Description
These high intensity blue, green, and cyan LEDs are
based on the most efficient and cost effective InGaN
material technology. The 470 nm typical dominant
wavelength for blue and 525 nm typical wavelength for
green is well suited to color mixing in full color signs.
The 505 nm typical dominant wavelength for cyan is
suitable for traffic signal application.
These LED lamps are untinted, non-diffused, T-13/4
packages incorporating second generation optics which
produce well-defined spatial radiation patterns at specific
viewing cone angles.
These lamps are made with an advanced optical grade
epoxy, offering superior temperature and moisture
resistance in outdoor signal and sign applications. The
high maximum LED junction temperature limit of +110°C
enables high temperature operation in bright sunlight
conditions.
Features
• Well defined spatial radiation pattern
• High luminous output
• Available in blue, green, and cyan color
• Viewing angle: 15°, 23° and 30°
• Standoff or non-standoff leads
• Superior resistance to moisture
Applications
• Traffic signals
• Commercial outdoor advertising
• Front panel backlighting
• Front panel indicator
HLMP-CB11, HLMP-CB12, HLMP-CM11,
HLMP-CM12, HLMP-CE11, HLMP-CE12,
HLMP-CB26, HLMP-CB27, HLMP-CM26,
HLMP-CM27, HLMP-CE26, HLMP-CE27,
HLMP-CB36, HLMP-CB37, HLMP-CM36,
HLMP-CM37, HLMP-CE36, HLMP-CE37
CAUTION: Devices are Class 1C ESD sensitive. Please observe appropriate precautions during handling and
processing. Refer to Application Note AN-1142 for additional details.
HLMP-Cxxx
T-13/4 (5 mm) Extra Bright Precision Optical
Performance InGaN LED Lamps
Data Sheet
2
Package Dimensions
Package A
Package B
1.14 ± 0.20
(0.045 ± 0.008)
5.80 ± 0.20
(0.228 ± 0.008)
4.90 ± 0.20
(0.193 ± 0.008)
31.60
(1.244)MIN.
0.70 (0.028)
MAX.
8.61 ± 0.20
(0.339 ± 0.008)
2.54 ± 0.38
(0.100 ± 0.015)
∅
CATHODE
LEAD
2.35 (0.093)
MAX.
CATHODE
FLAT
5.80 ± 0.20
(0.228 ± 0.008)
2.54 ± 0.38
(0.100 ± 0.015)
∅
CATHODE
FLAT
1.14 ± 0.20
(0.045 ± 0.008)
NOTE 1
4.90 ± 0.20
(0.192 ± 0.008)
31.60
(1.244) MIN.
0.70 (0.028)
MAX.
1.50 ± 0.15
(0.059 ± 0.006)
1.00
(0.039) MIN.
8.61 ± 0.20
(0.339 ± 0.008)
DIMENSION H
0.50 ± 0.10
(0.020 ± 0.004) SQ. TYP.
NOTES:
1. MEASURED JUST ABOVE FLANGE.
2. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).
3. EPOXY MENISCUS MAY EXTEND ABOUT 1 mm (0.040") DOWN THE LEADS.
4. IF HEAT SINKING APPLICATION IS REQUIRED, THE TERMINAL FOR HEAT SINK IS ANODE.
DIMENSION H:
15° = 10.80 ± 0.25 mm (0.425 ± 0.01 INCH)
23° = 10.00 ± 0.25 mm (0.394 ± 0.01 INCH)
30° = 11.27 ± 0.25 mm (0.444 ± 0.01 INCH)
CATHODE
LEAD
3
Device Selection Guide
Typical
Viewing Angle, Intensity (cd) at 20 mA Package
Part Number Color 2q1/2 (Degree) Min. Max. Standoff Dimension Lens
HLMP-CB11-TW0xx Blue 15 2.5 7.2 No A Clear
HLMP-CB11-UVBxx Blue 15 3.2 5.5 No A Clear
HLMP-CB12-TW0xx Blue 15 2.5 7.2 Yes B Clear
HLMP-CM11-Y20xx Green 15 9.3 27.0 No A Clear
HLMP-CM11-Z1Cxx Green 15 12.0 21.0 No A Clear
HLMP-CM12-Y20xx Green 15 9.3 27.0 Yes B Clear
HLMP-CE11-X10xx Cyan 15 7.2 21.0 No A Clear
HLMP-CE12-X10xx Cyan 15 7.2 21.0 Yes B Clear
HLMP-CB26-SV0xx Blue 23 1.9 5.5 No A Clear
HLMP-CB26-TUDxx Blue 23 2.5 4.2 No A Clear
HLMP-CB27-SV0xx Blue 23 1.9 5.5 Yes B Clear
HLMP-CM26-X10xx Green 23 7.2 21.0 No A Clear
HLMP-CM26-YZCxx Green 23 9.3 16.0 No A Clear
HLMP-CM27-X10xx Green 23 7.2 21.0 Yes B Clear
HLMP-CE26-WZ0xx Cyan 23 5.5 16.0 No A Clear
HLMP-CE27-WZ0xx Cyan 23 5.5 16.0 Yes B Clear
HLMP-CB36-QT0xx Blue 30 1.15 3.2 No A Clear
HLMP-CB36-RSBxx Blue 30 1.5 2.5 No A Clear
HLMP-CB37-RU0xx Blue 30 1.5 4.2 Yes B Clear
HLMP-CB37-RSDxx Blue 30 1.5 2.5 Yes B Clear
HLMP-CM36-X10xx Green 30 7.2 21.0 No A Clear
HLMP-CM36-XYCxx Green 30 7.2 12.0 No A Clear
HLMP-CM37-X10xx Green 30 7.2 21.0 Yes B Clear
HLMP-CM37-XYCxx Green 30 7.2 12.0 Yes B Clear
HLMP-CM37-XYDxx Green 30 7.2 12.0 Yes B Clear
HLMP-CE36-WZ0xx Cyan 30 5.5 16.0 No A Clear
HLMP-CE37-WZ0xx Cyan 30 5.5 16.0 Yes B Clear
Notes:
1. Tolerance for luminous intensity measurement is ±15%.
2. The luminous intensity is measured on the mechanical axis of the lamp package.
3. The optical axis is closely aligned with the package mechanical axis.
4. LED light output is bright enough to cause injuries to the eyes. Precautions must be taken to prevent looking directly at the LED without proper safety
equipment.
5. 2q1/2 is the off-axis angle where the luminous intensity is 1/2 the on-axis intensity.
4
Part Numbering System
HLMP - x x xx - x x x xx
Mechanical Options
00: Bulk
DD: Ammo Pack
Color Bin Options
0: Full Color Bin Distribution
B: Color Bin 2 and 3
C: Color Bin 3 and 4
D: Color Bin 4 and 5
Maximum Intensity Bin
0: No Maximum Intensity Bin Limitation
Others: Refer to Device Selection Guide
Minimum Intensity Bin
Refer to Device Selection Guide
Viewing Intensity Bin
11: 15° Without Standoff
12: 15° With Standoff
26: 23° Without Standoff
27: 23° With Standoff
36: 30° Without standoff
37: 30° With Standoff
Color
B: Blue 470 nm
M: Green 525 nm
E: Cyan 505 nm
Package
C: T-13/4 (5 mm) Round Lamp
5
Absolute Maximum Rating at TA = 25°C
Parameters Value Unit
DC Forward Current [1] 30 mA
Peak Pulsed Forward Current[2] 100 mA
Power Dissipation 116 mW
LED Junction Temperature 130 °C
Operating Temperature Range –40 to +85 °C
Storage Temperature Range –40 to +100 °C
Notes:
1. Derate linearly as shown in Figure 2.
2. Duty factor 10%, frequency 1 KHz.
Electrical/Optical Characteristics
TA = 25oC
Blue Green Cyan
Parameters Symbol Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Units Test Condition
Forward Voltage VF 3.2 3.85 3.3 3.85 3.2 3.85 V IF = 20 mA
Reverse Voltage[1] VR 5.0 5.0 5.0 V IR = 10 µA
Thermal Resistance RqJ-PIN 240 240 240 oC/W LED Junction to
Anode Lead
Dominant ld 460 470 480 520 525 540 490 505 508 nm IF = 20 mA
Wavelength[2]
Peak Wavelength lPEAK 464 516 501 nm Peak of Wavelength
of Spectral Distribu-
tion at IF = 20 mA
Spectral Half Width Dl1/2 23 32 30 nm Wavelength Width
at Spectral Distribu-
tion Power Point
at IF = 20 mA
Luminous Efficacy[3] hv 74 484 319 lm/W Emitted Luminous
Power/Emitted
Radiant Power
Notes:
1. The reverse voltage of the product is equivalent to the forward voltage of the protective chip at IR = 10 µA.
2. The dominant wavelength, ld, is derived from the Chromaticity Diagram and represents the color of the lamp.
3. The radiant intensity, Ie in watts/steradian, may be found from the equation Ie = Iv/hv, where Iv is the luminous intensity in candelas and hv is the lumi-
nous efficacy in lumens/watt.
6
Figure 5. Relative intensity vs. DC forward current
Figure 4. Relative dominant wavelength vs. DC forward current
Figure 1. Relative intensity vs. wavelength
Figure 3. Forward current vs. forward voltage
Figure 2. Forward current vs. ambient temperature
WAVELENGTH – nm
RELATIVE INTENSITY
380 430 480 530 580 630 680
1.0
CYAN
BLUE
0
0.8
0.6
0.4
0.2
GREEN
IF MAX. – MAXIMUM FORWARD CURRENT – mA
0
0
TA – AMBIENT TEMPERATURE – °C
50 80
35
10
5
15
10 20 30 40 60 70 90
20
25
30
RθJ-A = 780 °C/W
0
35
10
5
0 3.0
30
25
20
15
2.01.0
FORWARD CURRENT – mA
FORWARD VOLTAGE – V
4.0
DC FORWARD CURRENT – mA
RELATIVE DOMINANT WAVELENGTH
0 10 155 20 25 30
1.035
1.025
1.030
0.990
1.015
1.020
1.010
1.005
1.000
0.995
BLUE
GREEN
CYAN
0
1.6
0.2
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
DC FORWARD CURRENT – mA
0 5 15 30
1.2
10 2520
1.4
0.4
1.0
0.8
0.6
7
Figure 6. Spatial radiation pattern for Cx11 and Cx12
Figure 7. Spatial radiation pattern for Cx26 and Cx27
Figure 8. Spatial radiation pattern for Cx36 and Cx37
NORMALIZED INTENSITY
1
0
ANGULAR DISPLACEMENT – DEGREES
0.5
-90 -60 0-30 30 60 90
NORMALIZED INTENSITY
1
0
ANGULAR DISPLACEMENT – DEGREES
0.5
-90 -60 0-30 30 60 90
NORMALIZED INTENSITY
1
0
ANGULAR DISPLACEMENT – DEGREES
0.5
-90 -60 0-30 30 60 90
8
Intensity Bin Limit Table
Intensity (mcd) at 20 mA
Bin Min Max
N 680 880
P 880 1150
Q 1150 1500
R 1500 1900
S 1900 2500
T 2500 3200
U 3200 4200
V 4200 5500
W 5500 7200
X 7200 9300
Y 9300 12000
Z 12000 16000
1 16000 21000
Tolerance for each bin limit is ±15%.
Blue Color Bin Table
Bin Min Dom Max Dom Xmin Ymin Xmax Ymax
1 460.0 464.0 0.1440 0.0297 0.1766 0.0966
0.1818 0.0904 0.1374 0.0374
2 464.0 468.0 0.1374 0.0374 0.1699 0.1062
0.1766 0.0966 0.1291 0.0495
3 468.0 472.0 0.1291 0.0495 0.1616 0.1209
0.1699 0.1062 0.1187 0.0671
4 472.0 476.0 0.1187 0.0671 0.1517 0.1423
0.1616 0.1209 0.1063 0.0945
5 476.0 480.0 0.1063 0.0945 0.1397 0.1728
0.1517 0.1423 0.0913 0.1327
Tolerance for each bin limit is ±0.5 nm.
Cyan Color Bin Table
Bin Min Dom Max Dom Xmin Ymin Xmax Ymax
1 490.0 495.0 0.0454 0.2945 0.1164 0.3889
0.1318 0.306 0.0235 0.4127
2 495.0 500.0 0.0345 0.4127 0.1057 0.4769
0.1164 0.3889 0.0082 0.5384
3 500.0 505.0 0.0082 0.5384 0.1027 0.5584
0.1057 0.4769 0.0039 0.6548
4 505.0 510.0 0.0039 0.6548 0.1097 0.6251
0.1027 0.5584 0.0139 0.7502
7 498.0 503.0 0.0132 0.4882 0.1028 0.5273
0.1092 0.4417 0.0040 0.6104
8 503.0 508.0 0.0040 0.6104 0.1056 0.6007
0.1028 0.5273 0.0080 0.7153
Tolerance for each bin limit is ±0.5 nm.
Green Color Bin Table
Bin Min Dom Max Dom Xmin Ymin Xmax Ymax
1 520.0 524.0 0.0743 0.8338 0.1856 0.6556
0.1650 0.6586 0.1060 0.8292
2 524.0 528.0 0.1060 0.8292 0.2068 0.6463
0.1856 0.6556 0.1387 0.8148
3 528.0 532.0 0.1387 0.8148 0.2273 0.6344
0.2068 0.6463 0.1702 0.7965
4 532.0 536.0 0.1702 0.7965 0.2469 0.6213
0.2273 0.6344 0.2003 0.7764
5 536.0 540.0 0.2003 0.7764 0.2659 0.6070
0.2469 0.6213 0.2296 0.7543
Tolerance for each bin limit is ±0.5 nm.
9
Precautions
Lead Forming
• The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering on PC board.
• If lead forming is required before soldering, care must
be taken to avoid any excessive mechanical stress in-
duced into the LED package. Otherwise, cut the leads
to applicable length after soldering process at room
temperature. The solder joint formed will absorb the
mechanical stress, due to lead cutting, from traveling
to the LED chip die attach and wirebond.
• For better control, it is recommended to use proper
tool to precisely form and cut the leads to applicable
length rather than doing it manually.
Soldering Conditions
• Care must be taken during PCB assembly and soldering
process to prevent damage to LED component.
• The closest manual soldering distance of the soldering
heat source (soldering iron’s tip) to the body is
1.59 mm. Soldering the LED closer than 1.59 mm might
damage the LED.
• Recommended soldering conditions:
Manual Solder
Wave Soldering Dipping
Pre-heat Temperature 105 °C Max. –
Pre-heat Time 30 sec Max. –
Peak Temperature 250 °C Max. 260 °C Max.
Dwell Time 3 sec Max. 5 sec Max.
• If necessary, use fixture to hold the LED component
in proper orientation with respect to the PCB during
soldering process.
• At elevated temperature, the LED is more susceptible
to mechanical stress. Therefore, PCB must be allowed
to cool down to room temperature prior to handling,
which includes removal of jigs, fixtures or pallet.
• Special attention must be given to board fabrication,
solder masking, surface plating and lead holes size
and component orientation to assure solderability.
• Recommended PC board plated through hole sizes for
LED component leads:
LED Component Plated Through
Lead Size Diagonal Hole Diameter
0.457 x 0.457 mm 0.646 mm 0.976 to 1.078 mm
(0.018 x 0.018 inch) (0.025 inch) (0.038 to 0.042 inch)
0.508 x 0.508 mm 0.718 mm 1.049 to 1.150 mm
(0.020 x 0.020 inch) (0.028 inch) (0.041 to 0.045 inch)
Note: Refer to application note AN1027 for more information on soldering LED
components.
• Wave soldering parameter must be set and maintained
according to recommended temperature and dwell
time in the solder wave. Customer is advised to daily
check on the soldering profile to ensure the soldering
profile is always conforming to recommended
soldering condition.
Notes:
1. PCB with different size and design (component density) will have different heat
mass (heat capacity). This might cause a change in temperature experienced by the
board if samewave soldering setting is used. So, it is recommended to recalibrate
the soldering profile again before loading a new type of PCB.
2. Avago Technologies’ high brightness LEDs use a high efficiency LED die with single
wire bond, as shown below. Customer is advised to take extra precaution during
wave soldering to ensure that the maximum wave temperature does not exceed 250°C.
Over-stressing the LED during soldering process might cause premature failure to the
LED due to delamination.
Note: Electrical connection between bottom surface of LED die and the lead frame material
through conductive paste of solder.
Avago Technologies LED Configuration
InGaN Device
• Over sizing of plated through hole can lead to
twisting or improper LED placement during auto
insertion. Under sizing plated through hole can lead to
mechanical stress on the epoxy lens during clinching.
1.59 mm
ANODE
Recommended Wave Soldering Profile
Ammo Packs Drawing
10
LAMINAR WAVE BOTTOM SIDE
OF PC BOARD
HOT AIR KNIFE
TURBULENT WAVE
FLUXING
PREHEAT
0 10 20
30
50
100
150
200
250
30 40 50
TIME – SECONDS
TEMPERATURE – °C
60 70 80 90 100
TOP SIDE OF
PC BOARD
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150°C (100°C PCB)
SOLDER WAVE TEMPERATURE = 245°C ± 5°C
AIR KNIFE AIR TEMPERATURE = 390°C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40°
SOLDER: SN63; FLUX: RMA
LEAD-FREE SOLDER: 96.5% Sn; 3% Ag; 0.5% Cu
NOTE: ALLOW FOR BOARDS TO BE
SUFFICIENTLY COOLED BEFORE
EXERTING MECHANICAL FORCE.
18.00 ± 0.50
(0.7087 ± 0.0197)
6.35 ± 1.30
(0.25 ± 0.0512)
12.70 ± 1.00
(0.50 ± 0.0394)
9.125 ± 0.625
(0.3593 ± 0.0246)
12.70 ± 0.30
(0.50 ± 0.0118)
CATHODE
0.70 ± 0.20
(0.0276 ± 0.0079)
20.50 ± 1.00
(0.807 ± 0.039)
A A
VIEW A–A
∅4.00 ± 0.20
(0.1575 ± 0.008) TYP.
ALL DIMENSIONS IN MILLIMETERS (INCHES).
NOTE: THE AMMO-PACKS DRAWING IS APPLICABLE FOR PACKAGING OPTION -DD & -ZZ AND REGARDLESS OF STANDOFF OR NON-STANDOFF.
For product information and a complete list of distributors, please go to our website: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.
Data subject to change. Copyright © 2008 Avago Technologies Limited. All rights reserved. Obsoletes 5989-4115EN
AV02-0367EN March 6, 2008
Packaging Box for Ammo Packs
DISCLAIMER
AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR
SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT
OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY
RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS
DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE.
FROM LEFT SIDE OF BOX,
ADHESIVE TAPE MUST BE
FACING UPWARD.
AVAGO
TECHNOLOGIES
ANODE
MOTHER LABEL
CATHODE
C
A
+
–
ANODE LEAD LEAVES
THE BOX FIRST.
NOTE:
FOR InGaN DEVICE, THE AMMO PACK PACKAGING BOX CONTAINS ESD LOGO.
LABEL ON
THIS SIDE
OF BOX.
