3M™ Thermal Bonding Film 615

Product Description

3M™ Thermal Bonding Film 615 is a flexible, light colored, thermoplastic adhesive bonding film which exhibits good

adhesion to a variety of substrates. The bonding film is supplied on a release coated paper liner.

Technical Data May 2014

Key Features

• Can be die-cut

• Consistent, uniform adhesive thickness

• Quick fixturing/holding strength

Note 2: Other thicknesses may be available upon request. Contact your local 3M sales representative for details.

Product 3M™ Thermal Bonding Film 615

Base Resin Polyester Thermoplastic (non-curing)

Adhesive Thickness 2.5 mil (0.06 mm)

4.0 mil (0.10 mm)

Liner Thickness 3.0 mil (0.08 mm) nominal

Color Translucent / Tan

Specific Gravity 1.00

Solids 100%

Ball and Ring Softening Range 116 to 123°C (240 to 250°F)

The type of equipment used to bond 3M™ Thermal Bonding Film (TBF) 615 will depend on the application and on the

type of equipment available for the user. Thin films and flexible substrates can be bonded using a heated roll laminator

where heat and pressure can be varied to suit the application. Larger, thicker substrates can be bonded using a heated

static press or, in some cases, an autoclave. For applications where a shaped adhesive is to be transferred to a flat or

three-dimensional part, a hot shoe or thermode method may be appropriate.

It is recommended that whatever method of bonding the user chooses, the user should determine the optimum

bonding conditions using the specific substrates involved.

Directions For Use

To make a bond using 3M TBF 615, the adhesive, with the liner in place, can be first tacked (lightly bonded) to one

of the substrates using low heat. The liner can then be removed, and placing the second substrate to the exposed

For optimum bonding, heat, pressure and dwell time will depend upon the type and thicknesses of the substrates being

bonded together.

A suggested starting point is to use a method which will result in an adhesive bondline temperature of 135°C (275°F)

for 2-5 seconds using 10-20 psi pressure.

For reference, the following tables show typical bond strengths for bonds made at various temperatures. Such tables

can be used to evaluate optimum bondline temperatures. It is very important to note that this table is valid only for

the specific substrates shown. Varying temperature, pressure, or substrates can affect bond strengths. User should

develop a similar table using the specific substrates involved.

Note: Temperatures shown are bondline temperatures and not heat block or roll settings.

• Bond strength determined using Instron tester at 0.2 in/minute

(0.5 cm/min).

• Oven bonding method 10 minutes, 4.5 psi (30 kPa) pressure.

• CRS is Cold Rolled Steel.

• PET is 2 mil polyester film.

• PI is 3 mil polyimide film.

• Bonds made using 5 second dwell, 5 lb gauge pressure.

• T-Peel adhesion is 90° peel pulled @ room temperature using Instron

tester @ 2 in/minute.

• Substrates used: Cold Rolled Steel (CRS), FR-4 PCB (FR-4),

Polycarbonate (PC), Aluminum (AL).

• Bonds made using 2 second dwell, 10 psi.

• Peels tested at 90° angle, 2 in/minute.

Typical Methods For Bonding 3M™ Thermal Bonding Film Adhesives

Solvents, such as acetone, MEK, toluene and 3M™ Citrus Base Cleaner will soften 3M TBF 615 and can be used to

remove excess adhesive in unwanted areas.* Soaking bonds in these solvents can also aid in debonding operations

where appropriate.

*Note: When using solvents, extinguish all ignition sources and follow the manufacturer’s precautions and directions

Oven (Static or Conveyorized) Bonding

• Overlap shear made bonding 20 mil aluminum to test substrates using 138°C (280°F) bondline temperature, 5 seconds dwell, 5 lbs gauge pressure.

• Peel bonds made bonding 4.5 mil aluminum foil to test substrates using 138°C (280°F) bondline temperature, 5 seconds dwell, 5 lbs gauge pressure.

• Adhesion tests done using Instron @ 2 in/minute for peel, .2 in/minute for OLS.

• NT – Not Tested.

Bond Strength Retention After Humidity Aging

• Bonds made bonding 1.5 mil copper foil bonded to 0.125 in polycarbonate @ 127°C (260°F), 5 second dwell, 5 lbs gauge pressure.

• Bonds tested by Instron peel @ 2 in/minute @ 90° peel angle.

21 days @ 95% RH / 85°C (185°F) 4.2 piw

Typical Performance Characteristics (continued)

Note: The following technical information and data should be considered representative or typical only and should not

be used for specification purposes.

Adhesion Strength TESTED at Various Temperatures

24°C (75°F) 11.0 piw 1130 psi

• OLS bonds made @ 138°C (280°F), 10 minutes oven, 5 lbs pressure.

• Adhesion determined using Instron tester @ 2 in/minute for peels, .2 in/minute for OLS.

Dielectric Constant ASTM D-150 4.4 @ 1 kilohertz

Thermal Data

Regulatory

For regulatory information about this product, contact your 3M representative.

Technical Information

The technical information, recommendations and other statements contained in this document are based upon tests

Limitation of Liability

Except where prohibited by law, 3M will not be liable for any loss or damage arising from the 3M product, whether

negligence or strict liability.

Warranty, Limited Remedy, and Disclaimer

Unless an additional warranty is specifically stated on the applicable 3M product packaging or product literature,

3M warrants that each 3M product meets the applicable 3M product specification at the time 3M ships the product.

3M MAKES NO OTHER WARRANTIES OR CONDITIONS, EXPRESS OR IMPLIED, INCLUDING, BUT NOT LIMITED TO, ANY

WARRANTY OR CONDITION ARISING OUT OF A COURSE OF DEALING, CUSTOM OR USAGE OF TRADE. If the 3M product

Safety Data Sheet