INTEGRATED CIRCUITS DATA SHEET TDA3661 Very low dropout voltage/quiescent current adjustable voltage regulator Product specification Supersedes data of 2000 Dec 08 File under Integrated Circuits, IC01 2000 Dec 13 Philips Semiconductors Product specification Very low dropout voltage/quiescent current adjustable voltage regulator TDA3661 - Reverse polarity safe (down to -25 V without high reverse current) FEATURES * Output adjustable from 1.5 V to VP, 100 mA regulator - Negative transient of 50 V (RS = 10 , t < 100 ms) * Supply voltage range up to 45 V - Able to withstand voltages up to 18 V at the output (supply line may be short-circuited) * Very low quiescent current of 15 A (typical value) * Very low dropout voltage - ESD protection on all pins * High ripple rejection - DC short-circuit safe to ground and VP of the regulator output * Very high stability: - Temperature protection (at Tj > 150 C). - Electrolytic capacitors: Equivalent Series Resistance (ESR) < 22 at worst-case condition - Other capacitors: 100 nF at 200 A IREG 100 mA. GENERAL DESCRIPTION * Pin compatible family TDA3662 to TDA3666 The TDA3661 is an adjustable voltage regulator with very low dropout voltage and quiescent current, which operates over a wide supply voltage range. * Protections: QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supply VP supply voltage regulator on 3 14.4 45 V Iq quiescent supply current VP = 14.4 V; IREG = 0 mA - 15 30 A 8 V VP 22 V; IREG = 0.5 mA 4.8 5.0 5.2 V Regulator; k = 4.01929 (note 1) VREG output voltage 6 V VP 45 V; IREG = 0.5 mA 4.75 5.0 5.25 V VP = 14.4 V; 0.5 mA IREG 100 mA 4.75 5.0 5.25 V Vref reference voltage VP = 14.4 V 1.181 1.244 1.306 V VREG(drop) dropout voltage VP = 4.5 V; IREG = 50 mA; Tamb 85 C - 0.18 0.3 V Note 1. V REG = V ref x k ORDERING INFORMATION TYPE NUMBER TDA3661AT 2000 Dec 13 PACKAGE NAME SO8 DESCRIPTION plastic small outline package; 8 leads; body width 3.9 mm 2 VERSION SOT96-1 Philips Semiconductors Product specification Very low dropout voltage/quiescent current adjustable voltage regulator TDA3661 BLOCK DIAGRAM handbook, halfpage VP 8 REGULATOR 1 5 BAND GAP REG ADJ THERMAL PROTECTION TDA3661 2, 3, 6, 7 MGS579 GND Fig.1 Block diagram. PINNING SYMBOL REG GND PIN 1 DESCRIPTION handbook, halfpage regulator output REG 1 2, 3, 6 and 7 ground; note 1 n.c. 4 not connected ADJ 5 feedback input VP 8 supply voltage 8 VP GND 2 7 GND TDA3661 GND 3 6 GND n.c. 4 5 ADJ MGS580 Note 1. All GND pins are connected to the lead frame and can also be used to reduce the total thermal resistance Rth(j-a) by soldering these pins to a ground plane. The ground plane on the top side of the PCB acts like a heat spreader. 2000 Dec 13 Fig.2 Pin configuration. 3 Philips Semiconductors Product specification Very low dropout voltage/quiescent current adjustable voltage regulator FUNCTIONAL DESCRIPTION TDA3661 A temperature protection is included which switches off the regulator output at a junction temperature above 150 C. The TDA3661 is an adjustable voltage regulator with an output voltage that can be fixed by means of an external resistor divider. The regulator can deliver output currents up to 100 mA. The regulator is available in an SO8 package. The regulator is intended for portable, mains, telephone and automotive applications. To increase the lifetime of batteries, a specially built-in clamp circuit keeps the quiescent current of this regulator very low, in dropout and full load conditions. A new output circuit guarantees the stability of the regulator for a capacitor output circuit with an ESR (worst-case) up to 22 , see Figs 4 and 5. If only a 100 nF capacitor is used, the regulator is fully stable when IREG > 200 A. This is very attractive as the ESR of an electrolytic capacitor increases strongly at low temperatures (no expensive tantalum capacitor is required). The device remains operational down to very low supply voltages (typical 2 V) and below this voltage it switches off. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT - 45 V - -25 V temperature of copper area - is 25 C 4.1 W -55 +150 C operating -40 +125 C operating -40 +150 C VP supply voltage VP(rp) reverse polarity supply voltage non-operating Ptot total power dissipation Tstg storage temperature non-operating Tamb ambient temperature Tj junction temperature THERMAL CHARACTERISTICS SYMBOL PARAMETER CONDITIONS VALUE UNIT Rth(j-c) thermal resistance from junction to case to centre pins; soldered 30 K/W Rth(j-a) thermal resistance from junction to ambient in free air; soldered 125 K/W QUALITY SPECIFICATION In accordance with "SNW-FQ-611E". 2000 Dec 13 4 Philips Semiconductors Product specification Very low dropout voltage/quiescent current adjustable voltage regulator TDA3661 CHARACTERISTICS VP = 14.4 V; Tamb = 25 C; k = 4.01929 (note 1); measured with test circuit of Fig.3; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supply voltage: pin VP VP supply voltage regulator operating; note 2 3 14.4 45 V Iq quiescent supply current VP = 4.5 V; IREG = 0 mA - 10 30 A VP = 14.4 V; IREG = 0 mA - 15 30 A 6 V VP 24 V; IREG = 10 mA - 0.2 0.5 mA 6 V VP 24 V; IREG = 50 mA - 1.4 2.5 mA 8 V VP 22 V; IREG = 0.5 mA 4.8 5.0 5.2 V 0.5 mA IREG 100 mA 4.75 5.0 5.25 V Regulator output: pin REG VREG output voltage VREG(drop) dropout voltage VREG(stab) output voltage long-term stability VREG(adj) output voltage adjust range VREG(line) line input regulation voltage 6 V VP 45 V; IREG = 0.5 mA 4.75 5.0 5.25 V VP = 4.5 V; Tamb 85 C; IREG = 50 mA - 0.18 0.3 V - 20 - mV/1000 h 1.5 - VP V 7 V VP 22 V; IREG = 0.5 mA - 1 30 mV 7 V VP 45 V; IREG = 0.5 mA - 1 50 mV VREG(load) load output regulation voltage 0.5 mA IREG 50 mA - 10 50 mV SVRR supply voltage ripple rejection fi = 120 Hz; Vi(ripple) = 1 V (RMS); IREG = 0.5 mA 50 60 - dB Vref reference voltage VP = 14.4 V 1.181 1.244 1.306 V IREG(crl) output current limit VREG > 4 V ILO(rp) output leakage current at reverse VP = -15 V; VREG = 0.3 V polarity 0.17 0.3 - A - 1 500 A Notes R1 + R2 1. The output voltage can be calculated using the following formula: V REG = V ref x k where k = ---------------------- and R2 R1 + R2 100 k. 2. The regulator output will follow VP if VP < VREG + VREG(drop). 2000 Dec 13 5 Philips Semiconductors Product specification Very low dropout voltage/quiescent current adjustable voltage regulator TDA3661 TEST AND APPLICATION INFORMATION MDA961 102 handbook, halfpage ESR () handbook, halfpage VP C1(1) 1 F 8 10 VREG 1 R1 75.1 k TDA3661 (1) C2 = 5 V 10 F stable region 5 1 R2 24.9 k 2, 3, 6, 7 MGS581 (2) 10-1 10-1 1 10 C2 (F) 102 (1) Maximum ESR at 200 A IREG 100 mA. (2) Minimum ESR only when IREG 200 A. (1) C1 is optional (to minimize supply noise only). Fig.4 Graph for selecting the value of the output capacitor. Fig.3 Test circuit. Noise The output noise is determined by the value of the output capacitor. The noise figure is measured at a bandwidth of 10 Hz to 100 kHz (see Table 1). Table 1 ESR () Noise figures OUTPUT CURRENT IREG (mA) C2 = 10 F C2 = 47 F C2 = 100 F 0.5 550 320 300 50 650 400 400 NOISE FIGURE (V) 102 22 10 stable region Stability 1 The regulator is stabilized with an external capacitor connected to the output. The value of this capacitor can be selected using the diagrams shown in Figs 4 and 5. The following three examples show the effects of the stabilization circuit using different values for the output capacitor. 10-1 1 Fig.5 2000 Dec 13 MDA962 103 handbook, halfpage 6 10 102 IREG (mA) 103 ESR as a function of IREG for selecting the value of the output capacitor. Philips Semiconductors Product specification Very low dropout voltage/quiescent current adjustable voltage regulator EXAMPLE 1 TDA3661 For successful operation of the IC (maximum output current capability) special attention has to be given to the copper area required as heatsink (connected to all GND pins), the thermal capacity of the heatsink and its ability to transfer heat to the external environment. It is possible to reduce the total thermal resistance from 120 to 50 K/W. The regulator is stabilized with an electrolytic capacitor of 68 F (ESR = 0.5 ). At Tamb = -40 C, the capacitor value is decreased to 22 F and the ESR is increased to 3.5 . The regulator will remain stable at a temperature of Tamb = -40 C. EXAMPLE 2 APPLICATION CIRCUIT WITH BACKUP FUNCTION The regulator is stabilized with a 100 nF MKT capacitor connected to the output. When the output current is larger then 200 A full stability is guaranteed. Because the thermal influence on the capacitor value is almost zero, the regulator will remain stable at a temperature of Tamb = -40 C. Sometimes, a backup function is needed to supply, for example, a microcontroller for a short period of time when the supply voltage spikes to 0 V (or even -1 V). This function can easily be built with the TDA3661 by using an output capacitor with a large value. When the supply voltage is 0 V (or -1 V), only a small current will flow into pin REG from this output capacitor (a few A). EXAMPLE 3 The regulator is stabilized with a 100 nF capacitor in parallel with an electrolytic capacitor of 10 F connected to the output. The application circuit is given in Fig.6. The regulator is now stable under all conditions and independant of: andbook, halfpage * The ESR of the electrolytic capacitor VP * The value of the electrolytic capacitor 8 C1(1) 1 F VREG 1 R1 75.1 k TDA3661 * The output current. C2 (2) =5V 5 R2 24.9 k 2, 3, 6, 7 Application circuits The maximum output current of the regulator equals: MGS582 150 - T amb I REG ( max ) = ----------------------------------------------------------R th ( j - a ) x ( V P - V REG ) 150 - T amb = ------------------------------------ (mA) 100 x ( V P - 5 ) (1) C1 is optional (to minimize supply noise only). (2) C2 4700 F. When Tamb = 21 C, VP = 14 V and VREG = 5 V (k = 4.01929) the maximum output current equals 140 mA. 2000 Dec 13 Fig.6 Application circuit with backup function. 7 Philips Semiconductors Product specification Very low dropout voltage/quiescent current adjustable voltage regulator TDA3661 APPLICATION CIRCUIT WITH ENABLE FUNCTION An enable function can easily be built with the TDA3661 by connecting a diode to pin ADJ. When the voltage on pin ADJ is forced above 1.3 V, the output will switch off. The standby current is equal to the quiescent current of the TDA3661. handbook, halfpage VP The application circuit is given in Fig.7. 8 VREG 1 C1(1) 1 F R1 75.1 k TDA3661 =5V C2 10 F enable 5 D1 R2 24.9 k 2, 3, 6, 7 MGS583 (1) C1 is optional (to minimize supply noise only). Fig.7 Application circuit with enable function. Additional application information This section gives typical curves for various parameters measured on the TDA3661AT. Standard test conditions are: VP = 14.4 V, Tamb = 25 C and k = 4.01929. MDA947 25 MDA949 4 handbook, halfpage handbook, halfpage Iq (A) Iq (mA) 20 3 15 2 10 1 5 0 0 0 10 20 VP (V) 0 30 10 20 30 40 VP (V) 50 IREG = 0 mA. Fig.8 Quiescent current as a function of the supply voltage. 2000 Dec 13 Fig.9 8 Quiescent current increase as a function of high supply voltage. Philips Semiconductors Product specification Very low dropout voltage/quiescent current adjustable voltage regulator TDA3661 MDA951 2 MDA948 0.48 handbook, halfpage handbook, halfpage Iq (mA) (1) Iq (mA) 1.5 0.44 1 0.40 0.5 (2) 0 -40 0 40 80 120 0.36 160 Tj (C) 5 10 20 15 VP (V) 25 (1) Iq at 50 mA load. (2) Iq at 10 mA load. IREG = 10 mA. Fig.10 Quiescent current as a function of the junction temperature. Fig.11 Quiescent current as a function of the supply voltage. MDA950 2 MDA952 4 handbook, halfpage handbook, halfpage Iq (mA) Iq (mA) 3 1.8 2 1.6 1 1.4 5 10 15 20 VP (V) 0 25 0 20 40 60 80 100 IREG (mA) IREG = 50 mA. Fig.12 Quiescent current as a function of the supply voltage. 2000 Dec 13 Fig.13 Quiescent current as a function of the output current. 9 Philips Semiconductors Product specification Very low dropout voltage/quiescent current adjustable voltage regulator MDA953 5.10 TDA3661 MDA955 6 handbook, halfpage handbook, halfpage VREG VREG (V) (V) 5.05 4 5.00 2 4.95 -50 0 50 100 150 0 -50 200 Tj (C) 0 50 100 150 200 Tj (C) IREG = 0 mA. IREG = 0 mA. Fig.14 Output voltage as a function of the junction temperature. Fig.15 Output voltage thermal protection as a function of the junction temperature. MDA957 500 MDA954 6 handbook, halfpage handbook, halfpage VREG(drop) VREG (mV) (V) 400 4 300 2 200 0 100 0 40 80 IREG (mA) 120 0 100 200 IREG (mA) VP = 8 V and pulsed load. Fig.16 Dropout voltage as a function of the output current. 2000 Dec 13 Fig.17 Fold back protection mode. 10 300 Philips Semiconductors Product specification Very low dropout voltage/quiescent current adjustable voltage regulator MDA956 -30 handbook, halfpage (1) SVRR (dB) -40 (2) -50 (3) (1) -60 (2) -70 10 (3) 102 103 104 f (Hz) 105 IREG = 10 mA; C2 = 10 F. (1) SVRR at RL = 100 . (2) SVRR at RL = 500 . (3) SVRR at RL = 10 k. Fig.18 SVRR as a function of the ripple frequency. 2000 Dec 13 11 TDA3661 Philips Semiconductors Product specification Very low dropout voltage/quiescent current adjustable voltage regulator TDA3661 PACKAGE OUTLINE SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 D E A X c y HE v M A Z 5 8 Q A2 A (A 3) A1 pin 1 index Lp 1 L 4 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 5.0 4.8 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 0.069 0.010 0.057 0.004 0.049 0.01 0.019 0.0100 0.014 0.0075 0.20 0.19 0.16 0.15 0.050 0.01 0.01 0.004 0.028 0.012 inches 0.244 0.039 0.028 0.041 0.228 0.016 0.024 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT96-1 076E03 MS-012 2000 Dec 13 EIAJ EUROPEAN PROJECTION ISSUE DATE 97-05-22 99-12-27 12 o 8 0o Philips Semiconductors Product specification Very low dropout voltage/quiescent current adjustable voltage regulator SOLDERING TDA3661 If wave soldering is used the following conditions must be observed for optimal results: Introduction to soldering surface mount packages * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. Reflow soldering The footprint must incorporate solder thieves at the downstream end. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 220 C for thick/large packages, and below 235 C for small/thin packages. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Manual soldering Wave soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C. To overcome these problems the double-wave soldering method was specifically developed. 2000 Dec 13 13 Philips Semiconductors Product specification Very low dropout voltage/quiescent current adjustable voltage regulator TDA3661 Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE WAVE BGA, LFBGA, SQFP, TFBGA not suitable suitable(2) HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS not PLCC(3), SO, SOJ suitable LQFP, QFP, TQFP SSOP, TSSOP, VSO REFLOW(1) suitable suitable suitable not recommended(3)(4) suitable not recommended(5) suitable Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 2000 Dec 13 14 Philips Semiconductors Product specification Very low dropout voltage/quiescent current adjustable voltage regulator TDA3661 DATA SHEET STATUS DATA SHEET STATUS PRODUCT STATUS DEFINITIONS (1) Objective specification Development This data sheet contains the design target or goal specifications for product development. Specification may change in any manner without notice. Preliminary specification Qualification This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. Product specification Production This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. Note 1. Please consult the most recently issued data sheet before initiating or completing a design. DEFINITIONS DISCLAIMERS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Right to make changes Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. 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The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 753503/04/pp16 Date of release: 2000 Dec 13 Document order number: 9397 750 07864