TDA3661AT/N1 - Philips Semiconductors / NXP Semiconductors

DATA SH EET

Product speciﬁcation

Supersedes data of 2000 Dec 08

File under Integrated Circuits, IC01

2000 Dec 13

INTEGRATED CIRCUITS

TDA3661

Very low dropout voltage/quiescent

current adjustable voltage regulator

2000 Dec 13 2

Philips Semiconductors Product speciﬁcation

Very low dropout voltage/quiescent current

adjustable voltage regulator TDA3661

FEATURES

•Output adjustable from 1.5 V to VP, 100 mA regulator

•Supply voltage range up to 45 V

•Very low quiescent current of 15 µA (typical value)

•Very low dropout voltage

•High ripple rejection

•Very high stability:

– Electrolytic capacitors: Equivalent Series

Resistance (ESR) < 22 Ω at worst-case condition

– Other capacitors: 100 nF at 200 µA≤IREG ≤100 mA.

•Pin compatible family TDA3662 to TDA3666

•Protections:

– Reverse polarity safe (down to −25 V without high

reverse current)

– Negative transient of 50 V (RS=10Ω, t < 100 ms)

– Able to withstand voltages up to 18 V at the output

(supply line may be short-circuited)

– ESD protection on all pins

– DC short-circuit safe to ground and VP of the

regulator output

– Temperature protection (at Tj> 150 °C).

GENERAL DESCRIPTION

The TDA3661 is an adjustable voltage regulator with very

lowdropoutvoltageandquiescentcurrent,whichoperates

over a wide supply voltage range.

QUICK REFERENCE DATA

Note

ORDERING INFORMATION

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply

VPsupply voltage regulator on 3 14.4 45 V

Iqquiescent supply current VP= 14.4 V; IREG =0mA −15 30 µA

Regulator; k = 4.01929 (note 1)

VREG output voltage 8 V ≤VP≤22 V; IREG = 0.5 mA 4.8 5.0 5.2 V

6V≤V

P≤45 V; IREG = 0.5 mA 4.75 5.0 5.25 V

VP= 14.4 V;

0.5 mA ≤IREG ≤100 mA 4.75 5.0 5.25 V

Vref reference voltage VP= 14.4 V 1.181 1.244 1.306 V

VREG(drop) dropout voltage VP= 4.5 V; IREG = 50 mA;

Tamb ≤85 °C−0.18 0.3 V

TYPE

NUMBER PACKAGE

NAME DESCRIPTION VERSION

TDA3661AT SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1

VREG Vref k×=

2000 Dec 13 3

Philips Semiconductors Product speciﬁcation

Very low dropout voltage/quiescent current

adjustable voltage regulator TDA3661

BLOCK DIAGRAM

handbook, halfpage

MGS579

REGULATOR

2, 3, 6, 7

GND

REG

5ADJ

BAND GAP

TDA3661 THERMAL

PROTECTION

Fig.1 Block diagram.

PINNING

Note

1. All GND pins are connected to the lead frame and can

also be used to reduce the total thermal resistance

Rth(j-a) by soldering these pins to a ground plane.

The ground plane on the top side of the PCB acts like

a heat spreader.

SYMBOL PIN DESCRIPTION

REG 1 regulator output

GND 2, 3, 6 and 7 ground; note 1

n.c. 4 not connected

ADJ 5 feedback input

VP8 supply voltage

handbook, halfpage

MGS580

TDA3661

GNDGND

GND

ADJ

n.c.

GND

REG

Fig.2 Pin configuration.

2000 Dec 13 4

Philips Semiconductors Product speciﬁcation

Very low dropout voltage/quiescent current

adjustable voltage regulator TDA3661

FUNCTIONAL DESCRIPTION

The TDA3661 is an adjustable voltage regulator with an

output voltage that can be fixed by means of an external

resistor divider. The regulator can deliver output currents

up to 100 mA. The regulator is available in an SO8

package. The regulator is intended for portable, mains,

telephone and automotive applications. To increase the

lifetime of batteries, a specially built-in clamp circuit keeps

the quiescent current of this regulator very low, in dropout

and full load conditions.

The device remains operational down to very low supply

voltages (typical 2 V) and below this voltage it switches off.

Atemperatureprotectionisincludedwhichswitches offthe

regulator output at a junction temperature above 150 °C.

A new output circuit guarantees the stability of the

regulator for a capacitor output circuit with an ESR

(worst-case) up to 22 Ω, see Figs 4 and 5. If only a 100 nF

capacitor is used, the regulator is fully stable when

IREG > 200 µA. This is very attractive as the ESR of an

electrolytic capacitor increases strongly at low

temperatures (no expensive tantalum capacitor is

required).

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 60134).

THERMAL CHARACTERISTICS

QUALITY SPECIFICATION

In accordance with

“SNW-FQ-611E”

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

VPsupply voltage −45 V

VP(rp) reverse polarity supply voltage non-operating −−25 V

Ptot total power dissipation temperature of copper area

is 25 °C−4.1 W

Tstg storage temperature non-operating −55 +150 °C

Tamb ambient temperature operating −40 +125 °C

Tjjunction temperature operating −40 +150 °C

SYMBOL PARAMETER CONDITIONS VALUE UNIT

Rth(j-c) thermal resistance from junction to case to centre pins; soldered 30 K/W

Rth(j-a) thermal resistance from junction to ambient in free air; soldered 125 K/W

2000 Dec 13 5

Philips Semiconductors Product speciﬁcation

Very low dropout voltage/quiescent current

adjustable voltage regulator TDA3661

CHARACTERISTICS

VP= 14.4 V; Tamb =25°C; k = 4.01929 (note 1); measured with test circuit of Fig.3; unless otherwise speciﬁed.

Notes

1. The output voltage can be calculated using the following formula: where and

R1 + R2 ≤100 kΩ.

2. The regulator output will follow VPif VP<V

REG +V

REG(drop).

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply voltage: pin VP

VPsupply voltage regulator operating; note 2 3 14.4 45 V

Iqquiescent supply current VP= 4.5 V; IREG =0mA −10 30 µA

VP= 14.4 V; IREG =0mA −15 30 µA

6V≤V

P≤24 V; IREG =10mA −0.2 0.5 mA

6V≤V

P≤24 V; IREG =50mA −1.4 2.5 mA

Regulator output: pin REG

VREG output voltage 8 V ≤VP≤22 V; IREG = 0.5 mA 4.8 5.0 5.2 V

0.5 mA ≤IREG ≤100 mA 4.75 5.0 5.25 V

6V≤V

P≤45 V; IREG = 0.5 mA 4.75 5.0 5.25 V

VREG(drop) dropout voltage VP= 4.5 V; Tamb ≤85 °C;

IREG =50mA −0.18 0.3 V

VREG(stab) output voltage long-term stability −20 −mV/1000 h

VREG(adj) output voltage adjust range 1.5 −VPV

∆VREG(line) line input regulation voltage 7 V ≤VP≤22 V; IREG = 0.5 mA −130mV

7V≤V

P≤45 V; IREG = 0.5 mA −150mV

∆V

REG(load) load output regulation voltage 0.5 mA ≤IREG ≤50 mA −10 50 mV

SVRR supply voltage ripple rejection fi= 120 Hz;

Vi(ripple) = 1 V (RMS);

IREG = 0.5 mA

50 60 −dB

Vref reference voltage VP= 14.4 V 1.181 1.244 1.306 V

IREG(crl) output current limit VREG > 4 V 0.17 0.3 −A

ILO(rp) output leakage current at reverse

polarity VP=−15 V; VREG =≤0.3 V −1 500 µA

VREG Vref k×=kR1 R2+

----------------------

2000 Dec 13 6

Philips Semiconductors Product speciﬁcation

Very low dropout voltage/quiescent current

adjustable voltage regulator TDA3661

TEST AND APPLICATION INFORMATION

andbook, halfpage

MGS581

VP81

2, 3, 6, 7

VREG

= 5 V

TDA3661

75.1 kΩ10 µF

C1(1)

1 µFR1

24.9 kΩ

Fig.3 Test circuit.

(1) C1 is optional (to minimize supply noise only).

Noise

The output noise is determined by the value of the output

capacitor. The noise figure is measured at a bandwidth of

10 Hz to 100 kHz (see Table 1).

Table 1 Noise ﬁgures

Stability

The regulator is stabilized with an external capacitor

connected to the output. The value of this capacitor can be

selected using the diagrams shown in Figs 4 and 5.

The following three examples show the effects of the

stabilization circuit using different values for the output

capacitor.

OUTPUT

CURRENT

IREG (mA)

NOISE FIGURE (µV)

C2 = 10 µFC2=47µF C2 = 100 µF

0.5 550 320 300

50 650 400 400

handbook, halfpage

MDA961

ESR

(Ω)

C2 (µF)

102

10−1

10−111010

stable region

(2)

(1)

Fig.4 Graph for selecting the value of the output

capacitor.

(1) Maximum ESR at 200 µA≤IREG ≤100 mA.

(2) Minimum ESR only when IREG ≤200 µA.

handbook, halfpage

MDA962

ESR

(Ω)

IREG (mA)

103

102

10−1110 10

102

stable region

Fig.5 ESR as a function of IREG for selecting the

value of the output capacitor.

2000 Dec 13 7

Philips Semiconductors Product speciﬁcation

Very low dropout voltage/quiescent current

adjustable voltage regulator TDA3661

EXAMPLE 1

The regulator is stabilized with an electrolytic capacitor of

68 µF (ESR = 0.5 Ω). At Tamb =−40 °C, the capacitor

value is decreased to 22 µF and the ESR is increased

to 3.5 Ω. The regulator will remain stable at a temperature

of Tamb =−40 °C.

EXAMPLE 2

The regulator is stabilized with a 100 nF MKT capacitor

connected to the output. When the output current is larger

then 200 µA full stability is guaranteed. Because the

thermalinfluence onthecapacitorvalue isalmostzero,the

regulator will remain stable at a temperature of

Tamb =−40 °C.

EXAMPLE 3

The regulator is stabilized with a 100 nF capacitor in

parallelwith anelectrolyticcapacitorof10 µF connectedto

the output.

The regulator is now stable under all conditions and

independant of:

•The ESR of the electrolytic capacitor

•The value of the electrolytic capacitor

•The output current.

Application circuits

The maximum output current of the regulator equals:

When Tamb =21°C, VP= 14 V and VREG =5V

(k = 4.01929) the maximum output current equals 140 mA.

For successful operation of the IC (maximum output

current capability) special attention has to be given to the

copper area required as heatsink (connected to all

GND pins), the thermal capacity of the heatsink and its

ability to transfer heat to the external environment. It is

possible to reduce the total thermal resistance from

120 to 50 K/W.

APPLICATION CIRCUIT WITH BACKUP FUNCTION

Sometimes, a backup function is needed to supply, for

example, a microcontroller for a short period of time when

the supply voltage spikes to 0 V (or even −1 V).

Thisfunction can easilybebuiltwiththeTDA3661 by using

an output capacitor with a large value. When the supply

voltage is 0 V (or −1 V), only a small current will flow into

pin REG from this output capacitor (a few µA).

The application circuit is given in Fig.6.

IREG max() 150 Tamb

–

Rth j a–()V

REG

–()×

-----------------------------------------------------------

150 Tamb

–

100 VP5–()×

-------------------------------------

=(mA)

ndbook, halfpage

MGS582

VP81

2, 3, 6, 7

(2)

TDA3661

75.1 kΩ

(1)

1 µFR1

24.9 kΩ

VREG

= 5 V

Fig.6 Application circuit with backup function.

(1) C1 is optional (to minimize supply noise only).

(2) C2 ≤4700 µF.

2000 Dec 13 8

Philips Semiconductors Product speciﬁcation

Very low dropout voltage/quiescent current

adjustable voltage regulator TDA3661

APPLICATION CIRCUIT WITH ENABLE FUNCTION

AnenablefunctioncaneasilybebuiltwiththeTDA3661by

connecting a diode to pin ADJ. When the voltage on

pin ADJ is forced above 1.3 V, the output will switch off.

Thestandby current is equaltothequiescent current of the

TDA3661.

The application circuit is given in Fig.7.

ndbook, halfpage

MGS583

VP81

2, 3, 6, 7

enable

TDA3661 75.1 kΩ10 µF

C1(1)

1 µFR1

24.9 kΩ

R2 D1

VREG

= 5 V

Fig.7 Application circuit with enable function.

(1) C1 is optional (to minimize supply noise only).

Additional application information

This section gives typical curves for various parameters measured on the TDA3661AT. Standard test conditions are:

VP= 14.4 V, Tamb =25°C and k = 4.01929.

handbook, halfpage

010 V

(V)

(µA)

20 30

MDA947

Fig.8 Quiescent current as a function of the

supply voltage.

IREG = 0 mA.

handbook, halfpage

010 50

20 30 VP (V)

(mA)

MDA949

Fig.9 Quiescent current increase as a function of

high supply voltage.

2000 Dec 13 9

Philips Semiconductors Product speciﬁcation

Very low dropout voltage/quiescent current

adjustable voltage regulator TDA3661

handbook, halfpage

−40 0

(1)

(2)

160

1.5

0.5

40 80 Tj (°C)

(mA)

120

MDA951

Fig.10 Quiescent current as a function of the

junction temperature.

(1) Iq at 50 mA load.

(2) Iq at 10 mA load.

Fig.11 Quiescent current as a function of the

supply voltage.

IREG = 10 mA.

handbook, halfpage

0.36

0.40

0.44

0.48

10 15 VP (V)

(mA)

2520

MDA948

handbook, halfpage

1.4

1.6

1.8

10 15 VP (V)

(mA)

2520

MDA950

Fig.12 Quiescent current as a function of the

supply voltage.

IREG = 50 mA.

handbook, halfpage

0 20 100

40 60 IREG (mA)

(mA)

MDA952

Fig.13 Quiescent current as a function of the

output current.

2000 Dec 13 10

Philips Semiconductors Product speciﬁcation

Very low dropout voltage/quiescent current

adjustable voltage regulator TDA3661

handbook, halfpage

−50 200

5.10

4.95

5.00

5.05

050 T

(°C)

VREG

(V)

100 150

MDA953

Fig.14 Output voltage as a function of the junction

temperature.

IREG = 0 mA.

handbook, halfpage

−50 200

050 T

(°C)

VREG

(V)

100 150

MDA955

Fig.15 Output voltage thermal protection as a

function of the junction temperature.

IREG = 0 mA.

handbook, halfpage

040 I

REG (mA)

VREG(drop)

(mV)

80 120

500

400

200

100

300

MDA957

Fig.16 Dropout voltage as a function of the output

current.

handbook, halfpage

0100

VREG

(V)

IREG (mA)

200 300

MDA954

Fig.17 Fold back protection mode.

VP= 8 V and pulsed load.

2000 Dec 13 11

Philips Semiconductors Product speciﬁcation

Very low dropout voltage/quiescent current

adjustable voltage regulator TDA3661

handbook, halfpage

−70

−60

−50

−40

−30

MDA956

SVRR

(dB)

f (Hz)

102103104105

(1)

(2)

(3)

Fig.18 SVRR as a function of the ripple frequency.

IREG = 10 mA; C2 = 10 µF.

(1) SVRR at RL= 100 Ω.

(2) SVRR at RL= 500 Ω.

(3) SVRR at RL=10kΩ.

2000 Dec 13 12

Philips Semiconductors Product speciﬁcation

Very low dropout voltage/quiescent current

adjustable voltage regulator TDA3661

PACKAGE OUTLINE

UNIT A

max. A1A2A3bpcD

(1) E(2) (1)

ELL

pQZywv θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC EIAJ

inches

1.75 0.25

0.10 1.45

1.25 0.25 0.49

0.36 0.25

0.19 5.0

4.8 4.0

3.8 1.27 6.2

5.8 1.05 0.7

0.6 0.7

0.3 8

0.25 0.10.25

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

1.0

0.4

SOT96-1

detail X

vMA

(A )

pin 1 index

076E03 MS-012

0.069 0.010

0.004 0.057

0.049 0.01 0.019

0.014 0.0100

0.0075 0.20

0.19 0.16

0.15 0.050 0.244

0.228 0.028

0.024 0.028

0.012

0.010.010.041 0.004

0.039

0.016

0 2.5 5 mm

scale

SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1

97-05-22

99-12-27

2000 Dec 13 13

Philips Semiconductors Product speciﬁcation

Very low dropout voltage/quiescent current

adjustable voltage regulator TDA3661

SOLDERING

Introduction to soldering surface mount packages

Thistext gives averybriefinsighttoa complex technology.

A more in-depth account of soldering ICs can be found in

our

“Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011).

There is no soldering method that is ideal for all surface

mount IC packages. Wave soldering can still be used for

certainsurface mountICs,butit isnotsuitablefor fine pitch

SMDs. In these situations reflow soldering is

recommended.

Reﬂow soldering

Reflow soldering requires solder paste (a suspension of

fine solder particles, flux and binding agent) to be applied

totheprinted-circuitboardby screen printing, stencilling or

pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,

convection or convection/infrared heating in a conveyor

type oven. Throughput times (preheating, soldering and

cooling) vary between 100 and 200 seconds depending

on heating method.

Typical reflow peak temperatures range from

215 to 250 °C. The top-surface temperature of the

packages should preferable be kept below 220 °C for

thick/large packages, and below 235 °C for small/thin

packages.

Wave soldering

Conventional single wave soldering is not recommended

forsurface mountdevices(SMDs)or printed-circuit boards

with a high component density, as solder bridging and

non-wetting can present major problems.

To overcome these problems the double-wave soldering

method was specifically developed.

If wave soldering is used the following conditions must be

observed for optimal results:

•Use a double-wave soldering method comprising a

turbulent wave with high upward pressure followed by a

smooth laminar wave.

•For packages with leads on two sides and a pitch (e):

– larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the

transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the

printed-circuit board.

The footprint must incorporate solder thieves at the

downstream end.

•Forpackages withleadsonfour sides,thefootprintmust

be placed at a 45°angle to the transport direction of the

printed-circuit board. The footprint must incorporate

solder thieves downstream and at the side corners.

During placement and before soldering, the package must

be fixed with a droplet of adhesive. The adhesive can be

applied by screen printing, pin transfer or syringe

dispensing. The package can be soldered after the

adhesive is cured.

Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal

of corrosive residues in most applications.

Manual soldering

Fix the component by first soldering two

diagonally-opposite end leads. Use a low voltage (24 V or

less) soldering iron applied to the flat part of the lead.

Contact time must be limited to 10 seconds at up to

300 °C.

When using a dedicated tool, all other leads can be

soldered in one operation within 2 to 5 seconds between

270 and 320 °C.

2000 Dec 13 14

Philips Semiconductors Product speciﬁcation

Very low dropout voltage/quiescent current

adjustable voltage regulator TDA3661

Suitability of surface mount IC packages for wave and reﬂow soldering methods

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum

temperature (with respect to time) and body size of the package, there is a risk that internal or external package

cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the

Drypack information in the

“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”

2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink

(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.

The package footprint must incorporate solder thieves downstream and at the side corners.

4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;

it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is

definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

PACKAGE SOLDERING METHOD

WAVE REFLOW(1)

BGA, LFBGA, SQFP, TFBGA not suitable suitable

HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS not suitable(2) suitable

PLCC(3), SO, SOJ suitable suitable

LQFP, QFP, TQFP not recommended(3)(4) suitable

SSOP, TSSOP, VSO not recommended(5) suitable

2000 Dec 13 15

Philips Semiconductors Product speciﬁcation

Very low dropout voltage/quiescent current

adjustable voltage regulator TDA3661

DATA SHEET STATUS

Note

1. Please consult the most recently issued data sheet before initiating or completing a design.

DATA SHEET STATUS PRODUCT

STATUS DEFINITIONS (1)

Objective speciﬁcation Development This data sheet contains the design target or goal speciﬁcations for

product development. Speciﬁcation may change in any manner without

notice.

Preliminary speciﬁcation Qualiﬁcation This data sheet contains preliminary data, and supplementary data will be

published at a later date. Philips Semiconductors reserves the right to

make changes at any time without notice in order to improve design and

supply the best possible product.

Product speciﬁcation Production This data sheet contains ﬁnal speciﬁcations. Philips Semiconductors

reserves the right to make changes at any time without notice in order to

improve design and supply the best possible product.

DEFINITIONS

Short-form specification  The data in a short-form

specification is extracted from a full data sheet with the

same type number and title. For detailed information see

the relevant data sheet or data handbook.

Limiting values definition Limiting values given are in

accordance with the Absolute Maximum Rating System

(IEC 60134). Stress above one or more of the limiting

values may cause permanent damage to the device.

These are stress ratings only and operation of the device

atthese or at any other conditions above thosegiveninthe

Characteristics sections of the specification is not implied.

Exposure to limiting values for extended periods may

affect device reliability.

Application information  Applications that are

described herein for any of these products are for

illustrative purposes only. Philips Semiconductors make

norepresentationorwarranty thatsuchapplications willbe

suitable for the specified use without further testing or

modification.

DISCLAIMERS

Life support applications  These products are not

designed for use in life support appliances, devices, or

systems where malfunction of these products can

reasonably be expected to result in personal injury. Philips

Semiconductorscustomersusingor sellingtheseproducts

for use in such applications do so at their own risk and

agree to fully indemnify Philips Semiconductors for any

damages resulting from such application.

Right to make changes  Philips Semiconductors

reserves the right to make changes, without notice, in the

products, including circuits, standard cells, and/or

software, described or contained herein in order to

improve design and/or performance. Philips

Semiconductors assumes no responsibility or liability for

theuse ofanyofthese products,conveysnolicence or title

under any patent, copyright, or mask work right to these

products,andmakesnorepresentationsorwarrantiesthat

these products are free from patent, copyright, or mask

work right infringement, unless otherwise specified.

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed

without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license

under patent- or other industrial or intellectual property rights.

Internet: http://www.semiconductors.philips.com

2000 70

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Indonesia: PTPhilipsDevelopmentCorporation, SemiconductorsDivision,

Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,

Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080

Ireland: Newstead, Clonskeagh, DUBLIN 14,

Tel. +353 1 7640 000, Fax. +353 1 7640 200

Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,

TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007

Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI),

Tel. +39 039 203 6838, Fax +39 039 203 6800

Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,

TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057

Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,

Tel. +82 2 709 1412, Fax. +82 2 709 1415

Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,

Tel. +60 3 750 5214, Fax. +60 3 757 4880

Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,

Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087

Middle East: see Italy

Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,

Tel. +31 40 27 82785, Fax. +31 40 27 88399

New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,

Tel. +64 9 849 4160, Fax. +64 9 849 7811

Norway: Box 1, Manglerud 0612, OSLO,

Tel. +47 22 74 8000, Fax. +47 22 74 8341

Pakistan: see Singapore

Philippines: Philips Semiconductors Philippines Inc.,

106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,

Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474

Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW,

Tel. +48 22 5710 000, Fax. +48 22 5710 001

Portugal: see Spain

Romania: see Italy

Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,

Tel. +7 095 755 6918, Fax. +7 095 755 6919

Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,

Tel. +65 350 2538, Fax. +65 251 6500

Slovakia: see Austria

Slovenia: see Italy

South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,

2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,

Tel. +27 11 471 5401, Fax. +27 11 471 5398

South America: Al. Vicente Pinzon, 173, 6th floor,

04547-130 SÃO PAULO, SP, Brazil,

Tel. +55 11 821 2333, Fax. +55 11 821 2382

Spain: Balmes 22, 08007 BARCELONA,

Tel. +34 93 301 6312, Fax. +34 93 301 4107

Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,

Tel. +46 8 5985 2000, Fax. +46 8 5985 2745

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,

Tel. +41 1 488 2741 Fax. +41 1 488 3263

Taiwan: Philips Semiconductors, 5F, No. 96, Chien Kuo N. Rd., Sec. 1,

TAIPEI, Taiwan Tel. +886 2 2134 2451, Fax. +886 2 2134 2874

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,

60/14 MOO 11, Bangna Trad Road KM. 3, Bagna, BANGKOK 10260,

Tel. +66 2 361 7910, Fax. +66 2 398 3447

Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,

ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,

252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,

MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,

Tel. +1 800 234 7381, Fax. +1 800 943 0087

Uruguay: see South America

Vietnam: see Singapore

Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. +381 11 3341 299, Fax.+381 11 3342 553

Printed in The Netherlands 753503/04/pp16 Date of release: 2000 Dec 13 Document order number: 9397 750 07864