Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e/
AXK7L, 8L
ACCTB28E 20120-T
ORDERING INFORMATION
For board-to-FPC
F4 Series
Narrow pitch connectors
(0.4mm pitch)
FEATURES
1. 0.9 mm mated height low profile
two-piece type connectors
2. Strong resistance to adverse
environments! Utilizes
“” construction
for high contact reliability.
3. Improved mating strength between
the socket and header
The simple locking structures provided
for the soldering terminals and the
contact points improve the mating
strength and provide tactile feedback
when locked.
4. Easy to design product circuits
An insulating wall prevents contact
between the PC board enabling patterns
and the soldering terminals.
5. Connectors for inspection available
APPLICATIONS
Mobile devices, such as cellular
phones, digital still cameras and
digital video cameras.
Socket Header
4.1mm
5.0mm
RoHS compliant
Locking structure of the soldering terminals
Socket Header
<Socket>
Pattern wiring under the connector is possible.
<Header>
Mated height
<Socket>
2: For mated height 0.9 mm
<Header>
1: For mated height 0.9 mm
Surface treatment (Contact portion / Terminal portion)
<Socket>
3: Ni plating on base, Au plating on surface (for Ni barrier available)
<Header>
4: Ni plating on base, Au plating on surface
Other specifications
<Header>
B: Soldering terminals with fork type terminal Note 1
Number of pins (2 digits)
Packing
G: 3,000 pieces embossed tape and plastic reel × 2
Notes: 1. “B” in the 11th digit of the header part number signifies a fork type soldering terminals to lessen the constraint on amount of solder when mounting,
and a construction that makes it difficult when mounting for excess solder to interfere with the socket.
Although compatible with the previous parts, these parts are not compatible with the recommended PC board pattern and recommended metal mask pattern.
AXK: Narrow Pitch Connector Series
Series name;
7L: F4 (0.4 mm pitch) Socket
8L: F4 (0.4 mm pitch) Header
Functions
2: Without positioning bosses
AXK G
Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e/
AXK7L, 8L
ACCTB28E 20120-T
PRODUCT TYPES
Notes: 1. Regarding ordering units;
During production: Please make orders in 1-reel units.
Samples for mounting confirmation: Available in units of 50 pieces. Please contact us.
Samples: Available. Please contact us.
2. The above part numbers are for connectors without positioning bosses, which are standard. When ordering connectors with positioning bosses, please contact our
sales office.
3. Please contact us regarding different number of pins.
4. “B” in the 11th digit of the header part number signifies a fork type soldering terminals to lessen the constraint on amount of solder when mounting, and a
construction that makes it difficult when mounting for excess solder to interfere with the socket.
Although compatible with the previous parts, these parts are not compatible with the recommended PC board pattern and recommended metal mask pattern.
Mated height Number of pins
Part number Packing
Socket Header Inner carton
(1 reel) Outer carton
0.9 mm
10 AXK7L10223G AXK8L10124BG
3,000 pieces 6,000 pieces
(2 reels)
12 AXK7L12223G AXK8L12124BG
14 AXK7L14223G AXK8L14124BG
16 AXK7L16223G AXK8L16124BG
20 AXK7L20223G AXK8L20124BG
22 AXK7L22223G AXK8L22124BG
24 AXK7L24223G AXK8L24124BG
26 AXK7L26223G AXK8L26124BG
28 AXK7L28223G AXK8L28124BG
30 AXK7L30223G AXK8L30124BG
32 AXK7L32223G AXK8L32124BG
34 AXK7L34223G AXK8L34124BG
36 AXK7L36223G AXK8L36124BG
38 AXK7L38223G AXK8L38124BG
40 AXK7L40223G AXK8L40124BG
44 AXK7L44223G AXK8L44124BG
48 AXK7L48223G AXK8L48124BG
50 AXK7L50223G AXK8L50124BG
54 AXK7L54223G AXK8L54124BG
60 AXK7L60223G AXK8L60124BG
66 AXK7L66223G AXK8L66124BG
70 AXK7L70223G AXK8L70124BG
80 AXK7L80223G AXK8L80124BG
Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e/
AXK7L, 8L
ACCTB28E 20120-T
SPECIFICATIONS
1. Characteristics
2. Material and surface treatment
Item Specifications Conditions
Electrical
characteristics
Rated current 0.3A/pin contact (Max. 5 A at total pin contacts) —
Rated voltage 60V AC/DC —
Breakdown voltage 150V AC for 1 min. Rated voltage is applied for one minute and check for
short circuit or damage with a detection current of 1mA
Insulation resistance Min. 1,000MΩ (Initial) Using 250V DC megger (applied for 1 min.)
Contact resistance Max. 90mΩBased on the contact resistance measurement method
specified by JIS C 5402.
Mechanical
characteristics
Composite insertion force Max. 1.70N/pin contacts × pin contacts (initial)
Composite removal force Min. 0.098N/pin contacts × pin contacts
Contact holding force
(Socket contact) Min. 0.49N/pin contacts Measuring the maximum force.
As the contact is axially pull out.
Soldering terminal holding force
(Header soldering terminal) Min. 0.49N Measuring the maximum force.
As the soldering terminal is axially pull out.
Environmental
characteristics
Ambient temperature –55°C to +85°C No freezing at low temperatures
Soldering heat resistance
Max. peak temperature of 260°C (on the surface of the
PC board around the connector terminals) Infrared reflow soldering
300°C within 5 sec, 350°C within 3 sec. Soldering iron
Storage temperature –55°C to +85°C (Product only)
–40°C to +50°C (Emboss packing) No freezing at low temperatures
Thermal shock resistance
(header and socket mated)
5 cycles,
insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
Conformed to MIL-STD-202F, method 107G
Humidity resistance
(header and socket mated)
120 hours,
insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
Temperature 40±2°C,
humidity 90 to 95% R.H.
Saltwater spray resistance
(header and socket mated)
24 hours,
insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
Temperature 35±2°C,
saltwater concentration 5±1%
H2S resistance
(header and socket mated)
48 hours,
contact resistance max. 90mΩ
Temperature 40±2°C,
gas concentration 3±1 ppm, humidity 75 to 80% R.H.
Lifetime
characteristics Insertion and removal life 50 times Repeated insertion and removal speed of max. 200
times/hours
Unit weight 20 pin contacts; Socket: 0.03g Header: 0.01g —
Part name Material Surface treatment
Molded portion LCP resin (UL94V-0) —
Contact/Post Copper alloy
Contact portion: Ni plating on base, Au plating on surface
Te r minal portion: Ni plating on base, Au plating on surface (Except for front edge of terminal)
However, the area adjacent to the socket terminal is exposed to Ni on base.
Soldering terminals: Socket: Ni plating on base, Pd + Au flash plating on surface (Expect for front edge of terminal)
Header: Ni plating on base, Au plating on surface (Expect for front edge of terminal)
Order Temperature (°C) Time (minutes)
1
2
3
4
–55
85
–55
0
−330
Max. 5
30
Max. 5
+3
0
0
−3
Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e/
AXK7L, 8L
ACCTB28E 20120-T
DIMENSIONS (unit: mm)
• Socket and header are mated
The CAD data of the products with a CAD Data mark can be downloaded from: http://industrial.panasonic.com/ac/e/
• Socket (Mated height 0.9 mm)
General tolerance: ±0.2
5.00
0.87
5.00
0.60
Soldering
terminals
0.40±0.05
0.15±0.03
Soldering
terminals
F-F cross section
A
C±0.15
B±0.1
Suction
face
0.80
This surface
C0.15
0.40±0.05
4.40
0.10±0.03
(Contact and
soldering terminals)
Te rminal coplanarity
0.08
F
F
0.50
(5.00)
Dimension table (mm)
Number of pins/
Dimensions A B C
10 4.4 1.6 3.0
12 4.8 2.0 3.4
14 5.2 2.4 3.8
16 5.6 2.8 4.2
20 6.4 3.6 5.0
22 6.8 4.0 5.4
24 7.2 4.4 5.8
26 7.6 4.8 6.2
28 8.0 5.2 6.6
30 8.4 5.6 7.0
32 8.8 6.0 7.4
34 9.2 6.4 7.8
36 9.6 6.8 8.2
38 10.0 7.2 8.6
40 10.4 7.6 9.0
44 11.2 8.4 9.8
48 12.0 9.2 10.6
50 12.4 9.6 11.0
54 13.2 10.4 11.8
60 14.4 11.6 13.0
66 15.6 12.8 14.2
70 16.4 13.6 15.0
80 18.4 15.6 17.0
CAD Data
• Header (Mated height: 0.9 mm)
General tolerance: ±0.2
Te r minal coplanarity
(Contact and
soldering terminals)
0.08
0.63
4.10
3.36
0.65
R0.15
R0.15
0.08±0.03
Soldering
terminals
0.27
A
B
C±0.1
Suction face 2.30
1.20±0.05
0.80±0.05
0.40±0.05
0.15±0.03
Soldering terminals
Dimension table (mm)
Number of pins/
Dimensions A B C
10 4.0 3.74 1.6
12 4.4 4.14 2.0
14 4.8 4.54 2.4
16 5.2 4.94 2.8
20 6.0 5.74 3.6
22 6.4 6.14 4.0
24 6.8 6.54 4.4
26 7.2 6.94 4.8
28 7.6 7.34 5.2
30 8.0 7.74 5.6
32 8.4 8.14 6.0
34 8.8 8.54 6.4
36 9.2 8.94 6.8
38 9.6 9.34 7.2
40 10.0 9.74 7.6
44 10.8 10.54 8.4
48 11.6 11.34 9.2
50 12.0 11.74 9.6
54 12.8 12.54 10.4
60 14.0 13.74 11.6
66 15.2 14.94 12.8
70 16.0 15.74 13.6
80 18.0 17.74 15.6
CAD Data
Socket
Header
0.90±0.15
Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e/
AXK7L, 8L
ACCTB28E 20120-T
EMBOSSED TAPE DIMENSIONS (unit: mm) (Common for respective contact type, socket and header)
TABLE OF DIMENSIONS
Connector orientation with respect to direction of progress of embossed tape
Mated height Number of pins Type of taping A B C D Quantity per reel
Common for
socket and header:
0.9mm
Max. 24 Tape I 16.0 — 7.5 17.4 3000
26 to 70 Tape I 24.0 — 11.5 25.4 3000
80 Tape II 32.0 28.4 14.2 33.4 3000
Tape dimensions (Conforming to JIS C 0806-1990. However,
some tapes have mounting hole pitches that do not comply with
the standard.)
Tape I Tape II
1.75
C
8.0
A±0.3
4
2
1.5 dia.
+0.1
0
Pull out direction
1.75
C
8.0
A±0.3
4
2
Pull out direction
B
1.5 dia.
+0.1
0
Plastic reel dimensions (Conforming to EIAJ ET–7200B)
Top cover tape
Taping reel
Embossed carrier tape
Embossed mounting-hole
D±1
380 dia.
Type
Direction of
tape progress
Common for F4
Socket Header
Note: There is no indication on this product regarding top-bottom or left-right orientation.
Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e/
AXK7L, 8L
ACCTB28E 20120-T
TABLE OF PRODUCT TYPES
✩: Available for sale
Notes: 1. Please inquire about number of pins other than those shown above.
2. Please inquire with us regarding availability.
3. Please keep the minimum order quantities no less than 50 pieces per lot.
4. Please inquire if further information is needed.
PRODUCT TYPES
Notes: 1. When placing an order, substitute the “∗” (asterisk) in the above part number with the number of pins for the specific connector.
2. The above part numbers are for connectors without positioning bosses, which are standard. When ordering connectors with positioning bosses, please contact our
local sales office.
For board-to-FPC
F4 Series
Connectors for
inspection usage
(0.4mm pitch)
Product name Number of pins
F4
for inspection
10 12 14 16 20 22 24 26 28 30 32 34 36 38 40 44 48 50 54 60 66 70 80
✩✩✩✩✩✩✩✩✩✩✩✩✩✩✩✩✩✩✩✩✩✩✩
Specifications Part No. Specifications Part No.
Socket Without positioning bosses AXK7LE∗∗26G Header Without positioning bosses AXK8LE∗∗26BG
FEATURES
1. 3,000 mating and unmating cycles
2. Same external dimensions and foot
pattern as standard type.
3. Improved mating
Insertion and removal easy due to a
reduction in mating retention force. This
is made possible by a simple locking
structure design.
Note: Mating retention force cannot be
warranted.
APPLICATIONS
Ideal for module unit inspection and
equipment assembly inspection
Socket Header
4.1mm
5.0mm
RoHS compliant
Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e/
AXK7L, 8L
ACCTB28E 20120-T
NOTES
1. Removal by pulling up from an end
causes the entire connector removal
force to concentrate on both the
soldering terminals and end terminals.
Please lift and remove from it’s side.
This will also prevent cracking of the
soldered parts.
2. Recommended PC board and metal
mask patterns
Connectors are mounted with high pitch
density, intervals of 0.35 mm, 0.4 mm or
0.5 mm.
In order to reduce solder bridges and
other issues make sure the proper levels
of solder is used.
The figures to the right are recommended
metal mask patterns. Please use them as
a reference.
Socket
Recommended PC board pattern
(Mount pad arrangement pattern)
Recommended metal mask pattern
Metal mask thickness: Here, 150 µm
(Terminal portion opening area ratio: 53%)
(Metal portion opening area ratio: 100%)
Recommended metal mask pattern
Metal mask thickness: Here, 120 µm
(Terminal portion opening area ratio: 66%)
(Metal portion opening area ratio: 100%)
Header
Recommended PC board pattern
(Mount pad arrangement pattern)
Relation between connector and mounting pad
Recommended metal mask pattern
Metal mask thickness: Here, 150 µm
(Terminal portion opening area ratio: 52%)
(Metal portion opening area ratio: 80%)
Recommended metal mask pattern
Metal mask thickness: Here, 120 µm
(Terminal portion opening area ratio: 66%)
(Metal portion opening area ratio: 100%)
Note: if excess solder is used in the
header retaining soldering
terminals, this may cause
incomplete socket mating.
Therefore, please follow the
recommended conditions shown
on the right.
Pull
Pull
NG
3.60±0.03
1.40±0.03
4.00±0.03
0.23±0.03
5.60±0.03
0.40±0.03
C 0.40
1.00±0.03
0.40±0.01
0.20±0.01
5.40±0.01
4.42±0.01
(0.49)
(1.00)
C 0.40
1.00±0.01
3.60±0.01
1.40±0.01
5.60±0.01
5.40±0.01
0.20±0.01
0.40±0.01
4.18±0.01
(0.61)
1.00±0.01
3.60±0.01
(1.00)
1.40±0.01
5.60±0.01
C 0.40
: Insulation area
Max. 2.20
1.40±0.03
0.40±0.03
0.23±0.03 0.57±0.03
4.70±0.03
3.20±0.03
1.40±0.03
0.40±0.03
Mounting pad
: Insulation area
(3.20±0.03)
(4.70±0.03)
(Max. 2.20)
0.40±0.01
0.20±0.01
1.40±0.01
0.46±0.01
4.50±0.01
3.60±0.01
(0.45)
0.40±0.01
1.40±0.01
0.40±0.01
0.20±0.01
1.40±0.01
0.57±0.01
0.40±0.01
4.50±0.01
3.36±0.01
(0.57)
1.40±0.01
Please refer to the latest product
specifications when designing your
product.
Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e/
Notes on Using Narrow-pitch Connectors (Common)
ACCTB48E 201204-T
Regarding the design of devices and PC board patterns
Regarding the selection of the connector placement machine and the mounting
procedures
Notes on Using Narrow-pitch Connectors
(Common)
1) When connecting several connectors
together by stacking, make sure to
maintain proper accuracy in the design of
structure and mounting equipment so
that the connectors are not subjected to
twisting and torsional forces.
2) With mounting equipment, there may
be up to a ±0.2 to 0.3-mm error in
positioning. Be sure to design PC boards
and patterns while taking into
consideration the performance and
abilities of the required equipment.
3) Some connectors have tabs embossed
on the body to aid in positioning. When
using these connectors, make sure that
the PC board is designed with positioning
holes to match these tabs.
4) To ensure the required mechanical
strength when soldering the connector
terminals, make sure the PC board
meets recommended PC board pattern
design dimensions given.
5) For all connectors of the narrow-pitch
series, to prevent the PC board from
coming off during vibrations or impacts,
and to prevent loads from falling directly
on the soldered portions, be sure to
design some means to fix the PC board
in place.
Example) Secure in place with screws
When connecting PC boards, take
appropriate measures to prevent the
connector from coming off.
6) Notes when using a FPC.
(1) When the connector is soldered to an
FPC board, during its insertion and
removal procedures, forces may be
applied to the terminals and cause the
soldering to come off. It is recommended
to use a reinforcement board on the
backside of the FPC board to which the
connector is being connected. Please
make the reinforcement board
dimensions bigger than the outer limits of
the recommended PC board pattern
(should be approximately 1 mm greater
than the outer limit).
Material should be glass epoxy or
polyimide, and the thickness should be
between 0.2 and 0.3 mm.
(2) Collisions, impacts, or turning of FPC
boards, may apply forces on the
connector and cause it to come loose.
Therefore, make to design retaining
plates or screws that will fix the connector
in place.
7) The narrow-pitch connector series is
designed to be compact and thin.
Although ease of handling has been
taken into account, take care when
mating the connectors, as displacement
or angled mating could damage or
deform the connector.
Connector
Spacer
Spacer PC board
Screw
1) Select the placement machine taking
into consideration the connector height,
required positioning accuracy, and
packaging conditions.
2) Be aware that if the catching force of
the placement machine is too great, it
may deform the shape of the connector
body or connector terminals.
3) Be aware that during mounting,
external forces may be applied to the
connector contact surfaces and terminals
and cause deformations.
4) Depending on the size of the
connector being used, self alignment
may not be possible. In such cases, be
sure to carefully position the terminal with
the PC board pattern.
5) The positioning bosses give an
approximate alignment for positioning on
the PC board. For accurate positioning of
the connector when mounting it to the PC
board, we recommend using an
automatic positioning machine.
6) Excessive mounter chucking force may
deform the molded or metal part of the
connector. Consult us in advance if
chucking is to be applied.
Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e/
Notes on Using Narrow-pitch Connectors (Common)
ACCTB48E 201204-T
Regarding soldering
1. Reflow soldering
1) Measure the recommended profile
temperature for reflow soldering by
placing a sensor on the PC board near
the connector surface or terminals. (The
setting for the sensor will differ depending
on the sensor used, so be sure to
carefully read the instructions that comes
with it.)
2) As for cream solder printing, screen
printing is recommended.
3) To determine the relationship between
the screen opening area and the PC-
board foot pattern area, refer to the
diagrams in the recommended patterns
for PC boards and metal masks. Make
sure to use the terminal tip as a reference
position when setting. Avoid an excessive
amount of solder from being applied,
otherwise, interference by the solder will
cause an imperfect contact.
4) Consult us when using a screen-
printing thickness other than that
recommended.
5) When mounting on both sides of the
PC board and the connector is mounting
on the underside, use adhesives or other
means to ensure the connector is
properly fixed to the PC board. (Double
reflow soldering on the same side is
possible.)
6) N2 reflow, conducting reflow soldering
in a nitrogen atmosphere, increases the
solder flow too greatly, enabling wicking
to occur. Make sure that the solder feed
rate and temperature profile are
appropriate.
Soldering conditions
Please use the reflow temperature profile
conditions recommended below for
reflow soldering. Please contact us
before using a temperature profile other
than that described below (e.g. lead-free
solder).
• Narrow-pitch connectors
(except P8 type)
• Narrow-pitch connector (P8)
For products other than the ones above,
please refer to the latest product
specifications.
7) The temperatures are measured at the
surface of the PC board near the
connector terminals. (The setting for the
sensor will differ depending on the sensor
used, so be sure to carefully read the
instructions that comes with it.)
8) The temperature profiles given in this
catalog are values measured when using
the connector on a resin-based PC
board. When performed reflow soldering
on a metal board (iron, aluminum, etc.) or
a metal table to mount on a FPC, make
sure there is no deformation or
discoloration of the connector beforehand
and then begin mounting.
9) Consult us when using a screen-
printing thickness other than that
recommended.
10) Some solder and flux types may
cause serious solder creeping. Solder
and flux characteristics should be taken
into consideration when setting the reflow
soldering conditions.
2. Hand soldering
1) Set the soldering iron so that the tip
temperature is less than that given in the
table below.
2) Do not allow flux to spread onto the
connector leads or PC board. This may
lead to flux rising up to the connector
inside.
3) Touch the soldering iron to the foot
pattern. After the foot pattern and
connector terminal are heated, apply the
solder wire so it melts at the end of the
connector terminals.
4) Be aware that soldering while applying
a load on the connector terminals may
cause improper operation of the
connector.
5) Thoroughly clean the soldering iron.
6) Flux from the solder wire may get on
the contact surfaces during soldering
operations. After soldering, carefully
check the contact surfaces and clean off
any solder before use.
7) For soldering of prototype devices
during product development, you can
perform soldering at the necessary
locations by heating with a hot-air gun by
applying cream solder to the foot pattern
beforehand. However, at this time, make
sure that the air pressure does not move
connectors by carefully holding them
down with tweezers or other similar tool.
Also, be careful not to go too close to the
connectors and melt any of the molded
components.
8) If an excessive amount of solder is
applied during manual soldering, the
solder may creep up near the contact
points, or solder interference may cause
imperfect contact.
3. Solder reworking
1) Finish reworking in one operation.
2) For reworking of the solder bridge, use
a soldering iron with a flat tip. To prevent
flux from climbing up to the contact
surfaces, do not add more flux.
3) Keep the soldering iron tip temperature
below the temperature given in Table A.
Te rminal Paste
solder
PC board
foot pattern
60 to 120 sec.
Preheating
Peak temperature
200°C
220°C
Upper limited (Solder heat resistance)
Peak temperature 260°C
230°C
180°C
150°C
70 sec.
25 sec.
Lower limited (Solder wettability)
Time
Temperature
60 to 120 sec.
Preheating
Time
Temperature
Peak temperature
200°C
155 to 165°C
245°C max.
Within 30 sec.
Product name Soldering iron temperature
SMD type connectors 300°C within 5 sec.
350°C within 3 sec.
Apply the solder
wire here
Terminal
Pattern
PC board
Small angle as
possible up to
45 degrees
Soldering
iron
Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e/
Notes on Using Narrow-pitch Connectors (Common)
ACCTB48E 201204-T
Handling Single Components
Storage of connectors
Other Notes
1) Make sure not to drop or allow parts to
fall from work bench
2) Excessive force applied to the
terminals could cause warping, come
out, or weaken the adhesive strength of
the solder. Handle with care.
3) Repeated bending of the terminals
may cause terminals to break.
4) Do not insert or remove the connector
when it is not soldered. Forcibly applied
external pressure on the terminals can
weaken the adherence of the terminals to
the molded part or cause the terminals to
lose their evenness.
5) Excessive prying-force applied to one
end may cause product breakage and
separation of the solder joints at the
terminal.
Excessive force applied for insertion in a
pivot action as shown may also cause
product breakage.
Align the header and socket positions
before connecting them.
Cleaning flux from PC board
1) To increase the cleanliness of the
cleaning fluid and cleaning operations,
prepare equipment for cleaning process
beginning with boil cleaning, ultrasonic
cleaning, and then vapor cleaning.
2) Carefully oversee the cleanliness of
the cleaning fluids to make sure that the
contact surfaces do not become dirty
from the cleaning fluid itself.
3) Since some powerful cleaning
solutions may dissolve molded
components of the connector and wipe
off or discolor printed letters, we
recommend aqua pura electronic parts
cleaners. Please consult us if you wish to
use other types of cleaning fluids.
4) Please note that the surfaces of
molded parts may whiten when cleaned
with alcohol.
Handling the PC board
• Handling the PC board after
mounting the connector
When cutting or bending the PC board
after mounting the connector, be careful
that the soldered sections are subjected
to excessive force.
The soldered areas should not be subjected to force.
1) To prevent problems from voids or air
pockets due to heat of reflow soldering,
avoid storing the connectors in areas of
high humidity. When storing the
connectors for more than six months, be
sure to consider storage area where the
humidity is properly controlled.
2) Depending on the connector type, the
color of the connector may vary from
connector to connector depending on
when it is produced.
Some connectors may change color
slightly if subjected to ultraviolet rays
during storage. This is normal and will not
affect the operation of the connector.
3) When storing the connectors with the
PC boards assembled and components
alreeady set, be careful not to stack them
up so the connectors are subjected to
excessive forces.
4) Avoid storing the connectors in
locations with excessive dust. The dust
may accumulate and cause improper
connections at the contact surfaces.
1) These products are made for the
design of compact and lightweight
devices and therefore the thickness of the
molded components has been made very
thin. Therefore, be careful during
insertion and removal operations for
excessive forces applied may damage
the products.
2) Dropping of the products or rough
mishandling may bend or damage the
terminals and possibly hinder proper
reflow soldering.
3) Before soldering, try not to insert or
remove the connector more than
absolutely necessary.
4) When coating the PC board after
soldering the connector to prevent the
deterioration of insulation, perform the
coating in such a way so that the coating
does not get on the connector.
5) There may be variations in the colors
of products from different production lots.
This is normal.
6) The connectors are not meant to be
used for switching.
7) Be sure not to allow external pressure
to act on connectors when assembling
PCBs or moving in block assemblies.
Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e/
Notes on Using Narrow-pitch Connectors (Common)
ACCTB48E 201204-T
Regarding sample orders to confirm proper mounting
When ordering samples to confirm
proper mounting with the placement
machine, connectors are delivered in 50-
piece units in the condition given right.
Consult a sale representative for ordering
sample units.
Condition when delivered from manufacturing
Required number
of products for
sample production
(Unit 50 pcs.)
Embossed tape
amount required for
the mounting
Reel
(Delivery can also be made on a reel by
customer request.)
Please refer to the latest product
specifications when designing your
product.
