Technical Data May 2014 3MTM Thermal Bonding Film 615 Product Description 3MTM Thermal Bonding Film 615 is a flexible, light colored, thermoplastic adhesive bonding film which exhibits good adhesion to a variety of substrates. The bonding film is supplied on a release coated paper liner. Key Features *Can be die-cut *Consistent, uniform adhesive thickness * Quick fixturing/holding strength *100% solids *Excellent adhesion to many substrates Typical Physical Properties Note: T he following technical information and data should be considered representative or typical only and should not be used for specification purposes. Product 3MTM Thermal Bonding Film 615 Base Resin Polyester Thermoplastic (non-curing) Adhesive Thickness 2.5 mil (0.06 mm) 4.0 mil (0.10 mm) Liner Thickness Color 3.0 mil (0.08 mm) nominal Translucent / Tan Specific Gravity 1.00 Solids 100% Ball and Ring Softening Range 116 to 123C (240 to 250F) Tensile Strength @ Break 450 psi Elongation @ Break ~300% Two Lb. Dead Load Heat Resistance 102C (215F) Note 1:The data reported in this data sheet was determined using 4.0 mil film thickness 3MTM Thermal Bonding Film 615. Note 2:Other thicknesses may be available upon request. Contact your local 3M sales representative for details. 3MTM Thermal Bonding Film 615 Application Equipment Suggestions Note: Appropriate application equipment can enhance bonding film performance. We suggest the following equipment for the user's evaluation in light of the user's particular purpose and method of application. The type of equipment used to bond 3MTM Thermal Bonding Film (TBF) 615 will depend on the application and on the type of equipment available for the user. Thin films and flexible substrates can be bonded using a heated roll laminator where heat and pressure can be varied to suit the application. Larger, thicker substrates can be bonded using a heated static press or, in some cases, an autoclave. For applications where a shaped adhesive is to be transferred to a flat or three-dimensional part, a hot shoe or thermode method may be appropriate. It is recommended that whatever method of bonding the user chooses, the user should determine the optimum bonding conditions using the specific substrates involved. Directions For Use To make a bond using 3M TBF 615, the adhesive, with the liner in place, can be first tacked (lightly bonded) to one of the substrates using low heat. The liner can then be removed, and placing the second substrate to the exposed adhesive surface, make the final bond using heat and pressure. Alternatively, remove the liner and place the adhesive film between the two substrates and make the bond through heat and pressure using a heated press, a hot roll laminator, a hot shoe thermode method or similar equipment. Suggested TACKING Conditions 60C to 80C bondline temperature 1-2 seconds dwell time 5-10 psi (35-70 kPa) pressure For optimum bonding, heat, pressure and dwell time will depend upon the type and thicknesses of the substrates being bonded together. A suggested starting point is to use a method which will result in an adhesive bondline temperature of 135C (275F) for 2-5 seconds using 10-20 psi pressure. Suggested BEGINNING Bonding Conditions 130C to 150C bondline temperature 2-5 seconds dwell time 10-20 psi (70-140 kPa) pressure (2) 3MTM Thermal Bonding Film 615 Directions For Use (continued) One approach to establishing the correct/optimum bonding conditions for a user's application is to evaluate a series of bonding temperatures, for example 121, 135, 149, 163 and 177C (250, 275, 300, 325 and even 350F). Time and pressure will be dictated by the thickness of the substrate and the type of substrate being bonded. Thicker substrates and more difficult to bond surfaces will require longer times, higher pressures and higher temperatures. Once the bond is made, the bondline should be allowed to cool somewhat before stress is applied to the bond. Generally, cooling the bondline below 93C (200F) is adequate to allow the bonded parts to be unfixtured/unclamped and handled. For reference, the following tables show typical bond strengths for bonds made at various temperatures. Such tables can be used to evaluate optimum bondline temperatures. It is very important to note that this table is valid only for the specific substrates shown. Varying temperature, pressure, or substrates can affect bond strengths. User should develop a similar table using the specific substrates involved. Note: Temperatures shown are bondline temperatures and not heat block or roll settings. Overlap Shear Adhesive vs Bonding Temperature CRS/CRS Overlap Shear Bondline Temperature 3MTM Thermal Bonding Film 615 Peel Strengths of Bonds Made at Various Temperatures 3MTM Thermal Bonding Film 615 (4.0 mil) Bondline Temperature 110C (230F) 460 psi 121C (250F) 820 psi 132C (270F) 910 psi 143C (290F) 1070 psi 154C (310F) 1100 psi 166C (330F) 1090 psi T-Peel Adhesion of PET/PET and PI/PI Bonded at Various Temperatures 82C (180F) 91C (196F) 102C (216F) 113C (235F) 124C (256F) 136C (277F) 148C (298F) 157C (315F) 3MTM Thermal Bonding Film 615 (4.0 mil) PET/PET FR-4 AL PC AL 57C (135F) 0.4 piw 0.4 piw 0.2 piw 66C (150F) 0.4 piw 0.7 piw 0.2 piw 74C (165F) 0.9 piw 3.0 piw 0.5 piw 82C (180F) 1.7 piw 3.7 piw 1.0 piw 91C (195F) 3.3 piw 7.0 piw 2.9 piw 99C (210F) 2.1 piw 8.2 piw 4.0 piw 107C (225F) 8.4 piw 8.8 piw 3.6 piw 116C (240F) 9.2 piw 9.0 piw 8.8 piw 124C (255F) 8.6 piw 8.3 piw 9.3 piw 132C (270F) 8.7 piw 9.4 piw 8.6 piw 141C (285F) 7.9 piw 10.0 piw 9.4 piw 149C (300F) 7.8 piw 9.9 piw 9.6 piw 157C (315F) 8.5 piw 9.7 piw 9.9 piw 166C (330F) 9.7 piw 10.8 piw 9.9 piw 174C (345F) 10.6 piw 9.9 piw 10.7 piw 182C (360F) 10.5 piw 9.8 piw 9.3 piw *Bond strength determined using Instron tester at 0.2 in/minute (0.5 cm/min). * Oven bonding method 10 minutes, 4.5 psi (30 kPa) pressure. * CRS is Cold Rolled Steel. Bondline Temperature CRS AL 3MTM Thermal Bonding Film 615 (4.0 mil) PI/PI *Substrates used: Cold Rolled Steel (CRS), FR-4 PCB (FR-4), Polycarbonate (PC), Aluminum (AL). * Bonds made using 2 second dwell, 10 psi. *Peels tested at 90 angle, 2 in/minute. 0.3 piw 1.2 piw 0.6 piw 2.9 piw 1.3 piw 3.8 piw 1.8 piw 6.1 piw 3.6 piw 6.7 piw 5.2 piw 9.7 piw 6.4 piw 10.7 piw 8.0 piw 11.2 piw *PET is 2 mil polyester film. *PI is 3 mil polyimide film. * Bonds made using 5 second dwell, 5 lb gauge pressure. *T-Peel adhesion is 90 peel pulled @ room temperature using Instron tester @ 2 in/minute. (3) 3MTM Thermal Bonding Film 615 Typical Methods For Bonding 3MTM Thermal Bonding Film Adhesives The following illustrations show several of the many methods that can be used to make bonds using 3MTM Thermal Bonding Film (TBF) adhesives. Equipment is generally available commercially or can be built or modified by the user to fit a particular application. Hot Shoe or Thermode Bonding Oven (Static or Conveyorized) Bonding Heat/Pressure Heat/Pressure Hot Shore Hot Shore Clamp Clamp Substrate 1 Substrate 1 Thermal Bonding Film Thermal with linerBonding removedFilm with liner removed Substrate 2 Substrate 2 Substrate 1 Substrate 1 Thermal Bonding Film Thermal with linerBonding removedFilm with liner removed Place clamp Place clamp assembly assembly in oven in oven Substrate 2 Substrate 2 Good for small volume or startup bonding. Good for small volume or startup bonding. Generally used for small area bonding. Generally used for small area bonding. Lamination Bonding of Thin Substrates Hydraulic or Mechanical Press Bonding Substrate 1 Substrate 1 Thermal Bonding Film Thermal with linerBonding removedFilm with liner removed Substrate 2 Substrate 2 Substrate 1 Substrate 1 Thermal Bonding Film Thermal with linerBonding removedFilm with liner removed Substrate 2 Substrate 2 Useful in larger area applications. Useful in larger area applications. Suitable for thin, large area parts. Suitable for thin, large area parts. Debonding - Since 3MTM Thermal Bonding Film (TBF) 615 is a thermoplastic material, no curing during heating or aging occurs. To debond or open bonded parts, simply heat the bonded part to an adequate temperature (typically 135-149C / 275-300F) to soften the adhesive and then pry or peel the substrates apart. Solvents, such as acetone, MEK, toluene and 3MTM Citrus Base Cleaner will soften 3M TBF 615 and can be used to remove excess adhesive in unwanted areas.* Soaking bonds in these solvents can also aid in debonding operations where appropriate. *Note: W hen using solvents, extinguish all ignition sources and follow the manufacturer's precautions and directions for use. (4) 3MTM Thermal Bonding Film 615 Typical Performance Characteristics Note: T he following technical information and data should be considered representative or typical only and should not be used for specification purposes. Adhesion to Various Substrates Test Substrate Overlap Shear 3MTM Thermal Bonding Film 615 (4.0 mil) 90 Peel 3MTM Thermal Bonding Film 615 (4.0 mil) Cold Rolled Steel 840 psi 13.5 piw Stainless Steel 825 psi 16.0 piw Aluminum 810 psi 15.5 piw Polycarbonate 890 psi 11.5 piw Acrylic 905 psi 13.0 piw FR-4 PCB 930 psi 10.5 piw ABS 805 psi 10.5 piw HDPE 210 psi 3.5 piw Polypropylene 410 psi 0.7 piw PVC 915 psi 12.0 piw Fir Wood 360 psi NT LCP (Vectra A-130) NT 14.0 piw LCP (Vectra B-130) NT 11.0 piw LCP (Zenite 6130L) NT 13.0 piw Nylon 6,6 NT 9.5 piw PPS (Polyphenylene Sulfide) NT 7.5 piw *Overlap shear made bonding 20 mil aluminum to test substrates using 138C (280F) bondline temperature, 5 seconds dwell, 5 lbs gauge pressure. * Peel bonds made bonding 4.5 mil aluminum foil to test substrates using 138C (280F) bondline temperature, 5 seconds dwell, 5 lbs gauge pressure. *Adhesion tests done using Instron @ 2 in/minute for peel, .2 in/minute for OLS. * NT - Not Tested. Bond Strength Retention After Humidity Aging Copper to Polycarbonate Bonds 3MTM Thermal Bonding Film 615 (4.0 mil) Initial (Before Aging) 11.0 piw 6 days @ 95% RH / 66C (150F) 10.2 piw 21 days @ 95% RH / 66C (150F) 5.4 piw 6 days @ 95% RH / 85C (185F) 10.2 piw 21 days @ 95% RH / 85C (185F) 4.2 piw * Bonds made bonding 1.5 mil copper foil bonded to 0.125 in polycarbonate @ 127C (260F), 5 second dwell, 5 lbs gauge pressure. *Bonds tested by Instron peel @ 2 in/minute @ 90 peel angle. (5) 3MTM Thermal Bonding Film 615 Typical Performance Characteristics (continued) Note: T he following technical information and data should be considered representative or typical only and should not be used for specification purposes. Adhesion Strength TESTED at Various Temperatures Test Temperature 3MTM Thermal Bonding Film 615 (4.0 mil) Peel Strength Cu to PC 3MTM Thermal Bonding Film 615 (4.0 mil) Overlap Shear Strength CRS to CRS 24C (75F) 11.0 piw 1130 psi 45C (113F) 8.5 piw 220 psi 66C (150F) 1.8 piw 35 psi 85C (185F) 0.4 piw 20 psi 95C (203F) 0.2 piw 7 psi * Cu is 1.5 mil copper foil, PC is 0.125 in polycarbonate, CRS is Cold Rolled Steel. *Peel bonds made @ 127C (260F), 5 seconds dwell, 5 lbs pressure. *OLS bonds made @ 138C (280F), 10 minutes oven, 5 lbs pressure. * Adhesion determined using Instron tester @ 2 in/minute for peels, .2 in/minute for OLS. Electrical Data Test 3MTM Thermal Bonding Film 615 (4.0 mil) Method Value Dielectric Constant ASTM D-150 4.4 @ 1 kilohertz 4.4 @ 3 kilohertz Dissipation Factor ASTM D-150 0.018 @ 10 kilohertz 0.018 @ 100 kilohertz 0.017 @ 1000 kilohertz Dielectric Breakdown Strength ASTM D-149 520 volts/mil Surface Resistivity ASTM D-257 2 x 1013 ohms/sq. Volume Resistivity ASTM D-257 6 x 1014 ohm-cm Thermal Data Test 3MTM Thermal Bonding Film 615 (4.0 mil) Method Value Weight Loss By TGA Perkin-Elmer Series 7 (Thermal gravametric analysis) RT to 800C, 5C/min, in air Coefficient of Thermal Expansion By TMA (Thermal mechanical analysis) Perkin-Elmer Series 7 -60C to 125C @ 10C/min (6) 1% wt loss @ 202C 5% wt loss @ 268C 10% wt loss @ 307C 102 x 10-6 unit/unit/C (-60C to 20C) 3MTM Thermal Bonding Film 615 Storage and Shelf Life Storage: Store in a dry (preferably < 50% RH) location at 2C (35F) to 27C (80F). Shelf Life: Shelf life is 2 years from the date of shipment under storage conditions mentioned above. Safety Data Sheet Please consult Safety Data Sheet prior to use. Important Note Please consult Federal, State, and Local Regulations. State Volatile Organic Compound (VOC) regulations may prohibit the use of certain alcohol solutions or solvents. You should check with your state environmental authorities to determine whether use of a solution or solvent is restricted or prohibited. Regulatory For regulatory information about this product, contact your 3M representative. Technical Information The technical information, recommendations and other statements contained in this document are based upon tests or experience that 3M believes are reliable, but the accuracy or completeness of such information is not guaranteed. Product Use Many factors beyond 3M's control and uniquely within user's knowledge and control can affect the use and performance of a 3M product in a particular application. Given the variety of factors that can affect the use and performance of a 3M product, user is solely responsible for evaluating the 3M product and determining whether it is fit for a particular purpose and suitable for user's method of application. 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