SFH 4010
IR-Lumineszenzdiode
Infrared Emitter
Lead (Pb) Free Product - RoHS Compliant
2008-10-20 1
Wesentliche Merkmale
• Sehr kleines Gehäuse:
(LxBxH) 1,7 mm x 0,8 mm x 0,65 mm
• Typische Peakwellenlänge 950 nm
• Gegurtet lieferbar
Anwendungen
• Miniaturlichtschranken für Gleich- und
Wechsellichtbetrieb
• Industrieelektronik
• „Messen/Steuern/Regeln“
• Sensorik
• Alarm- und Sicherungssysteme
• IR-Freiraumübertragung
Typ
Type Bestellnummer
Ordering Code Strahlstärkegruppierung 1) (IF = 100 mA, tp = 20 ms)
Radiant Intensity Grouping 1)
Ie (mW/sr)
1) gemessen bei einem Raumwinkel Ω = 0.01 sr / measured at a solid angle of Ω = 0.01 sr
SFH 4010 Q65110A6459 > 1.0 (typ. 2.5)
Features
• Very small package:
(LxWxH) 1.7 mm x 0.8 mm x 0.65 mm
• Typical Peak wavelength 950 nm
• Available on tape and reel
Applications
• Miniature photointerrupters
• Industrial electronics
• For drive and control circuits
• Sensor technol ogy
• Alarm and safety equipment
• IR free air transmission
Nicht für Neuentwicklungen im Automobilbereich /
not for new designs in automotive applications
2008-10-20 2
SFH 4010
Grenzwerte (TA = 25 °C)
Maximum Ratings
Bezeichnung
Parameter Symbol
Symbol Wert
Value Einheit
Unit
Betriebs- und Lagertemperatur
Operating and storage temperature range Top; Tstg – 40 … + 100 °C
Sperrspannung
Reverse voltage VR5 V
Durchlassstrom
Forward current IF100 mA
Stoßstrom, τ = 10 μs, D = 0
Surge current IFSM 3 A
Verlustleistung
Power dissipation Ptot 160 mW
Wärmewiderstand Sperrschicht - Umgebung bei
Montage auf FR4 Platine, Padgröße je 5 mm2
Thermal resistance junction - ambient mounted
on PC-board (FR4), padsize 5 mm2 each
Wärmewiderstand Sperrschicht - Lötstelle bei
Montage auf Metall-Block
Thermal resistance junction - soldering point,
mounted on metal block
RthJA
RthJS
450
250
K/W
K/W
SFH 4010
2008-10-20 3
Kennwerte (TA = 25 °C)
Characteristics
Bezeichnung
Parameter Symbol
Symbol Wert
Value Einheit
Unit
Wellenlänge der Strahlung
Wavelength at peak emission
IF = 100 mA, tp = 20 ms
λpeak 950 nm
Spektrale Bandbreite bei 50% von Imax
Spectral bandwidth at 50% of Imax
IF = 100 m A
Δλ 55 nm
Abstrahlwinkel
Half angle ϕ± 80 Grad
deg.
Aktive Chipfläche
Active chip area A0.09 mm2
Abmessungen der aktiven Chipfläche
Dimensions of the active chip area L × B
L × W0.3 × 0.3 mm²
Schaltzeiten, Ie von 10% auf 90% und von 90%
auf 10%, bei IF = 100 mA, RL = 50 Ω
Switching times, Ιe from 10% to 90% and from
90% to 10%, IF = 100 mA, RL = 50 Ω
tr, tf0.5 μs
Kapazität
Capacitance
VR = 0 V, f = 1 MHz
Co25 pF
Durchlassspannung
Forward voltage
IF = 100 mA, tp = 20 ms
IF = 1 A, tp = 100 μs
VF
VF
1.3 (≤ 1.5)
1.9 (≤ 2.5)
V
V
Sperrstrom
Reverse current
VR = 5 V
IR0.01 (≤ 1) μA
Gesamtstrahlungsfluss
Total radiant flux
IF = 100 mA, tp = 20 ms
Φe20 mW
Temperaturkoeffizient von Ie bzw. Φe,
IF = 100 mA
Temperature coefficient of Ie or Φe, IF = 100 mA
TCI– 0.55 %/K
Temperaturkoeffizient von VF, IF = 100 mA
Temperature coefficient of VF, IF = 100 mA TCV– 2 mV/K
Temperaturkoeffizient von λ, IF = 100 mA
Temperature coefficient of λ, IF = 100 mA TCλ+ 0.3 nm/K
2008-10-20 4
SFH 4010
Strahlstärke Ie in Achsrichtung
gemessen bei einem Raumwinkel Ω = 0.01 sr
Radiant Intensity Ie in Axial Direction
at a solid angle of Ω = 0.01 sr
Bezeichnung
Parameter Symbol Werte
Values Einheit
Unit
Strahlstärke
Radiant intensity
IF = 100 mA, tp = 20 ms
Ie min
Ie typ
1.0
2.5 mW/sr
mW/sr
Strahlstärke
Radiant intensity
IF = 1 A, tp = 100 μs
Ie typ 22 mW/sr
SFH 4010
2008-10-20 5
Relative Spectral Emission
Irel = f (λ)
Forward Current
IF = f (VF) single pulse, tp = 20 μs
Radiation Characteristics Irel = f (ϕ)
OHR01938
λ
rel
Ι
0880 920 960 1000
nm
1060
20
40
60
80
%
100
10
OHR01554
F
V
-3
-2
10
-1
10
0
10
1
10
0123456V8
A
Ι
F
OHF00614
0˚ 20˚ 40˚ 60˚ 80˚ 100˚ 120˚0.40.60.81.0
100˚
90˚
80˚
70˚
60˚
50˚
0˚10˚20˚30˚40˚
0
0.2
0.4
0.6
0.8
1.0
ϕ
Radiant Intensity
Single pulse, tp = 20 μs
Permissible Pulse Handling
Capability IF = f (tp), TA = 25 °C
duty cycle D = parameter
Ιe
Ιe 100 mA = f (IF)
OHR01551
10
-3
Ι
F
-2
10
10
-1
10
0
10
1
10
2
Ι
e 100 mA
e
Ι
-2
10
-1
10
0
10
1
10A
A
t
OHR00860
p
-5
10
10
2
Ι
F
10
3
10
4
5
DC
0.2
0.5
0.1
0.005
0.01
0.02
0.05
t
p
T
Ι
F
t
p
T
D=
5
mA
-4
10
-3
10
-2
10
-1
10
0
10
1
10
2
10s
D=
Max. Permissible Forward Current
IF = f (TA), RthJA = 450 K/W
OHR00883
0
F
Ι
0
20
40
60
80
100
120
20 40 60 80 100 120
mA
˚C
T
A
R
thjA
= 450 K/W
2008-10-20 6
SFH 4010
Maßzeichnung
Package Outlines
Maße in mm (inch) / Dimensions in mm (inch).
Gehäuse / Package Epoxydharz, diffus / Epoxy, diffuse
Farbe / Colour Farblos / colourless
Gehäusemarkierung/
Package marking Kathode / cathode
GPLY7036
0.8 (0.031)
±0.1 (0.004)
Package
+0.05 (0.002)
-0.03 (0.001)
0.125 (0.005)
1.7 (0.067)±0.1 (0.004)
7˚ max
+0.02 (0.001)
-0.05 (0.002)
0.65 (0.026)
5˚
1.3 (0.051)±0.1 (0.004)
marking marking
Package
±0.05 (0.002)
0.7 (0.028)
SFH 4010
2008-10-20 7
Empfohlenes Lötpaddesign Reflow Löten
Recommended Solder Pad Reflow Soldering
Alternatives Lötpaddesign Reflow Löten
Alternative Solder Pad Reflow Soldering
Maße in mm (inch) / Dimensions in mm (inch).
0.8 (0.031)
0.8 (0.031)
OHAPY606
0.8 (0.031)
0.8 (0.031)
Copper solder pad
OHPY3832
0.8 (0.031)
0.7 (0.028)
0.8 (0.031)
0.05 (0.002)
0.6 (0.024)
Solder stencil aperture
0.05 (0.002)
0.7 (0.028)
Copper solder pad
2008-10-20 8
SFH 4010
Lötbedingungen Vorbehandlung nach JEDEC Level 2
Soldering Conditions Preconditioning acc. to JEDEC Level 2
Reflow Lötprofil für bleifreies Löten (nach J-STD-020C)
Reflow Soldering Profile for lead free soldering (acc. to J-STD-020C)
Wellenlöten (TTW) (nach CECC 00802)
TTW Soldering (acc. to CECC 00802)
OHLA0687
0
0
T
t
˚C
s
120 s max
50
100
150
200
250
300
Ramp Up
100 s max
50 100 150 200 250 300
Ramp Down
6 K/s (max)
3 K/s (max)
25 ˚C
30 s max
260 ˚C +0 ˚C
-5 ˚C
245 ˚C ±5 ˚C
240 ˚C
255 ˚C
217 ˚C
Maximum Solder Profile
Recommended Solder Profile
235 ˚C -0 ˚C
+5 ˚C
Minimum Solder Profile
10 s min
OHLY0598
0
050 100 150 200 250
50
100
150
200
250
300
T
t
C
s
235 C
10 s
C... 260
1. Welle
1. wave
2. Welle
2. wave
5 K/s 2 K/s
ca 200 K/s
CC... 130100
2 K/s Zwangskühlung
forced cooling
Normalkurve
standard curve
Grenzkurven
limit curves
SFH 4010
2008-10-20 9
Published by
OSRAM Opto Semiconductors GmbH
Wernerwerkstrasse 2, D-93049 Regensburg
www.osram-os.com
© All Rights Reserved.
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substances. For information on the types in question please contact our Sales Organization.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs
incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose! Critical
components 1 , may only be used in life-supp ort devices or systems 2 with the express written approval of OSRAM OS.
1 A critical componen t is a component usedin a life-support device or syste m whose failure can reasonably be expected
to cause the failure of that life-support devic e or system, or to a ffect its safety or e ffectiveness of that device or system.
2 Life support devices or syste ms are intended (a) to be implanted in the human body, o r (b) to support and/or maintain
and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.
