Product News
FPC Connectors
Low-profile FPC connectors
with 0.3/0.5 mm-pitch Series
Additions
Wide Variety from ZIF (Zero Insertion Force) to Non-ZIF
Original backlock mechanism
ensures greater work efficiency
and higher reliability.
N
XF2H
Lineup of 10 to 53-pin
types Applicable FPC
thickness, t = 0.3 mm
XF2B 0.3 mm-pitch with zigzag
terminal arrangement
Applicable FPC thickness,
t = 0.2 mm
XF2M
XF2N
Low profile of 0.9 mm
Applicable FPC thickness,
t = 0.2 mm
XF2R
Low profile of 0.9 mm
Applicable FPC thickness,
t = 0.12 mm
Low Profile
General-purpose Types
Narrow Pitch
On-board area reduced by approx. 27%
(compared to existing OMRON models)
Applicable FPC thickness, t = 0.3 mm
■
S
●
●
 
●
 
●
 
●
Mobile phones Parsonal
Computers
XF2B
XF2M
XF2H
XF2M
XF2B
XF2N
XF2R
N-ZIF
■形XF2E
LowProfile,Non-ZIFType
●0.8mm-pitch
●On-boardprofileof1.5mm
●Double-sidedcontacts
●SMTterminals
■XF2N
LowProfileType
●0.5mm-pitch
●On-board profile
 of0.9mm
●Rotary backlock
 mechanism
●Double-sided  
 contacts
●SMTterminals
■形XF2G
TopEntry,Non-ZIFType
●0.5mm-pitch
●On-boardprofileof4.15mm
●Single-sidedcontacts
●SMTterminals
■XF2L
SmallestOn-boardAreaintheIndustry
●0.5mm-pitch
●On-boardprofileof1.2mm
●Slide-lockingmechanism
●Upper-contacttype
●SMTterminals
■XF2M
ReducedOn-boardArea
●0.5mm-pitch
●On-boardprofileof2mm
●Rotarybacklockmechanism
●Double-sidedcontacts
●SMTterminals
■XF2R
LowProfileType
●0.5mm-pitch
●On-board profile
 of0.9mm
●Rotary backlock
 mechanism
●Double-sided  
 contacts
●SMTterminals
■XF2L
Smallest On-board Area in
theIndustry
●0.5mm-pitch
●On-boardprofileof1.2mm
●Slide-lockingmechanism
●Lower-contacttype
●SMTterminals
■XF2B
0.3mm-pitchType
●0.3mm-pitch
●On-boardprofileof1.2mm
●Rotarybacklockmechanism
●Double-sidedcontacts
●SMTterminals
■XF2J
TopEntry,ZIFType
●0.5mm-pitch
●
On-boardprofileof4.15mm
●Slide-lockingmechanism
●Single-sidedcontacts
●SMTterminals
■形XF2H
StandardType
●0.5mm-pitch
●On-board profile
 of2mm
●Rotary backlock
 mechanism
●Double-sided  
 contacts
●SMTterminals
Features of Rotary Backlock Mechanism
High reliability. A mounted FPC will not come away if
excess force is applied to it.
Slider does not disconnect if the FPC is lifted.
Rotary slider independent of the FPC socket.
Rotary Slider
FPC Socket
Conventional Rotary Connector
XF2 Series
1.Mount the connector.
2.Release the rotary slider.
3.Insert the FPC.
2. Insert the FPC.
4.Lock the rotary slider.
1.Mount the connector.
3. Lock the rotary slider.
Upper Contact
Lower Contact
Upper Contact
Lower Contact
XF
Improvement 1
Enhanced mounting reliability as the FPC is
held in a four-shrouded housing and is
unaffected by the slider operation.
Construction prevents FPC positional
displacement.
Four-shrouded FPC housing.
Improvement 2
Connector commonality makes it unnecessary to
distinguish between the upper and lower
contacts when connecting upper and lower PCBs.
No need to discriminate between
the FPC upper and lower contacts.
Double-sided contacts
Improvement 3
Assembly productivity is better than with the
conventional rotary locking type, as release of
the rotary slider is unnecessary.
Reduces the labor required to mount FPCs.
Delivered with the rotary slider open (released).
Improvement 4
sm
Depth: 5.9 mm
(with the slider closed)
5.9mm
FPC guide section: 1.1 mm
Molded cover provided on bottom surface.
A wide variety of designs ranging
from 10 to 53 pins.
XF2B
XF2N
).
PCB design freedom increased
with bottom wall and low profile.
XF2B/XF2N
The provision of a bottom wall eliminates exposure of
terminals on the reverse side of the connector. The
XF2N and XF2B have low on-board profiles of 0.9 mm
and 1.2 mm respectively and the XF2B boasts a
narrow pitch of 0.3 mm, contributing to downsizing of
devices.
Improved FPC insertion sensation.
XF2R
The provision of an FPC guide section makes FPC
insertion easier and improves work efficiency. The
effective interface length has been increased to
ensure greater reliability.
Meeting a wide range of applications
with a variety of models with
between 10 and 53 pins.
XF2H
Backed by reliability proved by many years of success
and a new type of rotary lock construction, a broad range
of models can be used to handle a wide range of
applications.
On-board mounting area approx.
27% less than the XF2H.
XF2M
The depth has been significantly reduced to contribute
to product downsizing.
Slider guide that restricts vertical movement
Holding bracket
Mechanism that clicks when slider stops
With slider open
Depth: 4.6 mm max.
Height: 1.15 mm
(1.2 mm max.)
With slider close
Depth: 3.5 mm max.
Pattern can be added to
bottom of connector.
Bottom wall
With slider open
Features of XF2L Slide-locking Mechanism
Ultra-compact size: 18.9 mm (W) Å~ 3.5 mm (D) Å~ 1.2 mm (H)*1 for 30-pin models.
*1: A maximum of 1.2 mm including tolerance.
Smallest on-board area and volume in the industry achieves reduced
equipment size, thickness, and weight.
Occupies the smallest on-board area and volume in the industry.
Improvement 1
The slider guide prevents rattling when the slider is opened and
closed to allow smooth operation. The holding bracket prevents the
slider from becoming detached after the connector has been
assembled.
Employs slider guide to restrict vertical movement
and holding bracket to securely lock the slider.
Unique slider mechanism for stability and reliability.
Improvement 2
The wall on the reverse side of the connector
prevents terminals from protruding. Circuit
patterns can be added to the connector's
Wall on reverse side of connector
enhances freedom of board design.
Highest board design efficiency
in the industry.
Improvement 3
7
Rotary Backlock Mechanism and 0.3 mm-pitch
Design
Wall provided on reverse side of connector to allow grea ter fr eedom of
board design.
Double-sided (upper and lower) contact structure enables component
reductions.
Applicable FPC thickness, t = 0.2 mm. Gold-pla te d ty pe.
Use FPCs with the construction recommended by OMRON.
(Refer to specifications for details.)
Specifications Materials/Finish
Dimensions
XF2B- 45-31A
Ordering Information
note 1. Consult your OMRON representative for enquiries related to pin-number specifications.
note 2. Order an integer multiple of the quantity per reel.
Rated current 0.2A AC/DC
Rated voltage 50V AC/DC
Contact resistance 50mΩ max. (at 20 mV max., 100 mA max.)
Insulation resistance 100MΩ min. (at 250V DC)
Withstand voltage 250V AC for 1 min.
(leakage current: 1 mA max.)
Insertion tolerance 20 times
Ambient operating
temperature -30 to +85°C
(with no icing or condensation)
Housing LCP resin (UL94V-0) / natural
Slider LCP resin (UL94V-0) / black
Contact Spring copper alloy/nickel substrate (2 μm),
gold-plated contacts (0.15
μm)
Pins note 1 Model Quantity per reel
note 2
17 XF2B-1745-31A 1,500
23 XF2B-2345-31A
A ±0.03
B ±0.03
(B+0.6) ±0.05
4.5
(reinforcement board)
2.5 ±0.03
2-R0.2MAX
T=0.2 ±0.03
(Conductive plating)
0.3+0.04
-0.03
0.3+0.04
-0.03
0.6±0.02
0.3 ±0.02
0.3 ±0.07
0.25
1
21.2
0.6 ±0.02
A±0.05
B±0.05
0.3±0.05
5.4±0.1
0.75±0.05
0.75±0.05
0.3±0.05
0.3±0.05
0.6±0.05
0.6±0.05
5.5
C
D
A
B
(1.1)
(1.4)
1.23
5.2
0.5
0.55
0.1
0.5
2.1
1.2
0.6
0.6
0.3
Table of Dimensions
Pins Model ABCD
17 XF2B-1745-31A 4.2 4.8 5.5 7.0
23 XF2B-2345-31A 6.0 6.6 7.3 8.8
Printed Circuit Board Matching Dimensions (Top View)
Applicable FPC Dimensions
Rotary Backlock Type (0.3 mm-pitch)
XF2B
8
XF2N
Low-profile Rotary Backlock Type (0.5 mm-pitch)
Greater Freedom of Board Design with 0.9-mm
Profile and Bottom Wall
Backlock mechanism makes FPC mounting significantly easier.
Double-sided (upper and lower) contact structure enables component
reductions.
Applicable FPC thic kn e ss, t = 0.2 mm. Gold-plated type .
Use FPCs with the construction recommended by OMRON.
(Refer to specifications for details.)
Specifications Materials/Finish
Dimensions
XF2N- 15-3
Ordering Information
note 1. Consult your OMRON representative for enquiries related to pin-number specifications.
note 2. Order an integer multiple of the quantity per reel.
Rated current 0.3A AC/DC
Rated voltage 50V AC/DC
Contact resistance 40mΩmax. (at 20 mV max., 100 mA max.)
Insulation resistance 100 MΩ min. (at 250 V DC)
Withstand voltage 250V AC for 1 min.
(leakage current: 1 mA max.)
Insertion tolerance 20 times
Ambient operating
temperature -30 to +85°C
(with no icing or condensation)
Housing LCP resin (UL94V-0)/natural
Slider LCP resin (UL94V-0)/black
Contact Spring copper alloy/nickel substrate (1.5μm),
gold-plated contacts (0.15μm)
Hold-down Spring copper alloy/fused-tin plating (1.5μm)
Pins note 1 Model Quantity per reel
note 2
21 XF2N-2115-3 3,000
32 XF2N-3215-3
1.7
C
A
0.15
0.5
1.2
(Effective interface
langth for upper /
lower contacts)
2.12
B4.34
4.12 0.75
0.25+0.05
0
A ±0.05
0.5 ±0.05
Shape of connector
(E-0.3) ±0.05
1.4 ±0.05
4.02 ±0.03
1 ±0.03
(D+0.4) ±0.05
1.95 ±0.05
(4.12)
(B-0.1) ±0.05
0.5 ±0.1
0.35 ±0.03
(4.12)
0.5 ±0.05
A ±0.05
5 (reinforcement board)
2.5MIN
2.12
1.2
(Effective
interface langth)
Shape of connector
with FPC inserted
T=0.2 ±0.03
(Conductive plating)
1.62
1
0.87
Table of Dimensions
Pins Model ABCDE
21 XF2N-2115-3 10.0 11.1 13.0 13.8 11.8
32 XF2N-3215-3 15.5 16.6 18.5 19.3 17.3
Printed Circuit Board Matching Dimensions Applicable FPC Dimensions
(Top View)
9
FPC Insertion Sensation and Work Efficiency Significantly
Improved with 0.9-mm Profile and FPC Guide Section
FPC insertion sensation greatly improved with 1.1-mm FPC guide section.
The effective interface length for terminals has been increased to 1.4
mm to ensure stability in applications with a lot of movement.
Double-sided (upper and lower) contact structure enables component
reductions.
Applicable FPC thickness, t = 0.12 mm. Gold-plated type.
Use FPCs with the construction recommended by OMRON.
(Refer to specifications for details.)
Specifications Materials/Finish
Dimensions
XF2R- 15-4A
Ordering Information
note 1. Consult your OMRON representative for enquiries related to pin-number specifications.
note 2. Order an integer multiple of the quantity per reel.
Rated current 0.3A AC/DC
Rated voltage 50V AC/DC
Contact resistance 40mΩmax. (at 20 mV max., 100 mA max.)
Insulation resistance 100 MΩ min. (at 250V DC)
Withstand voltage 250V AC for 1 min.
(leakage current: 1 mA max.)
Insertion tolerance 20 times
Ambient operating
temperature -30 to +85°C
(with no icing or condensation)
Housing LCP resin (UL94V-0)/natural
Slider LCP resin (UL94V-0)/brown
Contact Spring copper alloy/nickel substrate (1.5μm),
gold-plated contacts (0.15μm)
Hold-down Spring copper alloy/fused-tin plating (1.5μm)
Pins note 1 Model Pins note 1 Model Quantity per reel
note 2
6XF2R-0615-4A 24 XF2R-2415-4A 3,0009XF2R-0915-4A 34 XF2R-3415-4A
18 XF2R-1815-4A 40 XF2R-4015-4A
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Table of Dimension s
Pins Model ABCDEFG
6 XF2R-0615-4A 5.0 2.5 3.6 6.1 4.1 4.55 5.35
9 XF2R-0915-4A 6.5 4.0 5.1 7.6 5.6 6.05 6.85
18 XF2R-1815-4A 11.0 8.5 9.6 12.1 10.1 10.55 11.35
24 XF2R-2415-4A 14.0 11.5 12.6 15.1 13.1 13.55 14.35
34 XF2R-3415-4A 19.0 16.5 17.6 20.1 18.1 18.55 −
40 XF2R-4015-4A 22.0 19.5 20.6 23.1 21.1 21.55 22.35
Printed Circuit Board Matching Dimensions (Top View)
Applicable FPC Dimensions
Low-profile Rotary Backlock Type (0.5 mm-pitch)
XF2R
10
Reduced-area Type Requires Approx. 27% Less
On-board mounting area than the XF2H
Short body with depth of 5.9 mm (with slider closed).
Environment-friendly type that eliminates lead from solder is available
as a standard product.
Double-sided (upper and lower) contact structure enables component
reductions.
Applicable FPC thickness, t = 0.3 mm.
Specifications Materials/Finish
Dimensions
XF2M- 15-1F
Ordering Information
note 1. Consult your OMRON representative for enquiries related to pin-number specifications.
note 2. Order an integer multiple of the quantity per reel.
Rated current 0.5A AC/DC
Rated voltage 50V AC/DC
Contact resistance 40mΩ max. (at 20 mV max., 100 mA max.)
Insulation resistance 100 MΩ min. (at 250V DC)
Withstand voltage 250V AC for 1 min.
(leakage current: 1 mA max.)
Insertion tolerance 20 times
Ambient operating
temperature -30 to +85°C
(with no icing or condensation)
Housing LCP resin (UL94V-0)/natural
Slider LCP resin (UL94V-0)/black
Contact Spring copper alloy/nickel substrate (2μm),
tin-alloy plating (2μm)
Hold-down Spring copper alloy/fused-tin plating (1.5μm)
Pins note 1 Model Quantity per reel
note 2
40 XF2M-4015-1F 1,500
50 XF2M-5015-1F
Reference
pin mark
5.9
5.2
4.62
3.1
0.6
0.92
4.9
2
A
B
C
D
E
0.15
0.5±0.08
4.5
(reinforcement board)
2.5MIN
(B-0.1) ±0.05
A ±0.05
0.5 ±0.1
0.5 ±0.05
0.35 ±0.03
A ±0.05
0.5 ±0.05 (0.25)
1.1
2.6
1.5
F ±0.1
G ±0.1
3.4
1.1
1.35
(Effective interface
length)
T=0.3 ±0.05
(Conductive plating)
Table of Dimensions
Pins Model A B C D E F G
40 XF2M-4015-1F 19.5 20.6 23.5 24.1 22.1 21.1 24.5
50 XF2M-5015-1F 24.5 25.6 28.5 29.1 27.1 26.1 29.5
Printed Circuit Board Matching Dimensions (Top View)
Applicable FPC Dimensions
XF2M
Reduced-area Rotary Backlock Type (0.5 mm-pitch)
11
New rotary lock concept achieves high
reliability and superior work efficiency.
The unique rotary lock construction significantly improves work
efficiency
during FPC mounting.
Double-sided co ntacts maintain a stable contact force.
Discrimination between FPC upper and lower contacts in
unnecessary.
Applicable FPC thic kn e ss, t = 0.3 mm.
Specifications Materials/Finish
Dimensions
XF2H- 15-1LW
Rated current 0.5A AC/DC
Rated voltage 50V AC/DC
Contact resistance 30mΩ max. (at 20 mV max., 100 mA max.)
Insulation resistance 100 MΩ min. (at 250V DC)
Withstand voltage 250V AC for 1 min.
(leakage current: 1 mA max.)
Insertion tolerance 20 times
Ambient operating
temperature -30 to +85°C
(with no icing or condensation)
Housing PA6T resin (UL94V-0)/natural
Slider LCP resin (UL94V-0)/black
Contact Spring copper alloy/nickel substrate (2μm),
tin-alloy plating (2μm)
Hold-down Spring copper alloy/fused-tin plating (1.5μm)
C
D
B ±0.05
E ±0.1
B +0.25
note
F ±0.1
0.5 ±0.05 (0.25)
A
B
0.5
7.3
1
3.2
2
(8.1)
6.74
6.35
3.44
(1.9)
2.8MIN
1.7
(Effective
interface
length)
0.5 ±0.1 (C-0.1) ±0.07
B ±0.05
0.5 ±0.05 0.35 ±0.03
T=0.3 ±0.05
(Conductive plating)
1.3
1.5
2.2
2.3
note
Pattern-prohibited Area
If there is a pattern or via hole in this area, a short-circuit may occur in the terminals.
Table of Dimens ions
Pins Model ABCDEF
10 XF2H-1015-1LW 9.1 4.5 5.6 8.5 6.5 10.1
12 XF2H-1215-1LW 10.1 5.5 6.6 9.5 7.5 11.1
13 XF2H-1315-1LW 10.6 6.0 7.1 10.0 8.0 11.6
14 XF2H-1415-1LW 11.1 6.5 7.6 10.5 8.5 12.1
18 XF2H-1815-1LW 13.1 8.5 9.6 12.5 10.5 14.1
20 XF2H-2015-1LW 14.1 9.5 10.6 13.5 11.5 15.1
21 XF2H-2115-1LW 14.6 10.0 11.1 14.0 12.0 15.6
22 XF2H-2215-1LW 15.1 10.5 11.6 14.5 12.5 16.1
24 XF2H-2415-1LW 16.1 11.5 12.6 15.5 13.5 17.1
25 XF2H-2515-1LW 16.6 12.0 13.1 16.0 14.0 17.6
26 XF2H-2615-1LW 17.1 12.5 13.6 16.5 14.5 18.1
28 XF2H-2815-1LW 18.1 13.5 14.6 17.5 15.5 19.1
30 XF2H-3015-1LW 19.1 14.5 15.6 18.5 16.5 20.1
32 XF2H-3215-1LW 20.1 15.5 16.6 19.5 17.5 21.1
33 XF2H-3315-1LW 20.6 16.0 17.1 20.0 18.0 21.6
34 XF2H-3415-1LW 21.1 16.5 17.6 20.5 18.5 22.1
35 XF2H-3515-1LW 21.6 17.0 18.1 21.0 19.0 22.6
36 XF2H-3615-1LW 22.1 17.5 18.6 21.5 19.5 23.1
38 XF2H-3815-1LW 23.1 18.5 19.6 22.5 20.5 24.1
40 XF2H-4015-1LW 24.1 19.5 20.6 23.5 21.5 25.1
42 XF2H-4215-1LW 25.1 20.5 21.6 24.5 22.5 26.1
45 XF2H-4515-1LW 26.6 22.0 23.1 26.0 24.0 27.6
50 XF2H-5015-1LW 29.1 24.5 25.6 28.5 26.5 30.1
53 XF2H-5315-1LW 30.6 26.0 27.1 30.0 28.0 31.6
Printed Circuit Board Matching Dimensions Applicable FPC Dimensions
(Top View)
Standard Rotary Backlock Type (0.5 mm-pitch)
XF2H
12
Ordering Information
note 1. Consult your OMRON representative for enquiries related to pin-number specifications.
note 2. Order an integer multiple of the quantity per reel.
We will also accept small lot orders (for 100 or 500 units). When ordering, please specify model numbers that end with -R100 for 100
units or -R500 for 500 units.
Pins note 1 Model Pins note 1 Model Pins note 1 Model Quantity per reel
note 2
10 XF2H-1015-1LW 24 XF2H-2415-1LW 35 XF2H-3515-1LW
1,500
12 XF2H-1215-1LW 25 XF2H-2515-1LW 36 XF2H-3615-1LW
13 XF2H-1315-1LW 26 XF2H-2615-1LW 38 XF2H-3815-1LW
14 XF2H-1415-1LW 28 XF2H-2815-1LW 40 XF2H-4015-1LW
18 XF2H-1815-1LW 30 XF2H-3015-1LW 42 XF2H-4215-1LW
20 XF2H-2015-1LW 32 XF2H-3215-1LW 45 XF2H-4515-1LW
21 XF2H-2115-1LW 33 XF2H-3315-1LW 50 XF2H-5015-1LW
22 XF2H-2215-1LW 34 XF2H-3415-1LW 53 XF2H-5315-1LW
XF2H XF2H
13
Greater Freedom of Board Design with Smallest
On-board Area in Industry and Bottom Wall
Occupies the smallest on-board area and volume in the
industry.
Low on-board profile of only 1.2 mm max.
Highest efficiency with board design surfaces in the industry
with bottom wall preventing terminal exposure.
Construction employs secure locking mechanism.
Applicable FPC thic kn e ss, t = 0.3 mm.
Specifications Materials/Finish
Dimensions
Table of Dimensions
Upper-contact Type Lower-contact Type
Rated current 0.5A AC/DC
Rated voltage 50V AC/DC
Contact resistance 30mΩ max.
(at 20 mV DC max., 100 mA max.)
Insulation resistance 100 MΩ min. (at 250V DC)
Withstand voltage 250V AC for 1 min.
(leakage current: 1 mA max.)
Insertion tolerance 30 times
Ambient operating
temperature -30 to +85°C
(with no icing or condensation)
Model
Ordering XF2L
(Upper-contact Type) XF2L
(Lower-contact Type)
Housing LCP resin (UL94V-0)/natural
Slider LCP resin (UL94V-0)/
black LCP resin (UL94V-0)/
brown
Contact Spring copper alloy/nickel substrate (2 μm),
tin-alloy plating (2 μm)
Hold-down Spring copper alloy/fused-tin plating (1.5 μm)
3.05
3.45
3.05
3.45
4.55
4.55
B
C
A
0.5 ±0.08 (0.2)
0.75
1.05
1
D
1.2 MAX.
With slider open
With slider open
F
E
A ±0.05
G ±0.1
H ±0.1
0.5 ±0.05 (0.25)
1
0.55
1.34
(D-0.1) ±0.05
A ±0.05
0.5 ±0.1
2.5 MIN.
(5)
reinforcement board
note. 3
0.5 ±0.05
0.35 ±0.03
Applicable FPC Dimensions Printed Circuit Board Matching Dimensions (Top View)
D
1.2 MAX
XF2L- 25-1 (Upper-contact Type)
XF2L- 35-1 (Lower-contact Type)
XF2L- 25-1
(Cross Section of Upper-contact Type)
XF2L- 35-1
(Cross Section of Lower-contact Type)
1.35 (Effective
interface length)
XF2L- 5-1
T=0.3Å}0.03
(Cnductiv e plating)
PinsModel ABCDE F G H
4 XF2L-0425-1 1.5 5.9 6.9 2.6 5.88 6.88 5.28 7.28
6 XF2L-0625-1 2.5 6.9 7.9 3.6 6.88 7.88 6.28 8.28
7 XF2L-0725-1 3.0 7.4 8.4 4.1 7.38 8.38 6.78 8.78
8 XF2L-0825-1 3.5 7.9 8.9 4.6 7.88 8.88 7.28 9.28
9 XF2L-0925-1 4.0 8.4 9.4 5.1 8.38 9.38 7.78 9.78
10 XF2L-1025-1 4.5 8.9 9.9 5.6 8.88 9.88 8.28 10.28
12 XF2L-1225-1 5.5 9.9 10.9 6.6 9.88 10.88 9.28 11.28
13 XF2L-1325-1 6.0 10.4 11.4 7.1 10.38 11.38 9.78 11.78
18 XF2L-1825-1 8.5 12.9 13.9 9.6 12.88 13.88 12.28 14.28
21 XF2L-2125-1 10.0 14.4 15.4 11.1 14.38 15.38 13.78 15.78
26 XF2L-2625-1 12.5 16.9 17.9 13.6 16.88 17.88 16.28 18.28
30 XF2L-3025-1 14.5 18.9 19.9 15.6 18.88 19.88 18.28 20.28
Pins Model A B C D E F G H
5 XF2L-0535-1 2.0 6.4 7.4 3.1 6.38 7.38 5.78 7.78
6 XF2L-0635-1 2.5 6.9 7.9 3.6 6.88 7.88 6.28 8.28
7 XF2L-0735-1 3.0 7.4 8.4 4.1 7.38 8.38 6.78 8.78
8 XF2L-0835-1 3.5 7.9 8.9 4.6 7.88 8.88 7.28 9.28
10 XF2L-1035-1 4.5 8.9 9.9 5.6 8.88 9.88 8.28 10.28
12 XF2L-1235-1 5.5 9.9 10.9 6.6 9.99 10.88 9.28 11.28
13 XF2L-1335-1 6.0 10.4 11.4 7.1 10.38 11.38 9.78 11.78
15 XF2L-1535-1 7.0 11.4 12.4 8.1 11.38 12.38 10.78 12.78
18 XF2L-1835-1 8.5 12.9 13.9 9.6 12.88 13.88 12.28 14.28
19 XF2L-1935-1 9.0 13.4 14.4 10.1 13.38 14.38 12.78 14.78
20 XF2L-2035-1 9.5 13.9 14.9 10.6 13.88 14.88 13.28 15.28
22 XF2L-2235-1 10.5 14.9 15.9 11.6 14.88 15.88 14.28 16.28
24 XF2L-2435-1 11.5 15.9 16.9 12.6 15.88 16.88 15.28 17.28
30 XF2L-3035-1 14.5 18.9 19.9 15.6 18.88 19.88 18.28 20.28
ZIF Slide-locking Type (0.5 mm-pitch)
XF2L
14
Ordering Information
note 1. Consult your OMRON representative for enquiries related to pin-number and lead-free plating specifications.
note 2. Order an integer multiple of the quantity per reel.
note 3. Use polyimide and thermoset adhesive for reinforcement film material.
Pins
note 1 Type Model Pins
note 1 Type Model Pins
note 1 Type Model Quantity per reel
note 2
4 Upper-contact XF2L-0425-1 10 Upper-contact XF2L-1025-1 19 Lower-contact XF2L-1935-1
3,000
5 Lower-contact XF2L-0535-1 Lower-contact XF2L-1035-1 20 Lower-contact XF2L-2035-1
6Upper-contact XF2L-0625-1 12 Upper-contact XF2L-1225-1 21 Upper-contact XF2L-2125-1
Lower-contact XF2L-0635-1 Lower-contact XF2L-1235-1 22 Lower-contact XF2L-2235-1
7Upper-contact XF2L-0725-1 13 Upper-contact XF2L-1325-1 24 Lower-contact XF2L-2435-1
Lower-contact XF2L-0735-1 Lower-contact XF2L-1335-1 26 Upper-contact XF2L-2625-1
8Upper-contact XF2L-0825-1 15 Lower-contact XF2L-1535-1 30 Upper-contact XF2L-3025-1
Lower-contact XF2L-0835-1 18 Upper-contact XF2L-1825-1 Lower-contact XF2L-3035-1
9 Upper-contact XF2L-0925-1 Lower-contact XF2L-1835-1 −
−−
XF2L XF2L
15
Top-entry ZIF Connector
Low on-board profile of only 4.15 mm.
Adhesion face on top of the connector suits automatic mounting.
Models with reverse terminal arrangement also avai lable.
Applicable FPC thic kn e ss, t = 0.3 mm.
Specifications Materials/Finish
Dimensions
Table of Dimensions
Rated current 0.5A AC/DC
Rated voltage 50V AC/DC
Contact resistance 30mΩ max. (at 20 mV max., 100 mA max.)
Insulation resistance 100 MΩ min. (at 250V DC)
Withstand voltage 250V AC for 1 min.
(leakage current: 1 mA max.)
Insertion tolerance 30 times
Ambient operating
temperature -30 to +85°C
(with no icing or condensation)
Housing PA46 resin (UL94V-0)/natural
Slider PPS resin (UL94V-0)/black
LCP resin (UL94V-0)/black
Contact Spring copper alloy/nickel substrate (2μm),
tin-alloy plating (2μm)
Hold-down Spring copper alloy/fused-tin plating (1.5μm)
Pins Model ABCD
Standard Terminal
Arrangement Reverse Terminal
Arrangement
6 XF2J-0624-11 XF2J-0624-12 7.5 2.5 3.6 6.9
8 XF2J-0824-11 XF2J-0824-12 8.5 3.5 4.6 7.9
10 XF2J-1024-11 XF2J-1024-12 9.5 4.5 5.6 8.9
12 XF2J-1224-11 XF2J-1224-12 10.5 5.5 6.6 9.9
14 XF2J-1424-11
−
11.5 6.5 7.6 10.9
16 XF2J-1624-11 XF2J-1624-12 12.5 7.5 8.6 11.9
18 XF2J-1824-11 XF2J-1824-12 13.5 8.5 9.6 12.9
20 XF2J-2024-11 XF2J-2024-12 14.5 9.5 10.6 13.9
22 XF2J-2224-11 XF2J-2224-12 15.5 10.5 11.6 14.9
24 XF2J-2424-11 XF2J-2424-12 16.5 11.5 12.6 15.9
26 XF2J-2624-11
−
17.5 12.5 13.6 16.9
28 XF2J-2824-11
−
18.5 13.5 14.6 17.9
30 XF2J-3024-11
−
19.5 14.5 15.6 18.9
B ±0.05
0.5 ±0.05
0.4 ±0.05
2.9
1.4 1.4
11
1.6
1.6
4
0.5 ±0.1 (C-0.1) ±0.07
B ±0.05
0.5 ±0.05
0.35 ±0.03
T=0.3 ±0.05
(Conductive plating)
3MIN
B ±0.05
0.5 ±0.05
0.5 ±0.05
2.9
1.4 1.4
11
1.6
1.6
4
2.95
4.15
3.4
2.4
2.3
0.2
1.3
0.8
D
C
B
A
1
0.5
2.95
4.15
3.4
2.4
2.3
0.2
1.3
0.8
D
(B)
C
B
A
1
0.5
Printed Circuit Board Matching Dimensions
(Top View)
Printed Circuit Board Matching Dimensions
(Top View)
Applicable FPC Dimensions Standard Terminal Arrangement Reverse Terminal Arrangement
XF2J- 24-11
ZIF Slide-locking Type (0.5 mm-pitch)
XF2J
16
Ordering Information
note 1. Consult your OMRON representative for enquiries related to pin-number and lead-free plating specifications.
note 2. Order an integer multiple of the quantity per reel.
note 3. We will also accept small lot orders (for 100 or 500 units) . When orderin g, please specify model numbers that end w ith -R100 for 100
units or -R500 for 500 units.
Pins
note 1
Model Quantity per reel
note 2
Standard Terminal
Arrangement Reverse Terminal
Arrangement
6XF2J-0624-11 XF2J-0624-12
1,000
8XF2J-0824-11 XF2J-0824-12
10 XF2J-1024-11 XF2J-1024-12
12 XF2J-1224-11 XF2J-1224-12
14 XF2J-1424-11 −
16 XF2J-1624-11 XF2J-1624-12
18 XF2J-1824-11 XF2J-1824-12
20 XF2J-2024-11 XF2J-2024-12
22 XF2J-2224-11 XF2J-2224-12
24 XF2J-2424-11 XF2J-2424-12
26 XF2J-2624-11 −
28 XF2J-2824-11 −
30 XF2J-3024-11 −
XF2J XF2J
17
Top-entry ZIF Connector
Low on-board profile of only 4.15 mm.
Adhesion face on top of the connector suits automatic mounting.
Applicable FPC thic kn e ss, t = 0.3 mm.
Specifications Materials/Finish
Dimensions
XF2G- 14-11
Ordering Information
note 1. Consult your OMRON representative for enquiries related to pin-number specifications.
note 2. Order an integer multiple of the quantity per reel.
Rated current 0.5A AC/DC
Rated voltage 50V AC/DC
Contact resistance 30mΩ max. (at 20 mV max., 100 mA max.)
Insulation resistance 100 MΩ min. (at 250V DC)
Withstand voltage 250V AC for 1 min.
(leakage current: 1 mA max.)
Insertion tolerance 10 times
Ambient operating
temperature -30 to +85°C
(with no icing or condensation)
Housing PA46 resin (UL94V-0)/natural
Contact Spring copper alloy/nickel substrate (2μm),
tin-alloy plating (2μm)
Pins note 1 Model Quantity per reel
note 2
6XF2G-0614-11
1,000
14 XF2G-1414-11
16 XF2G-1614-11
24 XF2G-2414-11
26 XF2G-2614-11
A
B
C
0.5
2.4
2.95
3.4
4.15
0.2
4
1.6
1.6
0.5 ±0.05
C ±0.05
0.5 ±0.05
C ±0.05
B ±0.07
0.35 ±0.03
0.5 ±0.03
0.5 ±0.1
2.8
5
(reinforcement
board)
Table of Dimensions
Pins Model A B C
6 XF2G-0614-11 4.9 3.5 2.5
14 XF2G-1414-11 8.9 7.5 6.5
16 XF2G-1614-11 9.9 8.5 7.5
24 XF2G-2414-11 13.9 12.5 11.5
26 XF2G-2614-11 14.9 13.5 12.5
Printed Circuit Board Matching Dimensions (Top View)
Applicable FPC Dimensions
T=0.3Å}0.05
(Couductive pl ating)
Non-ZIF Type (0.5 mm-pitch)
XF2G
18
Low on-board profile of only 1.5 mm.
Double-sided co ntacts maintain a stable contact force.
Discrimination between FPC upper and lower contacts in
unnecessary.
Applicable FPC thickness, t = 0.3 mm..
Specifications Materials/Finish
Dimensions
Ordering Information
note 1. Consult your OMRON representative for enquiries related to pin-number specifications.
note 2. Order an integer multiple of the quantity per reel.
Rated current 0.5A AC/DC
Rated voltage 50V AC/DC
Contact resistance 30mΩ max. (at 20 mV max., 100 mA max.)
Insulation resistance 100 MΩ min. (at 250V DC)
Withstand voltage 500V AC for 1 min.
(leakage current: 1 mA max.)
Insertion tolerance 10 times
Ambient operating
temperature -30 to +85°C
(with no icing or condensation)
Housing Glass-filled modified PA resin (UL94V-0)/milk white
Contact Spring copper alloy/nickel substrate (2μm),
tin-alloy plating (2 μm)
Hold-down Copper-alloy/copper substrate (2μm),
tin-alloy plating (2μm)
A
C
B
1.2
D
0.3
1.5
0.20.8
1
0.6
2.85
4.9
5.6
0.1
0.2
0.4
2.1
2.8
+0.1
0
0.6 +0.1
0
0.3 0
-0.05
(1.4)
C ±0.05
0.8 ±0.05
(D+0.1) ±0.05
(B-0.1) ±0.07
C ±0.05
0.5 ±0.05
0.8 ±0.05
0.8 ±0.15
2.8
T=0.3 ±0.05
(Conductive plating)
Table of Dimensions
Pins Model ABCD
5 XF2E-0515-1 7.6 4.9 3.2 6.2
6 XF2E-0615-1 8.4 5.7 4.0 7.0
7 XF2E-0715-1 9.2 6.5 4.8 7.8
8 XF2E-0815-1 10.0 7.3 5.6 8.6
9 XF2E-0915-1 10.8 8.1 6.4 9.4
10 XF2E-1015-1 11.6 8.9 7.2 10.2
12 XF2E-1215-1 13.2 10.5 8.8 11.8
15 XF2E-1515-1 15.6 12.9 11.2 14.2
17 XF2E-1715-1 17.2 14.5 12.8 15.8
20 XF2E-2015-1 19.6 16.9 15.2 18.2
Basic Pattern Dimensions (Reference)
Applicable FPC Dimensions
XF2E- 15-1
Pins note 1 Model Pins note 1 Model Quantity per reel
note 2
5XF2E-0515-1 10 XF2E-1015-1
4,000
6XF2E-0615-1 12 XF2E-1215-1
7XF2E-0715-1 15 XF2E-1515-1
8XF2E-0815-1 17 XF2E-1715-1
9XF2E-0915-1 20 XF2E-2015-1
XF2E
Non-ZIF Type (0.8 mm-pitch)
19
Common Precautions for XF2 Connectors
Precautions
Backlock Types
Do not lock the slider without an FPC inserted. Locking the
slider without an FPC inserted will cause a decrease in the
dimensions between the contacts and consequently an
increase in the force required to insert an FPC.
・When designing the board, be sure to allow locking space
for the slider (i.e., space for the slider when it is locked).
・The connector has a double -sided contact structu re and so
be sure to insert the FPC with the correct orientation.
・When locking the slider, press it down securely with your
fingers at both ends.
Failing to lock th e slider properly may resu lt in contact fail-
ure.
・Unlocking the Sl ider
Unlock the slider manually. Place your index fingers at both
ends of the slider and lift it up. Do not apply excessive
force when lifting the slider. Doing so may result in the
slider being damaged or detached. If the slider becomes
detached, it may not be able to hold the FPC and contact
failure may result.
All Models
・Insert the FPC right to the back of the connector. Failing to
do so may result in a loss of contact reliability.
・After mounting (and locking) the FPC, do not bend or pull it
with excessive force. Doing so may result in FPC discon-
nection.
・When bending the FPC after mountin g to the PCB, do not
bend it excessively near the p lace where it enters the con-
nector. Doing so may result in a loss of contact reliability.
・In applications where the connector may frequently be
exposed to shock or vibration, or where, as part of a mech-
anism, connected parts may move, secure the FPC and
make sure that it is not subjected to a direct load.
・Do not perform reflow or manual soldering with the FPC
inserted in the connector. Doing so may result in a loss of
contact reliability.
・Unlock the slider befo re removing the FPC.
・Use an FPC with the structure recommended by OMRON.
・Do not perform reflow or manual soldering with the slider
locked. Doing so may result in a loss of contact reliability.
・Observe a metal mask thickness of t = 0.12 to 0.15 mm.
・Metal mask open area ratio: 90% of the printed circuit
board matching dimensions in the dimensions diagrams.
Recommended Reflow Conditions
Storage
1. Do not store in locations subject to dust or high humidity
levels.
2. Do not store in locations close to sources of gases such
ammonia gas or sulphide gas.
Correct Use Standard reflow
conditions
Reflow conditions
for lead-free solder
(backlock type only)
Preheating
temperature 150 ±10°C 150 to 180°C
Time 60 to 120 s 60 to 120 s
Soldering tem-
perature 200 to 240°C 230 to 250°C
Time
(10 s max. at the
maximum
t
emperature 240°C)
30 s max. 30 s max.
XF2 XF2
20
In the interest of product improvement, specifications are subject to change without notice.
ALL DIMENSIONS SHOWN ARE IN MILLIMETERS.
To convert millimeters into inches, multiply by 0.03937. To convert grams into ounces, multiply by 0.03527.
Cat. No. G011-E1- 02
OMRON Corporation
MARKETING SECTION
CONNECTOR DEPARTMENT
Electronic & Mechanical Components Division H.Q.
Work Shop4, Manufacturing Development Center
2-1, 2-Chome, Nishikusatsu, Kusatsu-City,
Shiga, 525-0035 Japan
Tel: (81)77-565-5314/Fax: (81)77-565-5581 Printed in Japan
0503-3M (0199)