shall NXP Semiconductors be liable for any indirect , incidental,

punitive, special or consequ ential damages (including - wit hout limitation - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ aggreg ate and cumulative liabil ity towards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all informa tion supplied prior

to the publication hereof .

Suitability for use — NXP Semiconductors product s are not designed,

authorized or warranted to be suit able for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors pro duct can reasonably be expected

to result in perso nal injury, death or severe property or environmental

damage. NXP Semiconductors accepts no liab ility for inclusion and/or use of

NXP Semiconductors products in such equipment or applications and

therefore such inclusion and/or use is at the customer’s own risk.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and ope ration of their applications

and products using NXP Semiconductors product s, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suit able and fit for the custome r’s applications and

products planned, as well as fo r the planned application and use of

customer’s third party customer(s). Custo mers should provide appropriate

design and operating safeguards to minimize the risks associated with t heir

applications and products.

NXP Semiconductors does not accept any liabili ty related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party custo m er(s). Customer is responsible for doing all necessary

testing for the customer’s applications and pro ducts using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by cust omer’s third party

customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individua l agreement. In case an individual

agreement is concluded only the ter m s and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing i n this document may be interpreted or

construed as an of fer t o sell product s that is open for accept ance or the gr ant,

conveyance or implication of any license under any copyrights, patents or

other industrial or inte llectual property rights.

Export control — This document as well as the item(s) described herein

may be subject to export control regulatio ns. Export might require a prior

authorization from national authorities.

Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contains data from the objective specification for product development.

Preliminary [short] dat a sheet Qualification This document contain s data from the preliminar y specification.

Product [short] data sheet Production This document contains the product specification.

Product data sheet Rev. 2 — 5 May 2011 17 of 18

NXP Semiconductors IP4251/52/53/54-TTL

Integrated 4-, 6- and 8-channel passive filter network

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors product is automotive qualified,

the product is not suitable for aut omo tive use. It is neither qua lified nor test ed

in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of

non-automotive qualified products in automotive equipment or applications.

In the event that customer uses the product for design-in and use in

automotive applications to automot ive specifications and standards, custome r

(a) shall use the product without NXP Semiconductors’ warranty of the

product for such automotive applications, use and specifications, and (b)

whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies NXP Semiconduct ors for an y

liability, damages or failed product cl aims resulting from custome r design and

use of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product specifications.

9.4 Trademarks

Notice: All referenced b rands, produc t names, service names and trademarks

are the property of their respective ow ners.

10. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

NXP Semiconductors IP4251/52/53/54-TTL

Integrated 4-, 6- and 8-channel passive filter network

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 5 May 2011

Document identifier: IP4251_52_53_54-TT L

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

11. Contents

1 Product profile. . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1 General description . . . . . . . . . . . . . . . . . . . . . 1

1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1

1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 2

2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2

3 Ordering information. . . . . . . . . . . . . . . . . . . . . 3

4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4

5 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 5

6 Application information. . . . . . . . . . . . . . . . . . . 7

6.1 Insertion loss . . . . . . . . . . . . . . . . . . . . . . . . . . 7

6.2 Selection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

6.2.1 SDHC and MMC memory interface . . . . . . . . . 9

6.2.2 LCD interfaces, medium-speed interfaces . . . 11

6.2.3 Keypad, low-speed interfaces. . . . . . . . . . . . . 11

7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12

8 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 15

9 Legal information. . . . . . . . . . . . . . . . . . . . . . . 16

9.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 16

9.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

9.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 16

9.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 17

10 Contact information. . . . . . . . . . . . . . . . . . . . . 17

11 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18