0.174
0.580
1.205
0.00
0.25
0.50
0.75
1.00
1.25
1.50
±50 ±25 0 25 50 75 100 125 150
Output Voltage (V)
DUT Temperature (ƒC)
C001
VO = (+6.25 mV/°C × T °C) + 424 mV
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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM60
SNIS119F –MAY 2004–REVISED AUGUST 2017
LM60 2.7-V, SOT-23 or TO-92 Temperature Sensor
1
1 Features
1• Calibrated Linear Scale Factor of 6.25 mV/°C
• Rated for Full −40°C to +125°C Range
• Suitable for Remote Applications
• Available in SOT-23 and TO-92 Packages
• Key Specifications
– Accuracy at 25°C: ±2°C and ±3°C (Maximum)
– Accuracy for −40°C to +125°C: ±4°C
(Maximum)
– Accuracy for −25°C to +125°C: ±3°C
(Maximum)
– Temperature Slope: 6.25 mV/°C
– Power-Supply Voltage Range: 2.7 V to 10 V
– Current Drain at 25°C: 110 μA (Maximum)
– Nonlinearity: ±0.8°C (Maximum)
– Output Impedance: 800 Ω(Maximum)
2 Applications
• Cell Phones and Computers
• Power Supply Modules
• Battery Management
• Fax Machines and Printers
• HVAC and Disk Drives
• Appliances
3 Description
The LM60 device is a precision integrated-circuit
temperature sensor that can sense a −40°C to
+125°C temperature range while operating from a
single 2.7-V supply. The output voltage of the device
is linearly proportional to Celsius (Centigrade)
temperature (6.25 mV/°C) and has a DC offset of
424 mV. The offset allows reading negative
temperatures without the need for a negative supply.
The nominal output voltage of the device ranges from
174 mV to 1205 mV for a −40°C to +125°C
temperature range. The device is calibrated to
provide accuracies of ±2°C at room temperature and
±3°C over the full −25°C to +125°C temperature
range.
The linear output of the device, 424-mV offset, and
factory calibration simplify external circuitry required
in a single supply environment where reading
negative temperatures is required. Because the
quiescent current of the device is less than 110 μA,
self-heating is limited to a very low 0.1°C in still air in
the SOT-23 package. Shutdown capability for the
device is intrinsic because its inherent low power
consumption allows it to be powered directly from the
output of many logic gates.
Device Information(1)
PART NUMBER PACKAGE BODY SIZE (NOM)
LM60 TO-92 (3) 4.30 mm × 4.30 mm
SOT-23 (3) 2.92 mm × 1.30 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Simplified Schematic Full-Range Centigrade Temperature Sensor
(−40°C to +125°C)
2
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Table of Contents
1 Features.................................................................. 1
2 Applications ........................................................... 1
3 Description............................................................. 1
4 Revision History..................................................... 2
5 Device Comparison Table..................................... 3
6 Pin Configuration and Functions......................... 4
7 Specifications......................................................... 4
7.1 Absolute Maximum Ratings ...................................... 4
7.2 ESD Ratings ............................................................ 4
7.3 Recommended Operating Conditions....................... 5
7.4 Thermal Information.................................................. 5
7.5 Electrical Characteristics........................................... 5
7.6 Typical Characteristics.............................................. 7
8 Detailed Description.............................................. 9
8.1 Overview................................................................... 9
8.2 Functional Block Diagram......................................... 9
8.3 Feature Description................................................... 9
8.4 Device Functional Modes.......................................... 9
9 Application and Implementation ........................ 10
9.1 Application Information............................................ 10
9.2 Typical Applications ................................................ 11
9.3 System Examples ................................................... 13
10 Power Supply Recommendations ..................... 13
11 Layout................................................................... 14
11.1 Layout Guidelines ................................................. 14
11.2 Layout Example .................................................... 14
11.3 Thermal Considerations........................................ 14
12 Device and Documentation Support................. 16
12.1 Receiving Notification of Documentation Updates 16
12.2 Community Resources.......................................... 16
12.3 Trademarks........................................................... 16
12.4 Electrostatic Discharge Caution............................ 16
12.5 Glossary................................................................ 16
13 Mechanical, Packaging, and Orderable
Information........................................................... 16
4 Revision History
Changes from Revision E (September 2015) to Revision F Page
• Moved the automotive device to a standalone data sheet (SNIS197)................................................................................... 1
• Added tablenote for the LM60B.............................................................................................................................................. 3
• Added tablenote for the LM60B.............................................................................................................................................. 5
Changes from Revision D (November 2012) to Revision E Page
• Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional
Modes,Application and Implementation section, Power Supply Recommendations section, Layout section, Device
and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1
3
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(1) LM60B will operate down to –40°C without damage but the accuracy is only ensured from –25°C to 125°C.
5 Device Comparison Table
ORDER NUMBER ACCURACY OVER SPECIFIED
TEMPERATURE RANGE SPECIFIED TEMPERATURE RANGE
LM60BIM3 ±3 –25°C ≤TA≤+125°C(1)
LM60BIM3X
LM60CIM3 ±4 –40°C ≤TA≤+125°C
LM60CIM3X
LM60QIM3 ±4 –40°C ≤TA≤+125°C
LM60QIM3X
LM60BIZ ±3 –25°C ≤TA≤+125°C
LM60CIZ ±4 –40°C ≤TA≤+125°C
4
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6 Pin Configuration and Functions
DBZ Package
3-Pin SOT-23
Top View LP Package
3-Pin TO-92
Bottom View
Pin Functions
PIN TYPE DESCRIPTION
NAME SOT-23 TO92
GND 3 3 GND Device ground, connected to power supply negative terminal
VOUT 2 2 O Temperature sensor analog output
+VS1 1 POWER Positive power supply pin
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) When the input voltage (VI) at any pin exceeds power supplies (VI< GND or VI> +VS), the current at that pin should be limited to 5 mA.
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Supply voltage −0.2 12 V
Output voltage −0.6 VS+ 0.6 V
Output current 10 mA
Input current at any pin(2) 5 mA
Maximum junction temperature (TJMAX) 125 °C
Storage temperature (Tstg)−65 150 °C
(1) The human body model is a 100-pF capacitor discharged through a 1.5-kΩresistor into each pin. The machine model is a 200-pF
capacitor discharged directly into each pin.
7.2 ESD Ratings VALUE UNIT
LM60 in DBZ Package
V(ESD) Electrostatic discharge(1) Human-body model (HBM) ±2500 V
Machine model (MM) ±250
LM60 in LP Package
V(ESD) Electrostatic discharge(1) Human-body model (HBM) ±2500 V
Machine model (MM) ±200
5
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(1) Soldering process must comply with National Semiconductor's Reflow Temperature Profile specifications. Refer to
www.national.com/packaging. Reflow temperature profiles are different for lead-free and non-lead-free packages.
(2) LM60B will operate down to –40°C without damage but the accuracy is only ensured from –25°C to 125°C.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
LM60B (TMIN ≤TA≤TMAX) –25(2) 125 °C
LM60C (TMIN ≤TA≤TMAX) –40 125 °C
Supply voltage (+VS) 2.7 10 V
(1) For more information about traditional and new thermal metrics, see the Semiconductor or IC Package Thermal Metrics application
report.
(2) The junction to ambient thermal resistance (RθJA) is specified without a heat sink in still air.
7.4 Thermal Information
THERMAL METRIC(1) LM60
UNITDBZ (SOT-23) LP (TO-92)
3 PINS 3 PINS
RθJA(2) Junction-to-ambient thermal resistance 266 162 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 135 85 °C/W
RθJB Junction-to-board thermal resistance 59 — °C/W
ψJT Junction-to-top characterization parameter 18 29 °C/W
ψJB Junction-to-board characterization parameter 58 142 °C/W
(1) Limits are specified to TI's AOQL (Average Outgoing Quality Level).
(2) Typicals are at TJ= TA= 25°C and represent most likely parametric norm.
(3) Accuracy is defined as the error between the output voltage and 6.25 mV/°C times the case temperature of the device plus 424 mV, at
specified conditions of voltage, current, and temperature (expressed in °C).
(4) Nonlinearity is defined as the deviation of the output-voltage-versus-temperature curve from the best-fit straight line, over the rated
temperature range of the device.
7.5 Electrical Characteristics
Unless otherwise noted, these specifications apply for +VS= 3 VDC and ILOAD = 1 μA. All limits TA= TJ= 25°C unless
otherwise noted.
PARAMETER TEST CONDITIONS MIN(1) TYP(2) MAX(1) UNIT
Accuracy(3)
LM60B –2 2 °C
TA= TJ= TMIN
to TMAX –3 3
LM60C –3 3 °C
TA= TJ= TMIN
to TMAX –4 4
Output voltage at 0°C 424 mV
Nonlinearity(4) LM60B TA= TJ= TMIN
to TMAX –0.6 ±0.6 °C
LM60C TA= TJ= TMIN
to TMAX –0.8 ±0.8
Sensor gain (average slope)
6.25
mV/°C
LM60B TA= TJ= TMIN
to TMAX 6.06 6.44
LM60C TA= TJ= TMIN
to TMAX 6 6.5
Output impedance TA= TJ= TMIN to TMAX 800 Ω
6
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Electrical Characteristics (continued)
Unless otherwise noted, these specifications apply for +VS= 3 VDC and ILOAD = 1 μA. All limits TA= TJ= 25°C unless
otherwise noted.
PARAMETER TEST CONDITIONS MIN(1) TYP(2) MAX(1) UNIT
(5) Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output due to heating
effects can be computed by multiplying the internal dissipation by the thermal resistance.
(6) For best long-term stability, any precision circuit will give best results if the unit is aged at a warm temperature, temperature cycled for at
least 46 hours before long-term life test begins for both temperatures. This is especially true when a small (surface-mount) part is wave-
soldered; allow time for stress relaxation to occur. The majority of the drift will occur in the first 1000 hours at elevated temperatures.
The drift after 1000 hours will not continue at the first 1000 hour rate.
Line regulation(5) 3 V ≤+VS≤10 V TA= TJ= TMIN
to TMAX –0.3 0.3 mV/V
2.7 V ≤+VS≤3.3 V TA= TJ= TMIN
to TMAX –2.3 2.3 mV
Quiescent current 2.7 V ≤+VS≤10 V 82 110 μA
TA= TJ= TMIN
to TMAX 125 μA
Change of quiescent current 2.7 V ≤+VS≤10 V ±5 μA
Temperature coefficient of
quiescent current 0.2 μA/°C
Long-term stability(6) TJ= TMAX = 125°C
for 1000 hours ±0.2 °C
0
7
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7.6 Typical Characteristics
To generate these curves, the device was mounted to a printed-circuit board as shown in Figure 20.
Figure 1. Thermal Resistance Junction to Air Figure 2. Thermal Time Constant
Figure 3. Thermal Response in Still Air With Heat Sink Figure 4. Thermal Response in Stirred Oil Bath With Heat
Sink
Figure 5. Thermal Response in Still Air Without a Heat Sink Figure 6. Start-Up Voltage vs Temperature
SVA-1268122
8
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Typical Characteristics (continued)
To generate these curves, the device was mounted to a printed-circuit board as shown in Figure 20.
Figure 7. Quiescent Current vs Temperature Figure 8. Accuracy vs Temperature
Figure 9. Noise Voltage Figure 10. Supply Voltage vs Supply Current
Figure 11. Start-Up Response
9
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8 Detailed Description
8.1 Overview
TheLM60 devices are precision analog bipolar temperature sensors that can sense a −40°C to +125°C
temperature range while operating from a single 2.7-V supply. The output voltage of the LM60 is linearly
proportional to Celsius (Centigrade) temperature (6.25 mV/°C) and has a DC offset of 424 mV. The offset allows
reading negative temperatures with a single positive supply. The nominal output voltage of the device ranges
from 174 mV to 1205 mV for a −40°C to +125°C temperature range. The device is calibrated to provide
accuracies of ±2.0°C at room temperature and ±3°C over the full −25°C to +125°C temperature range.
With a quiescent current of the device is less than 110 μA, self-heating is limited to a very low 0.1°C in still air in
the SOT-23 package. Shutdown capability for the device is intrinsic because its inherent low power consumption
allows it to be powered directly from the output of many logic gates.
The output of the LM60 is a Class A base emitter follower, thus the LM60 can source quite a bit of current while
sinking less than 1 µA. In any event load current should be minimized in order to limit it's contribution to the total
temperature error. The temperature-sensing element is based on a delta VBE topology of two transistors (Q1 and
Q2 in Functional Block Diagram) that are sized with a 10:1 area ratio.
8.2 Functional Block Diagram
8.3 Feature Description
8.3.1 LM60 Transfer Function
The LM60 follows a simple linear transfer function to achieve the accuracy as listed in Electrical Characteristics
as given:
VO= (6.25 mV/°C × T °C) + 424 mV
where
• T is the temperature
• VOis the LM60 output voltage (1)
8.4 Device Functional Modes
The only functional mode for this device is an analog output directly proportional to temperature.
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9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The device has a low supply current and a wide supply range, therefore it can easily be driven by a battery.
9.1.1 Capacitive Loads
The device handles capacitive loading well. Without any special precautions, the device can drive any capacitive
load as shown in Figure 12. Over the specified temperature range the device has a maximum output impedance
of 800 Ω. In an extremely noisy environment, adding some filtering to minimize noise pick-up may be required. TI
recommends that 0.1 μF be added from +VSto GND to bypass the power supply voltage, as shown in Figure 13.
In a noisy environment, adding a capacitor from the output to ground may be required. A 1-μF output capacitor
with the 800-Ωoutput impedance forms a 199-Hz, low-pass filter. Because the thermal time constant of the
device is much slower than the 6.3-ms time constant formed by the RC, the overall response time of the device
is not be significantly affected. For much larger capacitors, this additional time lag increases the overall response
time of the device.
Figure 12. No Decoupling Required for Capacitive Load
Figure 13. Filter Added for Noisy Environment
11
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9.2 Typical Applications
9.2.1 Full-Range Centigrade Temperature Sensor
Because the LM60 is a simple temperature sensor that provides an analog output, design requirements related
to the layout are also important. Refer to Layout for details.
VO= (6.25 mV/°C × T°C) + 424 mV
Figure 14. Full-Range Centigrade Temperature Sensor (−40°C to +125°C)
Operating From a Single Li-Ion Battery Cell
9.2.1.1 Design Requirements
For this design example, use the design parameters listed in Table 1.
Table 1. Temperature and Typical VOValues of
Figure 14
TEMPERATURE (T) TYPICAL VO
125°C 1205 mV
100°C 1049 mV
25°C 580 mV
0°C 424 mV
–25°C 268 mV
–40°C 174 mV
R1 + R2||R3
VT2 = (4.1)R2||R3
VT1 = (4.1)R2
R2 + R1||R3
R1
4.1V
R3
R2
0.1 PF
U3TI Device
R4
VOUT
V+
VT
VTemp
+
-U1
TI DeviceV+
U2
(High = overtemp alarm)
LM7211
Copyright © 2017, Texas Instruments Incorporated
0.174
0.580
1.205
0.00
0.25
0.50
0.75
1.00
1.25
1.50
±50 ±25 0 25 50 75 100 125 150
Output Voltage (V)
DUT Temperature (ƒC)
C001
VO = (+6.25 mV/°C × T °C) + 424 mV
12
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9.2.1.2 Detailed Design Procedure
Selection of the LM60 is based on the output voltage transfer function being able to meet the needs of the rest of
the system.
9.2.1.3 Application Curve
Figure 15. LM60 Output Transfer Function
9.2.2 Centigrade Thermostat Application
Figure 16. Centigrade Thermostat
9.2.2.1 Design Requirements
A simple thermostat can be created by using a reference (LM4040) and a comparator (LM7211) as shown in
Figure 16.
9.2.2.2 Detailed Design Procedure
Use Equation 2 and Equation 3 to calculate the threshold values for T1 and T2.
(2)
(3)
VT1
VT2
VTEMP
VOUT
13
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9.2.2.3 Application Curve
Figure 17. Thermostat Output Waveform
9.3 System Examples
9.3.1 Conserving Power Dissipation With Shutdown
The LM60 draws very little power, therefore it can simply be shutdown by driving the LM60 supply pin with the
output of a logic gate as shown in Figure 18.
Figure 18. Conserving Power Dissipation With Shutdown
10 Power Supply Recommendations
In an extremely noisy environment, add some filtering to minimize noise pick-up. Adding 0.1 μF from +VSto GND
is recommended to bypass the power supply voltage, as shown in Figure 13. In a noisy environment, add a
capacitor from the output to ground.
1
+VS
VO
GND
Via to ground plane
Via to power plane
2
3
14
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11 Layout
11.1 Layout Guidelines
The LM60 can be applied easily in the same way as other integrated-circuit temperature sensors. It can be glued
or cemented to a surface. The temperature that the LM60 is sensing will be within about +0.1°C of the surface
temperature that the leads of th LM60 are attached to.
This presumes that the ambient air temperature is almost the same as the surface temperature. If the air
temperature were much higher or lower than the surface temperature, the actual temperature of the device die
would be at an intermediate temperature between the surface temperature and the air temperature.
To ensure good thermal conductivity the backside of the device die is directly attached to the GND pin. The lands
and traces to the device will, of course, be part of the printed-circuit board, which is the object whose
temperature is being measured. These printed-circuit board lands and traces do not cause the temperature of the
device to deviate from the desired temperature.
Alternatively, the device can be mounted inside a sealed-end metal tube, and can then be dipped into a bath or
screwed into a threaded hole in a tank. As with any IC, the device and accompanying wiring and circuits must be
kept insulated and dry to avoid leakage and corrosion. Specifically when the device operates at cold
temperatures where condensation can occur. Printed-circuit coatings and varnishes such as a conformal coating
and epoxy paints or dips are often used to ensure that moisture cannot corrode the device or connections.
11.2 Layout Example
1/2-inch square printed circuit board with 2-oz. copper foil or similar.
Figure 19. PCB Layout
11.3 Thermal Considerations
The thermal resistance junction to ambient (RθJA) is the parameter used to calculate the rise of a device junction
temperature due to the device power dissipation. Use Equation 4 to calculate the rise in the die temperature of
the device.
TJ= TA+ RθJA [(+VSIQ) + (+VS−VO) IL]
where
• IQis the quiescent current
• ILis the load current on the output (4)
1/2"
Ground Plane
on 062 copper
clad board.
1/2"
LM60/LM60-Q1
15
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Thermal Considerations (continued)
(1) Part soldered to 30 gauge wire.
(2) Heat sink used is 1/2-in square printed-circuit board with 2-oz. foil with part attached as shown in Figure 20.
(3) Part glued or leads soldered to 1-in square of 1/16-in printed-circuit board with 2-oz. foil or similar.
Table 2 summarizes the rise in die temperature of the LM60 without any loading, and the thermal resistance for
different conditions. The values in Table 2 were actually measured where as the values shown in Thermal
Information where calculated using modeling methods as described in the Semiconductor and IC Package
Thermal Metrics (SPRA953) application report.
Table 2. Temperature Rise of LM60 Due to Self-Heating and Thermal Resistance (RθJA)
SOT-23(1)
NO HEAT SINK SOT-23(2)
SMALL HEAT FIN TO-92(1)
NO HEAT FIN TO-92(3)
SMALL HEAT FIN
RθJA TJ−TARθJA TJ−TARθJA TJ−TARθJA TJ−TA
(°C/W) (°C) (°C/W) (°C) (°C/W) (°C) (°C/W) (°C)
Still air 450 0.17 260 0.1 180 0.07 140 0.05
Moving air — — 180 0.07 90 0.034 70 0.026
1/2-in Square Printed-Circuit Board with 2-oz. Copper Foil or Similar.
Figure 20. Printed-Circuit Board Used for Heat Sink to Generate Thermal Response Curves
16
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12 Device and Documentation Support
12.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
12.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
12.3 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.5 Glossary
SLYZ022 —TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
PACKAGE OPTION ADDENDUM
www.ti.com 11-Jan-2021
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM60BIM3 NRND SOT-23 DBZ 3 1000 Non-RoHS
& Green Call TI Call TI -25 to 125 T6B
LM60BIM3/NOPB ACTIVE SOT-23 DBZ 3 1000 RoHS & Green SN Level-1-260C-UNLIM -25 to 125 T6B
LM60BIM3X NRND SOT-23 DBZ 3 3000 Non-RoHS
& Green Call TI Call TI -25 to 125 T6B
LM60BIM3X/NOPB ACTIVE SOT-23 DBZ 3 3000 RoHS & Green SN Level-1-260C-UNLIM -25 to 125 T6B
LM60BIZ/LFT3 ACTIVE TO-92 LP 3 2000 RoHS & Green SN N / A for Pkg Type LM60
BIZ
LM60BIZ/NOPB ACTIVE TO-92 LP 3 1800 RoHS & Green SN N / A for Pkg Type -25 to 125 LM60
BIZ
LM60CIM3 NRND SOT-23 DBZ 3 1000 Non-RoHS
& Green Call TI Call TI -40 to 125 T6C
LM60CIM3/NOPB ACTIVE SOT-23 DBZ 3 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 T6C
LM60CIM3X NRND SOT-23 DBZ 3 3000 Non-RoHS
& Green Call TI Call TI -40 to 125 T6C
LM60CIM3X/NOPB ACTIVE SOT-23 DBZ 3 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 T6C
LM60CIZ/NOPB ACTIVE TO-92 LP 3 1800 RoHS & Green SN N / A for Pkg Type -40 to 125 LM60
CIZ
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
PACKAGE OPTION ADDENDUM
www.ti.com 11-Jan-2021
Addendum-Page 2
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF LM60 :
•Automotive: LM60-Q1
NOTE: Qualified Version Definitions:
•Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LM60BIM3 SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM60BIM3/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM60BIM3X SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM60BIM3X/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM60CIM3 SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM60CIM3/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM60CIM3X SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM60CIM3X/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
PACKAGE MATERIALS INFORMATION
www.ti.com 29-Sep-2019
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM60BIM3 SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM60BIM3/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM60BIM3X SOT-23 DBZ 3 3000 210.0 185.0 35.0
LM60BIM3X/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0
LM60CIM3 SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM60CIM3/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM60CIM3X SOT-23 DBZ 3 3000 210.0 185.0 35.0
LM60CIM3X/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 29-Sep-2019
Pack Materials-Page 2
www.ti.com
PACKAGE OUTLINE
3X 2.67
2.03
5.21
4.44
5.34
4.32
3X
12.7 MIN
2X 1.27 0.13
3X 0.55
0.38
4.19
3.17
3.43 MIN
3X 0.43
0.35
(2.54)
NOTE 3
2X
2.6 0.2
2X
4 MAX
SEATING
PLANE
6X
0.076 MAX
(0.51) TYP
(1.5) TYP
TO-92 - 5.34 mm max heightLP0003A
TO-92
4215214/B 04/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Lead dimensions are not controlled within this area.
4. Reference JEDEC TO-226, variation AA.
5. Shipping method:
a. Straight lead option available in bulk pack only.
b. Formed lead option available in tape and reel or ammo pack.
c. Specific products can be offered in limited combinations of shipping medium and lead options.
d. Consult product folder for more information on available options.
EJECTOR PIN
OPTIONAL
PLANE
SEATING
STRAIGHT LEAD OPTION
321
SCALE 1.200
FORMED LEAD OPTION
OTHER DIMENSIONS IDENTICAL
TO STRAIGHT LEAD OPTION
SCALE 1.200
www.ti.com
EXAMPLE BOARD LAYOUT
0.05 MAX
ALL AROUND
TYP
(1.07)
(1.5) 2X (1.5)
2X (1.07)
(1.27)
(2.54)
FULL R
TYP
( 1.4)0.05 MAX
ALL AROUND
TYP
(2.6)
(5.2)
(R0.05) TYP
3X ( 0.9) HOLE
2X ( 1.4)
METAL
3X ( 0.85) HOLE
(R0.05) TYP
4215214/B 04/2017
TO-92 - 5.34 mm max heightLP0003A
TO-92
LAND PATTERN EXAMPLE
FORMED LEAD OPTION
NON-SOLDER MASK DEFINED
SCALE:15X
SOLDER MASK
OPENING
METAL
2X
SOLDER MASK
OPENING
123
LAND PATTERN EXAMPLE
STRAIGHT LEAD OPTION
NON-SOLDER MASK DEFINED
SCALE:15X
METAL
TYP
SOLDER MASK
OPENING
2X
SOLDER MASK
OPENING
2X
METAL
12 3
www.ti.com
TAPE SPECIFICATIONS
19.0
17.5
13.7
11.7
11.0
8.5
0.5 MIN
TYP-4.33.7
9.75
8.50
TYP
2.9
2.4 6.75
5.95
13.0
12.4
(2.5) TYP
16.5
15.5
32
23
4215214/B 04/2017
TO-92 - 5.34 mm max heightLP0003A
TO-92
FOR FORMED LEAD OPTION PACKAGE
4203227/C
www.ti.com
PACKAGE OUTLINE
C
TYP
0.20
0.08
0.25
2.64
2.10 1.12 MAX
TYP
0.10
0.01
3X 0.5
0.3
TYP
0.6
0.2
1.9
0.95
TYP-80
A
3.04
2.80
B
1.4
1.2
(0.95)
SOT-23 - 1.12 mm max heightDBZ0003A
SMALL OUTLINE TRANSISTOR
4214838/C 04/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Reference JEDEC registration TO-236, except minimum foot length.
0.2 C A B
1
3
2
INDEX AREA
PIN 1
GAGE PLANE
SEATING PLANE
0.1 C
SCALE 4.000
www.ti.com
EXAMPLE BOARD LAYOUT
0.07 MAX
ALL AROUND 0.07 MIN
ALL AROUND
3X (1.3)
3X (0.6)
(2.1)
2X (0.95)
(R0.05) TYP
4214838/C 04/2017
SOT-23 - 1.12 mm max heightDBZ0003A
SMALL OUTLINE TRANSISTOR
NOTES: (continued)
4. Publication IPC-7351 may have alternate designs.
5. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
SYMM
LAND PATTERN EXAMPLE
SCALE:15X
PKG
1
3
2
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
www.ti.com
EXAMPLE STENCIL DESIGN
(2.1)
2X(0.95)
3X (1.3)
3X (0.6)
(R0.05) TYP
SOT-23 - 1.12 mm max heightDBZ0003A
SMALL OUTLINE TRANSISTOR
4214838/C 04/2017
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
7. Board assembly site may have different recommendations for stencil design.
SOLDER PASTE EXAMPLE
BASED ON 0.125 THICK STENCIL
SCALE:15X
SYMM
PKG
1
3
2
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