1CSD01060 Rev. P
CSD01060
Silicon Carbide Schottky Diode
Zero recovery® RectifieR
Maximum Ratings (TC = 25 ˚C unless otherwise specied)
Symbol Parameter Value Unit Test Conditions Note
VRRM Repetitive Peak Reverse Voltage 600 V
VRSM Surge Peak Reverse Voltage 600 V
VDC DC Blocking Voltage 600 V
IFContinuous Forward Current
4
2
1
A
TC=25˚C
TC=135˚C
TC=158˚C
IFRM Repetitive Peak Forward Surge Current 7
5.5 ATC=25˚C, tP=10 ms, Half Sine Wave
TC=125˚C, tP=10 ms, Half Sine Wave
IFSM Non-Repetitive Peak Forward Surge Current 9 A TC=25˚C, tP=1.5 ms, Half Sine Wave
IFSM Non-Repetitive Peak Forward Surge Current 32 A TC=25˚C, tP=10 µs, Pulse
Ptot Power Dissipation 21.4
7.1 WTC=25˚C
TC=125˚C
TJ , Tstg Operating Junction and Storage Temperature -55 to
+175 ˚C
TO-220 Mounting Torque 1
8.8
Nm
lbf-in
M3 Screw
6-32 Screw
Features
• 600-Volt Schottky Rectier
• Zero Reverse Recovery Current
• Zero Forward Recovery Voltage
• High-Frequency Operation
• Temperature-Independent Switching Behavior
• Extremely Fast Switching
• Positive Temperature Coefcient on VF
Benets
• Replace Bipolar with Unipolar Rectiers
• Essentially No Switching Losses
• Higher Efciency
• Reduction of Rectier Heat Sink
• Parallel Devices Without Thermal Runaway
Applications
• Switch Mode Power Supplies
• Power Factor Correction
- Typical PFC Pout : 100W-200W
• Motor Drives
- Typical Power : 0.25HP-0.5HP
Package
TO-252-2 TO-220-2
Part Number Package Marking
CSD01060A TO-220-2 CSD01060
CSD01060E TO-252-2 CSD01060
VRRM = 600 V
IF (TC=135˚C) = 2 A
Qc = 3.3 nC
PIN 1
PIN 2 CASE
2CSD01060 Rev. P
Electrical Characteristics
Symbol Parameter Typ. Max. Unit Test Conditions Note
VFForward Voltage 1.6
2.0
1.8
2.4 VIF = 1 A TJ=25°C
IF = 1 A TJ=175°C
IRReverse Current 20
40
100
500 μAVR = 600 V TJ=25°C
VR = 600 V TJ=150°C
QCTotal Capacitive Charge 3.3 nC
VR = 600 V, IF = 1 A
di/dt = 500 A/μs
TJ = 25°C
CTotal Capacitance
80
11
8.5
pF
VR = 0 V, TJ = 25°C, f = 1 MHz
VR = 200 V, TJ = 25˚C, f = 1 MHz
VR = 400 V, TJ = 25˚C, f = 1 MHz
Note:
1. This is a majority carrier diode, so there is no reverse recovery charge.
Thermal Characteristics
Symbol Parameter Typ. Unit
RθJC Thermal Resistance from Junction to Case 7°C/W
RθJA Thermal Resistance from Junction to Ambient 60 ˚C/W
Typical Performance
Figure 1. Forward Characteristics Figure 2. Reverse Characteristics
0
10
20
30
40
50
0 200 400 600 800 1000
VR Reverse Voltage (V)
IR Reverse Current (µA)
TJ = 25°C
TJ = 100°C
TJ = 200°C
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5
VF Forward Voltage (V)
0
10
20
30
40
50
0200 400 600 800 1000
VR Reverse Voltage (V)
I
R
Reverse Current (µA)
T
J
25 ° C
T
J
100 ° C
T
J
200 ° C
TJ = 25°C
TJ = 100°C
TJ = 200°C
IF Forward Current (A)
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
TJ = 25°C
TJ = 50°C
TJ = 100°C
TJ = 150°C
V
R
Reverse Voltage (V
)
IR Reverse Current (μA)
50
40
30
20
10
0
0 200 400 600 800 1000
3CSD01060 Rev. P
Current Derating
0.00
3.00
6.00
9.00
12.00
15.00
25 50 75 100 125 150 175 200
Case Temperature
Peak Forward Current
T
C
Case Temperature (
°
C
)
* Frequency > 1KHz
Figure 3. Current Derating Figure 4. Capacitance vs. Reverse Voltage
0
5
10
15
20
25
30
35
40
45
50
1 10 100 1000
VR Reverse Voltage (V)
C Capacitance (pF)
Typical Performance
I
F(PEAK)
Peak Forward Current (A)
25 50 75 100 125 150 175 200
14
12
10
8
6
4
2
0
10% Duty*
30% Duty*
50% Duty*
70% Duty*
DC
Figure 5. Transient Thermal Impedance
1.0E-02
1.0E-01
1.0E+00
1.0E+01
1.E-07 1.E-06 1.E-05 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00
Time (s)
Zth (°C/W)
V
R
Reverse Voltage (V
)
C Capacitance (pF)
50
45
40
35
30
25
20
15
10
5
0
1 10 100 1000
4CSD01060 Rev. P
30
25
20
15
10
5
0
Power Dissipation (W)
T
C
Case Temperature (
°
C
)
25 50 75 100 125 150 175
Figure 6. Power Derating
0.000
5.000
10.000
15.000
20.000
25.000
30.000
25 50 75 100 125 150 175
Typical Performance
Diode Model
Note: Tj = Diode Junction Temperature In Degrees Celsius
VT
RT
Diode Model CSD01060
Vf
T
= V
T
+ If*R
T
VT= 0.94 + (Tj * -1.2*10-3)
RT= 0.015 + (Tj * 6.4*10-3)
5CSD01060 Rev. P
Package Dimensions
Package TO-220-2
POS Inches Millimeters
Min Max Min Max
A .255 .265 6.477 6.731
B .197 .205 5.004 5.207
C .027 .033 .686 .838
D* .270 .322 6.858 8.179
E .178 .182 4.521 4.623
F .025 .035 .635 .889
G44˚ 46˚ 44˚ 46˚
H.382 .397 9.703 10.084
J.090 TYP 2.286 TYP
K6˚ 8˚ 6˚ 8˚
L.086 .094 2.184 2.388
M .030 .034 .762 .864
N .040 .044 1.016 1.118
P.235 .245 5.969 6.223
Q 0.00 .004 0.00 .102
RR0.01 TYP R0.31 TYP
S .017 .023 .428 .588
T .040 .044 1.016 1.118
U.021 .027 .534 1.118
Package Dimensions
Package TO-252-2
Note:
* Tab “D” may not be present
*
POS Inches Millimeters
Min Max Min Max
A .381 .410 9.677 10.414
B .235 .255 5.969 6.477
C .100 .120 2.540 3.048
D .223 .337 5.664 8.560
E .590 .615 14.986 15.621
F .143 .153 3.632 3.886
G 1.105 1.147 28.067 29.134
H.500 .550 12.700 13.970
J R 0.197 R 0.197
L.025 .036 .635 .914
M .045 .055 1.143 1.397
N .195 .205 4.953 5.207
P.165 .185 4.191 4.699
Q .048 .054 1.219 1.372
S 3° 6° 3° 6°
T 3° 6° 3° 6°
U3° 6° 3° 6°
V .094 .110 2.388 2.794
W.014 .025 .356 .635
X 3° 5.5° 3° 5.5°
Y .385 .410 9.779 10.414
z.130 .150 3.302 3.810
NOTE:
1. Dimension L, M, W apply for Solder Dip
Finish
A
C
E
D
G
H
B
J
L
M
N
F
P
Q
S
T U
V
W
X
Y
M in M ax M in M ax
A .395 .410 10.033 10.414
B .235 .255 5.969 6.477
C .102 .112 2.591 2.845
D .337 .337 8.560 8.560
E .590 .610 14.986 15.494
F .149 .153 3.785 3.886
G 1.127 1.147 28.626 29.134
H .530 .550 13.462 13.970
J
L .028 .036 .711 .914
M .045 .055 1.143 1.397
N .195 .205 4.953 5.207
P .170 .180 4.318 4.572
Q .048 .054 1.219 1.371
S 3° 5° 3° 5°
T 3° 5° 3° 5°
U 3° 5° 3° 5°
V .100 .110 2.54 2.794
W .014 .021 .356 .533
X 3° 5° 3° 5°
Y .395 .410 10.033 10.414
Z .130 .150 3.302 3.810
Inc h es
M illim eters
P OS
R 0.010 R 0.254
1 2
Z
PIN 1
PIN 2 CASE
PIN 1
PIN 2 CASE
66 CSD01060 Rev. P
Copyright © 2013 Cree, Inc. All rights reserved.
The information in this document is subject to change without notice.
Cree, the Cree logo, and Zero Recovery are registered trademarks of Cree, Inc.
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
Fax: +1.919.313.5451
www.cree.com/power
• RoHSCompliance
The levels of RoHS restricted materials in this product are below the maximum concentration values (also referred
to as the threshold limits) permitted for such substances, or are used in an exempted application, in accordance
with EU Directive 2011/65/EC (RoHS2), as implemented January 2, 2013. RoHS Declarations for this product can
be obtained from your Cree representative or from the Product Documentation sections of www.cree.com.
• REAChCompliance
REACh substances of high concern (SVHCs) information is available for this product. Since the European Chemi-
cal Agency (ECHA) has published notice of their intent to frequently revise the SVHC listing for the foreseeable
future,please contact a Cree representative to insure you get the most up-to-date REACh SVHC Declaration.
REACh banned substance information (REACh Article 67) is also available upon request.
• This product has not been designed or tested for use in, and is not intended for use in, applications implanted into
the human body nor in applications in which failure of the product could lead to death, personal injury or property
damage, including but not limited to equipment used in the operation of nuclear facilities, life-support machines,
cardiacdebrillatorsorsimilaremergencymedicalequipment,aircraftnavigationorcommunicationorcontrol
systems,airtrafccontrolsystems,orweaponssystems.
Notes
Recommended Solder Pad Layout
Part Number Package Marking
CSD01060A TO-220-2 CSD01060
CSD01060E TO-252-2 CSD01060
TO-252-2 TO-220-2
.08
.26
Note: Recommended soldering proles can be found in the applications note here:
http://www.cree.com/power_app_notes/soldering