DATA SH EET
Product specification
Supersedes data of July 1994
File under Integrated Circuits, IC01
1995 May 08
INTEGRATED CIRCUITS
Philips Semiconductors
TDA2615
2× 6 W hi-fi audio power amplifier
1995 May 08 2
Philips Semiconductors Product specification
2× 6 W hi-fi audio power amplifier TDA2615
FEATURES
•Requires very few external components
•No switch-on/switch-off clicks
•Input mute during switch-on and switch-off
•Low offset voltage between output and ground
•Excellent gain balance of both amplifiers
•Hi-fi in accordance with
“IEC 268”
and
“DIN 45500”
•Short-circuit proof and thermal protected
•Mute possibility.
GENERAL DESCRIPTION
The TDA2615 is a dual power amplifier in a 9-lead plastic
single-in-line (SIL9MPF) medium power package. It has
been especially designed for mains fed applications, such
as stereo radio and stereo TV.
QUICK REFERENCE DATA
Stereo application.
ORDERING INFORMATION
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
±VPsupply voltage range 7.5 −21 V
POoutput power VS=±12 V; THD = 0.5% −6−W
Gvinternal voltage gain −30 −dB
Gvchannel unbalance −0.2 −dB
αchannel separation −70 −dB
SVRR supply voltage ripple rejection −60 −dB
Vno noise output voltage −70 −µV
TYPE
NUMBER PACKAGE
NAME DESCRIPTION VERSION
TDA2615 SIL9MPF plastic single in-line medium power package with fin; 9 leads SOT110-1
1995 May 08 3
Philips Semiconductors Product specification
2× 6 W hi-fi audio power amplifier TDA2615
BLOCK DIAGRAM
Fig.1 Block diagram.
MLA711
5
voltage
comparator
4
4 kΩ
10 kΩ
P
– V
P
+ V
THERMAL
PROTECTION
5 kΩ
1
CM
20 kΩ
VA
B
V
P
– V
680 Ω
20 kΩ
10 kΩ
VAB
V
P
+ V
ref1
V
ref3
V
ref2
+ V
ref2
– V
P
+ V
CM
20 kΩ
VA
B
V
P
– V
680 Ω
20 kΩ
ref1
V
ref1
V
6
P
– V
8
9
3
2
TDA2615
INV1
MUTE
1/2 V / GND
OUT1
OUT2
INV1, 2
INV2
P
7
1995 May 08 4
Philips Semiconductors Product specification
2× 6 W hi-fi audio power amplifier TDA2615
PINNING
SYMBOL PIN DESCRIPTION
−INV1 1 non-inverting input 1
MUTE 2 mute input
1⁄2VP/GND 3 1⁄2 supply voltage or ground
OUT1 4 output 1
−VP5 supply voltage (negative)
OUT2 6 output 2
+VP7 supply voltage (positive)
INV1, 2 8 inverting input 1 and 2
−INV2 9 non-inverting input 2
Fig.2 Pin configuration.
MLA708
1
2
3
4
5
6
7
8
9
P
+ V
OUT2
MUTE
INV2
TDA2615
/ GND
P
V
INV1
INV1, 2
OUT1
1/2 VP
FUNCTIONAL DESCRIPTION
The TDA2615 is a hi-fi stereo amplifier designed for mains
fed applications, such as stereo radio and stereo TV. The
circuit is optimally designed for symmetrical power
supplies, but is also well-suited to asymmetrical power
supply systems.
An output power of 2 ×6 W (THD = 0.5%) can be
delivered into an 8 Ω load with a symmetrical power supply
of ±12 V. The gain is internally fixed at 30 dB, thus offering
a low gain spread and a very good gain balance between
the two amplifiers (0.2 dB).
A special feature is the input mute circuit. This circuit
disconnects the non-inverting inputs when the supply
voltage drops below±6 V, while the amplifier still retains its
DC operating adjustment. The circuit features suppression
of unwanted signals at the inputs, during switch-on and
switch-off.
The mute circuit can also be activated via pin 2. When a
current of 300 µA is present at pin 2, the circuit is in the
mute condition.
The device is provided with two thermal protection circuits.
One circuit measures the average temperature of the
crystal and the other measures the momentary
temperature of the power transistors. These control
circuits attack at temperatures in excess of +150 °C, so a
crystal operating temperature of max. +150 °C can be
used without extra distortion.
With the derating value of 6 K/W, the heatsink can be
calculated as follows:
at RL=8Ω and VS=±12 V, the measured maximum
dissipation is 7.8 W.
With a maximum ambient temperature of +60 °C, the
thermal resistance of the heatsink is:
The metal tab has the same potential as pin 5.
Rth 150 60–
7.8
---------------------- 6–5.5 K/W==
1995 May 08 5
Philips Semiconductors Product specification
2× 6 W hi-fi audio power amplifier TDA2615
LIMITING VALUES
In accordance with the Absolute maximum System (IEC 134).
Note
1. For asymmetrical power supplies (with the load short-circuited), the maximum unloaded supply voltage is limited to
VP= 28 V and with an internal supply resistance of RS≥4Ω, the maximum unloaded supply voltage is limited to 32 V
(with the load short-circuited). For symmetrical power supplies the circuit is short-circuit-proof up to VP=21V.
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
±VPsupply voltage −21 V
IOSM non-repetitive peak output current −4A
P
tot total power dissipation see Fig.3 −15 W
Tstg storage temperature range −55 +150 °C
Txtal crystal temperature −+150 °C
Tamb ambient operating temperature range −25 +150 °C
tsc short-circuit time short-circuit to ground; note 1 −1h
Fig.3 Power derating curve.
– 25 0 50 150
16
12
4
0
8
MCD368 - 2
100T ( C)
o
amb
P
(W)
tot
infinite heatsink
R = 5.5 K/W
th-hs
THERMAL CHARACTERISTICS
SYMBOL PARAMETER VALUE UNIT
Rth j-c thermal resistance from junction to case 6 K/W
1995 May 08 6
Philips Semiconductors Product specification
2× 6 W hi-fi audio power amplifier TDA2615
CHARACTERISTICS
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Supply
±VPsupply voltage range −12 21 V
IORM repetitive peak output current 2.2 −−A
Operating position; note 1
±VPsupply voltage range 7.5 12 21 V
Iq(tot) total quiescent current RL=∞18 40 70 mA
POoutput power THD = 0.5% 5 6 −W
THD = 10% 6.5 8 −W
THD total harmonic distortion PO=4W −0.15 0.2 %
B power bandwidth THD = 0.5%; note 2 −20 to 20000 −Hz
Gvvoltage gain 29 30 31 dB
Gvgain unbalance −0.2 1 dB
Vno noise output voltage note 3 −70 140 µV
Ziinput impedance 14 20 26 kΩ
SVRR supply voltage ripple rejection note 4 40 60 −dB
αcs channel separation RS= 0 46 70 −dB
Ibias input bias current −0.3 −µA
∆VGNDDC output offset voltage −30 200 mV
∆V4−6DC output offset voltage between two channels −4 150 mV
MUTE POSITION (AT IMUTE ≥300 µA)
VOoutput voltage VI= 600 mV −0.3 1.0 mV
Z2−7mute input impedance −9−kΩ
Iq(tot) total quiescent current RL=∞18 40 70 mA
Vno noise output voltage note 3 −70 140 µV
SVRR supply voltage ripple rejection note 4 40 55 −dB
∆VGNDDC output offset voltage −40 200 mV
∆Voffoffset voltage with respect to
operating position −4 150 mV
I2current if pin 2 is connected to pin 5 −− 6mA
Mute position; note 5
±VPsupply voltage range 2 −5.8 V
IPtotal quiescent current RL=∞930 40mA
V
Ooutput voltage VI= 600 mV −0.3 1.0 mV
Vno noise output voltage note 3 −70 140 µV
SVRR supply voltage ripple rejection note 4 40 55 −dB
∆VGNDDC output offset voltage −40 200 mV
1995 May 08 7
Philips Semiconductors Product specification
2× 6 W hi-fi audio power amplifier TDA2615
Notes
1. VP=±12 V; RL=8Ω; Tamb =25°C; fi= 1 kHz; symmetrical power supply IMUTE =< 30 µA (see Fig.4).
2. The power bandwidth is measured at a maximum output power (POmax) of −3 dB.
3. The noise output voltage (RMS value) is measured at RS=2kΩ, unweighted (20 Hz to 20 kHz).
4. The ripple rejection is measured at RS= 0 and fi= 100 Hz to 20 kHz. The ripple voltage (200 mV) is applied in phase
to the positive and the negative supply rails. With asymmetrical power supplies, the ripple rejection is measured at
fi= 1 kHz.
5. ±VP= 4 V; RL=8Ω; Tamb =25°C; fi= 1 kHz; symmetrical power supply (see Fig.4).
6. VP= 24 V; RL=8Ω; Tamb =25°C; fi= 1 kHz; asymmetrical power supply IMUTE <30 µA (see Fig.5).
7. The internal network at pin 2 is a resistor divider of typical 4 kΩ and 5 kΩ to the positive supply rail. At the connection
of the 4 kΩ and 5 kΩ resistor a zener diode of typical 6.6 V is also connected to the positive supply rail. The spread
of the zener voltage is 6.1 to 7.1 V.
Operating position; note 6
Iq(tot) total quiescent current 18 40 70 mA
POoutput power THD = 0.5% 5 6 −W
THD = 10% 6.5 8 −W
THD total harmonic distortion PO=4W −0.13 0.2 %
B power bandwidth THD = 0.5%; note 1 −40 to 20000 −Hz
Gvvoltage gain 29 30 31 dB
Gvgain unbalance −0.2 1 dB
Vno noise output voltage note 3 −70 140 µV
Ziinput impedance 14 20 26 kΩ
SVRR supply voltage ripple rejection 35 44 −dB
αcs channel separation −45 −dB
MUTE POSITION (IMUTE ≥300 µA)
VOoutput voltage VI= 600 mV −0.3 1.0 mV
Z2−7mute input impedance note 7 6.7 9 11.3 kΩ
Iq(tot) total quiescent current 18 40 70 mA
Vno noise output voltage note 3 −70 140 µV
SVRR supply voltage ripple rejection note 4 35 44 −dB
∆Voffof fset voltage with respect to operating
position −4 150 mV
I2current if pin 2 is connected to pin 5 −− 6mA
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
1995 May 08 8
Philips Semiconductors Product specification
2× 6 W hi-fi audio power amplifier TDA2615
TEST AND APPLICATION INFORMATION
Fig.4 Test and application circuit with symmetrical power supply.
2200 µF
72
mute input P
+ V
5
TDA2615
MLA710 - 2
100 nF
6
20 kΩ
820 kΩ680 Ω
220 nF 9
R = 8 Ω
L
22 nF
8.2 Ω
I
V
P
– V
3R = 8 Ω
L
22 nF
8.2 Ω
4
20 kΩ
220 nF 1
I
V
20 kΩ680 Ω
2200 µF
1995 May 08 9
Philips Semiconductors Product specification
2× 6 W hi-fi audio power amplifier TDA2615
Fig.5 Test and application circuit with asymmetrical power supply.
6
20 kΩ
5
8
3
MLA709 - 1
20 kΩ680 Ω
9
R = 8 Ω
L
22 nF 680 µF
8.2 Ω
100 nF 2200 µF
72
mute input S
V
S
R
P
V
2
4
20 kΩ
1
220 nF
100 µF
I
V
220 nF
I
V
20 kΩ680 Ω
P
1/2 V
internal R = 8 Ω
L
22 nF 680 µF
8.2 Ω
TDA2615
1995 May 08 10
Philips Semiconductors Product specification
2× 6 W hi-fi audio power amplifier TDA2615
PACKAGE OUTLINE
UNIT AA
max.
2A3b1D1
b2
bcD
(1) E(1) Z
max.
(1)
eLPP
1q
1
q
2
q
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 18.5
17.8 3.7 8.7
8.0
A4
15.8
15.4 1.40
1.14 0.67
0.50 1.40
1.14 0.48
0.38 21.8
21.4 21.4
20.7 6.48
6.20 3.4
3.2
2.54 1.0
5.9
5.7
4.4
4.2
3.9
3.4 15.1
14.9
Q
1.75
1.55
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
2.75
2.50
SOT110-1 92-11-17
95-02-25
0 5 10 mm
scale
0.25
w
D
E
A
A
c
A2
3
A4
q1q2
L
Q
wM
b
b1
b2
D1
P
q
1
Ze
19
P
seating plane
pin 1 index
SIL9MPF: plastic single in-line medium power package with fin; 9 leads SOT110-1
1995 May 08 11
Philips Semiconductors Product specification
2× 6 W hi-fi audio power amplifier TDA2615
SOLDERING
Plastic single in-line packages
BY DIP OR WAVE
The maximum permissible temperature of the solder is
260 °C; this temperature must not be in contact with the
joint for more than 5 s. The total contact time of successive
solder waves must not exceed 5 s.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified storage maximum. If the printed-circuit board has
been pre-heated, forced cooling may be necessary
immediately after soldering to keep the temperature within
the permissible limit.
REPAIRING SOLDERED JOINTS
Apply the soldering iron below the seating plane (or not
more than 2 mm above it). If its temperature is below
300 °C, it must not be in contact for more than 10 s; if
between 300 and 400 °C, for not more than 5 s.
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
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SCD39 © Philips Electronics N.V. 1995
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Philips Semiconductors
Printed in The Netherlands
513061/1500/03/pp12 Date of release: 1995 May 08
Document order number: 9397 750 00122
