HIGH ISOLATION VOLTAGE
SINGLE TRANSISTOR TYPE
MULTI PHOTOCOUPLER SERIES
NEPOC Series
PHOTOCOUPLER
PS2561-1,PS2561L-1,PS2561L1-1,PS2561L2-1
Document No. PN10234EJ04V0DS (4th edition)
Date Published December 2008 NS
The mark <R> shows major revised points.
The revised points can be easily searched by copying an "<R>" in the PDF file and specifying it in the "Find what:" field.
DESCRIPTION
The PS2561-1 is optically coupled isolators containing a GaAs light emitting diode and an NPN silicon
phototransistor.
The PS2561-1 is in a plastic DIP (Dual In-line Package) and the PS2561L-1 is lead bending type (Gull-wing) for
surface mount.
The PS2561L1-1 is lead bending type for long creepage distance.
The PS2561L2-1 is lead bending type for long creepage distance (Gull-wing) for surface mount.
FEATURES
High Isolation voltage (BV = 5 000 Vr.m.s.)
High collector to emitter voltage (VCEO = 80 V)
High current transfer ratio (CTR = 200% TYP.)
High-speed switching (tr = 3 s TYP., tf = 5 s TYP.)
Ordering number of taping product: PS2561L-1-E3, E4, F3, F4, PS2561L2-1-E3, E4
Safety standards
UL approved: No. E72422
CSA approved: No. CA 101391
BSI approved: No. 7112/7420
SEMKO approved: No. 303059, 307244
NEMKO approved: No. P03200272, P03200747
DEMKO approved: No. 312341, 312340
FIMKO approved: No. FI 10620, FI 11898
DIN EN60747-5-2 (VDE0884 Part2) approved: No. 40008862 (Option)
APPLICATIONS
Power supply
Telephone/FAX.
FA/OA equipment
Programmable logic controller
<R>
Data Sheet PN10234EJ04V0DS
2
PS2561-1,PS2561L-1,PS2561L1-1,PS2561L2-1
PACKAGE DIMENSIONS (UNIT : mm)
DIP Type (New package)
DIP Type
Data Sheet PN10234EJ04V0DS
3
PS2561-1,PS2561L-1,PS2561L1-1,PS2561L2-1
Lead Bending Type (New package)
Lead Bending Type
Data Sheet PN10234EJ04V0DS
4
PS2561-1,PS2561L-1,PS2561L1-1,PS2561L2-1
Lead Bending Type For Long Creepage Distance (New Package)
Lead Bending Type For Long Creepage Distance
Data Sheet PN10234EJ04V0DS
5
PS2561-1,PS2561L-1,PS2561L1-1,PS2561L2-1
Lead Bending Type For Long Creepage Distance (Gull-Wing) (New Package)
Lead Bending Type For Long Creepage Distance (Gull-Wing)
Data Sheet PN10234EJ04V0DS
6
PS2561-1,PS2561L-1,PS2561L1-1,PS2561L2-1
MARKING EXAMPLE
<R>
Data Sheet PN10234EJ04V0DS
7
PS2561-1,PS2561L-1,PS2561L1-1,PS2561L2-1
ORDERING INFORMATION
Order Number
Solder Plating
Specification
Packing Style
Safety Standard
Approval
Application
Part
Number *1
PS2561-1-A
Pb-Free
Magazine case 100 pcs
Standard products
PS2561-1
PS2561L-1-A
(UL, CSA, BSI,
PS2561L1-1-A
NEMKO, SEMKO,
PS2561L2-1-A
DEMKO, FIMKO
PS2561L-1-E3-A
Embossed Tape 1 000 pcs/reel
approved)
PS2561L-1-E4-A
PS2561L-1-F3-A
Embossed Tape 2 000 pcs/reel
PS2561L-1-F4-A
PS2561L2-1-E3-A
Embossed Tape 1 000 pcs/reel
PS2561L2-1-E4-A
PS2561-1-V-A
Magazine case 100 pcs
DIN EN60747-5-2
PS2561L-1-V-A
(VDE0884 Part2)
PS2561L1-1-V-A
approved products
PS2561L2-1-V-A
(Option)
PS2561L-1-V-E3-A
Embossed Tape 1 000 pcs/reel
PS2561L-1-V-E4-A
PS2561L-1-V-F3-A
Embossed Tape 2 000 pcs/reel
PS2561L-1-V-F4-A
PS2561L2-1-V-E3-A
Embossed Tape 1 000 pcs/reel
PS2561L2-1-V-E4-A
PS2561-1Y-A
Special version
Magazine case 100 pcs
Standard products
PS2561-1
PS2561L-1Y-A
(Pb-Free and
(UL, CSA, BSI,
PS2561L1-1Y-A
Halogen Free)
NEMKO, SEMKO,
PS2561L2-1Y-A
DEMKO, FIMKO
PS2561L-1Y-F3-A
Embossed Tape 2 000 pcs/reel
approved)
PS2561L2-1Y-E3-A
Embossed Tape 1 000 pcs/reel
PS2561-1Y-V-A
Magazine case 100 pcs
DIN EN60747-5-2
PS2561L-1Y-V-A
(VDE0884 Part2)
PS2561L1-1Y-V-A
approved products
PS2561L2-1Y-V-A
(Option)
PS2561L-1Y-V-F3-A
Embossed Tape 2 000 pcs/reel
PS2561L2-1Y-V-E3-A
Embossed Tape 1 000 pcs/reel
*1 For the application of the Safety Standard, following part number should be used.
<R>
Data Sheet PN10234EJ04V0DS
8
PS2561-1,PS2561L-1,PS2561L1-1,PS2561L2-1
ABSOLUTE MAXIMUM RATINGS (TA = 25 C, unless otherwise specified)
Parameter
Symbol
Ratings
Unit
Diode
Reverse Voltage
VR
6
V
Forward Current (DC)
IF
80
mA
Power Dissipation Derating
PD/ C
1.5
mW/ C
Power Dissipation
PD
150
mW
Peak Forward Current*1
IFP
1
A
Transistor
Collector to Emitter Voltage
VCEO
80
V
Emitter to Collector Voltage
VECO
7
V
Collector Current
IC
50
mA
Power Dissipation Derating
PC/ C
1.5
mW/ C
Power Dissipation
PC
150
mW
Isolation Voltage*2
BV
5 000
Vr.m.s.
Operating Ambient Temperature
TA
55 to +100
C
Storage Temperature
Tstg
55 to +150
C
*1 PW = 100 s, Duty Cycle = 1%
*2 AC voltage for 1 minute at TA = 25 C, RH = 60% between input and output
Pins 1-2 shorted together, 3-4 shorted together.
Data Sheet PN10234EJ04V0DS
9
PS2561-1,PS2561L-1,PS2561L1-1,PS2561L2-1
ELECTRICAL CHARACTERISTICS (TA = 25 C)
Parameter
Symbol
Conditions
MIN.
TYP.
MAX.
Unit
Diode
Forward Voltage
VF
IF = 10 mA
1.17
1.4
V
Reverse Current
IR
VR = 5 V
5
A
Terminal Capacitance
Ct
V = 0 V, f = 1.0 MHz
50
pF
Transistor
Collector to Emitter Dark
Current
ICEO
VCE = 80 V, IF = 0 mA
100
nA
Coupled
Current Transfer Ratio
(IC/IF)*1
CTR
IF = 5 mA, VCE = 5 V
80
200
400
%
Collector Saturation
Voltage
VCE (sat)
IF = 10 mA, IC = 2 mA
0.3
V
Isolation Resistance
RI-O
VI-O = 1.0 kVDC
1011
Isolation Capacitance
CI-O
V = 0 V, f = 1.0 MHz
0.5
pF
Rise Time*2
tr
VCC = 10 V, IC = 2 mA, RL = 100
3
s
Fall Time*2
tf
5
*1 CTR rank
L : 200 to 400 (%)
M : 80 to 240 (%)
D : 100 to 300 (%)
H : 80 to 160 (%)
W : 130 to 260 (%)
*2 Test circuit for switching time
<R>
Data Sheet PN10234EJ04V0DS
10
PS2561-1,PS2561L-1,PS2561L1-1,PS2561L2-1
TYPICAL CHARACTERISTICS (TA = 25 C, unless otherwise specified)
Remark The graphs indicate nominal characteristics.
Data Sheet PN10234EJ04V0DS
11
PS2561-1,PS2561L-1,PS2561L1-1,PS2561L2-1
Remark The graphs indicate nominal characteristics.
Data Sheet PN10234EJ04V0DS
12
PS2561-1,PS2561L-1,PS2561L1-1,PS2561L2-1
TAPING SPECIFICATIONS (UNIT : mm)
Data Sheet PN10234EJ04V0DS
13
PS2561-1,PS2561L-1,PS2561L1-1,PS2561L2-1
Data Sheet PN10234EJ04V0DS
14
PS2561-1,PS2561L-1,PS2561L1-1,PS2561L2-1
Data Sheet PN10234EJ04V0DS
15
PS2561-1,PS2561L-1,PS2561L1-1,PS2561L2-1
NOTES ON HANDLING
1. Recommended soldering conditions
(1) Infrared reflow soldering
Peak reflow temperature 260 C or below (package surface temperature)
Time of peak reflow temperature 10 seconds or less
Time of temperature higher than 220 C 60 seconds or less
Time to preheat temperature from 120 to 180 C 120 30 s
Number of reflows Three
Flux Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
(2) Wave soldering
Temperature 260 C or below (molten solder temperature)
Time 10 seconds or less
Preheating conditions 120 C or below (package surface temperature)
Number of times One (Allowed to be dipped in solder including plastic mold portion.)
Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine
content of 0.2 Wt% is recommended.)
(3) Soldering by soldering iron
Peak temperature (lead part temperature) 350 C or below
Time (each pins) 3 seconds or less
Flux Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
(a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead.
(b) Please be sure that the temperature of the package would not be heated over 100 C.
Data Sheet PN10234EJ04V0DS
16
PS2561-1,PS2561L-1,PS2561L1-1,PS2561L2-1
(4) Cautions
Fluxes
Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.
2. Cautions regarding noise
Be aware that when voltage is applied suddenly between the photocoupler’s input and output or between
collector-emitters at startup, the output transistor may enter the on state, even if the voltage is within the absolute
maximum ratings.
3. Measurement conditions of current transfer ratios (CTR), which differ according to photocoupler
Check the setting values before use, since the forward current conditions at CTR measurement differ according
to product.
When using products other than at the specified forward current, the characteristics curves may differ from the
standard curves due to CTR value variations or the like. This tendency may sometimes be obvious, especially
below IF = 1 mA.
Therefore, check the characteristics under the actual operating conditions and thoroughly take variations or the
like into consideration before use.
USAGE CAUTIONS
1. Protect against static electricity when handling.
2. Avoid storage at a high temperature and high humidity.
Data Sheet PN10234EJ04V0DS
17
PS2561-1,PS2561L-1,PS2561L1-1,PS2561L2-1
SPECIFICATION OF VDE MARKS LICENSE DOCUMENT
Parameter
Symbol
Spec.
Unit
Climatic test class (IEC 60068-1/DIN EN 60068-1)
55/100/21
Dielectric strength
maximum operating isolation voltage
Test voltage (partial discharge test, procedure a for type test and random test)
Upr = 1.5 UIORM, Pd 5 pC
UIORM
Upr
890
1 335
Vpeak
Vpeak
Test voltage (partial discharge test, procedure b for all devices)
Upr = 1.875 UIORM, Pd 5 pC
Upr
1 669
Vpeak
Highest permissible overvoltage
UTR
8 000
Vpeak
Degree of pollution (DIN EN 60664-1 VDE0110 Part 1)
2
Clearance distance
7.0
mm
Creepage distance
7.0
mm
Comparative tracking index (IEC 60112/DIN EN 60112 (VDE 0303 Part 11))
CTI
175
Material group (DIN EN 60664-1 VDE0110 Part 1)
III a
Storage temperature range
Tstg
55 to +150
C
Operating temperature range
TA
55 to +100
C
Isolation resistance, minimum value
VIO = 500 V dc at TA = 25 C
VIO = 500 V dc at TA MAX. at least 100°C
Ris MIN.
Ris MIN.
1012
1011
Safety maximum ratings (maximum permissible in case of fault, see thermal
derating curve)
Package temperature
Current (input current IF, Psi = 0)
Power (output or total power dissipation)
Isolation resistance
VIO = 500 V dc at TA = Tsi
Tsi
Isi
Psi
Ris MIN.
175
400
700
109
°C
mA
mW
<R>
Data Sheet PN10234EJ04V0DS
18
PS2561-1,PS2561L-1,PS2561L1-1,PS2561L2-1
PS2561-1,PS2561L-1,PS2561L1-1,PS2561L2-1
Caution GaAs Products
This product uses gallium arsenide (GaAs).
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe
the following points.
• Follow related laws and ordinances when disposing of the product. If there are no applicable laws
and/or ordinances, dispose of the product as recommended below.
1. Commission a disposal company able to (with a license to) collect, transport and dispose of
materials that contain arsenic and other such industrial waste materials.
2. Exclude the product from general industrial waste and household garbage, and ensure that the
product is controlled (as industrial waste subject to special control) up until final disposal.
• Do not burn, destroy, cut, crush, or chemically dissolve the product.
• Do not lick the product or in any way allow it to enter the mouth.