CYBLE-214009-00
EZ-BLE™ Creator Module
Cypress Semiconductor Corporation • 198 Champion Court • San Jose,CA 95134-1709 • 408-943-2600
Document Number: 002-09714 Rev. *H Revised March 7, 2018
General Description
The Cypress CYBLE-214009-00 is a fully certified and qualified
module supporting Bluetooth Low Energy (BLE) wireless
communication. The CYBLE-214009-00 is a turnkey solution
and includes onboard crystal oscillators, trace antenna, passive
components, and the Cypress PSoC® 4 BLE. Refer to the
PSoC® 4 BLE datasheet for additional details on the capabilities
of the PSoC 4 BLE device used on this module.
The EZ-BLE Creator module is a scalable and reconfigurable
platform architecture. It combines programmable and
reconfigurable analog and digital blocks with flexible automatic
routing. The CYBLE-214009-00 also includes digital
programmable logic, high-performance analog-to-digital
conversion (ADC), opamps with comparator mode, and standard
communication and timing peripherals.
The CYBLE-214009-00 includes a royalty-free BLE stack
compatible with Bluetooth 4.1 and provides up to 25 GPIOs in a
small 11 × 11 × 1.80 mm package. The CYBLE-214009-00 is
drop-in compatible with the CYBLE-014008-00 EZ-BLE Module.
The CYBLE-214009-00 is a complete solution and an ideal fit for
applications seeking a highly integrated BLE wireless solution.
Module Description
■Module size: 11.0 mm × 11.0 mm × 1.80 mm (with shield)
■Drop-in compatible with CYBLE-014008-00
■256-KB flash memory, 32-KB SRAM memory
■Up to 25 GPIOs configurable as open drain high/low,
pull-up/pull-down, HI-Z analog, HI-Z digital, or strong output
■Bluetooth 4.1 qualified single-mode module
❐QDID: 79480
❐Declaration ID: D029646
■Certified to FCC, CE, MIC, KC, and ISED regulations
■Industrial temperature range: –40 °C to +85 °C
■32-bit processor (0.9 DMIPS/MHz) with single-cycle 32-bit
multiply, operating at up to 48 MHz
■Watchdog timer with dedicated internal low-speed oscillator
(ILO)
■Two-pin SWD for programming
Power Consumption
■TX output power: –18 dbm to +3 dbm
■Received signal strength indicator (RSSI) with 1-dB resolution
■TX current consumption of 15.6 mA (radio only, 0 dbm)
■RX current consumption of 16.4 mA (radio only)
■Low power mode support
❐Deep Sleep: 1.3 µA with watch crystal oscillator (WCO) on
❐Hibernate: 150 nA with SRAM retention
❐Stop: 60 nA with XRES wakeup
Programmable Analog
■Four opamps with reconfigurable high-drive external and
high-bandwidth internal drive, comparator modes, and ADC
input buffering capability; can operate in Deep-Sleep mode
■12-bit, 1-Msps SAR ADC with differential and single-ended
modes; channel sequencer with signal averaging
■Two current DACs (IDACs) for general-purpose or capacitive
sensing applications on any pin
■One low-power comparator that operate in Deep-Sleep mode
Programmable Digital
■Four programmable logic blocks called universal digital blocks,
(UDBs), each with eight macrocells and datapath
■Cypress-provided peripheral Component library, user-defined
state machines, and Verilog input
Capacitive Sensing
■Cypress CapSense Sigma-Delta (CSD) provides best-in-class
SNR (> 5:1) and liquid tolerance
■Cypress-supplied software component makes
capacitive-sensing design easy
■Automatic hardware-tuning algorithm (SmartSense™)
Segment LCD Drive
■LCD drive supported on all GPIOs (common or segment)
■Operates in Deep Sleep mode with four bits per pin memory
Serial Communication
■Two independent runtime reconfigurable serial communication
blocks (SCBs) with I2C, SPI, or UART functionality
Timing and Pulse-Width Modulation
■Four 16-bit timer, counter, pulse-width modulator (TCPWM)
blocks
■Center-aligned, Edge, and Pseudo-random modes
■Comparator-based triggering of Kill signals for motor drive and
other high-reliability digital logic applications
Up to 25 Programmable GPIOs
■Any GPIO pin can be CapSense, LCD, analog, or digital
CYBLE-214009-00
Document Number: 002-09714 Rev. *H Page 2 of 42
More Information
Cypress provides a wealth of data at www.cypress.com to help you to select the right module for your design, and to help you to
quickly and effectively integrate the module into your design.
■Overview: EZ-BLE Module Portfolio, Module Roadmap
■EZ-BLE PSoC Product Overview
■PSoC 4 BLE Silicon Datasheet
■Application notes: Cypress offers a number of BLE application
notes covering a broad range of topics, from basic to advanced
level. Recommended application notes for getting started with
EZ-BLE modules are:
❐AN96841 - Getting Started with EZ-BLE Module
❐AN91267 - Getting Started with PSoC® 4 BLE
❐AN97060 - PSoC® 4 BLE and PRoC™ BLE - Over-The-Air
(OTA) Device Firmware Upgrade (DFU) Guide
❐AN91162 - Creating a BLE Custom Profile
❐AN91184 - PSoC 4 BLE - Designing BLE Applications
❐AN92584 - Designing for Low Power and Estimating Battery
Life for BLE Applications
❐AN85951 - PSoC® 4 CapSense® Design Guide
❐AN95089 - PSoC® 4/PRoC™ BLE Crystal Oscillator
Selection and Tuning Techniques
❐AN91445 - Antenna Design and RF Layout Guidelines
■Technical Reference Manual (TRM):
❐PSoC® 4 BLE Technical Reference Manual
❐PSOC® 4 BLE Registers Technical Reference Manual
■Knowledge Base Articles
❐KBA10894 - Pin Mapping Differences Between the
EZ-BLE™ PSoC™ Evaluation Board (CYBLE-214009-
EVAL) and the BLE Pioneer Kit (CY8CKIT-042-BLE) -
KBA10894
❐KBA210574 - RF Regulatory Certifications for CY-
BLE-014008-00 and CYBLE-214009-00 EZ-BLE™ PSoC®
Modules - KBA210574
❐KBA97095 - EZ-BLE™ Module Placement
❐KBA213976 - FAQ for BLE and Regulatory Certifications with
EZ-BLE modules
❐KBA210802 - Queries on BLE Qualification and Declaration
Processes
❐KBA218122 - 3D Model Files for EZ-BLE/EZ-BT Modules
■Development Kits:
❐CYBLE-214009-EVAL, CYBLE-214009-00 Evaluation Board
❐CY8CKIT-042-BLE, Bluetooth® Low Energy (BLE) Pioneer
Kit
❐CY8CKIT-002, PSoC® MiniProg3 Program and Debug Kit
■Test and Debug Tools:
❐CYSmart, Bluetooth® LE Test and Debug Tool (Windows)
❐CYSmart Mobile, Bluetooth® LE Test and Debug Tool
(Android/iOS Mobile App)
Two Easy-To-Use Design Environments to Get You Started Quickly
PSoC® Creator™ Integrated Design Environment (IDE)
PSoC Creator is an Integrated Design Environment (IDE) that enables concurrent hardware and firmware editing, compiling and
debugging of PSoC 3, PSoC 4, PSoC 5LP, PSoC 4 BLE, and EZ-BLE module systems with no code size limitations. PSoC peripherals
are designed using schematic capture and simple graphical user interface (GUI) with over 120 pre-verified, production-ready PSoC
Components™.
PSoC Components are analog and digital “virtual chips,” represented by an icon that users can drag-and-drop into a design and
configure to suit a broad array of application requirements.
Bluetooth Low Energy Component
The Bluetooth Low Energy Component inside PSoC Creator provides a comprehensive GUI-based configuration window that lets you
quickly design BLE applications. The Component incorporates a Bluetooth Core Specification v4.1 compliant BLE protocol stack and
provides API functions to enable user applications to interface with the underlying Bluetooth Low Energy Sub-System (BLESS)
hardware via the stack.
EZ-Serial™ BLE Firmware Platform
The EZ-Serial Firmware Platform provides a simple way to access the most common hardware and communication features needed
in BLE applications. EZ-Serial implements an intuitive API protocol over the UART interface and exposes various status and control
signals through the module’s GPIOs, making it easy to add BLE functionality quickly to existing designs.
Use a simple serial terminal and evaluation kit to begin development without requiring an IDE. Refer to the EZ-Serial webpage for
User Manuals and instructions for getting started as well as detailed reference materials.
EZ-BLE modules are pre-flashed with the EZ-Serial Firmware Platform. If you do not have EZ-Serial pre-loaded on your module, you
can download each EZ-BLE module’s firmware images on the EZ-Serial webpage.
Technical Support
■Frequently Asked Questions (FAQs): Learn more about our BLE ECO System.
■Forum: See if your question is already answered by fellow developers on the PSoC 4 BLE forum.
■Visit our support page and create a technical support case or contact a local sales representatives. If you are in the United States,
you can talk to our technical support team by calling our toll-free number: +1-800-541-4736. Select option 2 at the prompt.
CYBLE-214009-00
Document Number: 002-09714 Rev. *H Page 3 of 42
Contents
Overview ............................................................................ 4
Module Description ......................................................4
Pad Connection Interface ................................................ 6
Recommended Host PCB Layout ................................... 7
Digital and Analog Capabilities
and Connections .............................................................. 9
Power Supply Connections and Recommended
External Components .................................................... 11
Connection Options ...................................................11
External Component Recommendation ....................11
Critical Components List ........................................... 14
Antenna Design .........................................................14
Electrical Specification .................................................. 15
GPIO .........................................................................17
XRES ......................................................................... 18
Analog Peripherals ....................................................18
Digital Peripherals .....................................................22
Serial Communication ...............................................24
Memory .....................................................................25
System Resources .................................................... 25
Environmental Specifications ....................................... 31
Environmental Compliance .......................................31
RF Certification .......................................................... 31
Environmental Conditions ......................................... 31
ESD and EMI Protection ........................................... 31
Regulatory Information .................................................. 32
FCC ........................................................................... 32
ISED .......................................................................... 33
European R&TTE Declaration of Conformity ............33
MIC Japan ................................................................. 34
KC Korea ................................................................... 34
Packaging ........................................................................ 35
Ordering Information ...................................................... 37
Part Numbering Convention ......................................37
Acronyms ........................................................................ 38
Document Conventions ................................................. 40
Units of Measure ....................................................... 40
Document History Page ................................................. 41
Sales, Solutions, and Legal Information ...................... 42
Worldwide Sales and Design Support ....................... 42
Products .................................................................... 42
PSoC® Solutions ...................................................... 42
Cypress Developer Community ................................. 42
Technical Support ..................................................... 42
CYBLE-214009-00
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Overview
Module Description
The CYBLE-214009-00 module is a complete module designed to be soldered to the main host board.
Module Dimensions and Drawing
Cypress reserves the right to select components (including the appropriate BLE device) from various vendors to achieve the BLE
module functionality. Such selections will guarantee that all height restrictions of the component area are maintained. Designs should
be completed with the physical dimensions shown in the mechanical drawings in Figure 1. All dimensions are in millimeters (mm).
Table 1. Module Design Dimensions
See Figure 1 on page 5 for the mechanical reference drawing for CYBLE-214009-00.
Dimension Item Specification
Module dimensions Length (X) 11.00 ± 0.15 mm
Width (Y) 11.00 ± 0.15 mm
Antenna location dimensions Length (X) 11.00 ± 0.15 mm
Width (Y) 4.62 ± 0.15 mm
PCB thickness Height (H) 0.80 ± 0.10 mm
Shield height Height (H) 1.00 ± 0.10 mm
Maximum component height Height (H) 1.00-mm typical (shield)
Total module thickness (bottom of module to highest component) Height (H) 1.80-mm typical
CYBLE-214009-00
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Figure 1. Module Mechanical Drawing
Top View
Side View
Bottom View (Seen from Bottom)
Note
1. No metal should be located beneath or above the antenna area. Only bare PCB material should be located beneath the antenna area. For more information on
recommended host PCB layout, see Figure 3 on page 6, Figure 4 and Figure 5 on page 7, and Figure 6 and Table 3 on page 8.
CYBLE-214009-00
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Pad Connection Interface
As shown in the bottom view of Figure 1 on page 5, the CYBLE-214009-00 connects to the host board via solder pads on the back
of the module. Table 2 and Figure 2 detail the solder pad length, width, and pitch dimensions of the CYBLE-214009-00 module.
Figure 2. Solder Pad Dimensions (Seen from Bottom)
To maximize RF performance, the host layout should follow these recommendations:
1. The ideal placement of the Cypress BLE module is in a corner of the host board with the antenna located on the edge of the host
board. This placement minimizes the additional recommended keep-out area stated in item 2. Refer to AN96841 for module
placement best practices.
2. To maximize RF performance, the area immediately around the Cypress BLE module trace antenna should contain an additional
keep-out area, where no grounding or signal traces are contained. The keep-out area applies to all layers of the host board. The
recommended dimensions of the host PCB keep-out area are shown in Figure 3 (dimensions are in mm).
Figure 3. Recommended Host PCB Keep-Out Area Around the CYBLE-214009-00 Trace Antenna
Table 2. Solder Pad Connection Description
Name Connections Connection Type Pad Length Dimension Pad Width Dimension Pad Pitch
SP 32 Solder Pads Pad9/Pad24: 0.74 mm
All Others: 0.79 mm 0.41 mm 0.66 mm
Host PCB Keep-Out Area Around Trace Antenna
CYBLE-214009-00
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Recommended Host PCB Layout
Figure 4 through Figure 6 and Ta ble 3 provide details that can be used for the recommended host PCB layout pattern for the
CYBLE-214009-00. Dimensions are in millimeters unless otherwise noted. Pad length of 0.99 mm (0.494 mm from center of the pad
on either side) shown in Figure 6 is the minimum recommended host pad length. The host PCB layout pattern can be completed using
either Figure 4, Figure 5, or Figure 6. It is not necessary to use all figures to complete the host PCB layout pattern.
Figure 4. Host Layout Pattern for CYBLE-214009-00 Figure 5. Module Pad Location from Origin
Top View (Seen on Host PCB)
Top View (Seen on Host PCB)
CYBLE-214009-00
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Table 3 provides the center location for each solder pad on the CYBLE-214009-00. All dimensions are referenced to the center of the
solder pad. Refer to Figure 6 for the location of each module solder pad.
Table 3. Module Solder Pad Location Figure 6. Solder Pad Reference Location
Solder Pad
(Center of Pad)
Location (X,Y) from
Orign (mm)
Dimension from
Orign (mils)
1 (0.30, 4.83) (11.81, 190.16)
2 (0.30, 5.49) (11.81, 216.14)
3 (0.30, 6.15) (11.81, 242.13)
4 (0.30, 6.81) (11.81, 268.11)
5 (0.30, 7.47) (11.81, 294.09)
6 (0.30, 8.13) (11.81, 320.08)
7 (0.30, 8.79) (11.81, 346.06)
8 (0.30, 9.45) (11.81, 372.05)
9 (0.27, 10.11) (10.63, 398.03)
10 (1.21, 10.70) (47.64, 421.26)
11 (1.87, 10.70) (73.62, 421.26)
12 (2.53, 10.70) (99.61, 421.26)
13 (3.19, 10.70) (125.59, 421.26)
14 (3.85, 10.70) (151.57, 421.26)
15 (4.51, 10.70) (177.56, 421.26)
16 (5.17, 10.70) (203.54, 421.26)
17 (5.84, 10.70) (229.92, 421.26)
18 (6.50, 10.70) (255.91, 421.26)
19 (7.16, 10.70) (281.89, 421.26)
20 (7.82, 10.70) (307.87, 421.26)
21 (8.48, 10.70) (333.86, 421.26)
22 (9.14, 10.70) (359.84, 421.26)
23 (9.80, 10.70) (385.83, 421.26)
24 (10.73, 10.11) (422.44, 398.03)
25 (10.70, 9.45) (421.26, 372.05)
26 (10.70, 8.79) (421.26, 346.06)
27 (10.70, 8.13) (421.26, 320.08)
28 (10.70, 7.47) (421.26, 294.09)
29 (10.70, 6.81) (421.26, 268.11)
30 (10.70, 6.15) (421.26, 242.13)
31 (10.70, 5.49) (421.26, 216.14)
32 (10.70, 4.83) (421.26, 190.16)
Top View (Seen on Host PCB)
CYBLE-214009-00
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Digital and Analog Capabilities and Connections
Table 4 and Tab le 5 detail the solder pad connection definitions and available functions for each connection pad. Table 4 lists the
solder pads on CYBLE-214009-00, the BLE device port-pin, and denotes whether the digital function shown is available for each
solder pad. Table 5 denotes whether the analog function shown is available for each solder pad. Each connection is configurable for
a single option shown with a ✓.
Table 4. Digital Peripheral Capabilities
Pad
Number
Device
Port Pin UART SPI I2CTCPWM[2,3] Cap
Sense
WCO
Out
ECO
OUT LCD SWD GPIO
1GND
[4] Ground Connection
2P1.1 ✓(SCB1_SS1) ✓(TCPWM) ✓✓✓
3P1.0 ✓(TCPWM) ✓✓✓
4P1.5✓(SCB0_TX) ✓(SCB0_MISO) ✓(SCB0_SCL) ✓(TCPWM) ✓✓✓
5P0.1✓(SCB1_TX) ✓(SCB1_MISO) ✓(SCB1_SCL) ✓(TCPWM) ✓✓✓
6P0.7✓(SCB0_CTS) ✓(SCB0_SCLK) ✓(TCPWM) ✓✓
✓
(SWDCLK)
✓
7 VDD Digital Power Supply Input (1.71 to 5.5V)
8P1.4
✓(SCB0_RX) ✓(SCB0_MOSI) ✓(SCB0_SDA) ✓(TCPWM) ✓✓✓
9P0.4✓(SCB0_RX) ✓(SCB0_MOSI) ✓(SCB0_SDA) ✓(TCPWM) ✓✓✓ ✓
10 P0.5 ✓(SCB0_TX) ✓(SCB0_MISO) ✓(SCB0_SCL) ✓(TCPWM) ✓✓✓
11 P0.6 ✓(SCB0_RTS) ✓(SCB0_SS0) ✓(TCPWM) ✓✓✓
(SWDIO)
✓
12 P1.2 ✓(SCB1_SS2) ✓(TCPWM) ✓✓✓
13 VDDR Radio Power Supply (1.9V to 5.5V)
14 P2.6 ✓(TCPWM) ✓✓✓
15 P1.3 ✓(SCB1_SS3) ✓(TCPWM) ✓✓✓
16 P3.0 ✓(SCB0_RX) ✓(SCB0_SDA) ✓(TCPWM) ✓✓✓
17 P2.1 ✓(SCB0_SS2) ✓(TCPWM) ✓✓✓
18 P2.2 ✓(SCB0_SS3) ✓(TCPWM) ✓✓✓
19 P2.3 ✓(TCPWM) ✓✓ ✓ ✓
20 VDDA Analog Power Supply Input (1.71 to 5.5V)
21 P3.4 ✓(SCB1_RX) ✓(SCB1_SDA) ✓(TCPWM) ✓✓✓
22 P3.1 ✓(SCB0_TX) ✓(SCB0_SCL) ✓(TCPWM) ✓✓✓
23 P3.7 ✓(SCB1_CTS) ✓(TCPWM) ✓✓ ✓ ✓
24 P3.5 ✓(SCB1_TX) ✓(SCB1_SCL) ✓(TCPWM) ✓✓✓
25 P3.3 ✓(SCB0_CTS) ✓(TCPWM) ✓✓✓
26 VREF Reference Voltage Input
27 P3.2 ✓(SCB0_RTS) ✓(TCPWM) ✓✓✓
28 P3.6 ✓(SCB1_RTS) ✓(TCPWM) ✓✓✓
29 XRES External Reset Hardware Connection Input
30 P2.4 ✓(TCPWM) ✓✓✓
31 P2.5 ✓(TCPWM) ✓✓✓
32 GND Ground Connection
Notes
2. TCPWM stands for timer, counter, and PWM. If supported, the pad can be configured to any of these peripheral functions.
3. TCPWM connections on ports 0, 1, 2, and 3 can be routed through the Digital Signal Interconnect (DSI) to any of the TCPWM blocks and can be either positive
or negative polarity.
4. The main board needs to connect both GND connections (Pad 1 and Pad 32) on the module to the common ground of the system.
CYBLE-214009-00
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Table 5. Analog Peripheral Capabilities
Pad Number Device Port Pin SARMUX OPAMP LPCOMP
1GND
[4] Ground Connection
2P1.1 ✓(CTBm1_OA0_INN)
3P1.0 ✓(CTBm1_OA0_INP)
4P1.5 ✓(CTBm1_OA1_INP)
5P0.1
6P0.7
7 VDD Digital Power Supply Input (1.71 to 5.5V)
8P1.4 ✓(CTBm1_OA1_INN)
9P0.4 ✓(COMP1_INP)
10 P0.5 ✓(COMP1_INN)
11 P0.6
12 P1.2 ✓(CTBm1_OA0_OUT)
13 VDDR Radio Power Supply (1.9V to 5.5V)
14 P2.6 ✓(CTBm0_OA0_INP)
15 P1.3 ✓(CTBm1_OA1_OUT)
16 P3.0 ✓
17 P2.1 ✓(CTBm0_OA0_INN)
18 P2.2 ✓(CTBm0_OA0_OUT)
19 P2.3 ✓(CTBm0_OA1_OUT)
20 VDDA Analog Power Supply Input (1.71 to 5.5V)
21 P3.4 ✓
22 P3.1 ✓
23 P3.7 ✓
24 P3.5 ✓
25 P3.3 ✓
26 VREF Reference Voltage Input (Optional)
27 P3.2 ✓
28 P3.6 ✓
29 XRES External Reset Hardware Connection Input
30 P2.4 ✓(CTBm0_OA1_INN)
31 P2.5 ✓(CTBm0_OA1_INP)
32 GND Ground Connection
CYBLE-214009-00
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Power Supply Connections and Recommended External Components
Power Connections
The CYBLE-214009-00 contains three power supply connec-
tions, VDD, VDDA, and VDDR. The VDD and VDDA connections
supply power for the digital and analog device operation respec-
tively. VDDR supplies power for the device radio.
VDD and VDDA accept a supply range of 1.71 V to 5.5 V. VDDR
accepts a supply range of 1.9 V to 5.5 V. These specifications
can be found in Ta ble 10. The maximum power supply ripple for
both power connections on the module is 100 mV, as shown in
Table 8.
The power supply ramp rate of VDD and VDDA must be equal
to or greater than that of VDDR when the radio is used.
Connection Options
Two connection options are available for any application:
1. Single supply: Connect VDD, VDDA, and VDDR to the same
supply.
2. Independent supply: Power VDD, VDDA, and VDDR
separately.
External Component Recommendation
In either connection scenario, it is recommended to place an
external ferrite bead between the supply and the module
connection. The ferrite bead should be positioned as close as
possible to the module pin connection.
Figure 7 details the recommended host schematic options for a
single supply scenario. The use of one or three ferrite beads will
depend on the specific application and configuration of the
CYBLE-214009-00.
Figure 8 details the recommended host schematic for an
independent supply scenario.
The recommended ferrite bead value is 330 , 100 MHz (Murata
BLM21PG331SN1D).
Figure 7. Recommended Host Schematic Options for Single Supply Option
Three Ferrite Bead Option (See from Bottom)
Single Ferrite Bead Option (Seen from Bottom)
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Figure 8. Recommended Host Schematic for Independent Supply Option
Independent Power Supply Option (Seen from Bottom)
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Critical Components List
Table 6 details the critical components used in the CYBLE-214009-00 module.
Table 6. Critical Component List
Antenna Design
Table 7 details antenna used on the CYBLE-214009-00 module. The Cypress module performance improves many of these
characteristics. For more information, see Table 9 on page 15.
Table 7. Trace Antenna Specifications
Component Reference Designator Description
Silicon U1 76-pin WLCSP PSoC 4 BLE
Crystal Y1 24.000 MHz, 10PF
Crystal Y2 32.768 kHz, 12.5PF
Item Description
Frequency Range 2400–2500 MHz
Peak Gain 0.5 dBi typical
Average Gain –0.5-dBi typical
Return Loss 10-dB minimum
CYBLE-214009-00
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Electrical Specification
Table 8 details the absolute maximum electrical characteristics for the Cypress BLE module.
Table 8. CYBLE-214009-00 Absolute Maximum Ratings
Table 9 details the RF characteristics for the Cypress BLE module.
Table 9. CYBLE-214009-00 RF Performance Characteristics
Table 10 through Table 51 list the module level electrical characteristics for the CYBLE-214009-00. All specifications are valid for
–40 °C TA 85 °C and TJ 100 °C, except where noted. Specifications are valid for 1.71V to 5.5V, except where noted.
Parameter Description Min Typ Max Unit Details/Conditions
VDDD_ABS VDD, VDDA or VDDR supply relative to VSS
(VSSD = VSSA)–0.5 – 6 VAbsolute maximum
VCCD_ABS Direct digital core voltage input relative to VSSD –0.5 – 1.95 Absolute maximum
VDDD_RIPPLE Maximum power supply ripple for VDD, VDDA and
VDDR input voltage – – 100 mV
3.0-V supply
Ripple frequency of 100 kHz
to 750 kHz
VGPIO_ABS GPIO voltage –0.5 – VDD +0.5 V Absolute maximum
IGPIO_ABS Maximum current per GPIO –25 – 25
mA
Absolute maximum
IGPIO_injection GPIO injection current: Maximum for VIH > VDD
and minimum for VIL < VSS –0.5 – 0.5 Absolute maximum current
injected per pin
LU Pin current for latch up –200 200 –
Parameter Description Min Typ Max Unit Details/Conditions
RFO RF output power on ANT –18 0 3
dBm
Configurable via register
settings
RXSRF receive sensitivity on ANT – –87 – Guaranteed by design
simulation
FRModule frequency range 2400 – 2480 MHz –
GPPeak gain – 0.5 – dBi –
GAvg Average gain – –0.5 – –
RL Return loss – –10 – dB –
Table 10. CYBLE-214009-00 DC Specifications
Parameter Description Min Typ Max Unit Details/Conditions
VDD1 Power supply input voltage (VDD = VDDA = VDDR)1.71 – 5.5
V
With regulator enabled
VDD2 Power supply input voltage unregulated (VDD =
VDDA = VDDR)1.71 1.8 1.89 Internally unregulated
supply
VDDR1 Radio supply voltage (radio on) 1.9 – 5.5 –
VDDR2 Radio supply voltage (radio off) 1.71 – 5.5 –
Active Mode, VDD = 1.71 V to 5.5 V
IDD3 Execute from flash; CPU at 3 MHz – 1.7 –
mA
T = 25 °C,
VDD = 3.3 V
IDD4 Execute from flash; CPU at 3 MHz – – – T = –40 °C to 85 °C
IDD5 Execute from flash; CPU at 6 MHz – 2.5 – T = 25 °C,
VDD = 3.3 V
IDD6 Execute from flash; CPU at 6 MHz – – – T = –40 °C to 85 °C
IDD7 Execute from flash; CPU at 12 MHz – 4 – T = 25 °C,
VDD = 3.3 V
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IDD8 Execute from flash; CPU at 12 MHz – – –
mA
T = –40 °C to 85 °C
IDD9 Execute from flash; CPU at 24 MHz – 7.1 – T = 25 °C,
VDD = 3.3 V
IDD10 Execute from flash; CPU at 24 MHz – – – T = –40 °C to 85 °C
IDD11 Execute from flash; CPU at 48 MHz – 13.4 – T = 25 °C,
VDD = 3.3 V
IDD12 Execute from flash; CPU at 48 MHz – – – T = –40 °C to 85 °C
Sleep Mode, VDD = 1.71 V to 5.5 V
IDD13 IMO on – – – mA T = 25 °C, VDD = 3.3 V,
SYSCLK = 3 MHz
Sleep Mode, VDD and VDDR = 1.9 V to 5.5 V
IDD14 ECO on – – – mA T = 25 °C, VDD = 3.3 V,
SYSCLK = 3 MHz
Deep-Sleep Mode, VDD = 1.71 V to 3.6 V
IDD15 WDT with WCO on – 1.3 –
µA
T = 25 °C,
VDD = 3.3 V
IDD16 WDT with WCO on – – – T = –40 °C to 85 °C
IDD17 WDT with WCO on – – – T = 25 °C,
VDD = 5 V
IDD18 WDT with WCO on – – – T = –40 °C to 85 °C
Deep-Sleep Mode, VDD = 1.71 V to 1.89 V (Regulator Bypassed)
IDD19 WDT with WCO on – – – µA T = 25 °C
IDD20 WDT with WCO on – – – T = –40 °C to 85 °C
Hibernate Mode, VDD = 1.71 V to 3.6 V
IDD27 GPIO and reset active – 150 – nA
T = 25 °C,
VDD = 3.3 V
IDD28 GPIO and reset active – – – T = –40 °C to 85 °C
Hibernate Mode, VDD = 3.6 V to 5.5 V
IDD29 GPIO and reset active – – – nA
T = 25 °C,
VDD = 5 V
IDD30 GPIO and reset active – – – T = –40 °C to 85 °C
Stop Mode, VDD = 1.71 V to 3.6 V
IDD33 Stop-mode current (VDD)–20–
nA
T = 25 °C,
VDD = 3.3 V
IDD34 Stop-mode current (VDDR)–40–-
T = 25 °C,
VDDR = 3.3 V
IDD35 Stop-mode current (VDD) – – – T = –40 °C to 85 °C
IDD36 Stop-mode current (VDDR)–––
T = –40 °C to 85 °C,
VDDR = 1.9 V to 3.6 V
Stop Mode, VDD = 3.6 V to 5.5 V
IDD37 Stop-mode current (VDD)–––
nA
T = 25 °C,
VDD = 5 V
IDD38 Stop-mode current (VDDR)–––
T = 25 °C,
VDDR = 5 V
IDD39 Stop-mode current (VDD) – – – T = –40 °C to 85 °C
IDD40 Stop-mode current (VDDR) – – – T = –40 °C to 85 °C
Table 10. CYBLE-214009-00 DC Specifications (continued)
Parameter Description Min Typ Max Unit Details/Conditions
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Table 11. AC Specifications
GPIO
Parameter Description Min Typ Max Unit Details/Conditions
FCPU CPU frequency DC – 48 MHz 1.71 V VDD 5.5 V
TSLEEP Wakeup from Sleep mode – 0 –
µs
Guaranteed by characterization
TDEEPSLEEP Wakeup from Deep-Sleep mode – – 25 24-MHz IMO. Guaranteed by
characterization
THIBERNATE Wakeup from Hibernate mode – – 800 Guaranteed by characterization
TSTOP Wakeup from Stop mode – – 2 ms XRES wakeup
Table 12. GPIO DC Specifications
Parameter Description Min Typ Max Unit Details/Conditions
VIH[5]
Input voltage HIGH threshold 0.7 × VDD – –
V
CMOS input
LVTTL input, VDD < 2.7 V 0.7 × VDD – – –
LVTTL input, VDD 2.7 V 2.0 – – –
VIL
Input voltage LOW threshold – – 0.3 × VDD CMOS input
LVTTL input, VDD < 2.7V – – 0.3 × VDD –
LVTTL input, VDD 2.7V – – 0.8 –
VOH
Output voltage HIGH level VDD – 0.6 – – IOH = 4 mA at 3.3-V VDD
Output voltage HIGH level VDD – 0.5 – – IOH = 1 mA at 1.8-V VDD
VOL
Output voltage LOW level – – 0.6 IOL = 8 mA at 3.3-V VDD
Output voltage LOW level – – 0.6 IOL = 4 mA at 1.8-V VDD
Output voltage LOW level – – 0.4 IOL = 3 mA at 3.3-V VDD
RPULLUP Pull-up resistor 3.5 5.6 8.5 k–
RPULLDOWN Pull-down resistor 3.5 5.6 8.5 –
IIL Input leakage current (absolute value) – – 2 nA 25 °C, VDD = 3.3 V
IIL_CTBM Input leakage on CTBm input pins – – 4 –
CIN Input capacitance – – 7 pF –
VHYSTTL Input hysteresis LVTTL 25 40 – mV VDD > 2.7 V
VHYSCMOS Input hysteresis CMOS 0.05 × VDD – – 1 –
IDIODE Current through protection diode to
VDD/VSS – – 100 µA –
ITOT_GPIO Maximum total source or sink chip
current – – 200 mA –
Note
5. VIH must not exceed VDD + 0.2 V.
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Table 13. GPIO AC Specifications
XRES
Analog Peripherals
Opamp
Parameter Description Min Typ Max Unit Details/Conditions
TRISEF Rise time in Fast-Strong mode 2 – 12
ns
3.3-V VDDD, CLOAD = 25 pF
TFALLF Fall time in Fast-Strong mode 2 – 12 3.3-V VDDD, CLOAD = 25 pF
TRISES Rise time in Slow-Strong mode 10 – 60 3.3-V VDDD, CLOAD = 25 pF
TFALLS Fall time in Slow-Strong mode 10 – 60 3.3-V VDDD, CLOAD = 25 pF
FGPIOUT1 GPIO Fout; 3.3 V VDD 5.5 V
Fast-Strong mode ––33
MHz
90/10%, 25-pF load, 60/40 duty
cycle
FGPIOUT2 GPIO Fout; 1.7 VVDD 3.3 V
Fast-Strong mode – – 16.7 90/10%, 25-pF load, 60/40 duty
cycle
FGPIOUT3 GPIO Fout; 3.3 V VDD 5.5 V
Slow-Strong mode –– 7 90/10%, 25-pF load, 60/40 duty
cycle
FGPIOUT4 GPIO Fout; 1.7 V VDD 3.3 V
Slow-Strong mode ––3.5 90/10%, 25-pF load, 60/40 duty
cycle
FGPIOIN GPIO input operating frequency
1.71 V VDD 5.5 V – – 48 90/10% VIO
Table 14. XRES DC Specifications
Parameter Description Min Typ Max Unit Details/Conditions
VIH Input voltage HIGH threshold 0.7 × VDDD ––VCMOS input
VIL Input voltage LOW threshold – – 0.3 × VDDD CMOS input
RPULLUP Pull-up resistor 3.5 5.6 8.5 k–
CIN Input capacitance – 3 – pF –
VHYSXRES Input voltage hysteresis – 100 – mV –
IDIODE Current through protection diode to
VDD/VSS – – 100 µA –
Table 15. XRES AC Specifications
Parameter Description Min Typ Max Unit Details/Conditions
TRESETWIDTH Reset pulse width 1 – – µs –
Table 16. Opamp Specifications
Parameter Description Min Typ Max Unit Details/Conditions
IDD (Opamp Block Current. VDD = 1.8 V. No Load)
IDD_HI Power = high – 1000 1300 µA –
IDD_MED Power = medium – 500 – –
IDD_LOW Power = low – 250 350 –
GBW (Load = 20 pF, 0.1 mA. VDDA = 2.7 V)
GBW_HI Power = high 6 – – MHz –
GBW_MED Power = medium 4 – – –
GBW_LO Power = low – 1 – –
IOUT_MAX (VDDA 2.7 V, 500 mV from Rail)
IOUT_MAX_HI Power = high 10 – – mA –
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IOUT_MAX_MID Power = medium 10 – – mA –
IOUT_MAX_LO Power = low – 5 – –
IOUT (VDDA = 1.71 V, 500 mV from Rail)
IOUT_MAX_HI Power = high 4 – –
mA
–
IOUT_MAX_MID Power = medium 4 – – –
IOUT_MAX_LO Power = low – 2 – –
VIN Charge pump on, VDDA 2.7 V –0.05 – VDDA – 0.2 V–
VCM Charge pump on, VDDA 2.7 V –0.05 – VDDA – 0.2 –
VOUT (VDDA 2.7 V)
VOUT_1 Power = high, ILOAD = 10 mA 0.5 – VDDA – 0.5
V
–
VOUT_2 Power = high, ILOAD = 1 mA 0.2 – VDDA – 0.2 –
VOUT_3 Power = medium, ILOAD = 1 mA 0.2 – VDDA – 0.2 –
VOUT_4 Power = low, ILOAD = 0.1 mA 0.2 – VDDA – 0.2 –
VOS_TR Offset voltage, trimmed 1 ±0.5 1
mV
High mode
VOS_TR Offset voltage, trimmed – ±1 – Medium mode
VOS_TR Offset voltage, trimmed – ±2 – Low mode
VOS_DR_TR Offset voltage drift, trimmed –10 ±3 10
µV/C
High mode
VOS_DR_TR Offset voltage drift, trimmed – ±10 – Medium mode
VOS_DR_TR Offset voltage drift, trimmed – ±10 – Low mode
CMRR DC 65 70 – dB
VDDD = 3.6 V,
High-power mode
PSRR At 1 kHz, 100-mV ripple 70 85 – VDDD = 3.6 V
Noise
VN1 Input referred, 1 Hz–1 GHz, power = high – 94 – µVrms –
VN2 Input referred, 1 kHz, power = high – 72 –
nV/rtHz
–
VN3 Input referred, 10 kHz, power = high – 28 – –
VN4 Input referred, 100 kHz, power = high – 15 – –
CLOAD Stable up to maximum load. Performance
specs at 50 pF
––125 pF
–
Slew_rate Cload = 50 pF, Power = High,
VDDA 2.7 V
6– – V/µs
–
T_op_wake From disable to enable, no external RC
dominating
– 300 – µs –
Comp_mode (Comparator Mode; 50-mV Drive, TRISE = TFALL (Approx.)
TPD1 Response time; power = high – 150 – ns –
TPD2 Response time; power = medium – 400 – –
TPD3 Response time; power = low – 2000 – –
Vhyst_op Hysteresis – 10 – mV –
Deep-Sleep Mode (Deep-Sleep mode operation is only guaranteed for VDDA > 2.5 V)
GBW_DS Gain bandwidth product – 50 – kHz –
IDD_DS Current – 15 – µA –
Vos_DS Offset voltage – 5 – mV –
Vos_dr_DS Offset voltage drift – 20 – µV/°C –
Vout_DS Output voltage 0.2 – VDD –0.2 V –
Vcm_DS Common mode voltage 0.2 – VDD –1.8 –
Table 16. Opamp Specifications (continued)
Parameter Description Min Typ Max Unit Details/Conditions
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Temperature Sensor
SAR ADC
Table 17. Comparator DC Specifications
Parameter Description Min Typ Max Unit Details/Conditions
VOFFSET1 Input offset voltage, Factory trim – – ±10
mV
–
VOFFSET2 Input offset voltage, Custom trim – – ±6 –
VOFFSET3 Input offset voltage, ultra-low-power mode – ±12 – –
VHYST Hysteresis when enabled – 10 35 –
VICM1 Input common mode voltage in normal mode 0 – VDDD – 0.1
V
Modes 1 and 2
VICM2 Input common mode voltage in low-power
mode 0– V
DDD –
VICM3 Input common mode voltage in ultra
low-power mode 0–V
DDD – 1.15 –
CMRR Common mode rejection ratio 50 – – dB VDDD 2.7 V
CMRR Common mode rejection ratio 42 – – VDDD 2.7 V
ICMP1 Block current, normal mode – – 400
µA
–
ICMP2 Block current, low-power mode – – 100 –
ICMP3 Block current in ultra-low-power mode – 6 – –
ZCMP DC input impedance of comparator 35 – – M–
Table 18. Comparator AC Specifications
Parameter Description Min Typ Max Unit Details/Conditions
TRESP1 Response time, normal mode, 50-mV
overdrive –38–
ns
50-mV overdrive
TRESP2 Response time, low-power mode, 50-mV
overdrive –70– 50-mV overdrive
TRESP3 Response time, ultra-low-power mode,
50-mV overdrive – 2.3 – µs 200-mV overdrive
Table 19. Temperature Sensor Specifications
Parameter Description Min Typ Max Unit Details/Conditions
TSENSACC Temperature-sensor accuracy –5 ±1 5 °C –40 to +85 °C
Table 20. SAR ADC DC Specifications
Parameter Description Min Typ Max Unit Details/Conditions
A_RES Resolution – – 12 bits –
A_CHNIS_S Number of channels - single-ended – – 8 – 8 full-speed
A-CHNKS_D Number of channels - differential – – 4 – Diff inputs use
neighboring I/O
A-MONO Monotonicity – – – – Yes
A_GAINERR Gain error – – ±0.1 % With external
reference
A_OFFSET Input offset voltage – – 2 mV Measured with 1-V
VREF
A_ISAR Current consumption – – 1 mA –
A_VINS Input voltage range - single-ended VSS –V
DDA V–
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CSD
A_VIND Input voltage range - differential VSS – VDDA V–
A_INRES Input resistance – – 2.2 k–
A_INCAP Input capacitance – – 10 pF –
VREFSAR Trimmed internal reference to SAR –1 – 1 % Percentage of Vbg
(1.024 V)
Table 20. SAR ADC DC Specifications (continued)
Parameter Description Min Typ Max Unit Details/Conditions
Table 21. SAR ADC AC Specifications
Parameter Description Min Typ Max Unit Details/Conditions
A_PSRR Power-supply rejection ratio 70 – – dB
Measured at 1-V
reference
A_CMRR Common-mode rejection ratio 66 – – –
A_SAMP Sample rate – – 1 Msps –
Fsarintref SAR operating speed without external ref.
bypass – – 100 Ksps 12-bit resolution
A_SNR Signal-to-noise ratio (SNR) 65 – – dB FIN = 10 kHz
A_BW Input bandwidth without aliasing – – A_SAMP/2 kHz –
A_INL Integral nonlinearity. VDD = 1.71 V to 5.5 V,
1 Msps –1.7 – 2
LSB
VREF = 1 V to VDD
A_INL Integral nonlinearity. VDDD = 1.71 V to 3.6 V,
1 Msps –1.5 – 1.7 VREF = 1.71 V to VDD
A_INL Integral nonlinearity. VDD = 1.71 V to 5.5 V,
500 Ksps –1.5 – 1.7 VREF = 1 V to VDD
A_dnl Differential nonlinearity. VDD = 1.71 V to
5.5 V, 1 Msps –1 – 2.2 VREF = 1 V to VDD
A_DNL Differential nonlinearity. VDD = 1.71 V to
3.6 V, 1 Msps –1 – 2 VREF = 1.71 V to VDD
A_DNL Differential nonlinearity. VDD = 1.71 V to
5.5 V, 500 Ksps –1 – 2.2 VREF = 1 V to VDD
A_THD Total harmonic distortion – – –65 dB FIN = 10 kHz
Table 22. CSD Block Specifications
Parameter Description Min Typ Max Unit Details/Conditions
VCSD Voltage range of operation 1.71 – 5.5 V –
IDAC1 DNL for 8-bit resolution –1 – 1
LSB
–
IDAC1 INL for 8-bit resolution –3 – 3 –
IDAC2 DNL for 7-bit resolution –1 – 1 –
IDAC2 INL for 7-bit resolution –3 – 3 –
SNR Ratio of counts of finger to noise 5 – – Ratio
Capacitance range of
9 pF to 35 pF, 0.1-pF
sensitivity. Radio is not
operating during the
scan
IDAC1_CRT1 Output current of IDAC1 (8 bits) in High
range –612 – µA–
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Digital Peripherals
Timer
Counter
IDAC1_CRT2 Output current of IDAC1 (8 bits) in Low
range –306 –
µA
–
IDAC2_CRT1 Output current of IDAC2 (7 bits) in High
range –305 – –
IDAC2_CRT2 Output current of IDAC2 (7 bits) in Low
range –153 – –
Table 22. CSD Block Specifications (continued)
Parameter Description Min Typ Max Unit Details/Conditions
Table 23. Timer DC Specifications
Parameter Description Min Typ Max Unit Details/Conditions
ITIM1 Block current consumption at 3 MHz – – 42
µA 16-bit timerITIM2 Block current consumption at 12 MHz – – 130
ITIM3 Block current consumption at 48 MHz – – 535
Table 24. Timer AC Specifications
Parameter Description Min Typ Max Unit Details/Conditions
TTIMFREQ Operating frequency FCLK –48MHz
–
TCAPWINT Capture pulse width (internal) 2 × TCLK ––
ns
–
TCAPWEXT Capture pulse width (external) 2 × TCLK –– –
TTIMRES Timer resolution TCLK –– –
TTENWIDINT Enable pulse width (internal) 2 × TCLK –– –
TTENWIDEXT Enable pulse width (external) 2 × TCLK –– –
TTIMRESWINT Reset pulse width (internal) 2 × TCLK –– –
TTIMRESEXT Reset pulse width (external) 2 × TCLK –– –
Table 25. Counter DC Specifications
Parameter Description Min Typ Max Unit Details/Conditions
ICTR1 Block current consumption at 3 MHz – – 42
µA 16-bit counterICTR2 Block current consumption at 12 MHz – – 130
ICTR3 Block current consumption at 48 MHz – – 535
Table 26. Counter AC Specifications
Parameter Description Min Typ Max Unit Details/Conditions
TCTRFREQ Operating frequency FCLK –48MHz
–
TCTRPWINT Capture pulse width (internal) 2 × TCLK ––
ns
–
TCTRPWEXT Capture pulse width (external) 2 × TCLK –– –
TCTRES Counter Resolution TCLK –– –
TCENWIDINT Enable pulse width (internal) 2 × TCLK –– –
TCENWIDEXT Enable pulse width (external) 2 × TCLK –– –
TCTRRESWINT Reset pulse width (internal) 2 × TCLK –– –
TCTRRESWEXT Reset pulse width (external) 2 × TCLK –– –
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Pulse Width Modulation (PWM)
LCD Direct Drive
Table 27. PWM DC Specifications
Parameter Description Min Typ Max Unit Details/Conditions
IPWM1 Block current consumption at 3 MHz – – 42
µA 16-bit PWMIPWM2 Block current consumption at 12 MHz – – 130
IPWM3 Block current consumption at 48 MHz – – 535
Table 28. PWM AC Specifications
Parameter Description Min Typ Max Unit Details/Conditions
TPWMFREQ Operating frequency FCLK –48MHz
–
TPWMPWINT Pulse width (internal) 2 × TCLK ––
ns
–
TPWMEXT Pulse width (external) 2 × TCLK –– –
TPWMKILLINT Kill pulse width (internal) 2 × TCLK –– –
TPWMKILLEXT Kill pulse width (external) 2 × TCLK –– –
TPWMEINT Enable pulse width (internal) 2 × TCLK –– –
TPWMENEXT Enable pulse width (external) 2 × TCLK –– –
TPWMRESWINT Reset pulse width (internal) 2 × TCLK –– –
TPWMRESWEXT Reset pulse width (external) 2 × TCLK –– –
Table 29. LCD Direct Drive DC Specifications
Spec ID Parameter Description Min Typ Max Unit Details/Conditions
SID228 ILCDLOW Operating current in low-power mode – 17.5 – µA 16 × 4 small segment
display at 50 Hz
SID229 CLCDCAP LCD capacitance per segment/common
driver – 500 5000 pF –
SID230 LCDOFFSET Long-term segment offset – 20 – mV –
SID231 ILCDOP1 LCD system operating current
VBIAS = 5 V –2–
mA
32 × 4 segments.
50 Hz at 25 °C
SID232 ILCDOP2 LCD system operating current
VBIAS = 3.3 V –2– 32 × 4 segments
50 Hz at 25 °C
Table 30. LCD Direct Drive AC Specifications
Spec ID Parameter Description Min Typ Max Unit Details/Conditions
SID233 FLCD LCD frame rate 10 50 150 Hz –
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Serial Communication
Table 31. Fixed I2C DC Specifications
Table 33. Fixed UART DC Specifications
Table 34. Fixed UART AC Specifications
Parameter Description Min Typ Max Unit Details/Conditions
II2C1 Block current consumption at 100 kHz – – 50
µA
–
II2C2 Block current consumption at 400 kHz – – 155 –
II2C3 Block current consumption at 1 Mbps – – 390 –
II2C4 I2C enabled in Deep-Sleep mode – – 1.4 –
Table 32. Fixed I2C AC Specifications
Parameter Description Min Typ Max Unit Details/Conditions
FI2C1 Bit rate – – 400 kHz –
Parameter Description Min Typ Max Unit Details/Conditions
IUART1 Block current consumption at 100 kbps – – 55 µA –
IUART2 Block current consumption at 1000 kbps – – 312 –
Parameter Description Min Typ Max Unit Details/Conditions
FUART Bit rate – – 1 Mbps –
Table 35. Fixed SPI DC Specifications
Parameter Description Min Typ Max Unit Details/Conditions
ISPI1 Block current consumption at 1 Mbps – – 360
µA
–
ISPI2 Block current consumption at 4 Mbps – – 560 –
ISPI3 Block current consumption at 8 Mbps – – 600 –
Table 36. Fixed SPI AC Specifications
Parameter Description Min Typ Max Unit Details/Conditions
FSPI SPI operating frequency (master; 6x over sampling) – – 8 MHz –
Table 37. Fixed SPI Master Mode AC Specifications
Parameter Description Min Typ Max Unit Details/Conditions
TDMO MOSI valid after SCLK driving edge – – 18
ns
–
TDSI MISO valid before SCLK capturing edge
Full clock, late MISO sampling used 20 – – Full clock, late MISO sampling
THMO Previous MOSI data hold time 0 – – Referred to Slave capturing edge
Table 38. Fixed SPI Slave Mode AC Specifications
Parameter Description Min Typ Max Unit
TDMI MOSI valid before SCLK capturing edge 40 – –
ns
TDSO MISO valid after SCLK driving edge – – 42 + 3 × TCPU
TDSO_ext MISO Valid after SCLK driving edge in
external clock mode. VDD < 3.0 V –– 50
THSO Previous MISO data hold time 0 – –
TSSELSCK SSEL valid to first SCK valid edge 100 – –
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Memory
System Resources
Power-on-Reset (POR)
Note
6. It can take as much as 20 ms to write to flash. During this time, the device should not be reset, or flash operations will be interrupted and cannot be relied on to have
completed. Reset sources include the XRES pin, software resets, CPU lockup states and privilege violations, improper power supply levels, and watchdogs. Make
certain that these are not inadvertently activated.
Table 39. Flash DC Specifications
Parameter Description Min Typ Max Unit Details/Conditions
VPE Erase and program voltage 1.71 – 5.5 V –
TWS48 Number of Wait states at 32–48 MHz 2 – – –
CPU execution from flashTWS32 Number of Wait states at 16–32 MHz 1 – – –
TWS16 Number of Wait states for 0–16 MHz 0 – – –
Table 40. Flash AC Specifications
Parameter Description Min Typ Max Unit Details/Conditions
TROWWRITE[6] Row (block) write time (erase and program) – – 20
ms
Row (block) = 256 bytes
TROWERASE[6] Row erase time – – 13 –
TROWPROGRAM[6] Row program time after erase – – 7 –
TBULKERASE[6] Bulk erase time (256 KB) – – 35 –
TDEVPROG[6] Total device program time – – 25 seconds –
FEND Flash endurance 100 K – – cycles –
FRET Flash retention. TA 55 °C, 100 K P/E cycles. 20 – – years –
FRET2 Flash retention. TA 85 °C, 10 K P/E cycles. 10 – – –
Table 41. POR DC Specifications
Parameter Description Min Typ Max Unit Details/Conditions
VRISEIPOR Rising trip voltage 0.80 – 1.45 V–
VFALLIPOR Falling trip voltage 0.75 – 1.40 –
VIPORHYST Hysteresis 15 – 200 mV –
Table 42. POR AC Specifications
Parameter Description Min Typ Max Unit Details/Conditions
TPPOR_TR Precision power-on reset (PPOR) response
time in Active and Sleep modes ––1µs–
Table 43. Brown-Out Detect
Parameter Description Min Typ Max Unit Details/Conditions
VFALLPPOR BOD trip voltage in Active and Sleep modes 1.64 – – V–
VFALLDPSLP BOD trip voltage in Deep Sleep 1.4 – – –
Table 44. Hibernate Reset
Parameter Description Min Typ Max Unit Details/Conditions
VHBRTRIP BOD trip voltage in Hibernate 1.1 – – V –
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Voltage Monitors (LVD)
SWD Interface
Table 45. Voltage Monitor DC Specifications
Parameter Description Min Typ Max Unit Details/Conditions
VLVI1 LVI_A/D_SEL[3:0] = 0000b 1.71 1.75 1.79
V
–
VLVI2 LVI_A/D_SEL[3:0] = 0001b 1.76 1.80 1.85 –
VLVI3 LVI_A/D_SEL[3:0] = 0010b 1.85 1.90 1.95 –
VLVI4 LVI_A/D_SEL[3:0] = 0011b 1.95 2.00 2.05 –
VLVI5 LVI_A/D_SEL[3:0] = 0100b 2.05 2.10 2.15 –
VLVI6 LVI_A/D_SEL[3:0] = 0101b 2.15 2.20 2.26 –
VLVI7 LVI_A/D_SEL[3:0] = 0110b 2.24 2.30 2.36 –
VLVI8 LVI_A/D_SEL[3:0] = 0111b 2.34 2.40 2.46 –
VLVI9 LVI_A/D_SEL[3:0] = 1000b 2.44 2.50 2.56 –
VLVI10 LVI_A/D_SEL[3:0] = 1001b 2.54 2.60 2.67 –
VLVI11 LVI_A/D_SEL[3:0] = 1010b 2.63 2.70 2.77 –
VLVI12 LVI_A/D_SEL[3:0] = 1011b 2.73 2.80 2.87 –
VLVI13 LVI_A/D_SEL[3:0] = 1100b 2.83 2.90 2.97 –
VLVI14 LVI_A/D_SEL[3:0] = 1101b 2.93 3.00 3.08 –
VLVI15 LVI_A/D_SEL[3:0] = 1110b 3.12 3.20 3.28 –
VLVI16 LVI_A/D_SEL[3:0] = 1111b 4.39 4.50 4.61 –
LVI_IDD Block current – – 100 µA –
Table 46. Voltage Monitor AC Specifications
Parameter Description Min Typ Max Unit Details/Conditions
TMONTRIP Voltage monitor trip time – – 1 µs –
Table 47. SWD Interface Specifications
Parameter Description Min Typ Max Unit Details/Conditions
F_SWDCLK1 3.3 V VDD 5.5 V – – 14 MHz SWDCLK 1/3 CPU clock frequency
F_SWDCLK2 1.71 V VDD 3.3 V – – 7 SWDCLK 1/3 CPU clock frequency
T_SWDI_SETUP T = 1/f SWDCLK 0.25 × T – –
ns
–
T_SWDI_HOLD T = 1/f SWDCLK 0.25 × T – – –
T_SWDO_VALID T = 1/f SWDCLK – – 0.5 × T –
T_SWDO_HOLD T = 1/f SWDCLK 1 – – –
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Internal Main Oscillator
Internal Low-Speed Oscillator
Table 52. Recommended ECO Trim Value
Table 48. IMO DC Specifications
Parameter Description Min Typ Max Unit Details/Conditions
IIMO1 IMO operating current at 48 MHz – – 1000
µA
–
IIMO2 IMO operating current at 24 MHz – – 325 –
IIMO3 IMO operating current at 12 MHz – – 225 –
IIMO4 IMO operating current at 6 MHz – – 180 –
IIMO5 IMO operating current at 3 MHz – – 150 –
Table 49. IMO AC Specifications
Parameter Description Min Typ Max Unit Details/Conditions
FIMOTOL3 Frequency variation from 3 to 48 MHz – – ±2 % With API-called calibration
FIMOTOL3 IMO startup time – 12 – µs –
Table 50. ILO DC Specifications
Parameter Description Min Typ Max Unit Details/Conditions
IILO2 ILO operating current at 32 kHz – 0.3 1.05 µA –
Table 51. ILO AC Specifications
Parameter Description Min Typ Max Unit Details/Conditions
TSTARTILO1 ILO startup time – – 2 ms –
FILOTRIM1 32-kHz trimmed frequency 15 32 50 kHz –
Parameter Description Value Details/Conditions
ECOTRIM 24-MHz trim value
(firmware configuration) 0x00009595 Recommended trim value that needs to be loaded to register
CY_SYS_XTAL_BLERD_BB_XO_CAPTRIM_REG
Table 53. UDB AC Specifications
Parameter Description Min Typ Max Unit Details/Conditions
Data Path performance
FMAX-TIMER Max frequency of 16-bit timer in a UDB
pair ––48
MHz
–
FMAX-ADDER Max frequency of 16-bit adder in a UDB
pair ––48 –
FMAX_CRC Max frequency of 16-bit CRC/PRS in a
UDB pair ––48 –
PLD Performance in UDB
FMAX_PLD Max frequency of 2-pass PLD function
in a UDB pair ––48MHz
–
Clock to Output Performance
TCLK_OUT_UDB1 Prop. delay for clock in to data out at
25 °C, Typical –15 –
ns
–
TCLK_OUT_UDB2 Prop. delay for clock in to data out,
Worst case –25 – –
CYBLE-214009-00
Document Number: 002-09714 Rev. *H Page 28 of 42
Table 54. BLE Subsystem
Parameter Description Min Typ Max Unit Details/Conditions
RF Receiver Specification
RXS, IDLE RX sensitivity with idle transmitter – –89 –
dBm
–
RX sensitivity with idle transmitter
excluding Balun loss – –91 – Guaranteed by design
simulation
RXS, DIRTY RX sensitivity with dirty transmitter – –87 –70 RF-PHY Specification
(RCV-LE/CA/01/C)
RXS, HIGHGAIN RX sensitivity in high-gain mode with idle
transmitter – –91 – –
PRXMAX Maximum input power –10 –1 – RF-PHY Specification
(RCV-LE/CA/06/C)
CI1
Cochannel interference,
Wanted signal at –67 dBm and Interferer
at FRX
–921
dB
RF-PHY Specification
(RCV-LE/CA/03/C)
CI2
Adjacent channel interference
Wanted signal at –67 dBm and Interferer
at FRX ±1 MHz
–315 RF-PHY Specification
(RCV-LE/CA/03/C)
CI3
Adjacent channel interference
Wanted signal at –67 dBm and Interferer
at FRX ±2 MHz
– –29 – RF-PHY Specification
(RCV-LE/CA/03/C)
CI4
Adjacent channel interference
Wanted signal at –67 dBm and Interferer
at FRX ±3 MHz
– –39 – RF-PHY Specification
(RCV-LE/CA/03/C)
CI5
Adjacent channel interference
Wanted Signal at –67 dBm and Interferer
at Image frequency (FIMAGE)
– –20 – RF-PHY Specification
(RCV-LE/CA/03/C)
CI3
Adjacent channel interference
Wanted signal at –67 dBm and Interferer
at Image frequency (FIMAGE ± 1 MHz)
– –30 – RF-PHY Specification
(RCV-LE/CA/03/C)
OBB1
Out-of-band blocking,
Wanted signal at –67 dBm and Interferer
at F = 30–2000 MHz
–30 –27 –
dBm
RF-PHY Specification
(RCV-LE/CA/04/C)
OBB2
Out-of-band blocking,
Wanted signal at –67 dBm and Interferer
at F = 2003–2399 MHz
–35 –27 – RF-PHY Specification
(RCV-LE/CA/04/C)
OBB3
Out-of-band blocking,
Wanted signal at –67 dBm and Interferer
at F = 2484–2997 MHz
–35 –27 – RF-PHY Specification
(RCV-LE/CA/04/C)
OBB4
Out-of-band blocking,
Wanted signal a –67 dBm and Interferer
at F = 3000–12750 MHz
–30 –27 – RF-PHY Specification
(RCV-LE/CA/04/C)
IMD
Intermodulation performance
Wanted signal at –64 dBm and 1-Mbps
BLE, third, fourth, and fifth offset channel
–50 – – RF-PHY Specification
(RCV-LE/CA/05/C)
RXSE1 Receiver spurious emission
30 MHz to 1.0 GHz –––57
100-kHz measurement
bandwidth
ETSI EN300 328 V1.8.1
RXSE2 Receiver spurious emission
1.0 GHz to 12.75 GHz –––47
1-MHz measurement
bandwidth
ETSI EN300 328 V1.8.1
CYBLE-214009-00
Document Number: 002-09714 Rev. *H Page 29 of 42
RF Transmitter Specifications
TXP, ACC RF power accuracy – ±1 – dB –
TXP, RANGE RF power control range – 20 – –
TXP, 0dBm Output power, 0-dB Gain setting (PA7) – 0 –
dBm
–
TXP, MAX Output power, maximum power setting
(PA10) –3 – –
TXP, MIN Output power, minimum power setting
(PA1) – –18 – –
F2AVG Average frequency deviation for
10101010 pattern 185 – –
kHz
RF-PHY Specification
(TRM-LE/CA/05/C)
F1AVG Average frequency deviation for
11110000 pattern 225 250 275 RF-PHY Specification
(TRM-LE/CA/05/C)
EO Eye opening = F2AVG/F1AVG 0.8 – – RF-PHY Specification
(TRM-LE/CA/05/C)
FTX, ACC Frequency accuracy –150 – 150
kHz
RF-PHY Specification
(TRM-LE/CA/06/C)
FTX, MAXDR Maximum frequency drift –50 – 50 RF-PHY Specification
(TRM-LE/CA/06/C)
FTX, INITDR Initial frequency drift –20 – 20 RF-PHY Specification
(TRM-LE/CA/06/C)
FTX, DR Maximum drift rate –20 – 20 kHz/
50 µs
RF-PHY Specification
(TRM-LE/CA/06/C)
IBSE1 In-band spurious emission at 2-MHz
offset –––20
dBm
RF-PHY Specification
(TRM-LE/CA/03/C)
IBSE2 In-band spurious emission at 3-MHz
offset –––30 RF-PHY Specification
(TRM-LE/CA/03/C)
TXSE1 Transmitter spurious emissions
(average), <1.0 GHz – – –55.5 FCC-15.247
TXSE2 Transmitter spurious emissions
(average), >1.0 GHz – – –41.5 FCC-15.247
RF Current Specifications
IRX Receive current in normal mode – 18.7 –
mA
–
IRX_RF Radio receive current in normal mode – 16.4 – Measured at VDDR
IRX, HIGHGAIN Receive current in high-gain mode – 21.5 – –
ITX, 3dBm TX current at 3-dBm setting (PA10) – 20 – –
ITX, 0dBm TX current at 0-dBm setting (PA7) – 16.5 – –
ITX_RF, 0dBm Radio TX current at 0 dBm setting (PA7) – 15.6 – Measured at VDDR
ITX_RF, 0dBm Radio TX current at 0 dBm excluding
Balun loss – 14.2 – Guaranteed by design
simulation
ITX,-3dBm TX current at –3-dBm setting (PA4) – 15.5 – –
ITX,-6dBm TX current at –6-dBm setting (PA3) – 14.5 – –
ITX,-12dBm TX current at –12-dBm setting (PA2) – 13.2 – –
ITX,-18dBm TX current at –18-dBm setting (PA1) – 12.5 – –
Table 54. BLE Subsystem (continued)
Parameter Description Min Typ Max Unit Details/Conditions
CYBLE-214009-00
Document Number: 002-09714 Rev. *H Page 30 of 42
Iavg_1sec, 0dBm Average current at 1-second BLE
connection interval – 17.1 –
µA
TXP: 0 dBm; ±20-ppm
master and slave clock
accuracy.
For empty PDU
exchange.
Iavg_4sec, 0dBm Average current at 4-second BLE
connection interval –6.1 –
TXP: 0 dBm; ±20-ppm
master and slave clock
accuracy.
For empty PDU
exchange.
General RF Specifications
FREQ RF operating frequency 2400 – 2482 MHz –
CHBW Channel spacing – 2 – –
DR On-air data rate – 1000 – kbps –
IDLE2TX BLE.IDLE to BLE. TX transition time – 120 140 µs –
IDLE2RX BLE.IDLE to BLE. RX transition time – 75 120 –
RSSI Specifications
RSSI, ACC RSSI accuracy – ±5 – dB –
RSSI, RES RSSI resolution – 1 – –
RSSI, PER RSSI sample period – 6 – µs –
Table 54. BLE Subsystem (continued)
Parameter Description Min Typ Max Unit Details/Conditions
CYBLE-214009-00
Document Number: 002-09714 Rev. *H Page 31 of 42
Environmental Specifications
Environmental Compliance
This Cypress BLE module is built in compliance with the Restriction of Hazardous Substances (RoHS) and Halogen Free (HF)
directives. The Cypress module and components used to produce this module are RoHS and HF compliant.
RF Certification
The CYBLE-214009-00 module is certified under the following RF certification standards:
■FCC ID: WAP4008
■CE
■IC: 7922A-4008
■MIC: 203-JN0505
■KC: MSIP-CRM-Cyp-4008
Environmental Conditions
Table 55 describes the operating and storage conditions for the Cypress BLE module.
Table 55. Environmental Conditions for CYBLE-214009-00
ESD and EMI Protection
Exposed components require special attention to ESD and electromagnetic interference (EMI).
A grounded conductive layer inside the device enclosure is suggested for EMI and ESD performance. Any openings in the enclosure
near the module should be surrounded by a grounded conductive layer to provide ESD protection and a low-impedance path to ground.
Device Handling: Proper ESD protocol must be followed in manufacturing to ensure component reliability.
Description Minimum Specification Maximum Specification
Operating temperature –40 °C 85 °C
Operating humidity (relative, non-condensation) 5% 85%
Thermal ramp rate – 3 °C/minute
Storage temperature –40 °C 85 °C
Storage temperature and humidity – 85 ° C at 85%
ESD: Module integrated into system
Components[7] –15-kV Air
2.2-kV Contact
Note
7. This does not apply to the RF pins (ANT, XTALI, and XTALO). RF pins (ANT, XTALI, and XTALO) are tested for 500-V HBM.
CYBLE-214009-00
Document Number: 002-09714 Rev. *H Page 32 of 42
Regulatory Information
FCC
FCC NOTICE:
The device CYBLE-214009-00 complies with Part 15 of the FCC Rules. The device meets the requirements for modular transmitter
approval as detailed in FCC public Notice DA00-1407. Transmitter Operation is subject to the following two conditions: (1) This device
may not cause harmful interference, and (2) This device must accept any interference received, including interference that may cause
undesired operation.
CAUTION:
The FCC requires the user to be notified that any changes or modifications made to this device that are not expressly approved by
Cypress Semiconductor may void the user's authority to operate the equipment.
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules.
These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment
generates and can radiate radio frequency energy and, if not installed and used in accordance with the instructions,ê may cause
harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.
If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment
off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
■Reorient or relocate the receiving antenna.
■Increase the separation between the equipment and receiver.
■Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
■Consult the dealer or an experienced radio/TV technician for help
LABELING REQUIREMENTS:
The Original Equipment Manufacturer (OEM) must ensure that FCC labelling requirements are met. This includes a clearly visible
label on the outside of the OEM enclosure specifying the appropriate Cypress Semiconductor FCC identifier for this product as well
as the FCC Notice above. The FCC identifier is FCC ID: WAP4008.
In any case the end product must be labeled exterior with "Contains FCC ID: WAP4008"
ANTENNA WARNING:
This device is tested with a standard SMA connector and with the antennas listed in Table 7 on page 14. When integrated in the OEMs
product, these fixed antennas require installation preventing end-users from replacing them with non-approved antennas. Any antenna
not in the following table must be tested to comply with FCC Section 15.203 for unique antenna connectors and Section 15.247 for
emissions.
RF EXPOSURE:
To comply with FCC RF Exposure requirements, the Original Equipment Manufacturer (OEM) must ensure to install the approved
antenna in the previous.
The preceding statement must be included as a CAUTION statement in manuals, for products operating with the approved antennas
in Table 7 on page 14, to alert users on FCC RF Exposure compliance. Any notification to the end user of installation or removal
instructions about the integrated radio module is not allowed.
The radiated output power of CYBLE-214009-00 is far below the FCC radio frequency exposure limits. Nevertheless, use
CYBLE-214009-00 in such a manner that minimizes the potential for human contact during normal operation.
End users may not be provided with the module installation instructions. OEM integrators and end users must be provided with
transmitter operating conditions for satisfying RF exposure compliance.
CYBLE-214009-00
Document Number: 002-09714 Rev. *H Page 33 of 42
ISED
Innovation, Science and Economic Development Canada (ISED) Certification
CYBLE-214009-00 is licensed to meet the regulatory requirements of Innovation, Science and Economic Development Canada
(ISED).
License: IC: 7922A-4008
Manufacturers of mobile, fixed or portable devices incorporating this module are advised to clarify any regulatory questions and ensure
compliance for SAR and/or RF exposure limits. Users can obtain Canadian information on RF exposure and compliance from
www.ic.gc.ca.
This device has been designed to operate with the antennas listed in Table 7 on page 14, having a maximum gain of 0.5 dBi. Antennas
not included in this list or having a gain greater than 0.5 dBi are strictly prohibited for use with this device. The required antenna
impedance is 50 ohms. The antenna used for this transmitter must not be co-located or operating in conjunction with any other antenna
or transmitter.
ISED NOTICE:
The device CYBLE-214009-00 complies with Canada RSS-GEN Rules. The device meets the requirements for modular transmitter
approval as detailed in RSS-GEN. Operation is subject to the following two conditions: (1) This device may not cause harmful
interference, and (2) This device must accept any interference received, including interference that may cause undesired operation.
ISED RADIATION EXPOSURE STATEMENT FOR CANADA
This device complies with Innovation, Science and Economic Development (ISED) Canada licence-exempt RSS standard(s).
Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any
interference, including interference that may cause undesired operation of the device.
Cet appareil est conforme à la norme sur l'innovation, la science et le développement économique (ISED) norme RSS exempte de
licence. L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur
de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le
fonctionnement.
LABELING REQUIREMENTS:
The Original Equipment Manufacturer (OEM) must ensure that ISED labelling requirements are met. This includes a clearly visible
label on the outside of the OEM enclosure specifying the appropriate Cypress Semiconductor IC identifier for this product as well as
the ISED Notice above. The IC identifier is 7922A-4008. In any case, the end product must be labeled in its exterior with “Contains
IC: 7922A-4008”.
European R&TTE Declaration of Conformity
Hereby, Cypress Semiconductor declares that the Bluetooth module CYBLE-214009-00 complies with the essential requirements and
other relevant provisions of Directive 1999/5/EC. As a result of the conformity assessment procedure described in Annex III of the
Directive 1999/5/EC, the end-customer equipment should be labeled as follows:
All versions of the CYBLE-214009-00 in the specified reference design can be used in the following countries: Austria, Belgium,
Cyprus, Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Ireland, Italy, Latvia, Lithuania, Luxem-
bourg, Malta, Poland, Portugal, Slovakia, Slovenia, Spain, Sweden, The Netherlands, the United Kingdom, Switzerland, and Norway.
CYBLE-214009-00
Document Number: 002-09714 Rev. *H Page 34 of 42
MIC Japan
CYBLE-214009-00 is certified as a module with type certification number 203-JN0505. End products that integrate CYBLE-214009-00
do not need additional MIC Japan certification for the end product.
End product can display the certification label of the embedded module.
KC Korea
CYBLE-214009-00 is certified for use in Korea with certificate number MSIP-CRM-Cyp-4008.
CYBLE-214009-00
Document Number: 002-09714 Rev. *H Page 35 of 42
Packaging
The CYBLE-214009-00 is offered in tape and reel packaging. Figure 10 details the tape dimensions used for the CYBLE-214009-00.
Figure 10. CYBLE-214009-00 Tape Dimensions
Figure 11 details the orientation of the CYBLE-214009-00 in the tape as well as the direction for unreeling.
Figure 11. Component Orientation in Tape and Unreeling Direction
Table 56. Solder Reflow Peak Temperature
Module Part Number Package Maximum Peak Temperature Maximum Time at PeakTemperature No. of Cycles
CYBLE-214009-00 32-pad SMT 260 °C 30 seconds 2
Table 57. Package Moisture Sensitivity Level (MSL), IPC/JEDEC J-STD-2
Module Part Number Package MSL
CYBLE-214009-00 32-pad SMT MSL 3
CYBLE-214009-00
Document Number: 002-09714 Rev. *H Page 36 of 42
Figure 12 details reel dimensions used for the CYBLE-214009-00.
Figure 12. Reel Dimensions
The CYBLE-214009-00 is designed to be used with pick-and-place equipment in an SMT manufacturing environment. The
center-of-mass for the CYBLE-214009-00 is detailed in Figure 13.
Figure 13. CYBLE-214009-00 Center of Mass
CYBLE-214009-00
Document Number: 002-09714 Rev. *H Page 37 of 42
Ordering Information
Table 58 lists the CYBLE-214009-00 part number and features. Table 59 lists the reel shipment quantities for the CYBLE-214009-00.
Table 59. Tape and Reel Package Quantity and Minimum Order Amount
The CYBLE-214009-00 is offered in tape and reel packaging. The CYBLE-214009-00 ships with a maximum of 500 units/reel.
Part Numbering Convention
The part numbers are of the form CYBLE-FATT##-SB where the fields are defined as follows.
For additional information and a complete list of Cypress Semiconductor BLE products, contact your local Cypress sales
representative. To locate the nearest Cypress office, visit our website.
Table 58. Ordering Information
MPN
Features
Package
Max CPU Speed (MHz)
Flash (KB)
SRAM (KB)
UDB
Opamp (CTBm)
CapSense
Direct LCD Drive
12-bit SAR ADC
LP Comparators
TCPWM Blocks
SCB Blocks
PWMs (using UDBs)
I2S (using UDB)
GPIO
CYBLE-214009-00 48 256 32 4 4 ✓ ✓ 1 Msps 1 4 2 4 ✓25 32-SMT
Description Minimum Reel Quantity Maximum Reel Quantity Comments
Reel Quantity 500 500 Ships in 500 unit reel quantities.
Minimum Order Quantity (MOQ) 500 –
Order Increment (OI) 500 –
U.S. Cypress Headquarters Address 198 Champion Court, San Jose, CA 95134
U.S. Cypress Headquarter Contact Info (408) 943-2600
Cypress website address http://www.cypress.com
CYBLE-214009-00
Document Number: 002-09714 Rev. *H Page 38 of 42
Acronyms
Table 60. Acronyms Used in this Document
Acronym Description
ABUS analog local bus
ADC analog-to-digital converter
AG analog global
AHB
AMBA (advanced microcontroller bus
architecture) high-performance bus, an ARM
data transfer bus
ALU arithmetic logic unit
AMUXBUS analog multiplexer bus
API application programming interface
APSR application program status register
ARM®advanced RISC machine, a CPU architecture
ATM automatic thump mode
BLE Bluetooth Low Energy
Bluetooth
SIG Bluetooth Special Interest Group
BW bandwidth
CAN Controller Area Network, a communications
protocol
CE European Conformity
CSA Canadian Standards Association
CMRR common-mode rejection ratio
CPU central processing unit
CRC cyclic redundancy check, an error-checking
protocol
DAC digital-to-analog converter, see also IDAC, VDAC
DFB digital filter block
DIO digital input/output, GPIO with only digital
capabilities, no analog. See GPIO.
DMIPS Dhrystone million instructions per second
DMA direct memory access, see also TD
DNL differential nonlinearity, see also INL
DNU do not use
DR port write data registers
DSI digital system interconnect
DWT data watchpoint and trace
ECC error correcting code
ECO external crystal oscillator
EEPROM electrically erasable programmable read-only
memory
EMI electromagnetic interference
EMIF external memory interface
EOC end of conversion
EOF end of frame
EPSR execution program status register
ESD electrostatic discharge
ETM embedded trace macrocell
FCC Federal Communications Commission
FET field-effect transistor
FIR finite impulse response, see also IIR
FPB flash patch and breakpoint
FS full-speed
GPIO general-purpose input/output, applies to a PSoC
pin
HCI host controller interface
HVI high-voltage interrupt, see also LVI, LVD
IC integrated circuit
IDAC current DAC, see also DAC, VDAC
IDE integrated development environment
I2C, or IIC Inter-Integrated Circuit, a communications
protocol
IC Industry Canada
IIR infinite impulse response, see also FIR
ILO internal low-speed oscillator, see also IMO
IMO internal main oscillator, see also ILO
INL integral nonlinearity, see also DNL
I/O input/output, see also GPIO, DIO, SIO, USBIO
IPOR initial power-on reset
IPSR interrupt program status register
IRQ interrupt request
ITM instrumentation trace macrocell
KC Korea Certification
LCD liquid crystal display
LIN Local Interconnect Network, a communications
protocol.
LR link register
LUT lookup table
LVD low-voltage detect, see also LVI
LVI low-voltage interrupt, see also HVI
LVTTL low-voltage transistor-transistor logic
Table 60. Acronyms Used in this Document (continued)
Acronym Description
CYBLE-214009-00
Document Number: 002-09714 Rev. *H Page 39 of 42
MAC multiply-accumulate
MCU microcontroller unit
MIC Ministry of Internal Affairs and Communications
(Japan)
MISO master-in slave-out
NC no connect
NMI nonmaskable interrupt
NRZ non-return-to-zero
NVIC nested vectored interrupt controller
NVL nonvolatile latch, see also WOL
Opamp operational amplifier
PAL programmable array logic, see also PLD
PC program counter
PCB printed circuit board
PGA programmable gain amplifier
PHUB peripheral hub
PHY physical layer
PICU port interrupt control unit
PLA programmable logic array
PLD programmable logic device, see also PAL
PLL phase-locked loop
PMDD package material declaration data sheet
POR power-on reset
PRES precise power-on reset
PRS pseudo random sequence
PS port read data register
PSoC®Programmable System-on-Chip™
PSRR power supply rejection ratio
PWM pulse-width modulator
QDID qualification design ID
RAM random-access memory
RISC reduced-instruction-set computing
RMS root-mean-square
RTC real-time clock
RTL register transfer language
RTR remote transmission request
RX receive
SAR successive approximation register
SC/CT switched capacitor/continuous time
SCL I2C serial clock
Table 60. Acronyms Used in this Document (continued)
Acronym Description
SDA I2C serial data
S/H sample and hold
SINAD signal to noise and distortion ratio
SIO special input/output, GPIO with advanced
features. See GPIO.
SMT
surface-mount technology; a method for
producing electronic circuitry in which the
components are placed directly onto the surface
of PCBs
SOC start of conversion
SOF start of frame
SPI Serial Peripheral Interface, a communications
protocol
SR slew rate
SRAM static random access memory
SRES software reset
STN super twisted nematic
SWD serial wire debug, a test protocol
SWV single-wire viewer
TD transaction descriptor, see also DMA
THD total harmonic distortion
TIA transimpedance amplifier
TN twisted nematic
TRM technical reference manual
TTL transistor-transistor logic
TUV Germany: Technischer Überwachungs-Verein
(Technical Inspection Association)
TX transmit
UART Universal Asynchronous Transmitter Receiver, a
communications protocol
UDB universal digital block
USB Universal Serial Bus
USBIO USB input/output, PSoC pins used to connect to
a USB port
VDAC voltage DAC, see also DAC, IDAC
WDT watchdog timer
WOL write once latch, see also NVL
WRES watchdog timer reset
XRES external reset I/O pin
XTAL crystal
Table 60. Acronyms Used in this Document (continued)
Acronym Description
CYBLE-214009-00
Document Number: 002-09714 Rev. *H Page 40 of 42
Document Conventions
Units of Measure
Table 61. Units of Measure
Symbol Unit of Measure
°C degrees Celsius
dB decibel
dBm decibel-milliwatts
fF femtofarads
Hz hertz
KB 1024 bytes
kbps kilobits per second
Khr kilohour
kHz kilohertz
kkilo ohm
ksps kilosamples per second
LSB least significant bit
Mbps megabits per second
MHz megahertz
Mmega-ohm
Msps megasamples per second
µA microampere
µF microfarad
µH microhenry
µs microsecond
µV microvolt
µW microwatt
mA milliampere
ms millisecond
mV millivolt
nA nanoampere
ns nanosecond
nV nanovolt
ohm
pF picofarad
ppm parts per million
ps picosecond
s second
sps samples per second
sqrtHz square root of hertz
Vvolt
CYBLE-214009-00
Document Number: 002-09714 Rev. *H Page 41 of 42
Document History Page
Document Title: CYBLE-214009-00 EZ-BLE™ Creator Module
Document Number: 002-09714
Revision ECN Orig. of
Change
Submission
Date Description of Change
** 5086199 DSO 01/14/2016 Preliminary datasheet for CYBLE-214009-00 module.
*A 5146846 DSO 02/22/2016
Removed “Preliminary” document status.
Updated More Information section to add KBA210574 (Certification Test Reports)
to reference list.
Updated General Description to include reference and link for QDID and
Declaration ID.
Updated orientation of module drawings in Figure 1 through Figure 9 and
Figure 13 to match orientation in PSoC Creator.
Updated Table 4 to add additional information with respect to the digital
functionality for each solder pad.
*B 5152410 DSO 02/26/2016 Updated Up to 25 Programmable GPIOs.
*C 5424511 DSO 09/02/2016
Updated General Description:
Updated Power Consumption:
Replaced “Stop: 60 nA with XRES wakeup” with “Stop: 60 nA with GPIO (P2.2)
or XRES wakeup” under “Low power mode support”.
Updated More Information:
Added additional Knowledge Base Article references.
Updated Electrical Specification:
Updated System Resources:
Updated Internal Low-Speed Oscillator:
Updated Table 52 (Updated details in “Value” column corresponding to
ECOTRIM parameter).
Updated Ordering Information:
No change in part numbers.
Add Table 59 (To specify minimum and maximum reel quantities that ship for
orders of the CYBLE-214009-00 module).
Updated to new template.
*D 5529621 DSO 11/22/2016
Updated More Information:
Added EZ-Serial™ BLE Firmware Platform section.
Updated Overview:
Updated Figure 1 to specify that Bottom View is “Seen from Bottom”.
Updated Recommended Host PCB Layout:
Updated Figure 4, Figure 5, and Figure 6 captions to specify that these as “Seen
on Host PCB”.
Updated Power Supply Connections and Recommended External Components:
Updated Figure 7 and Figure 8 to specify that these are “Seen from Bottom”.
Updated Digital and Analog Capabilities and Connections:
Updated Table 4:
Updated TCPWM column to add TCPWM capability on Port 2 pins.
Added Footnote 3.
Updated Document History Page:
Remove “,” from Document Title.
*E 5553544 DSO 12/14/2016
Updated Table 5:
Port 2.x OPAMP definitions changed to CTBm0 instead of CTBm1.
Updated Power Supply Connections and Recommended External Components:
Updated typo to state that the use of one to three ferrite beads will depend on the
application configuration.
*F 5731446 DSO 05/09/2017 Updated the Cypress logo.
*G 6002363 DSO 12/22/2017 Updated reel dimensions in Figure 10 and Figure 12.
*H 6086513 DSO 03/07/2018
Updated document title: Updated “PSoC®” reference to “Creator”.
Updated Module Description, More Information, Environmental Specifications,
and Regulatory Information.
CYBLE-214009-00
Document Number: 002-09714 Rev. *H Revised March 7, 2018 Page 42 of 42
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