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DATA BRIEF
October 20 04
STV0976
1.0 Megapixel SMIA Processor
Rev. 1
FEATURES
■Supports the VS6650 1.0 Megapixel (1152H x
864V) and the VS 659 0 SVGA (8 00H x 600V)
camera modules
■SMIA1 class 0 (208 Mbit/s) sensor interface
■Up to 30 frame per second (fps) operation at
SVGA or 15 fps at 1.0 Megapixel
■Dedicated digital image processing functions
including defect correction, noise filtering, lens
shading correction, demosaicing, sharpening,
gamma correction and color space conversion
■Embedded camera controller for automatic
exposure control, automatic white balance,
black level compensation, 50/60 Hz flicker
detection and elimination
■Fine image downscaler, 13 steps of 0.5 from 1x
to 7x, 5 steps of 1.0 from 7x to 12x, maximum
CIF output image size
■ITU-R BT.656-4 YUV (YCbCr) 4:2:2, RGB 565,
RGB 444 or JPEG output formats with
embedded syncs
■JPEG compression with programmable target
file size
■SMIA Class 0 (208 Mbit/s) host interface
■8-bit parallel video interface with separate
horizontal and vertical syncs, 24 MHz clock
■Two-wire control interface (CCI)
■Single 1.8 V power supply
■15 µW standby power consumption
■TFBGA 56, 6mm x 6mm AFOP leadfree
package
■Pin compatible with the STV0974 processor
DESCRIPTION
The STV0976 is a low power digital image proces-
sor supporting the VS6650 1.0 Megapixel SMIA
camera module at up to 15 fps, or the VS6590
SVGA camera module at up to 30 fps.
The STV0976 performs all the necessary opera-
tions required to capture state-of-the-art megapix-
el images, including JPEG compression and
viewfinder generation, in a small footprint and low
power budget. With both video input and output
being SMIA-class 0, hardware acceleration in
SMIA architecture achieves leading edge-mobile-
imaging capabilities.
APPLICATIONS
■Mobile pho ne
■PDA
■Wireless security camera
PART NUMBERING
1.Standard Mobile Imag ing Architecture
visit www.smia-forum.org
Part Number Description
STV0976E TFBGA 56 AFOP lead-free,
tray packing
STV0976E/TR TFBGA 56 AFOP lead-free,
13 inch tape-and-reel packing
STV0976
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APPLICATION DIAGRAM
BLOCK DIAGRAM
TECHNICAL SPECIFICATIONS
TEMPERATURE RANGES
EXTCLK
XSHUTDOWN
CCP 1.0
VS6650
Camera
CCI
Baseband
or
Application
Processor
Module
STV0976
1.0 Megapixel
SMIA
Processor
or
VS6590
SMIA
MSCL
MSDA
PCLKP
PCLKN
PDATAP
PDATAN
RST_IN
CLK
SSCL
SSDA
Video Processor
JTAG & Test Interf ace
CCP
Receiver
STV0976
I
2
C
slave
Internal bus
I2C
Master
VC
CCP
Transmitter
HCLKP
HCLKN
HDATAP
HDATAN
VDD_POR
Clock &
Power
Mgmt
RAM, ROM,
µprocessor
TMS, TCK,
TDI, TDO
Sensor Inte rface
Sensor su ppo rt VS6650 1.0MP SMIA
VS6590 480kP
Frame rate 1 to 15 Hz (1152H x 864V)
1 to 30 Hz (800H x 600V)
Gamma correction Standard, S-curve
Image Crop Arbitrary size
Image Downscale x1 to x7 in 0.5 steps
x7 to x12 in 1.0 steps
Image Compression JPEG on YUV 4:2:2,
programmable quantization
tables
Output Form a t YUV 4:2:2
RGB 565, RG B 444
JPEG
Video Output Interface
SMIA class 0 high-speed
serial
208Mbit/s data/clock
1.8 V LVDS
Video Output Interface
(2)
8-bit parallel video
HSYNC/VSYNC/PCLK
24 MHz max
Clock input 6.5 to 27 MHz square
13 MHz typ.
Supply voltage 1.8 V ± 0.1 V digital
I/O voltage 1.8 V CMOS levels
Power consumption Streaming 15 fps: 85 mW
max
Power down: 60 µW max.
Package type TFBGA 56 AFOP lead-free
STV0974 compatible
Package size (mm) 6 x 6 x 1.2 (wlh)
Storage -40 to +85 °C
Operating -25 to +70 °C
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STV0976
REVISION HISTORY
Table 1. Revision History
Date Revision Description of Changes
October 2004 1 First Issue
Information furnished is be lieved to be accur ate and reliable. However, STMicroelectronics assumes no responsib ility for the consequences
of use of such inf ormation nor for any infringemen t of patents or other rights of thir d parties which may resul t from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. T his publication supersedes and replac es all information previously supplied. STMicroelectronic s products are not
authorized for use as critical components in life support devices or systems without ex press writte n approval of STMicroelectronics.
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© 2004 STMicroelectronics - All righ ts reserved
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