1
Rectifier Device Data
D2PAK Surface Mount Power Package
The D2PAK Power Rectifier employs the Schottky Barrier principle in a large
metal–to–silicon power diode. State–of–the–art geometry features epitaxial
construction with oxide passivation and metal overlay contact. Ideally suited for
use in low voltage, high frequency switching power supplies, free wheeling
diodes, and polarity protection diodes. These state–of–the–art devices have the
following features:
•Center–Tap Configuration
•Guardring for Stress Protection
•Low Forward Voltage
•125°C Operating Junction Temperature
•Epoxy Meets UL94, VO at 1/8″
•Guaranteed Reverse Avalanche
•Short Heat Sink Tab Manufactured — Not Sheared!
•Similar in Size to the Industry Standard TO–220 Package
Mechanical Characteristics
•Case: Epoxy, Molded
•Weight: 1.7 grams (approximately)
•Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable
•Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds
•Shipped 50 units per plastic tube
•Available in 24 mm Tape and Reel, 800 units per 13″ reel by adding a “T4” suffix to the part number
•Marking: B2535L
MAXIMUM RATINGS (PER LEG)
Rating Symbol Value Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
35 Volts
Average Rectified Forward Current
(Rated VR) TC = 110°CIF(AV) 12.5 Amps
Peak Repetitive Forward Current
(Rated VR, Square Wave, 20 kHz), TC = 90°CIFRM 25 Amps
Nonrepetitive Peak Surge Current
(Surge applied at rated load conditions halfwave, single phase, 60 Hz) IFSM 150 Amps
Peak Repetitive Reverse Surge Current (2.0 µs, 1.0 kHz) IRRM 1.0 Amp
Storage Temperature Tstg –65 to +150 °C
Operating Junction Temperature TJ–65 to +125 °C
Voltage Rate of Change (Rated VR) dv/dt 10,000 V/µs
THERMAL CHARACTERISTICS (PER LEG)
Thermal Resistance — Junction to Case
— Junction to Ambient (1) RθJC
RθJA 2.0
50 °C/W
(1) When mounted using minimum recommended pad size on FR–4 board.
Designer’s Data for “W orst Case” Conditions — The Designer’s Data Sheet permits the design of most circuits entirely from the information presented. SOA Limit
curves — representing boundaries on device characteristics — are given to facilitate “worst case” design.
Designer’s and SWITCHMODE are trademarks of Motorola, Inc.
Thermal Clad is a trademark of the Bergquist Company
Preferred devices are Motorola recommended choices for future use and best overall value.
Order this document
by MBRB2535CTL/D
SEMICONDUCTOR TECHNICAL DATA
Motorola, Inc. 1996
SCHOTTKY BARRIER
RECTIFIER
25 AMPERES
35 VOLTS
CASE 418B–02
D2PAK
Motorola Preferred Device
4
3
1
1
34
Rev 1
MBRB2535CTL
2Rectifier Device Data
ELECTRICAL CHARACTERISTICS (PER LEG)
Rating Symbol Value Unit
Maximum Instantaneous Forward Voltage (2) (iF = 25 Amps, TJ = 25°C)
(iF = 12.5 Amps, TJ = 125°C)
(iF = 12.5 Amps, TJ = 25°C)
vF0.55
0.41
0.47
Volts
Maximum Instantaneous Reverse Current (2) (Rated dc V oltage, TJ = 125°C)
(Rated dc Voltage, TJ = 25°C) iR500
10 mA
(2) Pulse Test: Pulse Width = 300 µs, Duty Cycle ≤2.0%.
, REVERSE LEAKAGE CURRENT (mA)
50
20
10
5
2
1
0.5
0.2
0.1 0.9 100.80.70.60.50.40.30.20.10 vF, INSTANTANEOUS VOLTAGE (VOLTS)
Figure 1. Typical Forward Voltage, Per Leg
IF, INSTANTANEOUS FORWARD CURRENT (AMP)
1000
100
10
1
IR
0.1
35302520150 VR, REVERSE VOLTAGE (VOL TS)
Figure 2. Typical Reverse Current, Per Leg
510
T
J
= 125
°
C
TJ = 25
°
C
TJ = 100
°
C
DC
TJ = 125
°
C
SQUARE
WAVE
40
35
30
25
20
15
10
5
0
PF(AV), AVERAGE FORWARD POWER DISSIP ATION (W ATTS)
403530252015105 IF(AV), A VERAGE FOR W ARD CURRENT (AMPS)
Figure 3. Typical Forward Power Dissipation
0
SINE WAVE
(RESISTIVE LOAD)
(RATED Vr APPLIED)
R
θ
JC = 2
°
C/W
SQUARE
DC
32
28
24
20
16
12
8
4
IF(AV), A VERAGE FORW ARD CURRENT (AMPS)
01251151059585 TC, CASE TEMPERATURE (
°
C)
Figure 4. Current Derating, Case
TJ = 125
°
C
TJ = 25
°
C
MBRB2535CTL
3
Rectifier Device Data
INFORMATION FOR USING THE D2PAK SURFACE MOUNT PACKAGE
MINIMUM RECOMMENDED FOOTPRINTS FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor packages must be
the correct size to insure proper solder connection interface
between the board and the package. With the correct pad
geometry, the packages will self align when subjected to a
solder reflow process.
mm
inches
0.70
17.78
0.0625
1.587
0.08
2.032
0.15
3.81
0.350
8.89
0.450
11.43
D2PAK POWER DISSIPATION
The power dissipation of the D2PAK is a function of the drain
pad size. This can vary from the minimum pad size for
soldering to a pad size given for maximum power dissipation.
Power dissipation for a surface mount device is determined by
TJ(max), the maximum rated junction temperature of the die,
RθJA, the thermal resistance from the device junction to
ambient; and the operating temperature, T A. Using the values
provided on the data sheet for the D2P AK package, PD can be
calculated as follows:
PD = TJ(max) – TA
RθJA
The values for the equation are found in the maximum
ratings table on the data sheet. Substituting these values into
the equation for an ambient temperature T A of 25°C, one can
calculate the power dissipation of the device which in this case
is 2.5 watts.
PD = 150°C – 25°C
50°C/W = 2.5 watts
The 50°C/W for the D2PAK package assumes the
recommended drain pad area of 158K mil2 on FR–4 glass
epoxy printed circuit board to achieve a power dissipation of
2.5 watts using the footprint shown. Another alternative is to
use a ceramic substrate or an aluminum core board such as
Thermal Clad. By using an aluminum core board material
such as Thermal Clad, the power dissipation can be doubled
using the same footprint.
GENERAL SOLDERING PRECAUTIONS
The melting temperature of solder is higher than the rated
temperature of the device. When the entire device is heated
to a high temperature, failure to complete soldering within a
short time could result in device failure. Therefore, the
following items should always be observed in order to
minimize the thermal stress to which the devices are
subjected.
•Always preheat the device.
•The delta temperature between the preheat and soldering
should be 100°C or less.*
•When preheating and soldering, the temperature of the
leads and the case must not exceed the maximum
temperature ratings as shown on the data sheet. When
using infrared heating with the reflow soldering method,
the difference shall be a maximum of 10°C.
•The soldering temperature and time shall not exceed
260°C for more than 5 seconds.
•When shifting from preheating to soldering, the maximum
temperature gradient shall be 5°C or less.
•After soldering has been completed, the device should be
allowed to cool naturally for at least three minutes.
Gradual cooling should be used as the use of forced
cooling will increase the temperature gradient and result
in latent failure due to mechanical stress.
•Mechanical stress or shock should not be applied during
cooling
* Soldering a device without preheating can cause excessive
thermal shock and stress which can result in damage to the
device.
* Due to shadowing and the inability to set the wave height to
incorporate other surface mount components, the D2PAK is
not recommended for wave soldering.
MBRB2535CTL
4Rectifier Device Data
RECOMMENDED PROFILE FOR REFLOW SOLDERING
For any given circuit board, there will be a group of control
settings that will give the desired heat pattern. The operator
must set temperatures for several heating zones, and a figure
for belt speed. Taken together, these control settings make up
a heating “profile” for that particular circuit board. On
machines controlled by a computer , the computer remembers
these profiles from one operating session to the next. Figure
5 shows a typical heating profile for use when soldering the
D2PAK to a printed circuit board. This profile will vary among
soldering systems but it is a good starting point. Factors that
can affect the profile include the type of soldering system in
use, density and types of components on the board, type of
solder used, and the type of board or substrate material being
used. This profile shows temperature versus time. The line on
the graph shows the actual temperature that might be
experienced on the surface of a test board at or near a central
solder joint. The two profiles are based on a high density and
a low density board. The Vitronics SMD310 convection/in-
frared reflow soldering system was used to generate this
profile. The type of solder used was 62/36/2 Tin Lead Silver
with a melting point between 177–189°C. When this type of
furnace is used for solder reflow work, the circuit boards and
solder joints tend to heat first. The components on the board
are then heated by conduction. The circuit board, because it
has a large surface area, absorbs the thermal energy more
efficiently, then distributes this energy to the components.
Because of this effect, the main body of a component may be
up to 30 degrees cooler than the adjacent solder joints.
STEP 1
PREHEAT
ZONE 1
“RAMP”
STEP 2
VENT
“SOAK”
STEP 3
HEATING
ZONES 2 & 5
“RAMP”
STEP 4
HEATING
ZONES 3 & 6
“SOAK”
STEP 5
HEATING
ZONES 4 & 7
“SPIKE”
STEP 6
VENT STEP 7
COOLING
200
°
C
150
°
C
100
°
C
50
°
C
TIME (3 TO 7 MINUTES T OTAL) TMAX
SOLDER IS LIQUID FOR
40 TO 80 SECONDS
(DEPENDING ON
MASS OF ASSEMBLY)
205
°
TO 219
°
C
PEAK AT
SOLDER JOINT
DESIRED CURVE FOR LOW
MASS ASSEMBLIES
DESIRED CURVE FOR HIGH
MASS ASSEMBLIES
100
°
C
150
°
C
160
°
C
170
°
C
140
°
C
Figure 5. Typical Solder Heating Profile for D2PAK
MBRB2535CTL
5
Rectifier Device Data
PACKAGE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.340 0.380 8.64 9.65
B0.380 0.405 9.65 10.29
C0.160 0.190 4.06 4.83
D0.020 0.035 0.51 0.89
E0.045 0.055 1.14 1.40
G0.100 BSC 2.54 BSC
H0.080 0.110 2.03 2.79
J0.018 0.025 0.46 0.64
K0.090 0.110 2.29 2.79
S0.575 0.625 14.60 15.88
V0.045 0.055 1.14 1.40
STYLE 3:
PIN 1. ANODE
2. CATHODE
3. ANODE
4. CATHODE
CASE 418B–02
ISSUE B
SEATING
PLANE
B
S
G
D
–T–
M
0.13 (0.005) T
231
4
3 PL
K
J
H
V
E
C
A
MBRB2535CTL
6Rectifier Device Data
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the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
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