Ver.2014-12-22
IRON SOLDERING METHOD
* Recommended Iron Soldering conditions
Temperature of Iron : 350℃ or less
Soldering time : within 3s (At a lead)
Soldering Position : At least 4mm away from body. (Prevent the temperature rise of the body.)
(Note1) Do not apply load to body and lead when soldering.
(Note2) Do not heat the whole body when soldering.
IC STORAGE CONDITION AND ITS DURATION
(1) Temperature and humidity ranges.
Temperature: 5 ~ 40 (℃)
Humidity : 30 ~ 75 (%)
Normally a package product does not have a quality problem such as package crack because of absorbing
humidity. However, the above stated conditions are recommended for storage. Please note that an
electrostatic discharge is apt to destroy the product under the dried environment below 30%.
It is also recommended to store the products avoiding the place where it creates dew with the products due to
a sudden change in temperature.
(2) Please do not expose the products in the corrosive atmosphere.
(3) Please store the products in dust free place.
(4) Please do not expose the products to a direct sun light.
(5) Please store the IC without adding a load.
(6) No need to worry about baking under above storage terms.
(7) The leads are silver plated and they are discolored if the device is left open to the air for long after taken out of
the envelop. It causes deterioration of soldering characteristics. Mount the device as short as possible after
opening the envelope.
STORAGE DURATION
Please store the products less than one year after opening the envelop is made.
For the products which storage duration are longer than one year, please check the solderability and if the leads
are rusty before they are used.
[CAUTION]
The specifications on this databook are only
given for information , without any guarantee
as regards either mistakes or omissions. The
application circuits in this databook are
described only to show representative usages
of the product and not intended for the
guarantee or permission of any right including