ASMT-Ax3x
3W Power LED Light Source
Data Sheet
Description
This 3W Power LED Light Source is a high performance
energy efficient device which can handle high thermal
and high driving current. The exposed pad design enables
excellent heat transfer from the package to the mother-
board. Option with electrically isolated metal slug is also
available.
The White Power LED is available in the range of color
temperature from 2700K to 10000K.
The low profile package design is suitable for a wide variety
of applications especially where height is a constraint.
The package is compatible with reflow soldering process.
This part has a foot print that is compatible to most of the
high power LED in the market today.
Features
• Available in Red, Red Orange, Amber, Blue, Royal Blue,
Cool White, Neutral White and Warm White color
• Energy efficient
• Exposed metal slug for excellent heat transfer
• Compatible with reflow soldering process
• High current operation
• Long operation life
• Wide viewing angle at 140°
• Silicone encapsulation
• Non-ESD sensitive (threshold > 16 kV)
• MSL 2a products
Applications
• Architectural lighting
• Channel backlighting
• Contour lighting
• Retail Display lighting
• Decorative lighting
• Garden lighting
• Safety, exit and emergency signs lighting
• Specialty lighting
• Task lighting
2
Package Dimensions
Figure 1. ASMT-Ax3x package outline drawing
Notes:
1. All dimensions in millimeters.
2. Metal slug is connected to anode for electrically non-isolated option.
3. Tolerance is ±0.1 mm unless otherwise specified.
4 . Terminal Finish: Ag plating
7.4
2.3
Ø 8.0
7.4
1.1
1.5
Ø 6.0
Metal Slug
Anode
Lead
Lens
Cathode
Lead
Body
Metal Slug
13.6
0.5
4.1 (ref:)
6.0
TOP VIEW BOTTOM VIEW
3.0 2.0
3
Part Numbering System
Note:
1. Please refer to Page 11 for selection details.
Device Selection Guide (Tj = 25°C)
Part Number Color
Luminous Flux (lm) / Radiometric Power
(mW), ΦV [1,2] Test
Current
(mA)
Dice
Technology
Electrically
Isolated
Metal Slug Min. Typ. Max.
ASMT-AR30-ARR00 Red 39.8 45.0 51.7 350 AllnGaP No [3]
ASMT-AH30-ARR00 Red Orange 39.8 45.0 51.7 350 AlInGaP No [3]
ASMT-AA30-ARS00 Amber 39.8 48.0 67.2 350 AllnGaP No [3]
ASMT-AB31-NMP00 Blue 13.9 18.0 30.6 350 InGaN Yes
ASMT-AL31-NPQ00 Royal Blue 355 mW 435 mW 515 mW 350 InGaN Yes
ASMT-AW31-NUV00 Cool White 87.4 100.0 113.6 350 InGaN Yes
ASMT-AN31-NUV00 Neutral White 87.4 100.0 113.6 350 InGaN Yes
ASMT-AY31-NTU00 Warm White 67.2 80.0 99.6 350 InGaN Yes
Notes:
1. ΦV is the total luminous flux / radiometric power output as measured with an integrating sphere at 25ms mono pulse condition.
2. Flux and power tolerance is ±10 %
3. Electrically isolated metal slug option is also available. Please contact your Avago sale representative.
ASMT – A x1 3 x2 – x3 x4 x5 x6 x7
Packaging Option
Color Bin Selection
Maximum Flux Bin Selection
Minimum Flux Bin Selection
Dice Type
N – InGaN
A – AllnGaP
Heat Sink
0 – Electrically Non-isolated
1 – Electrically Isolated
Color
R – Red
H – Red Orange
A – Amber
B – Blue
L – Royal Blue
W – Cool White
N – Neutral White
Y – Warm White
4
Absolute Maximum Ratings
Parameter AllnGaP InGaN Units
DC Forward Current [1] 700 700 mA
Power Dissipation 2450 3010 mW
LED Junction Temperature 125 135 °C
Operating Metal Slug Temperature Range at 350 mA -40 to +115 -40 to +120 °C
Operating Metal Slug Temperature Range at 700 mA -40 to +100 -40 to +105 °C
Storage Temperature Range -40 to +120 -40 to +120 °C
Soldering Temperature Refer to Figure 26
Reverse Voltage [2] Not recommended
Note:
1. Derate linearly based on Figure 10 for AlInGaP and Figure 22 for InGaN.
2. Not recommended for reverse bias operation.
Optical Characteristics at 350 mA (TJ = 25 °C)
Part Number Color
Peak Wavelength,
λPEAK (nm)
Dominant
Wavelength,
λD [1] (nm)
Viewing Angle,
2θ½ [2] (°)
Luminous Efficiency
(lm/W)
Typ. Typ. Typ. Typ.
ASMT-AR30-ARR00 Red 635 625 140 61
ASMT-AH30-ARR00 Red Orange 625 615 140 61
ASMT-AA30-ARS00 Amber 598 590 140 65
ASMT-AB31-NMP00 Blue 460 470 140 16
ASMT-AL31-NPQ00 Royal Blue 450 455 140 Not applicable
Part Number Color
Correlated Color Temperature,
CCT (Kelvin)
Viewing Angle,
2θ½ [2] (°)
Luminous Efficiency
(lm/W)
Min. Max. Typ. Typ.
ASMT-AW31-NUV00 Cool White 4500 10000 140 89
ASMT-AN31-NUV00 Neutral White 3500 4500 140 89
ASMT-AY31-NTU00 Warm White 2700 3500 140 71
Notes:
1. The dominant wavelength, λD, is derived from the CIE Chromaticity Diagram and represents the color of the device.
2. θ½ is the off-axis angle where the luminous intensity is ½ the peak intensity.
5
Electrical Characteristic at 350 mA (TJ = 25°C)
Dice Type
Forward Voltage,
VF (Volts)
Thermal Resistance,
Rθj-ms(°C/W) [1]
Min. Typ Max. Typ.
AllnGaP 1.7 2.1 2.3 10
InGaN 2.8 3.2 3.5 10
Notes:
1. Rθj-ms is Thermal Resistance from LED junction to metal slug.
Optical and Electrical Characteristic at 700 mA (TJ = 25°C)
Part Number Color
Luminous Flux (lm)
/ Radiometric Power
(mW), ΦV
Forward Voltage,
VF (Volts)
Typ. Typ.
ASMT-AR30-ARR00 Red 85.0 2.4
ASMT-AH30-ARR00 Red Orange 85.0 2.4
ASMT-AA30-ARS00 Amber 90.0 2.4
ASMT-AB31-NMP00 Blue 30.0 3.6
ASMT-AL31-NPQ00 Royal Blue 760 mW 3.6
ASMT-AW31-NUV00 Cool White 175.0 3.6
ASMT-AN31-NUV00 Neutral White 175.0 3.6
ASMT-AY31-NTU00 Warm White 140.0 3.6
6
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
530 545 560 575 590 605 620 635 650 665 680
WAVELENGTH - nm
RELATIVE INTENSITY
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
2
0 100 200 300 400 500 600 700
MONO PULSE CURRENT - mA
RELATIVE LUMINOUS FLUX
(NORMALIZED AT 350 mA)
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
-90 -60 -30 0 30 60 90
ANGULAR DISPLACEMENT - DEGREES
NORMALIZED INTENSITY
RED ORANGE
RED
AMBER
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
0.00001 0.0001 0.001 0.01 0.1 1 10 100
PULSE DURATION, tp - sec
PULSE CURRENT, IP - A
D =
0.05
0.10
0.25
0.50
1.00
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
0.00001 0.0001 0.001 0.01 0.1 1 10 100
PULSE DURATION, tp - sec
PULSE CURRENT, IP - A
D =
0.05
0.10
0.25
0.50
1.00
D=tp
T
tp
IF
T
D=tp
T
tp
IF
T
0
50
100
150
200
250
300
350
400
450
500
550
600
650
700
0 0.5 1 1.5 2 2.5 3
FORWARD VOLTAGE - V
FORWARD CURRENT - mA
Figure 2. Relative Intensity vs. Wavelength for Red, Red Orange and Amber. Figure 3. Relative Luminous Flux vs. Mono Pulse Current.
Figure 4. Forward Current vs. Forward Voltage. Figure 5. Radiation Pattern Red, Red Orange and Amber.
AlInGaP
Figure 6. Maximum pulse current vs. ambient temperature. Derated based
on TA = 25°C, RθJ-A = 30°C/W.
Figure 7. Maximum pulse current vs. ambient temperature. Derated based
on TA = 85°C, RθJ-A = 30°C/W.
7
0
100
200
300
400
500
600
700
800
0 20 40 60 80 100 120 140
AMBIENT TEMPERATURE, TA - °C
MAX ALLOWABLE DC CURRENT - mA
0
100
200
300
400
500
600
700
800
0 20 40 60 80 100 120 140
METAL SLUG TEMPERATURE, TMS - °C
MAX ALLOWABLE DC CURRENT - mA
RθJ-A = 20°C/W
RθJ-A = 25°C/W
RθJ-A = 30°C/W
RθJ-MS = 10°C/W
-0.25
-0.15
-0.05
0.05
0.15
0.25
0.35
0.45
0.55
0.65
-50 -25 0 25 50 75 100 125
JUNCTION TEMPERATURE, TJ -°C
FORWARD VOLTAGE SHIFT - V
(NORMALIZED AT 25°C)
RED
0.0
20.0
40.0
60.0
80.0
100.0
120.0
140.0
160.0
180.0
200.0
220.0
-50 -25 0 25 50 75 100 125
JUNCTION TEMPERATURE, TJ -°C
RELATIVE LIGHT OUTPUT - %
(NORMALIZED AT 25°C)
RED ORANGE
RED
AMBER
AMBER
RED ORANGE
Figure 10. Maximum Forward Current vs. Ambient Temperature.
Derated based on TJMAX = 125°C, RθJ-A = 20°C/W, 25°C/W and 30°C/W.
AlInGaP
Figure 11. Maximum Forward Current vs. Metal Slug Temperature.
Derated based on TJMAX = 125°C, RθJ-MS = 10°C/W.
Figure 8. Relative Light Output vs. Junction Temperature. Figure 9. Forward Voltage Shift vs. Junction Temperature.
8
InGaN
Figure 12. Relative Intensity vs. Wavelength for Warm White and Cool White. Figure 13. Relative Intensity vs. Wavelength for Blue and Royal Blue.
Figure 14. Relative Luminous Flux vs. Mono Pulse Current. Figure 15. Forward Current vs. Forward Voltage.
Figure 16. Radiation Pattern for Blue and Royal Blue. Figure 17. Radiation Pattern for Cool White, Neutral White and Warm White.
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
380 430 480 530 580 630 680 730 780
WAVELENGTH - nm
RELATIVE INTENSITY
COOL WHITE
WARM WHITE
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
380 405 430 455 480 505 530 555 580
WAVELENGTH - nm
RELATIVE INTENSITY
BLUE
ROYAL BLUE
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
-90 -60 -30 0 30 60 90
ANGULAR DISPLACEMENT - DEGREES
NORMALIZED INTENSITY
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
-90 -60 -30 0 30 60 90
ANGULAR DISPLACEMENT - DEGREES
NORMALIZED INTENSITY
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
2
0 100 200 300 400 500 600 700
MONO PULSE CURRENT - mA
RELATIVE LUMINOUS FLUX / RADIOMETRIC
POWER (NORMALIZED AT 350 mA)
0
50
100
150
200
250
300
350
400
450
500
550
600
650
700
0 0.5 1 1.5 2 2.5 3 3.5 4
FORWARD VOLTAGE - V
FORWARD CURRENT - mA
9
Figure 18. Maximum pulse current vs. ambient temperature. Derated based
on TA = 25°C, RθJ-A = 30°C/W.
Figure 19. Maximum pulse current vs. ambient temperature. Derated based
on TA = 85°C, RθJ-A = 30°C/W.
Figure 20. Relative Light Output vs. Junction Temperature. Figure 21. Forward Voltage Shift vs. Junction Temperature.
InGaN
Figure 22. Maximum Forward Current vs. Ambient Temperature.
Derated based on TJMAX = 135°C, RθJ-A = 20°C/W, 25°C/W and 30°C/W.
Figure 23. Maximum Forward Current vs. Metal Slug Temperature.
Derated based on TJMAX = 135°C, RθJ-MS = 10°C/W.
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
0.00001 0.0001 0.001 0.01 0.1 1 10 100
PULSE DURATION, tp - sec
PULSE CURRENT, Ip - A
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
0.00001 0.0001 0.001 0.01 0.1 1 10 100
PULSE DURATION, tp - sec
PULSE CURRENT, Ip - A
D =
0.05
0.10
0.25
0.50
1.00
D =
0.05
0.10
0.25
0.50
1.00
D=tp
T
tp
IF
T
D=tp
T
tp
IF
T
0
100
200
300
400
500
600
700
800
0 20 40 60 80 100 120 140
AMBIENT TEMPERATURE, TA - °C
MAX ALLOWABLE DC CURRENT - mA
0
100
200
300
400
500
600
700
800
0 20 40 60 80 100 120 140
METAL SLUG TEMPERATURE, TMS - °C
MAX ALLOWABLE DC CURRENT - mA
RθJ-A = 20°C/W
RθJ-A = 25°C/W
RθJ-A = 30°C/W
RθJ-MS = 10°C/W
JUNCTION TEMPERATURE, T J -°C JUNCTION TEMPERATURE,TJ - °C
0.0
10.0
20.0
30.0
40.0
50.0
60.0
70.0
80.0
90.0
100.0
110.0
120.0
-50 -25 0 25 50 75 100 125 150
RELATIVE LIGHT OUTPUT - %
(NORMALIZED AT 25°C)
-0.25
-0.20
-0.15
-0.10
-0.05
0.00
0.05
0.10
0.15
0.20
0.25
-50 -25 0 25 50 75 100 125 150
FORWARD VOLTAGE SHIFT - V
(NORMALIZED AT 25°C)
BLUE
ROYAL BLUE
WHITE
BLUE
WHITE
ROYAL BLUE
10
Figure 24. Recommended soldering land pattern.
Note:
For detail information on reflow soldering of Avago surface mount LEDs,
do refer to Avago Application Note AN1060 Surface Mounting SMT LED
Indicator Components.
Figure 25. Recommended pick and place nozzle tip.
Inner diameter = 5.8 mm
Figure 26. Recommended Reflow Soldering.
Ø 6.40
1.10
1.60
2.65
8.80
4.38
14.10
5.8
(Acc. to J-STD-020C)
217°C
200°C
60 - 120 SEC.
6°C/SEC. MAX.
3°C/SEC. MAX.
3°C/SEC. MAX.
150°C
255 - 260°C
100 SEC. MAX.
10 to 30 SEC.
TIME
TEMPERATURE
11
Option Selection Details
ASMT-A x13 x2 – x3 x4 x5 x6 x7
x4 – Minimum Flux Bin Selection
x5 – Maximum Flux Bin Selection
x6 – Color Bin Selection
x7 – Packaging Option
Color Bin Selection [x6]
Individual reel or tube will contain parts from one color bin selection only.
Cool White
Selection Bin ID
0 Full Distribution
E VM, UM, VN and UN
F WM, VM, WN and VN
G XM, WM, XN and WN
H UN, VN, U0 and V0
J WN, VN, W0 and V0
K XN, WN, X0 and W0
L V0, U0, VP and UP
M W0, V0, WP, VP and WQ
N X0, W0, XP, WP and WQ
P Y0
Q YA
Neutral White
Selection Bin ID
0 Full Distribution
E SM, RM, S1 and R1
F TM, SM, TN and S1
G S1, R1, S0 and R0
H TN, S1, T0 and S0
J S0, R0, SA and RA
K T0, S0, TP and SA
Flux / Power Bin Limit [x4, x5]
Color Bin ID
Luminous Flux (lm) / Radiometric
Power (mW) at 350 mA
Min. Max.
Blue M 13.9 18.1
N 18.1 23.5
P 23.5 30.6
Other Colors R 39.8 51.7
S 51.7 67.2
T 67.2 87.4
U 87.4 99.6
V 99.6 113.6
Royal Blue M 225.0 275.0
N 275.0 355.0
P 355.0 435.0
Q 435.0 515.0
Tolerance for each bin limits is ±10 %
Warm White
Selection Bin ID
0 Full Distribution
E NM, MM, N1 and M1
F PM, NM, P1 and N1
G QM, PM, Q1 and P1
H M1, N1, M0 and N0
J P1, N1, P0 and N0
K Q1, P1, Q0 and P0
L N0, M0, NA and MA
M P0, N0, PA and NA
N Q0, P0, QA and PA
Other Colors
Selection Bin ID
0 Full Distribution
Z A and B
Y B and C
W C and D
V D and E
Q A, B and C
P B, C and D
N C, D and E
M D, E and F
12
0.26
0.28
0.30
0.32
0.34
0.36
0.38
0.40
0.42
0.26 0.28 0.30 0.32 0.34 0.36 0.38 0.40
X-COORDINATE
Y-COORDINATE
10000K
7000K
6300K
Y0
YA
UM
UN
U0
UP
V0
VM
VN
VP
X0
XP
XM
XN W0
WN
WQ
WM
WP
5650K
5000K
4500K
BLACK BODY CURVE
0.32
0.34
0.36
0.38
0.40
0.42
0.44
0.46
0.48
0.38 0.40 0.42 0.44 0.46 0.48 0.50
X-COORDINATE
Y-COORDINATE
QM
PM
MM
NM
Q1
Q0
QA
P0
P1
PA
M0
M1
MA
N0
N1
NA
3050K 2850K
BLACK BODY CURVE
2700K
3500K 3250K
0.32
0.34
0.36
0.38
0.40
0.42
0.44
0.46
0.34 0.36 0.38 0.40 0.42 0.44
X-COORDINATE
Y-COORDINATE
RM
R1
R0
RA
T0
SM
S1
SA
TM
TN
TP
S0
4500K
4100K
BLACK BODY CURVE
3500K
3800K
Figure 27. Color bin structure for Cool White. Figure 28. Color bin structure for Warm White.
Figure 29. Color bin structure for Neutral White.
13
Color Bin Limit
Cool Color Limits
White (Chromaticity Coordinates)
Bin UM x 0.365 0.367 0.348 0.347
y 0.386 0.400 0.385 0.372
Bin UN x 0.365 0.362 0.346 0.347
y 0.386 0.372 0.359 0.372
Bin U0 x 0.362 0.360 0.344 0.346
y 0.372 0.357 0.344 0.359
Bin UP x 0.360 0.357 0.343 0.344
y 0.357 0.342 0.311 0.344
Bin VM x 0.329 0.329 0.348 0.347
y 0.357 0.369 0.385 0.372
Bin VN x 0.329 0.329 0.347 0.346
y 0.345 0.357 0.372 0.359
Bin V0 x 0.329 0.329 0.346 0.344
y 0.311 0.345 0.359 0.344
Bin VP x 0.329 0.344 0.343 0.329
y 0.331 0.344 0.331 0.320
Bin WM x 0.329 0.329 0.315 0.314
y 0.369 0.357 0.344 0.355
Bin WN x 0.329 0.316 0.315 0.329
y 0.345 0.333 0.344 0.357
Bin W0 x 0.329 0.329 0.317 0.316
y 0.345 0.331 0.320 0.333
Bin WP x 0.329 0.329 0.318 0.317
y 0.331 0.320 0.310 0.320
Bin WQ x 0.329 0.329 0.319 0.318
y 0.320 0.310 0.300 0.310
Bin XM x 0.301 0.314 0.315 0.303
y 0.342 0.355 0.344 0.333
Bin XN x 0.305 0.303 0.315 0.316
y 0.322 0.333 0.344 0.333
Bin X0 x 0.308 0.305 0.316 0.317
y 0.311 0.322 0.333 0.320
Bin XP x 0.308 0.317 0.319 0.311
y 0.311 0.320 0.300 0.293
Bin Y0 x 0.308 0.283 0.274 0.303
y 0.311 0.284 0.301 0.333
Bin YA x 0.308 0.311 0.290 0.283
y 0.311 0.293 0.270 0.284
Tolerance: ± 0.01
Warm Color Limits
White (Chromaticity Coordinates)
Bin MM x 0.471 0.460 0.473 0.486
y 0.451 0.430 0.432 0.455
Bin M1 x 0.460 0.453 0.467 0.473
y 0.430 0.416 0.419 0.432
Bin M0 x 0.453 0.444 0.459 0.467
y 0.416 0.399 0.403 0.419
Bin MA x 0.459 0.444 0.436 0.451
y 0.403 0.399 0.384 0.389
Bin NM x 0.454 0.444 0.460 0.4 71
y 0.446 0.426 0.430 0.451
Bin N1 x 0.444 0.438 0.453 0.4 60
y 0.426 0.412 0.416 0.430
Bin N0 x 0.438 0.429 0.444 0.4 53
y 0.412 0.394 0.399 0.416
Bin NA x 0.444 0.429 0.422 0.4 36
y 0.399 0.394 0.379 0.384
Bin PM x 0.438 0.430 0.444 0.454
y 0.440 0.421 0.426 0.446
Bin P1 x 0.430 0.424 0.438 0.444
y 0.421 0.407 0.412 0.426
Bin P0 x 0.424 0.416 0.429 0.438
y 0.407 0.389 0.394 0.412
Bin PA x 0.429 0.416 0.410 0.422
y 0.394 0.389 0.374 0.379
Bin QM x 0.421 0.414 0.430 0.438
y 0.433 0.414 0.421 0.440
Bin Q1 x 0.414 0.409 0.424 0.430
y 0.414 0.400 0.407 0.421
Bin Q0 x 0.409 0.402 0.416 0.424
y 0.400 0.382 0.389 0.407
Bin QA x 0.416 0.402 0.396 0.410
y 0.389 0.382 0.367 0.374
Tolerance: ± 0.01
14
Neutral Color Limits
White (Chromaticity Coordinates)
Bin RM x 0.421 0.414 0.397 0.402
y 0.433 0.414 0.406 0.423
Bin R1 x 0.414 0.409 0.392 0.397
y 0.414 0.400 0.391 0.406
Bin R0 x 0.392 0.387 0.402 0.409
y 0.391 0.374 0.382 0.400
Bin RA x 0.387 0.383 0.396 0.402
y 0.374 0.360 0.367 0.382
Bin SM x 0.402 0.397 0.382 0.386
y 0.423 0.406 0.397 0.413
Bin S1 x 0.397 0.392 0.378 0.382
y 0.406 0.391 0.382 0.397
Bin S0 x 0.392 0.387 0.374 0.378
y 0.391 0.374 0.366 0.382
Bin SA x 0.387 0.383 0.370 0.374
y 0.374 0.360 0.351 0.366
Bin TM x 0.386 0.382 0.365 0.367
y 0.413 0.397 0.386 0.400
Bin TN x 0.382 0.378 0.362 0.365
y 0.397 0.382 0.372 0.386
Bin T0 x 0.378 0.374 0.360 0.362
y 0.382 0.366 0.357 0.372
Bin TP x 0.374 0.370 0.357 0.360
y 0.366 0.351 0.342 0.357
Tolerance: ± 0.01
Packaging Option [x7]
Selection Option
0 Tube
1 Tape and Reel
Color Bin ID
Dominant Wavelength (nm)
at 350 mA
Min. Max.
Red - 620.0 635.0
Red Orange - 610.0 620.0
Amber B 587.0 589.5
C 589.5 592.0
D 592.0 594.5
E 594.5 597.0
Blue A 460.0 465.0
B 465.0 470.0
C 470.0 475.0
D 475.0 480.0
Tolerance: ±1 nm
Color Bin ID
Peak Wavelength (nm) at 350 mA
Min. Max.
Royal Blue C 440.0 445.0
D 445.0 450.0
E 450.0 455.0
F 455.0 460.0
Tolerance: ±2 nm
Example
ASMT-AW31-NUV00
ASMT-AW31-Nxxxx – Cool White, InGaN,
Electrically isolated Heat Sink
x4 = U – Minimum Flux Bin U
x5 = V – Maximum Flux Bin V
x6 = 0 – Full Distribution
x7 = 0 – Tube Option
15
Figure 30. Package tube dimensions.
17.2 ±0.1
7.3 ±0.10.4 ±0.1
3.4 ±0.1 5.0 ±0.1
8.4 ±0.1
395mm
Packing Tube – Option 0
16
Figure 32. Reel dimensions.
Tape and Reel – Option 1
Figure 31. Carrier tape dimensions.
Ø 330.0 ± 2.0
2.0 ±0.5
Ø 21.0 ±0.8
Ø 13.0 +0.5
–0.2
See Detail – 1
Detail – 1
1.8 +0.2
0.0
24.0 +0.2
0.0
100 ±0.5
Ø 1.50 +0.10
0.00
Ø 8.10 +0.10
0.00
4.00 ±0.10
2.00 ±0.10
1.75 ±0.10
24.00 ±0.30
11.50 ±0.10
12.00 ±0.10
‘AO’
8.10 ±0.10
2.55
Section 'A-A'
Section 'B-B'
B
B
A
A
‘KO’
4.50 ±0.10
0.40 ±0.05
‘BO’
14.30 ±0.10
R 0.30 Max (TYP.)
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2010 Avago Technologies. All rights reserved.
AV02-2048EN - June 24, 2010
DISCLAIMER: Avago’s products and software are not specifically designed, manufactured or authorized for
sale as parts, components or assemblies for the planning, construction, maintenenace or direct operation of a
nuclear facility or for use in medical devices or applications. Customer is solely responsible, and waives all rights
to make claims against avago or its suppliers, fo all loss, damage, expense or liability in connection with such use.
Handling Precaution
The encapsulation material of the product is made of
silicone for better reliability of the product. As silicone
is a soft material, please do not press on the silicone or
poke a sharp object onto the silicone. These might
damage the product and cause premature failure. During
assembly of handling, the unit should be held on the body
only. Please refer to Avago Application Note AN 5288 for
detail information.
Moisture Sensitivity
This product is qualified as Moisture Sensitive Level 2a per
Jedec J-STD-020. Precautions when handling this moisture
sensitive product is important to ensure the reliability of
the product. Do refer to Avago Application Note AN5305
Handling of Moisture Sensitive Surface Mount Devices for
details.
A. Storage before use
– Unopen moisture barrier bag (MBB) can be stored at
<40°C/90%RH for 12 months. If the actual shelf life
has exceeded 12 months and the humidity indicator
card (HIC) indicates that baking is not required, then
it is safe to reflow the LEDs per the original MSL
rating.
– It is not recommended to open the MBB prior to
assembly (e.g. for IQC).
B. Control after opening the MBB
– The humidity indicator card (HIC) shall be read
immediately upon opening of MBB.
– The LEDs must be kept at <30°C/60%RH at all time
and all high temperature related process including
soldering, curing or rework need to be completed
within 672 hours.
C. Control for unfinished reel
– For any unused LEDs, they need to be stored in
sealed MBB with desiccant or desiccator at <5%RH.
D. Control of assembled boards
– If the PCB soldered with the LEDs is to be subjected to
other high temperature processes, the PCB need to
be stored in sealed MBB with desiccant or desiccator
at <5%RH to ensure no LEDs have exceeded their
floor life of 672 hours.
E. Baking is required if:
– HIC “10%” indicator is NOT Brown and “5%” indicator
is Azure.
– The LEDs are exposed to condition of >30°C/60% RH
at any time.
– The LED floor life exceeded 672hrs.
Recommended baking condition: 60±5°C for 20hrs.
