Agilent ADNB-6011 and ADNB-6012 High Performance Laser Mouse Bundles Datasheet Description The Agilent ADNB-6011 and ADNB-6012 laser mouse bundles are the world's first laser-illuminated systems enabled for high performance navigation. Driven by Agilent's LaserStream Technology, the mouse can operate on many surfaces that prove difficult for traditional LED-based optical navigation. Its highperformance architecture is capable of sensing high-speed mouse motion - with resolution up to 2000 counts per inch, velocities up to 45 inches per second (ips) and accelerations up to 20G. This sensor is powered for the extremely high sensitive user. The ADNS-6010 sensor along with the ADNS-6120 or ADNS6130-001 lens, ADNS-6230-001 clip and ADNV-6330 laser diode form a complete and compact laser mouse tracking system. There are no moving parts, which means high reliability and less maintenance for the end user. In addition, precision optical alignment is not required, facilitating high volume assembly. Agilent Lasers must be used with Agilent sensors and lenses to ensure proper product operation and compliance to eye safety regulations. This document will begin with some general information and usage guidelines on the bundles, followed by individual detailed information on ADNS6010 laser mouse sensor, ADNV-6330 VCSEL, ADNS6120 and ADNS-6130-001 lenses, and ADNS-6230-001 clip. ADNB-6011 and ADNB- 6012 High Performance Laser Mouse Bundles include: Bundle Part Number Part Number Description ADNB-6011 ADNS-6010 Laser Mouse Sensor ADNV-6330 Single-Mode Vertical-Cavity Surface Emitting Laser (VCSEL) ADNS-6120 Laser Mouse Round Lens ADNS-6230-001 Laser Mouse VCSEL Assembly Clip Bundle Part Number Part Number Description ADNB-6012 ADNS-6010 Laser Mouse Sensor ADNV-6330 Single-Mode Vertical-Cavity Surface Emitting Laser (VCSEL) ADNS-6130-001 Laser Mouse Trim Lens ADNS-6230-001 Laser Mouse VCSEL Assembly Clip Overview of Laser Mouse Sensor Assembly Figure 1. Assembly drawing of ADNB-6011 (top, front and cross-sectional view) 2 2D Assembly Drawing of ADNB-6011, PCBs and Base Plate Customer Supplied VCSEL PCB ADNS-6010 (sensor) ADNV-6330 (VCSEL) Customer Supplied PCB ADNS-6230-001 (clip) ADNS-6120 (lens)* Customer Supplied Base Plate With Recommended Features Per IGES Drawing *or ADNS-6130-001 for trim lens Figure 2. Exploded view drawing Shown with ADNS-6120 or ADNS-6130-001 Laser Mouse Lens, ADNS-6230-001 VCSEL Assembly Clip and ADNV-6330 VCSEL. The components interlock as they are mounted onto defined features on the base plate. The ADNS-6010 laser mouse sensor is designed for mounting on a through hole PCB, looking down. There is an aperture stop and features on the package that align to the lens. The ADNV-6330 VCSEL provides a laser diode with a single longitudinal and a single transverse mode. It is particularly suited as lower power consumption and highly 3 coherent replacement of LEDs. It also provides wider operation range while still remaining within single-mode, reliable operating conditions. The ADNS-6120 or ADNS6130-001 Laser Mouse Lens is designed for use with ADNS6010 sensor and the illumination subsystem provided by the VCSEL assembly clip and the VCSEL. Together with the VCSEL, the ADNS-6120 or ADNS-6130-001 lens provides the directed illumination and optical imaging necessary for proper operation of the Laser Mouse Sensor. ADNS-6120 or ADNS6130-001 is a precision molded optical component and should be handled with care to avoid scratching of the optical surfaces. ADNS-6120 has a large round flange to provide a long creepage path for any ESD events that occur at the opening of the base plate. The ADNS-6230-001 VCSEL Assembly Clip is designed to provide mechanical coupling of the ADNV-6330 VCSEL to the ADNS-6120 or ADNS-6130-001 lens. This coupling is essential to achieve the proper illumination alignment required for the sensor to operate on a wide variety of surfaces. Agilent Technologies provides an IGES file drawing describing the base plate molding features for lens and PCB alignment. Assembly Recommendation 1. Insert the sensor and all other electrical components into the application PCB (main PCB board and VCSEL PCB board). 2. Wave solder the entire assembly in a no-wash solder process utilizing a solder fixture. The solder fixture is needed to protect the sensor during the solder process. It also sets the correct sensor-to -PCB distance, as the lead shoulders do not normally rest on the PCB surface. The fixture should be designed to expose the sensor leads to solder while shielding the optical aperture from direct solder contact. 3. Place the lens onto the base plate. 7. Insert the VCSEL assembly into the lens. 4. Remove the protective kapton tape from the optical aperture of the sensor. Care must be taken to keep contaminants from entering the aperture. 8. Slide the clip in place until it latches. This locks the VCSEL and lens together. 5. Insert the PCB assembly over the lens onto the base plate. The sensor aperture ring should self-align to the lens. The optical position reference for the PCB is set by the base plate and lens. Note that the PCB motion due to button presses must be minimized to maintain optical alignment. 6. Remove the protective kapton tape from the VCSEL. Figure 3. Recommended PCB mechanical cutouts and spacing 4 9. Tune the laser output power from the VCSEL to meet the Eye Safe Class I Standard as detailed in the LASER Power Adjustment Procedure. 10. Install the mouse top case. There must be a feature in the top case (or other area) to press down onto the sensor to ensure the sensor and lens are interlocked to the correct vertical height. Design considerations for improving ESD Performance VCSEL PCB For improved electrostatic discharge performance, typical creepage and clearance distance are shown in the table below. Assumption: base plate construction as per the Agilent supplied IGES file and ADNS-6130-001 trim lens (or ADNS-6120 round lens). Typical Distance Millimeters Creepage 12.0 Clearance 2.1 SENSOR LENS CLIP VCSEL BASE PLATE PCB Figure 4. Cross section of PCB assembly The lens flange can be sealed (i.e. glued) to the base plate. Note that the lens material is polycarbonate and therefore, cyanoacrylate based adhesives or other adhesives that may damage the lens should NOT be used. 16 KBit EEPROM (optional) R7 100K 3.3V Regulator +3.3V Buttons 1 SW2 6 middle __ VCC ___ WP ____ HLD CS SCLK SW1 5 2 right SW3 SI S0 left Vcc USB microcontroller 8 3 Vout Vin 3 Gnd C7 4.7 C5 0.1 7 C4 0.1 2 4 U1 25LC160A C1 0.1 16 18 GND P1.1 USB Port P1.6 17 P1.7 VBUS GND D+ D- 1 P0.5 * 16 3 15 4 22 2 23 4 MISO 3 R9 6 P0.2 7 4 D+/SCLK P1.4 11 7 R1 20K 12 1 P0.1 2 10 Vreg C8 2.2 15 OSC_IN N/C Vcc VPP 1 9 QA QB SW4 ALPS EC10E 2 Scroll wheel encoder R4 20K Figure 5. Schematic Diagram for 3-Button Scroll Wheel USB PS/2 Mouse Rbin Selected to match laser D1 VCSEL 20 14 8 X1 Murata 24 CSALS24MOX53-B0 MHz 9 GUARD RBIN C9 0.1 12 LASER_NEN N/C R6 2.7K REFB NPD OSC_OUT 10 3 XTALIN/P2.1 R3 20K 5 RESET Vcc P0.0 GND * Outputs configured as open drain 5 13 XTALOUT 11 XY_LASER R2 20K 18 13 C10 470pF Q2 2N3906 19 REFC 10 K P1.5 R5 1.30K C3 0.1 17 NCS P0.4 * R10 10 K D-/SDAT MOSI 1 24 P0.3 2 GND SCLK ADNS-6010 P0.6 P1.3 CYPRESS CY7C63743-PXC 8 3 P0.7 * 21 P1.2 Vcc C2 0.1 P1.0 6 19 VDD3 VDD3 Vcc 5 C6 4.7 GND 14 20 Vcc U4 LP2950ACZ-3.3 1 Optional Ground Plane Notes (for Figure 5) * Caps for pins 11, 12, 16 and 18 MUST have trace lengths LESS than 5 mm on each side. * Pins 16 and 18 caps MUST use pin 17 GND. * Pin 9, if used, should not be connected to PCB GND to reduce potential RF emissions. * The 0.1 uF caps must be ceramic. * Caps should have less than 5 nH of self inductance. * Caps should have less than 0.2 W ESR. * NC pins should not be connected to any traces. * Surface mount parts are recommended. * Care must be taken when interfacing a 5V microcontroller to the ADNS-6010. Serial port inputs on the sensor should be connected to open-drain outputs from the microcontroller or use an active drive level shifter. NPD and RESET should be connected to 5V microcontroller outputs through a resistor divider or other level shifting technique. * VDD3 and GND should have low impedance connections to the power supply. * Because the RBIN pin sets the XY_LASER current, the following PC board layout practices should be followed to reduce the chance of uncontrolled laser drive current caused from a leakage path between RBIN and ground. One hypothetical source of such a leakage path is PC board contamination due to a liquid, such as a soft drink, being deposited on the printed circuit board. o The RBIN resistor should be located close to the sensor pin 13. The traces between the resistor and the sensor should be short. o The pin 13 solder pad and all exposed conductors connected to pin 13 should be surrounded by a guard trace connected to VDD3 and devoid of a solder mask. o The pin 13 solder pad, the traces connected to pin 13, and the RBIN resistor should be covered with a conformal coating. o The RBIN resistor should be a thru-hole style to increase the distance between its terminals. This does not apply if a conformal coating is used. Laser Bin Table Bin Number Rbin Resistor Value (kohm) Match_Bit (Reg 0x2C, Bit7) 2A 18.7 0 3A 12.7 0 LASER Drive Mode The LASER has 2 modes of operation: DC and Shutter. In DC mode, the LASER is on at all times the chip is powered except when in the power down mode via the NPD pin. In shutter mode the LASER is on only during the portion of the frame that light is required. The LASER mode is set by the LASER_MODE bit in the Configuration_bits register. For optimum product lifetime, Agilent recommends the default Shutter mode setting (except for calibration and test). Eye Safety The ADNS-6010 and the associated components in the schematic of Figure 5 are intended to comply with Class 1 Eye Safety Requirements of IEC 60825-1. Agilent Technologies suggests that manufacturers perform testing to verify eye safety on each mouse. It is also recommended to review possible single fault mechanisms beyond those described below in the section "Single Fault Detection". Under normal conditions, the ADNS-6010 generates the drive current for the laser diode (ADNV-6330). In order to stay below the Class 1 power requirements, resistor Rbin must be set at least as high as the value in the bin table of Figure 5, based on the bin number of the laser diode and LP_CFG0 and LP_CFG1 must be programmed to appropriate 6 values. Agilent recommends using the exact Rbin value specified in the bin table to ensure sufficient laser power for navigation. The system comprised of the ADNS-6010 and ADNV-6330 is designed to maintain the output beam power within Class 1 requirements over component manufacturing tolerances and the recommended temperature range when adjusted per the procedure below and when implemented as shown in the recommended application circuit of Figure 5. For more information, please refer to Agilent ADNB-6001, ADNB6002, ADNB-6011 and ADNB6012 Laser Mouse Eye Safety Calculation Application Note 5088. LASER Power Adjustment Procedure 1. The ambient temperature should be 25C +/- 5C. 2. Set VDD3 to its permanent value. 3. Ensure that the laser drive is at 100% duty cycle. 4. Program the LP_CFG0 and LP_CFG1 registers to achieve an output power as close to 506uW as possible without exceeding it. Good engineering practices should be used to guarantee performance, reliability and safety for the product design. Agilent has additional information and detail, such as firmware practices, PCB layout suggestions, and manufacturing procedures and specifications that could be provided. Parameter Symbol Laser output power LOP Minimum Maximum Units Notes 716 uW Per conditions above LASER Output Power Disabling the LASER The laser beam output power as measured at the navigation surface plane is specified below. The following conditions apply: LASER_NEN is connected to the base of a PNP transistor which when ON connects VDD3 to the LASER. In normal operation, LASER_NEN is low. In the case of a fault condition (ground at XY_LASER or RBIN), LASER_NEN goes high to turn the transistor off and disconnect VDD3 from the LASER. 1. The system is adjusted according to the above procedure. 2. The system is operated within the recommended operating temperature range. 3. The VDD3 value is no greater than 50mV above its value at the time of adjustment. 4. No allowance for optical power meter accuracy is assumed. Single Fault Detection ADNS-6010 is able to detect a short circuit, or fault, condition at the RBIN and XY_LASER pins, which could lead to excessive laser power output. A low resistance path to ground on either of these pins will trigger the fault detection circuit, which will turn off the laser drive current source and set the LASER_NEN output high. When used in combination with external components as shown in the block diagram below, the system will prevent excess laser power for a single short to ground at RBIN or XY_LASER by shutting off the laser. Refer to the PC board layout notes for recommendations to reduce the chance of high resistance paths to ground existing due to PC board contamination. In addition to the continuous fault detection described above, an additional test is executed automatically whenever the LP_CFG0 register is written to. This test will check for a short to ground on the XY_LASER pin, a short to VDD3 on the XY_LASER pin, and will test the fault detection circuit on the XY_LASER pin. VDD3 Microcontroller ADNS-6010 LASER DRIVER RESET LASER_NEN VDD3 fault control block LASER XY_LASER voltage sense NPD current set RBIN GND Figure 6. Single Fault Detection and Eye-safety Feature Block Diagram 7 Agilent ADNS-6010 Laser Mouse Sensor Theory of Operation The ADNS-6010 is based on LaserStream Technology, which measures changes in position by optically acquiring sequential images (frames) and mathematically determining the direction and magnitude of movement. ADNS-6010 contains an Image Acquisition System (IAS), a Digital Signal Processor (DSP), and a four wire serial port. The IAS acquires microscopic surface images via the lens and illumination system. These images are processed by the DSP to determine the direction and distance of motion. The DSP calculates the x and y relative displacement values. An external microcontroller reads the x and y information from the sensor serial port. The microcontroller then translates the data into PS2 or USB signals before sending them to the host PC or game console. Applications * Mice for game consoles and computer games * Mice for desktop PC's, Workstations, and portable PC's * Laser Trackballs * Integrated input devices Pinout TOP VIEW NCS 1 MISO 2 SCLK 3 MOSI 4 NC 5 RESET 6 NPD 7 OSC_OUT 8 GUARD 9 OSC_IN 10 A6010 XYYWWZ 20 LASER_NEN 19 GND 18 VDD3 17 GND 16 VDD3 15 NC 14 XY_LASER 13 RBIN 12 REFB 11 REFC PINOUT Figure 7. Package outline drawing (top view) 8 Features * High speed motion detection - up to 45 ips and 20G * New LaserStream architecture for greatly improved optical navigation technology * Programmable frame rate over 7080 frames per second * SmartSpeed self-adjusting frame rate for optimum performance * Serial port burst mode for fast data transfer * 400, 800, 1600 or 2000 cpi selectable resolution * Single 3.3 volt power supply * Four-wire serial port along with Power Down, and Reset pins * Laser fault detect circuitry onchip for Eye Safety Compliance Pin Name Description 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 NCS MISO SCLK MOSI NC RESET NPD OSC_OUT GUARD OSC_IN REFC REFB RBIN XY_LASER NC VDD3 GND VDD3 GND LASER_NEN Chip select (active low input) Serial data output (Master In/Slave Out) Serial clock input Serial data input (Master Out/Slave In) No Connection Reset input Power down (active low input) Oscillator output Oscillator GND for PCB guard (optional) Oscillator input Reference capacitor Reference capacitor Set XY_LASER current LASER current output No Connection Supply voltage Ground Supply voltage Ground Laser enable (active low) A A SECTION A-A Notes. 1. Dimensions in millimeters (inches) 2. Dimenstional tolerance: 0.1 mm 3. Coplanarity of leads: 0.1 mm 4. Lead pitch tolerance: 0.15 mm 5. Cummulative pitch tolerance. 0.15 mm 6. Angular tolerance: 3.0 7. Maximum flash +0.2 mm 8. Chamfer (25 x 2) on the taper side of the lead Figure 8. Package outline drawing CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD 9 External PROM * Passes IEC-1000-4-3 radiated susceptibility level when assembled into a mouse with shielded cable and following Agilent recommendations. * Passes EN61000-4-4/IEC8014 EFT tests when assembled into a mouse with shielded cable and following Agilent recommendations. * UL flammability level UL94 V-0. 10 RESONATOR OSCILLATOR OSC_OUT MOSI MISO REFB IMAGE PROCESSOR CTRL RESET VOLTAGE REGULATOR AND POWER CONTROL SCLK REFC REFERENCE VOLTAGE FILTER NODE NPD V DD3 3.3 V POWER GND XY_LASER LASER DRIVER RBIN LASER_NEN Figure 9. Block diagram of ADNS-6010 optical mouse sensor VCSEL VCSEL PCB VCSEL Clip Sensor Regulatory Requirements * Passes FCC B and worldwide analogous emission limits when assembled into a mouse with shielded cable and following Agilent recommendations. OSC_IN NCS Serial Port The ADNS-6010 must operate from externally loaded programming. This architecture enables immediate adoption of new features and improved performance algorithms. The external program is supplied by Agilent as a file, which may be burned into a programmable device. The example application shown in this document uses an EEPROM to store and load the external program memory. A micro-controller with sufficient memory may be used instead. On power-up and reset, the ADNS-6010 program is downloaded into volatile memory using the burst-mode procedure described in the Synchronous Serial Port section. The program size is 1986 x 8 bits. Sensor PCB 2.40 0.094 Lens Figure 10. Distance from lens reference plane to surface Surface Absolute Maximum Ratings Parameter Symbol Minimum Maximum Units Notes Storage Temperature TS -40 85 O Operating Temperature TA -15 55 O 260 O 3.7 V 2 kV All pins, human body model MIL 883 Method 3015 VDD3+0.5 V NPD, NCS, MOSI, SCLK, RESET, OSC_IN, OSC_OUT, REFC, RBIN Lead Solder Temp Supply Voltage VDD3 -0.5 ESD C C C For 10 seconds, 1.6mm below seating plane. Input Voltage VIN Output current IOUT 7 mA MISO, LASER_NEN Input Current IIN 11 mA XY_LASER -0.5 Recommended Operating Conditions Parameter Symbol Minimum Operating Temperature TA 0 Power supply voltage VDD3 3.10 Power supply rise time VRT 1 Supply noise (Sinusoidal) VNB Oscillator Frequency fCLK Serial Port Clock Frequency Resonator Impedance Typical Maximum Units 40 C 3.60 Volts 3.30 Notes us 0 to 3.0V 30 80 mV p-p 10kHz- 300KHZ 300KHz-50MHz 25 MHz Set by ceramic resonator fSCLK 2 500 MHz kHz Active drive, 50% duty cycle Open drain drive with pullups on, 50 pF load XRES 55 2.62 mm Distance from lens Z reference plane to surface 23 2.18 24 2.40 Results in +/- 0.2 mm minimum DOF, see Figure 10 Speed S 45 in/sec Acceleration A 20 G Frame Rate FR 2000 7080 Frames/s See Frame_Period register section Resistor value for LASER Drive Current set Rbin See Bin Table in Figure 5 Voltage at XY_LASER Vxy_laser 0.7 11 kOhms VDD3 V ADNV-6330 VCSEL AC Electrical Specifications Electrical Characteristics over recommended operating conditions. Typical values at 25 C, VDD3=3.3V, fclk=24MHz. Parameter Symbol Minimum Typical VDD to RESET tOP 250 s From VDD = 3.0V to RESET sampled Data delay after RESET tPU-RESET 180 ms From RESET falling edge to valid motion data at 2000 fps and shutter bound 20k. Input delay after reset TIN-RST 550 s From RESET falling edge to inputs active (NPD, MOSI, NCS, SCLK) Power Down tPD 600 s From NPD falling edge to initiate the power down cycle at 2000 fps (tpd = 1 frame period + 100s ) Wake from NPD tPUPD 75 ms From NPD rising edge to valid motion data at 2000 fps and shutter bound 20k. Max assumes surface change while NPD is low Data delay after NPD tCOMPUTE 3.1 ms From NPD rising edge to all registers contain data from new images at 2000 fps (See Figure 11). RESET pulse width tPW-RESET MISO rise time tr-MISO 40 200 ns CL = 50pF MISO fall time tf-MISO 40 200 ns CL = 50pF MISO delay after SCLK tDLY-MISO 120 ns From SCLK falling edge to MISO data valid, no load conditions MISO hold time thold-MISO 250 ns Data held until next falling SCLK edge MOSI hold time thold-MOSI 200 ns Amount of time data is valid after SCLK rising edge MOSI setup time tsetup-MOSI 120 ns From data valid to SCLK rising edge SPI time between write commands tSWW 50 s From rising SCLK for last bit of the first data byte, to rising SCLK for last bit of the second data byte. SPI time between write and read commands tSWR 50 s From rising SCLK for last bit of the first data byte, to rising SCLK for last bit of the second address byte. SPI time between read and subsequent commands tSRW tSRR 250 ns From rising SCLK for last bit of the first data byte, to falling SCLK for first bit of the second address byte. SPI read addressdata delay tSRAD 50 s From rising SCLK for last bit of the address byte, to falling SCLK for first bit of data being read. All registers except Motion & Motion_Burst SPI motion read address-data delay tSRAD-MOT 75 s From rising SCLK for last bit of the address byte, to falling SCLK for first bit of data being read. Applies to 0x02 Motion, and 0x50 Motion_Burst, registers NCS to SCLK active tNCS-SCLK 120 ns From NCS falling edge to first SCLK rising edge SCLK to NCS inactive tSCLK-NCS 120 ns From last SCLK falling edge to NCS rising edge, for valid MISO data transfer ns From NCS rising edge to MISO high-Z state tCOMPUTE Maximum Units Notes s 10 NCS to MISO high-Z tNCS-MISO 250 PROM download and frame capture byte-to-byte delay tLOAD 10 s (See Figure 24 and 25) NCS to burst mode exit tBEXIT 4 s Time NCS must be held high to exit burst mode Transient Supply Current IDDT mA Max supply current during a VDD3 ramp from 0 to 3.6 V Input Capacitance C pF OSC_IN, OSC_OUT 12 IN 68 14-22 DC Electrical Specifications Electrical Characteristics over recommended operating conditions. Typical values at 25 C, VDD3=3.3 V. Parameter Symbol Minimum Typical Maximum Units Notes DC Supply Current IDD_AVG 53 mA DC average at 7080 fps. No DC load on XY_LASER, MISO. Power Down Supply Current IDDPD 90 A NPD=GND; SCLK, MOSI, NCS=GND or VDD3; RESET=0V or GND Input Low Voltage VIL 0.8 V SCLK, MOSI, NPD, NCS, RESET Input High Voltage VIH V SCLK, MOSI, NPD, NCS, RESET Input hysteresis VI_HYS 200 mV SCLK, MOSI, NPD, NCS, RESET Input current, pull-up disabled IIH_DPU 0 10 A Vin=0.8*VDD3, SCLK, MOSI, NCS Input current, CMOS inputs IIH 0 10 A NPD, RESET, Vin=0.8*VDD3 Output current, pulled-up inputs IOH_PU 300 600 A Vin=0.2V, SCLK, MOSI, NCS; See bit 2 in Extended_Config register XY_LASER Current ILAS A Vxy_laser >= 0.7 V LP_CFG0 = 0x00, LP_CFG1 = 0xFF XY_LASER Current (fault mode) ILAS 500 uA Rbin < 50 Ohms, or VXY_LASER <0.2V Output Low Voltage, MISO, LASER_NEN VOL 0.5 V Iout=2mA, MISO Iout= 1mA, LASER_NEN Output High Voltage, MISO, LASER_NEN VOH V Iout=-2mA, MISO Iout= -0.5 mA, LASER_NEN XY_LASER Current (no Rbin) ILAS_NRB mA Rbin = open 5 0.7 * VDD3 150 146/Rbin 0.8*VDD3 1 NPD Reset Count Oscillator Start 250 us 340 us Frame 1 Frame 2 Frame 3 Frame 4 Frame 5 LASER CURRENT (shutter mode) SCLK 590 us Optional SPI transactions with old image data tCOMPUTE = 590us + 5 Frame Periods Figure 11. NPD Rising Edge Timing Detail 13 "Motion" bit set if motion was detected. First read dX = dY = 0 Typical Performance Characteristics Resolution (counts/inch) Typical Resolution vs. Z 2400 Black Formica 2000 White Melamine Bookshelf Manila Z Photo Paper 1600 DOF 1200 DOF 800 Recommended Operating Region 400 0 1.5 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 Distance from Lens Refremce Plane to Surface, Z (mm) Figure 12. Mean Resolution vs. Z at 2000cpi Typical Path Deviation Largest Single Perpendicular Deviation From A Straight Line At 45 Degrees Path Length = 4 inches; Speed = 6 ips ; Resolution = 2000 cpi Maximun Distance (mouse count) 50 Black Formica 45 White Melamine Bookshelf Manila Photo Paper 40 35 30 25 20 15 10 5 0 1.5 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 Distance From Lens Reference Plane To Navigation Surface (mm) Relationship of mouse count to distance = m (mouse count) / n (cpi) eg: Deviation of 7 mouse count = 7/800 = 0.00875 inch ~ 0.009 inch; where m = 7, n = 800 Figure 13. Average Error vs. Distance at 2000cpi (mm) Average Supply Current vs. Frame Rate VDD = 3.6 V 100.0% 100% 90.0% Relative Current 94% 80.0% 79% 70.0% 60.0% 60% 50.0% 50% 40.0% 30.0% 2000 3000 4000 5000 Frame Rate (Hz) Figure 14. Average Supply Current vs. Frame Rate 14 6000 7000 8000 Relative Responsivity for ADNS-6010 1 0.9 0.8 Relative responsivity 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 400 500 600 700 Wavelength (nm) 800 900 1000 Figure 15. Relative Responsivity Synchronous Serial Port The synchronous serial port is used to set and read parameters in the ADNS-6010, and to read out the motion information. The serial port is also used to load PROM data into the ADNS-6010. The port is a four wire port. The host micro-controller always initiates communication; the ADNS6010 never initiates data transfers. The serial port cannot be activated while the chip is in power down mode (NPD low) or reset (RESET high). SCLK, MOSI, and NCS may be driven directly by a 3.3V output from a microcontroller, or they may be driven by an open drain configuration by enabling onchip pull-up current sources. The open drain drive allows the use of a 5V micro- 15 controller without any level shifting components. The port pins may be shared with other SPI slave devices. When the NCS pin is high, the inputs are ignored and the output is tristated. The lines that comprise the SPI port are: SCLK: Clock input. It is always generated by the master (the micro-controller.) MOSI: Input data. (Master Out/Slave In) MISO: Output data. (Master In/Slave Out) NCS: Chip select input (active low). NCS needs to be low to activate the serial port; otherwise, MISO will be high Z, and MOSI & SCLK will be ignored. NCS can also be used to reset the serial port in case of an error. Chip Select Operation The serial port is activated after NCS goes low. If NCS is raised during a transaction, the entire transaction is aborted and the serial port will be reset. This is true for all transactions including PROM download. After a transaction is aborted, the normal address-to-data or transaction-to-transaction delay is still required before beginning the next transaction. To improve communication reliability, all serial transactions should be framed by NCS. In other words, the port should not remain enabled during periods of nonuse because ESD and EFT/B events could be interpreted as serial communication and put the chip into an unknown state. In addition, NCS must be raised after each burstmode transaction is complete to terminate burst-mode. The port is not available for further use until burst-mode is terminated. Write Operation Read Operation Write operation, defined as data going from the microcontroller to the ADNS-6010, is always initiated by the micro-controller and consists of two bytes. The first byte contains the address (seven bits) and has a "1" as its MSB to indicate data direction. The second byte contains the data. The ADNS-6010 reads MOSI on rising edges of SCLK. A read operation, defined as data going from the ADNS6010 to the micro-controller, is always initiated by the microcontroller and consists of two bytes. The first byte contains the address, is sent by the micro-controller over MOSI, and has a "0" as its MSB to indicate data direction. The second byte contains the data and is driven by the ADNS6010 over MISO. The sensor outputs MISO bits on falling edges of SCLK and samples MOSI bits on every rising edge of SCLK. SCLK NOTE: The 250 ns minimum high state of SCLK is also the minimum MISO data hold time of the ADNS-6010. Since the falling edge of SCLK is actually the start of the next read or write command, the ADNS6010 will hold the state of data on MISO until the falling edge of SCLK. MOSI t Hold,MOSI tsetup , MOSI Figure 16. MOSI Setup and Hold Time NCS 1 2 1 A 3 4 5 6 7 8 9 10 12 11 13 15 14 16 1 2 1 A SCLK MOSI A 6 5 A 4 A 3 A 2 A A 1 D 0 7 D 6 D D 5 D 4 D 3 2 D 1 D 0 MISO MOSI Driven by Micro Figure 17. Write Operation NCS SCLK Cycle # 1 2 3 4 5 6 7 A6 A5 A4 A3 A2 A1 8 9 10 D7 D6 11 12 13 14 D4 D3 D2 15 16 SCLK MOSI 0 MISO Figure 18. Read Operation 16 A0 tSRAD delay D5 D1 D0 6 Required timing between Read and Write Commands (tsxx) There are minimum timing requirements between read and write commands on the serial port. SCLK t HOLD-MISO t DLY-MISO MISO D0 If the rising edge of the SCLK for the last data bit of the second write command occurs before the 50 microsecond required delay, then the first write command may not complete correctly. operation SCLK should be delayed after the last address data bit to ensure that the ADNS-6010 has time to prepare the requested data. If the rising edge of SCLK for the last address bit of the read command occurs before the 50 microsecond required delay, the write command may not complete correctly. Burst mode is a special serial port operation mode which may be used to reduce the serial transaction time for three predefined operations: motion read and PROM download and frame capture. The speed improvement is achieved by continuous data clocking to or from multiple registers without the need to specify the register address, and by not requiring the normal delay period between data bytes. Burst Mode Operation The falling edge of SCLK for the first address bit of either the read or write command must be at least 250 ns after the last SCLK rising edge of the last data bit of the previous read operation. In addition, during a read Figure 19. MISO Delay and Hold Time tSWW 50 s SCLK Address Data Address Write Operation Data Write Operation Figure 20. Timing between two write commands t SWR 50 s SCLK Address Data Address Write Operation Next Read Operation Figure 21. Timing between write and read commands t t SRAD SRAD MOT 50 s for non-motion read 75 s for register 0x02 tSRW & tSRR >250 ns SCLK Address Data Read Operation Figure 22. Timing between read and either write or subsequent read commands 17 Address Next Read or Write Operation Motion Read PROM Download Reading the Motion_Burst register activates this mode. The ADNS-6010 will respond with the contents of the Motion, Delta_X, Delta_Y, SQUAL, Shutter_Upper, Shutter_Lower, and Maximum_Pixel registers in that order. After sending the register address, the microcontroller must wait tSRAD-MOT and then begin reading data. All 64 data bits can be read with no delay between bytes by driving SCLK at the normal rate. The data are latched into the output buffer after the last address bit is received. After the burst transmission is complete, the micro-controller must raise the NCS line for at least tBEXIT to terminate burst mode. The serial port is not available for use until it is reset with NCS, even for a second burst transmission. This function is used to load the Agilent-supplied firmware file contents into the ADNS6010. The firmware file is an ASCII text file with each 2character byte on a single line. The following steps activate this mode: 1. Perform hardware reset by toggling the RESET pin 2. Write 0x1D to register 0x14 (SROM_Enable register) 3. Wait at least 1 frame period 4. Write 0x18 to register 0x14 (SROM_Enable register) 5. Begin burst mode write of data file to register 0x60 (SROM_Load register) After the first data byte is complete, the PROM or microcontroller must write subsequent bytes by presenting the data on the MOSI line and driving SCLK at the normal rate. A delay of at least tLOAD must exist between data bytes as shown. After the download is complete, the microcontroller must raise the NCS line for at least tBEXIT to terminate burst mode. The serial port is not available for use until it is reset with NCS, even for a second burst transmission. Agilent recommends reading the SROM_ID register to verify that the download was successful. In addition, a self-test may be executed, which performs a CRC on the SROM contents and reports the results in a register. The test is initiated by writing a particular value to the SROM_Enable register; the result is placed in the Data_Out register. See those register descriptions for more details. Agilent provides the data file for download; the file size is 1986 data bytes. The chip will ignore any additional bytes written to the SROM_Load register after the SROM file. t SRAD-MOT 75 s SCLK Motion_Burst Register Address Read First Byte First Read Operation Read Second Byte Read Third Byte Figure 23. Motion burst timing. exit burst mode tBEXIT 4 s NCS SROM_Enable reg write MOSI SROM_Enable reg write address key data SROM_Load reg write address 1 frame byte 0 byte 1 byte 1985 address enter burst mode period SCLK tNCS-SCLK >120ns 40 s tLOAD 10 s tLOAD 10 s 10 s soonest to read SROM_ID Figure 24. PROM Download Burst Mode 18 100 s Frame Capture This is a fast way to download a full array of pixel values from a single frame. This mode disables navigation and overwrites any downloaded firmware. A hardware reset is required to restore navigation, and the firmware must be reloaded. To trigger the capture, write to the Frame_Capture register. The next available complete 1 2/3 frames (1536 values) will be stored to memory. The data are retrieved by reading the Pixel_Burst register once using the normal read method, after which the remaining bytes are clocked out by driving SCLK at the normal rate. The byte time must be at least tLOAD. If the Pixel_Burst register is read before the data is ready, it will return all zeros. past the end of the data (1537 reads and on) , the data returned will be zeros. Pixel data is in the lower six bits of each byte. To read a single frame, read a total of 900 bytes. The next 636 bytes will be approximately 2/3 of the next frame. The first pixel of the first frame (1st read) has bit 6 set to 1 as a start-of-frame marker. The first pixel of the second partial frame (901st read) will also have bit 6 set to 1. All other bytes have bit 6 set to zero. The MSB of all bytes is set to 1. If the Pixel_Burst register is read After the download is complete, the micro-controller must raise the NCS line for at least tBEXIT to terminate burst mode. The read may be aborted at any time by raising NCS. Alternatively, the frame data can also be read one byte at a time from the Frame_Capture register. See the register description for more information. exit burst mode tBEXIT 4 s NCS frame capture reg write MOSI address frame capture reg address pixel dump reg read address data enter burst mode 10 s soonest to begin again SCLK tNCS-SCLK >120ns tCAPTURE tSRAD 50 s MISO tLOAD tLOAD 10 s 10 s P0 P0 bit 6 set to 1 P1 all MSB = 1 P899 see note 2 Notes: 1. MSB = 1 for all bytes. Bit 6 = 0 for all bytes except pixel 0 of both frames which has bit 6 = 1 for use as a frame marker. 2. Reading beyond pixel 899 will return the first pixel of the second partial frame. 3. tCAPTURE = 10 s + 3 frame periods. 4. This figure illustrates reading a single complete frame of 900 pixels. An additional 636 pixels from the next frame are available. Figure 25. Frame capture burst mode timing 19 The pixel output order as related to the surface is shown below. Cable Top Xray View of Mouse Positive Y LB RB Positive X 1 A6010 10 20 11 expanded view of the surface as viewed through the lens last output 899 898 897 896 895 894 893 892 891 890 889 888 887 886 885 884 883 882 881 880 879 878 877 876 875 874 873 872 871 870 869 868 867 866 865 864 863 862 861 860 859 858 857 856 855 854 853 852 851 850 849 848 847 846 845 844 843 842 841 840 839 838 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 etc. 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 first output Figure 26. Pixel address map (surface referenced) Error detection and recovery 1. The ADNS-6010 and the micro-controller might get out of synchronization due to ESD events, power supply droops or micro-controller firmware flaws. In such a case, the micro-controller should pulse NCS high for at least 1 ms. The ADNS6010 will reset the serial port (but not the control registers) and will be prepared for the beginning of a new transmission after the normal transaction delay. 2. Invalid addresses: Writing to an invalid address will have no effect. Reading from an invalid address will return all zeros. 20 3. Termination of a transmission by the microcontroller may sometimes be required (for example, due to a USB suspend interrupt during a read operation). To accomplish this the micro-controller should raise NCS. The ADNS-6010 will not write to any register and will reset the serial port (but not the control registers) and be prepared for the beginning of future transmissions after NCS goes low. The normal delays between reads or writes (tSWW, tswr, tSRAD, tSRAD-mot) are still required after aborted transmissions. 4. The micro-controller can verify success of write operations by issuing a read command to the same address and comparing written data to read data. 5. The micro-controller can verify the synchronization of the serial port by periodically reading the product ID and inverse product ID registers. 6. The microcontroller can read the SROM_ID register to verify that the sensor is running downloaded PROM code. ESD or similar noise events may cause the sensor to revert to native ROM execution. If this should happen, pulse RESET and reload the SROM code. Notes on Power-up and the serial port Reset Circuit The ADNS-6010 does not perform an internal power up self-reset; the reset pin must be raised and lowered to reset the chip. This should be done every time power is applied. During power-up there will be a period of time after the power supply is high but before any clocks are available. The table below shows the state of the various pins during power-up and reset when the RESET pin is driven high by a micro-controller. State of Signal Pins After VDD is Valid Pin Before Reset During Reset After Reset SPI pullups undefined off on (default) NCS hi-Z control functional hi-Z control functional functional MISO driven or hi-Z (per NCS) driven or hi-Z (per NCS) low or hi-Z (per NCS) SCLK undefined ignored functional MOSI undefined ignored functional XY_LASER undefined hi-Z functional RESET functional high (externally driven) functional NPD undefined ignored functional LASER_NEN undefined high (off) functional Power Down Circuit The following table lists the pin states during power down. The chip is put into the power down (PD) mode by lowering the NPD input. When in PD mode, the oscillator is stopped but all register contents are retained. To achieve the lowest current state, all inputs must be held externally within 200mV of a rail, either ground or VDD3. The chip outputs are driven low or hi-Z during PD to prevent current consumption by an external load. 21 State of Signal Pins During Power Down Pin NPD low After wake from PD SPI pullups off pre-PD state NCS hi-Z control functional functional MISO low or hi-Z (per NCS) pre-PD state or hi-Z SCLK ignored functional MOSI ignored functional XY_LASER high (off) functional RESET functional functional NPD low (driven externally) functional REFC VDD3 REFC OSC_IN low OSC_IN OSC_OUT high OSC_OUT LASER_NEN high (off) functional Registers The ADNS-6010 registers are accessible via the serial port. The registers are used to read motion data and status as well as to set the device configuration. Address Register Read/Write Default Value 0x00 Product_ID R 0x1C 0x01 Revision_ID R 0x20 0x02 Motion R 0x20 0x03 Delta_X R 0x00 0x04 Delta_Y R 0x00 0x05 SQUAL R 0x00 0x06 Pixel_Sum R 0x00 0x07 Maximum_Pixel R 0x00 0x08 Reserved 0x09 Reserved 0x0a Configuration_bits R/W 0x49 0x0b Extended_Config R/W 0x08 0x0c Data_Out_Lower R Any 0x0d Data_Out_Upper R Any 0x0e Shutter_Lower R 0x85 0x0f Shutter_Upper R 0x00 0x10 Frame_Period_Lower R Any 0x11 Frame_Period_Upper R Any 0x12 Motion_Clear W Any 0x13 Frame_Capture R/W 0x00 0x14 SROM_Enable W 0x00 0x15 Reserved 0x16 Configuration II R/W 0x34 0x17 Reserved 0x18 Reserved 0x19 Frame_Period_Max_Bound Lower R/W 0x90 0x1a Frame_Period_Max_Bound_Upper R/W 0x65 0x1b Frame_Period_Min_Bound_Lower R/W 0x7E 0x1c Frame_Period_Min_Bound_Upper R/W 0x0E 0x1d Shutter_Max_Bound_Lower R/W 0x20 0x1e Shutter_Max_Bound_Upper R/W 0x4E 0x1f SROM_ID R Version dependent 0x20-0x2b Reserved 0x2c LP_CFG0 R/W 0x7F 0x2d LP_CFG1 R/W 0x80 R/W 0x00 0x2e-0x3c Reserved 0x3d Observation 0x3e Reserved 0x3f Inverse Product ID R 0xE3 0x40 Pixel_Burst R 0x00 0x50 Motion_Burst R 0x00 0x60 SROM_Load W Any 22 Product_ID Address: 0x00 Access: Read Default Value: 0x1C Bit 7 6 5 4 3 2 1 0 Field PID7 PID6 PID5 PID4 PID3 PID2 PID1 PID0 Data Type: 8-Bit unsigned integer USAGE: This register contains a unique identification assigned to the ADNS-6010. The value in this register does not change; it can be used to verify that the serial communications link is functional. Revision_ID Address: 0x01 Access: Read Default Value: 0x20 Bit 7 6 5 4 3 2 1 0 Field RID7 RID6 RID5 RID4 RID3 RID2 RID1 RID0 Data Type: 8-Bit unsigned integer. USAGE: This register contains the IC revision. It is subject to change when new IC versions are released. NOTE: The downloaded SROM firmware revision is a separate value and is available in the SROM_ID register. 23 Motion Address: 0x02 Access: Read Default Value: 0x00 Bit 7 6 5 4 3 2 1 0 Field MOT Reserved LP_Valid OVF Reserved RES1 Fault RES0 Data Type: Bit field. USAGE: Register 0x02 allows the user to determine if motion has occurred since the last time it was read. If so, then the user should read registers 0x03 and 0x04 to get the accumulated motion. It also tells if the motion buffers have overflowed, if fault is detected, and the current resolution setting. Field Name Description MOT Motion since last report 0 = No motion 1 = Motion occurred, data ready for reading in Delta_X and Delta_Y registers LP_Valid This bit is an indicator of complementary value contained in registers 0x2C and 0x2D. 0 = register 0x2C and 0x2D do not have complementary values 1 = register 0x2C and 0x2D contain complementary values OVF Motion overflow, Y and/or X buffer has overflowed since last report 0 = no overflow 1 = overflow has occurred Fault Indicates that the RBIN and/or XY_LASER pin is shorted to GND. 0 = no fault detected 1 = fault detected RES1, RES0 Resolution in counts per inch (cpi). Resolution values are approximate. Cpi Bit2(RES1) Bit0(RES0) 400 0 0 800 0 1 1600 1 0 2000 1 1 Please see register 0x0a to set cpi Notes for Motion: 1. Reading this register freezes the Delta_X and Delta_Y register values. Read this register before reading the Delta_X and Delta_Y registers. If Delta_X and Delta_Y are not read before the motion register is read a second time, the data in Delta_X and Delta_Y will be lost. 2. Agilent RECOMMENDS that registers 0x02, 0x03 and 0x04 be read sequentially. burst mode also. See Motion 3. Internal buffers can accumulate more than eight bits of motion for X or Y. If either one of the internal buffers overflows, then absolute path data is lost and the OVF bit is set. This bit is cleared once some motion has been read from the Delta_X and Delta_Y registers, and if the buffers are not at full scale. Since more data is present in the buffers, the cycle of reading the Motion, Delta_X and Delta_Y registers should be repeated until the motion bit (MOT) is cleared. Until MOT is cleared, either the Delta_X or Delta_Y registers will read either positive or negative full scale. If the motion register has not been read for long time, at 400 cpi it may take up to 16 read cycles to clear the buffers, at 2000 cpi, up to 80 cycles. Alternatively, writing to the Motion_Clear register (register 0x12) will clear all stored motion at once. 24 Delta_X Address: 0x03 Access: Read Default Value: 0x00 Bit 7 6 5 4 3 2 1 0 Field X7 X6 X5 X4 X3 X2 X1 X0 Data Type: Eight bit 2's complement number. USAGE: X movement is counts since last report. Absolute value is determined by resolution. Reading clears the register. Motion -128 -127 -2 -1 0 +1 +2 +126 +127 80 81 FE FF 00 01 02 7E 7F Delta_X Delta_Y Address: 0x04 Access: Read Default Value: 0x00 Bit 7 6 5 4 3 2 1 0 Field Y7 Y6 Y5 Y4 Y3 Y2 Y1 Y0 Data Type: Eight bit 2's complement number. USAGE: Y movement is counts since last report. Absolute value is determined by resolution. Reading clears the register. Motion Delta_Y 25 -128 -127 -2 -1 0 +1 +2 +126 +127 80 81 FE FF 00 01 02 7E 7F SQUAL Address: 0x05 Access: Read Default Value: 0x00 Bit 7 6 5 4 3 2 1 0 Field SQ7 SQ6 SQ5 SQ4 SQ3 SQ2 SQ1 SQ0 Data Type: Upper 8 bits of a 10-bit unsigned integer. USAGE: SQUAL (Surface Quality) is a measure of 1/4 of the number of valid features visible by the sensor in the current frame. Use the following formula to find the total number of valid features. Number of features = SQUAL register value *4 The maximum SQUAL register value is 169. Since small changes in the current frame can result in changes in SQUAL, variations in SQUAL when looking at a surface are expected. The graph below shows 700 sequentially acquired SQUAL values, while a sensor was moved slowly over white paper. SQUAL is nearly equal to zero if there is no surface below the sensor. SQUAL remains fairly high throughout the Z-height range. SQUAL Values (White Paper) At Z=0mm, Circle@7.5" diameter, Speed-6ips 90 80 70 SQUAL Value (counts) 60 50 40 30 20 10 0 1 51 101 151 201 251 301 351 401 451 501 551 601 651 Counts Figure 27. SQUAL Values at 2000cpi (White Paper) Mean SQUAL vs. Z (White Paper) 2000 cpi, Circle@7.5" diameter, Speed-6ips SQUAL Vaalue (counts) 120 Avg-3sigma Avg Avg+3sigma 100 80 60 40 20 0 -0.8 -0.6 -0.4 -0.2 0 0.2 0.4 Distance of Lens Reference Plane to Surface, Z (mm) Figure 28. Mean SQUAL vs. Z (White Paper) 26 0.6 0.8 Pixel_Sum Address: 0x06 Access: Read Default Value: 0x00 Bit 7 6 5 4 3 2 1 0 Field AP7 AP6 AP5 AP4 AP3 AP2 AP1 AP0 Data Type: High 8 bits of an unsigned 16-bit integer. USAGE: This register is used to find the average pixel value. It reports the upper byte of a 16bit counter which sums all 900 pixels in the current frame. It may be described as the full sum divided by 256. To find the average pixel value, use the following formula: Average Pixel = Register Value * 256 / 900 = Register Value/3.51 The maximum register value is 221 (63 * 900/256 truncated to an integer). The minimum is 0. The pixel sum value can change on every frame. Maximum_Pixel Address: 0x07 Access: Read Default Value: 0x00 Bit 7 6 5 4 3 2 1 0 Field 0 0 MP5 MP4 MP3 MP2 MP1 MP0 Data Type: Six bit number. USAGE: Maximum Pixel value in current frame. Minimum value = 0, maximum value = 63. The maximum pixel value can vary with every frame. Reserved Address: 0x08 Reserved Address: 0x09 27 Configuration_bits Address: 0x0a Access: Read/Write Default Value: 0x49 Bit 7 6 5 4 3 2 1 0 Field 0 LASER_MODE Sys Test RES0 1 RES1 Reserved Reserved Data Type: Bit field USAGE: Register 0x0a allows the user to change the configuration of the sensor. Shown below are the bits, their default values, and optional values. Field Name Description BIT 7 Must always be zero LASER_MODE LASER Shutter Mode 0 = Shutter mode off (LASER always on) 1 = Shutter mode on (LASER only on when illumination is required) Sys Test System Tests 0 = no tests 1 = perform all system tests, output 16 bit CRC via Data_Out_Upper and Data_Out_Lower registers. NOTE: The test will fail if SROM is loaded. Perform a hardware reset before executing this test. Reload SROM after the test is completed. NOTE: The test will fail if a laser fault condition exists. NOTE: Since part of the system test is a RAM test, the RAM and SROM will be overwritten with the default values when the test is done. If any configuration changes from the default are needed for operation, make the changes AFTER the system test is run. The system test takes 200ms (@24MHz) to complete. NOTE: Do not access the Synchronous Serial Port during system test. RES Resolution in counts per inch. Resolution values are approximate. Cpi Bit2(RES1) Bit0(RES0) 400 0 0 800 1 0 1600 0 1 2000 1 1 Also see register 0x02i BIT 3 28 Must always be one Extended_Config Address: 0x0b Access: Read/Write Default Value: 0x08 Bit 7 6 5 4 3 2 1 0 Field Busy Reserved Reserved Reserved 1 Serial_NPU NAGC Fixed_FR Data Type: Bit field USAGE: Register 0x0b allows the user to change the configuration of the sensor. Shown below are the bits, their default values, and optional values. Field Name Description Busy Read-only bit. Indicates if it is safe to write to one or more of the following registers: Frame_Period_Max_Bound_Upper and Frame_Period_Max_Bound_Lower Frame_Period_Min_Bound_Upper and Frame_Period_Min_Bound_Lower Shutter_Max_Bound_Upper and Shutter_Max_Bound_Lower After writing to the Frame_Period_Maximum_Bound_Upper register, at least two frames must pass before writing again to any of the above registers. This bit may be used in lieu of a timer since the actual frame rate may not be known when running in auto mode. 0 = writing to the registers is allowed 1 = do not write to the registers yet BIT 3 Must always be one Serial_NPU Disable serial port pull-up current sources on SCLK, MOSI and NCS 0 = no, current sources are on 1 = yes, current sources are off NAGC Disable AGC. Shutter will be set to the value in the Shutter_Maximum_Bound registers. 0 = no, AGC is active 1 = yes, AGC is disabled Fixed_FR Fixed frame rate (disable automatic frame rate control). When this bit is set, the frame rate will be determined by the value in the Frame_Period_Maximum_Bound registers. 0 = automatic frame rate 1 = fixed frame rate 29 Data_Out_Lower Address: 0x0c Access: Read Default Value: Undefined Bit 7 6 5 4 3 2 1 0 Field DO7 DO6 DO5 DO4 DO3 DO2 DO1 DO0 Data_Out_Upper Address: 0x0d Access: Read Default Value: Undefined Bit 7 6 5 4 3 2 1 0 Field DO15 DO14 DO13 DO12 DO11 DO10 DO9 DO8 Data Type: Sixteen bit word USAGE: Data in these registers come from the system self test or the SROM CRC test. can be read out in either order. Data_Out_Upper Data_Out_Lower System test results: 0xA9 0xD5 SROM CRC Test Result: 0xBE 0xEF The data System Test: This test is initiated via the Configuration_Bits register. It performs several tests to verify that the hardware is functioning correctly. Perform a hardware reset just prior to running the test. SROM contents and register settings will be lost. SROM Content: Performs a CRC on the SROM contents. The test is initiated by writing a particular value to the SROM_Enable register. 30 Shutter_Lower Address: 0x0e Access: Read Default Value: 0x85 Bit 7 6 5 4 3 2 1 0 Field S7 S6 S5 S4 S3 S2 S1 S0 Shutter_Upper Address: 0x0f Access: Read Default Value: 0x00 Bit 7 6 5 4 3 2 1 0 Field S15 S14 S13 S12 S11 S10 S9 S8 Data Type: Sixteen bit unsigned integer. USAGE: Units are clock cycles. Read Shutter_Upper first, then Shutter_Lower. They should be read consecutively. The shutter is adjusted to keep the average and maximum pixel values within normal operating ranges. The shutter value is checked and automatically adjusted to a new value if needed on every frame when operating in default mode. When the shutter adjusts, it changes by 1/16 of the current value. The shutter value can be set manually by setting the AGC mode to Disable using the Extended_Config register and writing to the Shutter_Max_Bound registers. Because the automatic frame rate feature is related to shutter value it may also be appropriate to enable the Fixed Frame Rate mode using the Extended_Config register. Shown below is a graph of 700 sequentially acquired shutter values, while the sensor was moved slowly over white paper. Shutter Value (White Paper) At Z=0mm, Circle@7.5" diameter, Speed-6ips 160 Shutter Value (counts) 140 120 100 80 60 40 20 0 1 51 101 151 201 251 301 Figure 29. Shutter Values at 2000cpi (White Paper) 31 351 401 Counts 451 501 551 601 651 Shutter Value (counts) Mean Shutter vs. Z (White Paper) 2000dpi, Circle@7.5" diameter, Speed-6ips 200 180 160 140 120 100 80 60 40 20 0 Avg-3sigma Avg Avg+3sigma -0.8 -0.6 -0.4 -0.2 0 0.2 0.4 0.6 0.8 Distance from Lens Reference Plane to Surface, Z (mm) Figure 30. Mean Shutter vs. Z (White Paper) The maximum value of the shutter is dependent upon the setting in the Shutter_Max_Bound_Upper and Shutter_Max_Bound_Lower registers. 32 Frame_Period_Lower Address: 0x10 Access: Read Default Value: Undefined Bit 7 6 5 4 3 2 1 0 Field FP7 FP6 FP5 FP4 FP3 FP2 FP1 FP0 Frame_Period_Upper Address: 0x11 Access: Read Default Value: Undefined Bit 7 6 5 4 3 2 1 0 Field FP15 FP14 FP13 FP12 FP11 FP10 FP9 FP8 Data Type: Sixteen bit unsigned integer. USAGE: Read these registers to determine the current frame period and to calculate the frame rate. Units are clock cycles. The formula is Frame Rate = Clock Frequency/Register value To read from the registers, read Frame_Period_Upper first followed by Frame_Period Lower. To set the frame rate manually, disable automatic frame rate mode via the Extended_Config register and write the desired count value to the Frame_Period_Max_Bound registers. The following table lists some Frame_Period values for popular frame rates with a 24MHz clock. Frames/second Counts Frame_Period Decimal Hex Upper Lower 7080 3,390 0D3E 0D 3E 5000 4,800 12C0 12 C0 3000 8,000 1F40 1F 40 2000 12,000 2EE0 2E E0 Motion_Clear Address: 0x12 Access: Write Default Value: Undefined Data Type: Any. USAGE: Writing any value to this register will cause the Delta_X, Delta_Y, and internal motion registers to be cleared. Use this as a fast way to reset the motion counters to zero without resetting the entire chip. 33 Frame_Capture Address: 0x13 Access: Read/Write Default Value: 0x00 Bit 7 6 5 4 3 2 1 0 Field FC7 FC6 FC5 FC4 FC3 FC2 FC1 FC0 Data Type: Bit field. USAGE: Writing 0x83 to this register will cause the next available complete 1 2/3 frames of pixel values to be stored to SROM RAM. Writing to this register is required before using the Frame Capture burst mode to read the pixel values (see the Synchronous Serial Port section for more details). Writing to this register will stop navigation and cause any firmware loaded in the SROM to be overwritten. A hardware reset is required to restore navigation, and the firmware must be reloaded using the PROM Download burst method. This register can also be used to read the frame capture data. The same data available by reading the Pixel_Burst register using burst mode is available by reading this register in the normal fashion. The data pointer is automatically incremented after each read so all 1536 pixel values (1 and 2/3 frames) may be obtained by reading this register 1536 times in a row. Both methods share the same pointer such that reading pixel values from this register will increment the pointer causing subsequent reads from the Pixel_Burst register (without initiating a new frame dump) to start at the current pointer location. This register will return all zeros if read before the frame capture data is ready. See the Frame Capture description in the Synchronous Serial Port section for more information. This register will not retain the last value written. Reads will return zero or frame capture data. SROM_Enable Address: 0x14 Access: Write Default Value: 0x00 Bit 7 6 5 4 3 2 1 0 Field SE7 SE6 SE5 SE4 SE3 SE2 SE1 SE0 Data Type: 8-bit number. USAGE: Write to this register to start either PROM download or SROM CRC test. Write 0x1D to this register, wait at least 1 frame period, and write 0x18 to this register before downloading PROM firmware to the SROM_Load register. The download will not be successful unless this sequence is followed. See the Synchronous Serial port section for details. Write 0xA1 to start the SROM CRC test. Wait 7ms plus one frame period, then read result from the Data_Out_Lower and Data_Out_Upper registers. Navigation is halted and the SPI port should not be used during this test. Reserved 34 Address: 0x15 Configuration II Address: 0x16 Access: Read/Write Default Value: 0x34 Bit 7 6 5 4 3 2 1 0 Field Reserved Reserved Reserved Reserved Reserved 1 Force_disable Reserved Data Type: Bit field USAGE: Write to this register Field Name Description BIT 2 Must be set to one Force_disable 0 = LASER_NEN functions as normal 1 = LASER_NEN output high. May be useful for product test. Reserved 35 Address: 0x17-0x18 Frame_Period_Max_Bound_Lower Address: 0x19 Access: Read/Write Default Value: 0x90 Bit 7 6 5 4 3 2 1 0 Field FBM7 FBM6 FBM5 FBM4 FBM3 FBM2 FBM1 FBM0 Frame_Period_Max_Bound_Upper Address: 0x1A Access: Read/Write Default Value: 0x65 Bit 7 6 5 4 3 2 1 0 Field FBM15 FBM14 FBM13 FBM13 FBM11 FBM10 FBM9 FBM8 Data Type: 16-bit unsigned integer. USAGE: This value sets the maximum frame period (the MINIMUM frame rate) which may be selected by the automatic frame rate control, or sets the actual frame period when operating in manual mode. Units are clock cycles. The formula is Frame Rate = Clock Frequency / Register value To read from the registers, read Upper first followed by Lower. To write to the registers, write Lower first, followed by Upper. To set the frame rate manually, disable automatic frame rate mode via the Extended_Config register and write the desired count value to these registers. Writing to the Frame_Period_Max_Bound_Upper and Lower registers also activates any new values in the following registers: * Frame_Period_Max_Bound_Upper and Lower * Frame_Period_Min_Bound_Upper and Lower * Shutter_Max_Bound_Upper and Lower Any data written to these registers will be saved but will not take effect until the write to the Frame_Period_Max_Bound_Upper and Lower is complete. After writing to this register, two complete frame times are required to implement the new settings. Writing to any of the above registers before the implementation is complete may put the chip into an undefined state requiring a reset. The "Busy" bit in the Extended_Config register may be used in lieu of a timer to determine when it is safe to write. See the Extended_Config register for more details. The following table lists some Frame_Period values for popular frame rates (clock rate = 24MHz). In addition, the three bound registers must also follow this rule when set to non-default values: Frame_Period_Max_Bound Frame_Period_Min_Bound + Shutter_Max_Bound. Frames/second 36 Counts Frame_Period Decimal Hex Upper Lower 7080 3,390 0D3E 0D 3E 5000 4,800 12C0 12 C0 3000 8,000 1F40 1F 40 2000 12,000 2EE0 2E E0 Frame_Period_Min_Bound_Lower Access: Read/Write Address: 0x1B Default Value: 0x7E Bit 7 6 5 4 3 2 1 0 Field FBm7 FBm6 FBm5 FBm4 FBm3 FBm2 FBm1 FBm0 Frame_Period_Min_Bound_Upper Access: Read/Write Address: 0x1C Default Value: 0x0E Bit 7 6 5 4 3 2 1 0 Field FBm15 FBm14 FBm13 FBm13 FBm11 FBm10 FBm9 FBm8 Data Type: 16-bit unsigned integer. USAGE: This value sets the minimum frame period (the MAXIMUM frame rate) which may be selected by the automatic frame rate control. Units are clock cycles. The formula is Frame Rate = Clock Rate / Register value To read from the registers, read Upper first followed by Lower. To write to the registers, write Lower first, followed by Upper, then execute a write to the Frame_Period_Max_Bound_Upper and Lower registers. The minimum allowed write value is 0x0E7E; the maximum is 0xFFFF. Reading this register will return the most recent value that was written to it. However, the value will take effect only after a write to the Frame_Period_Max_Bound_Upper and Lower registers. After writing to Frame_Period_Max_Bound_Upper, wait at least two frame times before writing to Frame_Period_Min_Bound_Upper or Lower again. The "Busy" bit in the Extended_Config register may be used in lieu of a timer to determine when it is safe to write. See the Extended_Config register for more details. In addition, the three bound registers must also follow this rule when set to non-default values: Frame_Period_Max_Bound Frame_Period_Min_Bound + Shutter_Max_Bound. 37 Shutter_Max_Bound_Lower Address: 0x1D Access: Read/Write Default Value: 0x20 Bit 7 6 5 4 3 2 1 0 Field SB7 SB6 SB5 SB4 SB3 SB2 SB1 SB0 Shutter_Max_Bound_Upper Address: 0x1E Access: Read/Write Default Value: 0x4E Bit 7 6 5 4 3 2 1 0 Field SB15 SB14 SB13 SB12 SB11 SB10 SB9 SB8 Data Type: 16-bit unsigned integer. USAGE: This value sets the maximum allowable shutter value when operating in automatic mode. Units are clock cycles. Since the automatic frame rate function is based on shutter value, the value in these registers can limit the range of the frame rate control. To read from the registers, read Upper first followed by Lower. To write to the registers, write Lower first, followed by Upper, then execute a write to the Frame_Period_Max_Bound_Upper and Lower registers. To set the shutter manually, disable the AGC via the Extended_Config register and write the desired value to these registers. Reading this register will return the most recent value that was written to it. However, the value will take effect only after a write to the Frame_Period_Max_Bound_Upper and Lower registers. After writing to Frame_Period_Max_Bound_Upper, wait at least two frame times before writing to Shutter_Max_Bound_Upper or Lower again. The "Busy" bit in the Extended_Config register may be used in lieu of a timer to determine when it is safe to write. See the Extended_Config register for more details. In addition, the three bound registers must also follow this rule when set to non-default values: Frame_Period_Max_Bound Frame_Period_Min_Bound + Shutter_Max_Bound. SROM_ID Address: 0x1F Access: Read Default Value: Version dependent Bit 7 6 5 4 3 2 1 0 Field SR7 SR6 SR5 SR4 SR3 SR2 SR1 SR0 Data Type:8-Bit unsigned integer. USAGE: Contains the revision of the downloaded Shadow ROM firmware. If the firmware has been successfully downloaded and the chip is operating out of SROM, this register will contain the SROM firmware revision, otherwise it will contain 0x00. Note: The IC hardware revision is available by reading the Revision_ID register (register 0x01). 38 LP_CFG0 Address: 0x2C Access: Read/Write Default Value: 0x7F Bit 7 6 5 4 3 2 1 0 Field Match LP6 LP5 LP4 LP3 LP2 LP1 LP0 Data Type: 8-bit unsigned integer USAGE: This register is used to set the laser current and bin matching parameter. It is to be used together with register 0x2D where register 0x2D must contain the complement of register 0x2C in order for the laser current to be programmed. Writing to this register causes a fault test to be performed on the XY_LASER pin. The test checks for stuck low and stuck high conditions. During the test, LASER_NEN will be driven high and XY_LASER will pulse high for 12us and pulse low for 12us (times are typical). Both pins will return to normal operation if no fault is detected. Field Name Description Match Match the sensor to the VCSEL characteristics. Set per the bin table specification for the VCSEL bin in use. LP6 - LP0 Controls the 7 bit DAC for adjusting laser current. One step is equivalent to (1/192)*100% = 0.5208% drop of relative laser current. Refer to the table below for example of relative laser current settings. LP6- LP3 LP2 LP1 LP0 Relative Laser Current 0000 0 0 0 100% 0000 0 0 1 99.48% 0000 0 1 0 98.96% 0000 0 1 1 98.43% 0000 1 0 0 97.92% : : : : : 1111 1 0 1 34.90% 1111 1 1 0 34.38% 1111 1 1 1 33.85% LP_CFG1 Address: 0x2D Access: Read/Write Default Value: 0x80 Bit 7 6 5 4 3 2 1 0 Field LPC7 LPC6 LPC5 LPC4 LPC3 LPC2 LPC1 LPC0 Data Type: 8-bit unsigned integer USAGE: The value in this register must be a complement of register 0x2C for laser current to be as programmed, otherwise the laser current is set to 33.85%. Registers 0x2C and 0x2D may be written in any order after power ON reset or SROM download. 39 Reserved Address: 0x2f-0x3C Observation Address: 0x3D Access: Read/Write Default Value: 0x00 Bit 7 6 5 4 3 2 1 0 Field OB7 Reserved OB5 Reserved Reserved Reserved OB1 OB0 Data Type: Bit field USAGE: Each bit is set by some process or action at regular intervals, or when the event occurs. The user must clear the register by writing 0x00, wait an appropriate delay, and read the register. The active processes will have set their corresponding bit(s). This register may be used as part of a recovery scheme to detect a problem caused by EFT/B or ESD. Field Name Description OB7 0 = Chip is not running SROM code 1 = Chip is running SROM code OB5 0 = NPD pulse was not detected 1 = NPD pulse was detected OB1 Set once per frame OB0 Set once per frame Reserved Address: 0x3E Inverse_Product_ID Address: 0x3F Access: Read Default Value: 0xE3 Bit 7 6 5 4 3 2 1 0 Field NPID7 NPID6 NPID5 NPID4 NPID3 NPID2 NPID1 NPID0 Data Type: Inverse 8-Bit unsigned integer USAGE: This value is the inverse of the Product_ID, located at the inverse address. It can be used to test the SPI port. 40 Pixel_Burst Address: 0x40 Access: Read Default Value: 0x00 Bit 7 6 5 4 3 2 1 0 Field PB7 PB6 PB5 PB4 PB3 PB2 PB1 PB0 Data Type: Eight bit unsigned integer USAGE: The Pixel_Burst register is used for high-speed access to all the pixel values from one and 2/3 complete frame. See the Synchronous Serial Port section for use details. Motion_Burst Address: 0x50 Access: Read Default Value: 0x00 Bit 7 6 5 4 3 2 1 0 Field MB7 MB6 MB5 MB4 MB3 MB2 MB1 MB0 Data Type: Various, depending on data USAGE: The Motion_Burst register is used for high-speed access to the Motion, Delta_X, Delta_Y, SQUAL, Shutter_Upper, Shutter_Lower, and Maximum_Pixel registers. See the Synchronous Serial Port section for use details. SROM_Load Address: 0x 60 Access: Write Default Value: N/A Bit 7 6 5 4 3 2 1 0 Field SL7 SL6 SL5 SL4 SL3 SL2 SL1 SL0 Data Type: Eight bit unsigned integer USAGE: The SROM_Load register is used for high-speed programming of the ADNS-6010 from an external PROM or microcontroller. See the Synchronous Serial Port section for use details. 41 Agilent ADNV-6330 Single-Mode Vertical-Cavity Surface Emitting Laser (VCSEL) Description This advanced class of VCSELs was engineered by Agilent to provide a laser diode with a single longitudinal and a single transverse mode. In contrast to most oxide-based single-mode VCSELs, this class of Agilent VCSELs remains within single mode operation over a wide range of output power. The ADNV-6330 has significantly lower power consumption than a LED. It is an excellent choice for optical navigation applications. W = Bin# X = Bin Letter Y = Subcon Code Z = Die Source Features * Advanced Technology VCSEL chip * Single Mode Lasing operation * Non-hermetic plastic package * 832-865 nm wavelength Notes: Because the can is not sealed, the protective kapton tape should not be removed until just prior to assembly into the ADNS-6120 or ADNS-6130-001 lens. Figure 31. Outline Drawing for ADNV-6330 VCSEL (11) 5.0 For cable or wire connections (2X) 1.7 Dimension in millimeters Figure 32. Suggested ADNV-6330 PCB Mounting Guide 42 1.5 Max PCB Thickness 7.2 Max 0.8 Comments: Absolute Maximum Ratings: 1. Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are the stress ratings only and functional operation of the device at these or any other condition beyond those indicated for extended period of time may affect device reliability. Parameter Rating Units DC Forward current 12 mA Peak Pulsing current [1] 19 mA Power Dissipation 24 mW Reverse voltage [2] 5 V Laser Junction Temperature 150 C Operating case Temperature 5 to 45 C Storage case Temperature -40 to +85 C Lead Soldering Temperature [3] 260 C ESD (Human-body model) 200 Volts 2. The maximum ratings do not reflect eye-safe operation. Eye safe operating conditions are listed in the power adjustment procedure section in the ADNS-6010 laser sensor datasheet. 3. The inherent design of this component causes it to be sensitive to electrostatic discharge. The ESD threshold is listed above. To prevent ESD-induced damage, take adequate ESD precautions when handling this product. Notes: 1. Duration = 100ms, 10% duty cycle 2. I = 10A 3. See IR reflow profile (Figure 36) Comments: Danger: VCSELs are sorted into bins as specified in the power adjustment procedure section in the ADNS-6010 laser sensor datasheet. Appropriate binning resistor and register data values are used in the application circuit to achieve the target output power. When driven with current or temperature range greater than specified in the power adjustment procedure section, eye safety limits may be exceeded. The VCSEL should then be treated as a Class IIIb laser and as a potential eye hazard. Optical/Electrical Characteristics (at Tc = 5C to 45C): Parameter Symbol Min. Typ. Max. Units Peak Wavelength 832 865 nm Maximum Radiant Power [1] LOP max 4.5 mW Wavelength Temperature coefficient d/dT 0.065 nm/C Wavelength Current coefficient d/dI 0.21 nm/mA Beam Divergence FW@1/e^2 15 deg Threshold current Ith 4.2 mA Slope Efficiency SE 0.4 W/A Forward Voltage [2] VF 1.9 V Notes: 1. Maximum output power under any condition. This is not a recommended operating condition and does not meet eye safety requirements. 2. At 500uW output power. 43 Typical Characteristics Forward Voltage vs. Forward Currents 2.5 Forward Voltage (V) 2.0 1.5 1.0 0.5 0.0 0 2 4 6 8 10 Forward Current (mA) Figure 33. Forward Voltage vs. Forward Current 4.5 Optical Power, LOP (mW) 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 0 5 10 15 20 25 Forward Current, If (mA) Figure 34. Optical Power vs. Forward Current Junction Temperature rise vs. CW current 50 dT Temperature rise (C) 40 30 20 10 0 0 1 2 3 4 5 6 7 8 I(mA) Figure 35. Junction Temperature Rise vs. Forward Current 44 9 10 11 12 13 14 15 300 10 - 20 255 C 250 C 250 200 217 C 120 sec 60 - 150 sec 150 125 C 100 50 40 C Figure 36. Recommended Reflow Soldering Profile 45 384 363 341 320 299 278 256 235 213 192 171 150 129 108 87 66 45 22 1 0 Agilent ADNS-6120 and ADNS-6130-001 Laser Mouse Lens Description The ADNS-6120 and ADNS6130-001 laser mouse lens are designed for use with Agilent laser mouse sensors and the illumination subsystem provided by the ADNS-6230001 VCSEL assembly clip and the ADNV-6330 Single-Mode Vertical-Cavity Surface Emitting Lasers (VCSEL). Together with the VCSEL, the ADNS-6120 or ADNS-6130-001 laser mouse lens provides the directed illumination and optical imaging necessary for proper operation of the laser mouse sensor. ADNS-6120 or Part Number Description ADNS-6120 Laser Mouse Round Lens ADNS-6130-001 Laser Mouse Trim Lens Figure 37. ADNS-6120 laser mouse round lens outline drawings and details 46 ADNS-6130-001 laser mouse lens is a precision molded optical component and should be handled with care to avoid scratching of the optical surfaces. Figure 38. ADNS-6130-001 laser mouse trim lens outline drawings and details MOUSE SENSOR LID ADNS-6120 B A OBJECT SURFACE Figure 39. Optical system assembly cross-section diagram 47 Mechanical Assembly Requirements All specifications reference Figure 39, Optical System Assembly Diagram Parameters Symbol Distance from Object Surface to A Lens Reference Plane Distance from Mouse Sensor Lid Surface to Object Surface Figure 40. Agilent's logo locations 48 B Min. Typical Max. Units Conditions 2.18 2.40 2.62 mm For ADNS-6120 and ADNS6130-001 mm Sensor lid must be in contact with lens housing surface 10.65 Lens Design Optical Performance Specifications All specifications are based on the Mechanical Assembly Requirements. Parameters Symbol Design Wavelength Lens Material* Index of Refraction N Min. Typical Max. 842 1.5693 1.5713 Units Conditions nm 1.5735 = 842 nm *Lens material is polycarbonate. Cyanoacrylate based adhesives should not be used as they will cause lens material deformation. Mounting Instructions for the ADNS-6120 and ADNS-6130-001 Laser Mouse Lenses to the Base Plate An IGES format drawing file with design specifications for laser mouse base plate features is available. These features are useful in maintaining proper positioning and alignment of the ADNS6120 or ADNS-6130-001 laser mouse lens when used with the Agilent Laser Mouse Sensor. This file can be obtained by contacting your local Agilent sales representative. Figure 41. Illustration of base plate mounting features for ADNS-6120 laser mouse round lens 49 Figure 42. Illustration of base plate mounting features for ADNS-6130-001 laser mouse trim lens Agilent ADNS-6230-001 Laser Mouse VCSEL Assembly Clip Description The ADNS-6230-001 VCSEL Assembly Clip is designed to provide mechanical coupling of the ADNV-6330 VCSEL to the ADNS-6120 or ADNS-6130-001 Laser Mouse Lens. This coupling is essential to achieve the proper illumination alignment required for the sensor to operate on a wide variety of surfaces. Figure 43. Outline Drawing for ADNS-6230-001 VCSEL Assembly Clip www.agilent.com/ semiconductors For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (916) 788-6763 Europe: +49 (0) 6441 92460 China: 10800 650 0017 Hong Kong: (+65) 6756 2394 India, Australia, New Zealand: (+65) 6755 1939 Japan: (+81 3) 3335-8152(Domestic/International), or 0120-61-1280(Domestic Only) Korea: (+65) 6755 1989 Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (+65) 6755 2044 Taiwan: (+65) 6755 1843 Data subject to change. Copyright (c) 2005 Agilent Technologies, Inc. Obsoletes 5989-3077EN July 4, 2005 5989-3437EN