DAC161P997EVAL/NOPB - TEXAS INSTRUMENTS

High Efficacy

VIOLET LED Emitter

LZ4-00UA00

Key Features

 High Efficacy 10W Violet LED

 Ultra-small foot print – 7.0mm x 7.0mm

 Surface mount ceramic package with integrated glass lens

 Very low Thermal Resistance (1.1°C/W)

 Electrically neutral thermal path

 Individually addressable die

 Very high Radiant Flux density

 JEDEC Level 1 for Moisture Sensitivity Level

 Autoclave complaint (JEDEC JESD22-A102-C)

 Lead (Pb) free and RoHS compliant

 Reflow solderable (up to 6 cycles)

 Emitter available on Standard or Serially Connected MCPCB (optional)

Typical Applications

 Dental Curing and Teeth Whitening

 Sterilization and Medical

 Ink and Adhesive Curing

 DNA Gel

Description

The LZ4-00UA00 VIOLET LED emitter provides superior radiometric power in the wavelength range specifically

required for sterilization, dental curing lights, and numerous medical applications. With a 7.0mm x 7.0mm ultra-

small footprint, this package provides exceptional optical power density. The radiometric power performance and

optimal peak wavelength of this LED are matched to the response curves of many dental resins, inks & adhesives,

resulting in a significantly reduced curing time. The patent-pending design has unparalleled thermal and optical

performance. The high quality materials used in the package are chosen to optimize light output, have excellent

VIOLET resistance, and minimize stresses which results in monumental reliability and radiant flux maintenance.

UV RADIATION

Avoid exposure to the beam

Wear protective eyewear

2

Part number options

Base part number

Part number

Description

LZ4-00UA00-xxxx

LZ4 emitter

LZ4-40UA00-xxxx

LZ4 emitter on Standard Star 1 channel MCPCB

Bin kit option codes

Single wavelength bin (5nm range)

Kit number suffix

Min flux Bin

Color Bin Range

Description

00U4

R

U4

R minimum flux; wavelength U4 bin only

00U5

S

U5

S minimum flux; wavelength U5 bin only

00U6

S

U6

S minimum flux; wavelength U6 bin only

00U7

S

U7

S minimum flux; wavelength U7 bin only

00U8

S

U8

S minimum flux; wavelength U8 bin only

3

Radiant Flux Bins

Table 1:

Bin Code

Minimum

Radiant Flux (Φ)

@ IF = 700mA

[1,2]

(W)

Maximum

Radiant Flux (Φ)

@ IF = 700mA

[1,2]

(W)

R

2.40

3.00

S

3.00

3.80

T

3.80

4.80

Notes for Table 1:

1. Radiant flux performance guaranteed within published operating conditions. LED Engin maintains a tolerance of ± 10% on flux measurements.

2. Future products will have even higher levels of radiant flux performance. Contact LED Engin Sales for updated information.

Peak Wavelength Bins

Table 2:

Bin Code

Minimum

Peak Wavelength (λP)

@ IF = 700mA

[1]

(nm)

Maximum

Peak Wavelength (λP)

@ IF = 700mA

[1]

(nm)

U4

385

390

U5

390

395

U6

395

400

U7

400

405

U8

405

410

Notes for Table 2:

1. LED Engin maintains a tolerance of ± 2.0nm on peak wavelength measurements.

Forward Voltage Bins

Table 3:

Bin Code

Minimum

Forward Voltage (VF)

@ IF = 700mA

[1,2]

(V)

Maximum

Forward Voltage (VF)

@ IF = 700mA

[1,2]

(V)

0

13.76

18.56

Notes for Table 3:

1. LED Engin maintains a tolerance of ± 0.16V for forward voltage measurements.

2. Forward Voltage is binned with all four LED dice connected in series.

4

Absolute Maximum Ratings

Table 4:

Parameter

Symbol

Value

Unit

DC Forward Current

[1]

IF

1000

mA

Peak Pulsed Forward Current

[2]

IFP

1000

mA

Reverse Voltage

VR

See Note 3

V

Storage Temperature

Tstg

-40 ~ +150

°C

Junction Temperature

TJ

125

°C

Soldering Temperature

Tsol

260

°C

Allowable Reflow Cycles

6

Autoclave Conditions

[4]

121°C at 2 ATM,

100% RH for 168 hours

ESD Sensitivity

[5]

> 2,000 V HBM

Class 2 JESD22-A114-D

Notes for Table 4:

1. Maximum DC forward current is determined by the overall thermal resistance and ambient temperature.

Follow the curves in Figure 10 for current derating.

2: Pulse forward current conditions: Pulse Width ≤ 10msec and Duty Cycle ≤ 10%.

3. LEDs are not designed to be reverse biased.

4. Autoclave Conditions per JEDEC JESD22-A102-C.

5. LED Engin recommends taking reasonable precautions towards possible ESD damages and handling the LZ4-00UA00

in an electrostatic protected area (EPA). An EPA may be adequately protected by ESD controls as outlined in

ANSI/ESD S6.1.

Optical Characteristics @ TC = 25°C

Table 5:

Parameter

Symbol

Typical

Unit

385-390nm

390-400nm

400-410nm

Radiant Flux (@ IF = 700mA)

Φ

2.95

3.50

3.90

W

Radiant Flux (@ IF = 1000mA)

Φ

4.10

4.90

5.45

W

Peak Wavelength

[1]

λP

385

395

405

nm

Viewing Angle

[2]

2Θ1/2

97

Degrees

Total Included Angle

[3]

Θ0.9V

120

Degrees

Notes for Table 5:

1. When operating the VIOLET LED, observe IEC 60825-1 class 3B rating. Avoid exposure to the beam.

2. Viewing Angle is the off axis angle from emitter centerline where the radiant power is ½ of the peak value.

3. Total Included Angle is the total angle that includes 90% of the total radiant flux.

Electrical Characteristics @ TC = 25°C

Table 6:

Parameter

Symbol

Typical

Unit

1 Die

4 Dice

Forward Voltage (@ IF = 700mA)

VF

3.9

15.6

V

Forward Voltage (@ IF = 1000mA)

VF

4.1

16.5

V

Temperature Coefficient

of Forward Voltage

ΔVF/ΔTJ

-14.2

mV/°C

Thermal Resistance

(Junction to Case)

RΘJ-C

1.1

°C/W

5

IPC/JEDEC Moisture Sensitivity Level

Table 7 - IPC/JEDEC J-STD MSL-20 Classification:

Soak Requirements

Floor Life

Standard

Accelerated

Level

Time

Conditions

Time (hrs)

Conditions

Time (hrs)

Conditions

1

Unlimited

≤ 30°C/

85% RH

168

+5/-0

85°C/

85% RH

n/a

Notes for Table 7:

1. The standard soak time is the sum of the default value of 24 hours for the semiconductor manufacturer’s exposure time (MET) between bake and bag

and the floor life of maximum time allowed out of the bag at the end user of distributor’s facility.

Average Radiant Flux Maintenance Projections

Lumen maintenance generally describes the ability of an emitter to retain its output over time. The useful lifetime

for power LEDs is also defined as Radiant Flux Maintenance, with the percentage of the original light output

remaining at a defined time period.

Based on long-term WHTOL testing, LED Engin projects that the LZ Series will deliver, on average, 70% Radiant Flux

Maintenance (RP70%) at 20,000 hours of operation at a forward current of 700 mA per die. This projection is

based on constant current operation with junction temperature maintained at or below 80°C.

6

3

4

1

2

5

6

7

8

Mechanical Dimensions (mm)

Figure 1: Package outline drawing.

Notes for Figure 1:

1. Unless otherwise noted, the tolerance = ± 0.20 mm.

2. Thermal contact, Pad 9, is electrically neutral.

Recommended Solder Pad Layout (mm)

Figure 2a: Recommended solder pad layout for anode, cathode, and thermal pad.

Note for Figure 2a:

1. Unless otherwise noted, the tolerance = ± 0.20 mm.

2. This pad layout is “patent pending”.

Pin Out

Pad

Die

Function

1

A

Anode

2

A

Cathode

3

B

Anode

4

B

Cathode

5

C

Anode

6

C

Cathode

7

D

Anode

8

D

Cathode

9

[2]

n/a

Thermal

7

Recommended Solder Mask Layout (mm)

Figure 2b: Recommended solder mask opening (hatched area) for anode, cathode, and thermal pad.

Note for Figure 2b:

1. Unless otherwise noted, the tolerance = ± 0.20 mm.

Reflow Soldering Profile

Figure 3: Reflow soldering profile for lead free soldering.

Notes for Figure 3:

1. Solder profile for low temperature solder. LED Engin recommends 58Bi-42Sn (wt.%) Solder for the LZ4-00UA00.

8

0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1

300 350 400 450 500

Wavelength (nm)

Relative Spectral Power

Typical Radiation Pattern

Figure 4: Typical representative spatial radiation pattern.

Typical Relative Spectral Power Distribution

Figure 5: Typical relative spectral power vs. wavelength @ TC = 25°C.

0

10

20

30

40

50

60

70

80

90

100

-90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90

Relative Intensity (%)

Angular Displacement (Degrees)

9

0.0

1.0

2.0

3.0

4.0

5.0

020 40 60 80 100 120

Case Temperature (ºC)

Peak Wavelength Shift (nm)

0

0.2

0.4

0.6

0.8

1

1.2

1.4

0200 400 600 800 1000

IF - Forward Current (mA)

Normalized Radiant Flux

Typical Peak Wavelength Shift over Temperature

Figure 6: Typical peak wavelength shift vs. case temperature.

Typical Normalized Radiant Flux

Figure 7: Typical normalized radiant flux vs. forward current @ TC = 25°C.

10

0

200

400

600

800

1000

1200

11.0 12.0 13.0 14.0 15.0 16.0 17.0 18.0

VF - Forward Voltage (V)

IF - Forward Current (mA)

Typical Normalized Radiant Flux over Temperature

Figure 8: Typical normalized radiant flux vs. case temperature @700mA

Typical Forward Current Characteristics

Figure 9: Typical forward current vs. forward voltage @ TC = at 25°C.

0.00

0.20

0.40

0.60

0.80

1.00

1.20

020 40 60 80 100 120

Normalized Radiant Flux

Case Temperature (oC)

11

0

200

400

600

800

1000

1200

025 50 75 100 125

Maximum Ambient Temperature (ºC)

IF - Maximum Current (mA)

700

(Rated)

RΘJ-A = 4°C/W

RΘJ-A = 5°C/W

RΘJ-A = 6°C/W

Current De-rating

Figure 10: Maximum forward current vs. ambient temperature based on TJ(MAX) = 125°C.

Notes for Figure 10:

1. RΘJ-C [Junction to Case Thermal Resistance] for the LZ4-00UA00 is typically 1.1°C/W.

2. RΘJ-A [Junction to Ambient Thermal Resistance] = RΘJ-C + RΘC-A [Case to Ambient Thermal Resistance].

12

Emitter Tape and Reel Specifications (mm)

Figure 11: Emitter carrier tape specifications (mm).

Figure 12: Emitter Reel specifications (mm).

Notes:

1. Packaging contains VIOLET caution labels. Avoid exposure to the beam and wear appropriate protective eyewear when operating the VIOLET LED.

13

LZ4 MCPCB Family

Part number

Type of MCPCB

Diameter

(mm)

Emitter + MCPCB

Thermal Resistance

(°C /W)

Typical Vf

(V)

Typical If

(mA)

LZ4-4xxxxx

1-channel

19.9

1.1 + 1.1 = 2.2

15.6

700

Mechanical Mounting of MCPCB

 MCPCB bending should be avoided as it will cause mechanical stress on the emitter, which could lead to

substrate cracking and subsequently LED dies cracking.

 To avoid MCPCB bending:

o Special attention needs to be paid to the flatness of the heat sink surface and the torque on the screws.

o Care must be taken when securing the board to the heat sink. This can be done by tightening three M3

screws (or #4-40) in steps and not all the way through at once. Using fewer than three screws will

increase the likelihood of board bending.

o It is recommended to always use plastics washers in combinations with the three screws.

o If non-taped holes are used with self-tapping screws, it is advised to back out the screws slightly after

tightening (with controlled torque) and then re-tighten the screws again.

Thermal interface material

 To properly transfer heat from LED emitter to heat sink, a thermally conductive material is required when

mounting the MCPCB on to the heat sink.

 There are several varieties of such material: thermal paste, thermal pads, phase change materials and thermal

epoxies. An example of such material is Electrolube EHTC.

 It is critical to verify the material’s thermal resistance to be sufficient for the selected emitter and its operating

conditions.

Wire soldering

 To ease soldering wire to MCPCB process, it is advised to preheat the MCPCB on a hot plate of 125-150oC.

Subsequently, apply the solder and additional heat from the solder iron will initiate a good solder reflow. It is

recommended to use a solder iron of more than 60W.

 It is advised to use lead-free, no-clean solder. For example: SN-96.5 AG-3.0 CU 0.5 #58/275 from Kester (pn:

24-7068-7601)

14

LZ4-4xxxxx

1 channel, Standard Star MCPCB (1x4) Dimensions (mm)

Notes:

 Unless otherwise noted, the tolerance = ± 0.2 mm.

 Slots in MCPCB are for M3 or #4-40 mounting screws.

 LED Engin recommends plastic washers to electrically insulate screws from solder pads and electrical traces.

 Electrical connection pads on MCPCB are labeled “+” for Anode and “-” for Cathode

 LED Engin recommends thermal interface material when attaching the MCPCB to a heatsink

 The thermal resistance of the MCPCB is: RΘC-B 1.1°C/W

Components used

MCPCB: HT04503 (Bergquist)

ESD chips: BZX585-C30 (NXP, for 4 LED dies in series)

Pad layout

Ch.

MCPCB

Pad

String/die

Function

1

1, 2, 3

1/ABCD

Cathode -

4, 5

Anode +

15