April 1995 3
Philips Semiconductors Product specification
N-channel FETs PMBF4391; PMBF4392;
PMBF4393
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
THERMAL RESISTANCE
CHARACTERISTICS
Tj=25°C unless otherwise specified
Drain-source voltage ±VDS max. 40 V
Drain-gate voltage VDGO max. 40 V
Gate-source voltage −VGSO max. 40 V
Gate current (DC) IGmax. 50 mA
Total power dissipation up to Tamb =40°C(1) Ptot max. 250 mW
Storage temperature range Tstg −65 to +150 °C
Junction temperature Tjmax. 150 °C
From junction to ambient(1) Rth j-a = 430 K/W
Gate-source voltage
IG= 1 mA; VDS = 0 VGSon <1V
Gate-source cut-off current
VDS = 0 V; −VGS = 20 V −IGSS <0.1 nA
VDS = 0 V; −VGS = 20 V; Tamb = 150 °C−IGSS <0.2 µA
PMBF4391 PMBF4392 PMBF4393
Drain current
VDS = 20 V; VGS =0 I
DSS >
<50
150 25
75 5
30 mA
mA
Gate-source breakdown voltage
−IG=1µA; VDS =0 −V
(BR)GSS >40 40 40 V
Gate-source cut-off voltage
ID= 1 nA; VDS = 20 V −V(P)GS >
<4
10 2
50.5
3V
V
Drain-source voltage (on)
ID= 12 mA; VGS =0 V
DSon <0.4 −−V
I
D
= 6 mA; VGS =0 V
DSon <0.4 −V
ID= 3 mA; VGS =0 V
DSon <− −0.4 V
Drain-source resistance (on)
ID= 0; VGS = 0; f = 1 kHz; Tamb =25°Cr
ds on <30 −100 Ω
Drain cut-off current
−VGS = 12 V VDS = 20 V IDSX <0.1 −−nA
−VGS =7 V I
DSX <− 0.1 −nA
−VGS =5 V I
DSX <− −0.1 nA
−VGS = 12 V VDS = 20 V; Tamb = 150 °CIDSX <0.2 −−µA
−V
GS =7 V I
DSX <− 0.2 −µA
−V
GS =5 V I
DSX <− −0.2 µA