38
特長 FEATURES
形名表記法 ORDERING CODE
用途 APPLICATIONS
Y電極にNi金属を使用し、端子電極部にメッキをしてあることにより、はん
だ付け性および耐熱性にすぐれ、マイグレーションもほとんど発生せず、
高い信頼性を示します
Y等価直列抵抗fESRgが小さく、ノイズ吸収性にすぐれています。特にタン
タルおよびアルミ電解コンデンサに比較した場合
Y高い許容リップル電流値
Y高い定格電圧でありながら小型形状
Y絶縁抵抗、破壊電圧が高く信頼性にすぐれる
等の特徴があります
YThe use of Nickel(Ni) as material for both the internal and external elec-
trodes improves the solderability and heat resistance characteristics. This
almost completely eliminates migration and raises the level of reliability
significantly.
YLow equivalent series resistance(ESR) provides excellent noise absorp-
tion characteristics.
YCompared to tantalum or aluminum electrolytic capacitors these ceramic
capacitors offer a number of excellent features, including:
Higher permissible ripple current values
Smaller case sizes relative to rated voltage
Improved reliability due to higher insulation resistance and break-
down voltage.
大容量積層セラミックコンデンサ
HIGH VALUE MULTILAYER CERAMIC
CAPACITORS
BJ
JMK316BJ106ML_TZ
KM10
MM20
ZM
A4
J 6.3
L10
E16
T25
G35
U50
K Plated QF Y5V K30VJ85C
J22NK82L
B J X7R K55VJ125C
M15L
B J X5R K55VJ85C
M15L
80
20
1
Rated voltagefVDCg
3
End termination
5
Temperature characteristics code
7
Capacitance tolerancesfLg
KStandard products
9
B Bulk
T Tape & reel
A 0.8
D 0.85
F 1.15
G
1.25
H 1.5
L 1.6
N 1.9
M 2.5
U 3.2
8
Thicknessfmmg
4
Dimensions(case size)fmmg
10
11
Packaging
Internal code
107f0603g1.6P0.8
212f0805g2.0P1.25
316f1206g3.2P1.6
325f1210g3.2P2.5
432f1812g4.5P3.2
B単品 f袋づめ g
Tリールテーピング
107f0603g1.6P0.8
212f0805g 2.0P1.25
316f1206g3.2P1.6
325f1210g3.2P2.5
432f1812g4.5P3.2
KM10 %
MM20 %
Z M%
A4
J 6.3
L10
E16
T25
G35
U50
Kメッキ品 QFM
B J M10
30
80
80
20
1
定格電圧 fVDCg
35
温度特性 fLg
7
容量許容差
K標準
個別仕様
9
包装
8
製品厚み fmmg
6
公称静電容量 fpFg
4
形状寸法 fEIAgLPWfmmg
10
当社管理記号
11
A0.8
D 0.85
F 1.15
G
1.25
H1.5
L1.6
N1.9
M2.5
U3.2
M積層コンデンサ
2
シリーズ名
例
473 47,000
105 1,000,000
Q標準品
QW スペース
MMultilayer ceramic
capacitors
2
Series name
Special code
QStandard products
F
BJ
X7R
X5R
F
Y5V
K25VJ85C
K55VJ125C
K55VJ85C
K25VJ85C
K30VJ85C
OPERATING TEMP.
YGeneral digital circuit
YPower supply bypass capacitors
Liquid crystal modules
Liquid crystal drive voltage lines
LS I, I C, converters(both for input and output)
YSmoothing capacitors
DC-DC converters (both for input and output)
Switching power supplies (secondary side)
Yデジタル回路全般
Y電源バイパスコンデンサ
液晶モジュール用
液晶駆動電圧ライン用
電源電圧の高いLSI、IC、OPアンプ用
Y平滑コンデンサ
DC-DCコンバータf入力、出力側用g
スイッチング電源f2次側用g
678
5
4
3
2
1910 11
6
Nominal capacitancefpFg
example
473 47,000
105 1,000,000
QWBlank space
端子電極
QW スペース
QWBlank space
39
外形寸法 EXTERNAL DIMENSIONS
■汎用積層セラミックコンデンサ General Multilayer Ceramic Capacitors
■低背積層セラミックコンデンサ Low profile Multilayer Ceramic Capacitors
P.40 P.44 P.78 P.80 P.86P.8
UnitDmm
f
inch
g
アイテム一覧
Part Numbers 特性図
Electrical Characteristics 梱包
Packaging 信頼性
Reliability Data 使用上の注意
Precautions
セレクションガイド
Selection Guide
CAPACITORS
etc
4
10LmaxDJMKtype ; 107type fCX1.0AFg, 212type fCX0.47AFg, 316type fCX10AFg,
325type fCX22AFg, 432type fCX47AFg
H H H 9.0LmaxDLMKtype ; 212type, 汎用316type fC＝10μFg, 低背316type fC＝4.7μFg
UMKtype ; 325type
16%max：JMKtype ; 107／212／316／325／432type
LMKtype ; 107／325／432, 汎用316type fC＞10μFg
H
Some exceptions apply, Refer to the available capacitance range table for the parts which are only available in X5R.
HH3.5LmaxDLMKtype ; 107type fCT0.47AFg, 212type fCT1.0AFg, 316N325N432type
EMKtype ; 107N212N316N325N432type
TMKtype ; 316type fCX0.47AFg, 325type, 432type
GMKtype ; 212type, 316type, 325type
UMKtype ; 212type fCX0.1AFg, 316type fCU0.47AFg, 325type
5.0LmaxDJMKtype ; 107type fCT1.0AFg, 212typefCT4.7AFg,
316typefCT10AFg, 325typefCT22AFg, 432typefCT47AFg
LMKtype ; 107type fCX0.47AFg, 212type fCU2.2AFg
BJ JIS BJ K25V85 20 M10 M20fMg2.5%max.**
EIA X7R* K55V125 25 M15 M10fKg
FJIS F K25V85 20 fZg7.0%max.***
EIA Y5V K30V85 25
温度範囲hCi
Temperature range
基準温度hCi
Ref. Temp.
静電容量変化率hLi
Capacitance change
温度特性コード
Temp. char.Code
静電容量許容差hLi
Capacitance tolerance
tandhLi
Dissipation factor
温度特性
Temperature characteristics
J
30
K
80
J
22
K
82
J80
K20
準拠規格
Applicable standard
注：＊1. M0.15mm公差あり
Note: ＊1. Inclulding dimension tolerance M0.15mm (M0.006inch).
概略バリエーション AVAILABLE CAPACITANCE RANGE
TypefEIAgLW T e
0.45M0.05 K
GMK107 1.6M0.10 0.8M0.10 f0.018M0.002g0.35M0.25
(0603) f0.063M0.004gf0.031M0.004g 0.8M0.10 Af0.014M0.010g
f0.031M0.004g
0.45M0.05 K
f0.018M0.002g
GMK212 2.0M0.10 1.25M0.10 0.85M0.10 D0.5M0.25
f0805gf0.079M0.004gf0.049M0.004gf0.033M0.004gf0.02M0.010g
1.25M0.10 G
f0.049M0.004g
0.85M0.10 D
f0.033M0.004g
1.15M0.10 F
GMK316 3.2M0.15 1.6M0.15 f0.045M0.004g0.50000
(1206) f0.126M0.006gf0.063M0.006g1.25M0.10 Gf0.020 g
f0.049M0.004g
1.6M0.20 L
f0.063M0.008g
0.85M0.10 D
f0.033M0.004g
1.15M0.10 F
f0.045M0.004g
GMK325 3.2M0.30 2.5M0.20 1.5M0.10 H0.6M0.3
(1210) f0.126M0.012gf0.098M0.008gf0.059M0.004gf0.024M0.012g
1.9M0.20 N
f0.075M0.008g
2.5M0.20 M
f0.098M0.008g
2.5M0.20 M
GMK432 4.5M0.40 3.2M0.30 f0.098M0.008g0.9M0.6
(1812) f0.177M0.016gf0.126M0.012g3.2M0.30 Uf0.035M0.024g
f0.125M0.012g
J0.35
K0.25
J0.014
K0.010
6.3 6.3 16 10 6.3 10 6.3 10 6.3 6.310 1025 6.3 16 10
Cap
[AF]
Type
Temp.Char
VDC
[pF:3digits]
212 316107 325
F/Y5V F/Y5V F/Y5VBJ/X7R BJ/X5R BJ/X5RBJ/X7RBJ/X7R
BJ/X5R F/Y5V BJ/X7R BJ/X5R
K
K
D
D
D
D
D
D
D
D
F
DF
F
D
FD
F
D
D
F
K
474
684
105
225
335
475
685
106
226
0.47
0.68
1.0
2.2
3.3
4.7
6.8
10.0
22.0
＊1
40
TMK107BJ223GA
TMK107BJ104GA
EMK107BJ333GA
EMK107BJ473GA
EMK107BJ683GA
EMK107BJ104GA
EMK107BJ154GA
EMK107BJ224GA
LMK107BJ334GA
LMK107BJ474GA
LMK107BJ684GA
LMK107BJ105GA
JMK107BJ225MA＊
EMK107F224ZA
EMK107F474ZA
LMK107F105ZA
JMK107F225ZA
M10L
M20L
M20L
J80L
K20L
PART NUMBERS
アイテム一覧
25V
16V
10V
6.3V
16V
10V
6.3V
F107TYPE (0603 case size)
0.8M0.10
(0.031M0.004)
M10L
M20L
J20L
J80L
K20L
0.022
0.1
0.033
0.047
0.068
0.1
0.15
0.22
0.33
0.47
0.68
1.0
2.2
0.22
0.47
1.0
2.2
BJ/X7R
BJ/X5R
BJ/X7R
BJ/X5R
F/Y5V
RatedVoltage
定 格
電 圧
F212TYPE (0805 case size)
50V
35V
25V
16V
10V
6.3V
50V
16V
10V
6.3V
BJ/X7R
BJ/X5R
BJ/X7R
BJ/X5R
BJ/X7R
BJ/X5R
BJ/X7R
BJ/X5R
F/Y5R
0.022
0.033
0.047
0.068
0.1
0.15
0.22
0.33
0.47
0.047
0.068
0.68
1.0
1.0
2.2
3.3
4.7
10
0.22
0.47
1.0
2.2
4.7
10
0.85M0.1
(0.033M0.004)
1.25M0.1
(0.049M0.004)
0.85M0.1
(0.033M0.004)
1.25M0.1
(0.049M0.004)
1.25M0.15
(0.049M0.006)
0.85M0.1(0.033M0.004)
1.25M0.1
(0.049M0.004)
RatedVoltage
Temperature
characteristics
Capacitance
[AF]
Capacitance
tolerance
Thickness
(inch)
定 格
電 圧
厚 み
[mm]
静電容量
許容差
公 称
静電容量 温度特性
■汎用積層セラミックコンデンサ General Multilayer Ceramic Capacitors
0.8M0.10
(0.031M0.004)
tanδ
Dissipation
factor
[L]Max.
Soldering method
R:リフロー
Reflow soldering
W:フロー
Wave soldering
実装条件
2.5
3.5
2.5
3.5
5
10
7
9
16
R,W
R
R,W
R
Temperature
characteristics
Capacitance
[AF]
Capacitance
tolerance
厚 み
[mm]
静電容量
許容差
公 称
静電容量 温度特性 tanδ
Dissipation
factor
[L]Max.
Soldering method
R:リフロー
Reflow soldering
W:フロー
Wave soldering
実装条件
Thickness
(inch)
2.5
3.5
5
10
7
16
R,W
R
R,W
R
Ordering code
形 名
UMK212BJ223GD
UMK212BJ333GD
UMK212BJ473GG
UMK212BJ683GG
UMK212BJ104GG
UMK212BJ154GG
UMK212BJ224GG
GMK212BJ334GG
GMK212BJ474GG
TMK212BJ473GD
TMK212BJ683GD
EMK212BJ684GG
EMK212BJ105GG
LMK212BJ105GG
LMK212BJ225MG
JMK212BJ335MG
JMK212BJ475MG
JMK212BJ106MG＊
UMK212F224ZD
UMK212F474ZG
UMK212F105ZG
EMK212F225ZG
LMK212F475ZG
JMK212F106ZG
Ordering code
形 名
G Please specify the capacitance tolerance code.
* Test Voltage of Loading at high temperature test is 1.5 time of the rated voltage.
形名のGには静電容量許容差記号が入ります。
*高温負荷試験の試験電圧は定格電圧の1.5倍
G Please specify the capacitance tolerance code.
* Test Voltage of Loading at high temperature test is 1.5 time of the rated voltage.
形名のGには静電容量許容差記号が入ります。
*高温負荷試験の試験電圧は定格電圧の1.5倍
CAPACITORS
44
41
F316TYPE(1206 case size)
0.15
0.22
0.47
0.68
1.0
0.15
0.22
0.33
0.68
0.68
1.0
2.2
3.3
4.7
3.3
4.7
10
22
2.2
4.7
10
22
1.15M0.1 (0.045M0.004)
1.6M0.2 (0.063M0.008)
0.85M0.1 (0.033M0.004)
1.15M0.1 (0.045M0.004)
1.6M0.2 (0.063M0.008)
1.15M0.1 (0.045M0.004)
1.6M0.2 (0.063M0.008)
1.25M0.1 (0.049M0.004)
1.6M0.2 (0.063M0.008)
PART NUMBERS
アイテム一覧
J80L
K20L
F325TYPE(1210 case size)
UMK325BJ105GH
GMK325BJ225MN
TMK325BJ225MH
TMK325BJ335MN
TMK325BJ475MN
TMK325BJ106MM＊
EMK325BJ475MN
EMK325BJ106MN
LMK325BJ106MN
JMK325BJ226MM
JMK325BJ476MM＊
UMK325F475ZH
GMK325F106ZH
LMK325F226ZN
JMK325F476ZN
JMK325F107ZM＊
1.0
2.2
2.2
3.3
4.7
10
4.7
10
10
22
47
4.7
10
22
47
100
M20L
50V
35V
25V
16V
10V
6.3V
50V
35V
10V
6.3V
RatedVoltage
定 格
電 圧
UMK316BJ154GF
UMK316BJ224GL
UMK316BJ474GL
GMK316BJ684GL
GMK316BJ105GL
TMK316BJ154GD
TMK316BJ224GF
TMK316BJ334GF
TMK316BJ684GL
EMK316BJ684
G
F
EMK316BJ105
G
F
EMK316BJ225ML
EMK316BJ335ML
EMK316BJ475ML
LMK316BJ335ML
LMK316BJ475ML
JMK316BJ106ML
JMK316BJ226ML＊
UMK316F225ZG
GMK316F475ZG
LMK316F106ZL
LMK316F226ZL
F/Y5V
50V
35V
25V
16V
10V
6.3V
50V
35V
10V
M10L
M20L
M20L
J80L
K20L00
RatedVoltage
定 格
電 圧
M10LM20L
G Please specify the capacitance tolerance code.
* Test Voltage of Loading at high temperature test is 1.5 time of the rated voltage.
形名のGには静電容量許容差記号が入ります。
*高温負荷試験の試験電圧は定格電圧の1.5倍
Ordering code
形 名
Temperature
characteristics
Capacitance
[AF]
Capacitance
tolerance
静電容量
許容差
公 称
静電容量 温度特性 tanδ
Dissipation
factor
[L]Max.
Soldering method
R:リフロー
Reflow soldering
W:フロー
Wave soldering
実装条件
BJ/X7R
BJ/X7R
BJ/X5R
2.5
3.5
2.5
3.5
5
10
7
9
16
R,W
R
R,W
R
Ordering code
形 名
Temperature
characteristics
Capacitance
[AF]
Capacitance
tolerance
静電容量
許容差
公 称
静電容量 温度特性 tanδ
Dissipation
factor
[L]Max.
Soldering method
R:リフロー
Reflow soldering
W:フロー
Wave soldering
実装条件
BJ/X7R
BJ/X5R
BJ/X7R
BJ/X5R
BJ/X7R
BJ/X5R
BJ/X7R
BJ/X5R
F/Y5V
3.5
5
10
9
7
16
R,W
R
R
BJ/X5R
厚 み
Thickness
(inch)
厚 み
[mm]
Thickness
(inch)
1.5M0.1 (0.059M0.004)
1.9M0.2 (0.075M0.008)
1.5M0.1 (0.059M0.004)
1.9M0.2 (0.075M0.008)
2.5M0.2 (0.098M0.008)
1.9M0.2 (0.075M0.008)
2.5M0.2 (0.098M0.008)
1.5M0.1 (0.059M0.004)
1.9M0.2 (0.075M0.008)
2.5M0.2 (0.098M0.008)
G Please specify the capacitance tolerance code.
* Test Voltage of Loading at high temperature test is 1.5 time of the rated voltage.
形名のGには静電容量許容差記号が入ります。
*高温負荷試験の試験電圧は定格電圧の1.5倍
42
PART NUMBERS
アイテム一覧
J80L
K20L
F432TYPE(1812 case size)
10
22
22
47
100
47
100
M20L
2.5M0.2 (0.098M0.008)
3.2M0.3 (0.125M0.012)
2.5M0.2 (0.098M0.08)
25V
16V
10V
6.3V
10V
6.3V
RatedVoltage
定 格
電 圧
形 名
Temperature
characteristics
Capacitance
[AF]
Capacitance
tolerance
静電容量
許容差
公 称
静電容量 温度特性 tanδ
Dissipation
factor
[L]Max.
Soldering method
R:リフロー
Reflow soldering
W:フロー
Wave soldering
実装条件
BJ/X5R
F/Y5V
3.5
5
10
16
R
R
TMK432BJ106MM
EMK432BJ226MM＊
LMK432BJ226MM
JMK432BJ476MM＊
JMK432BJ107MU＊
LMK432F476ZM＊
JMK432F107ZM＊
Ordering code
厚 み
[mm]
Thickness
(inch)
*高温負荷試験の試験電圧は定格電圧の1.5倍* Test voltage of Loading at high temperature test is 1.5 times of the rated voltage.
CAPACITORS
44
43
PART NUMBERSアイテム一覧
■低背積層セラミックコンデンサ Low profile Multilayer Ceramic Capacitors
J80L
K20L
F212TYPE(0805 case size)
0.47
0.68
1.0
1.0
2.2
4.7
M10L
M20L
0.85M0.1 (0.033M0.004)
0.45M0.05 (0.018M0.002)
0.85M0.1 (0.033M0.004)
16V
10V
6.3V
10V
6.3V
RatedVoltage
定 格
電 圧
形 名
Temperature
characteristics
Capacitance
[AF]
Capacitance
tolerance
静電容量
許容差
公 称
静電容量 温度特性 tanδ
Dissipation
factor
[L]Max.
Soldering method
R:リフロー
Reflow soldering
W:フロー
Wave soldering
実装条件
3.5
5
9
16
R, W
R
R
EMK212BJ474□D
EMK212BJ684□D
LMK212BJ105□D
JMK212BJ105□K
LMK212F225ZD
JMK212F475ZD
Ordering code
J80L
K20L
F316TYPE(1206 case size)
2.2
3.3
3.3
4.7
6.8
4.7
10
10
M20L
0.85M0.1 (0.033M0.004)
1.15M0.1 (0.045M0.004)
0.85M0.1 (0.033M0.004)
1.15M0.1 (0.045M0.004)
0.85M0.1 (0.033M0.004)
1.15M0.1 (0.045M0.004)
0.85M0.1 (0.033M0.004)
10V
6.3V
10V
6.3V
RatedVoltage
定 格
電 圧
形 名
Temperature
characteristics
Capacitance
[AF]
Capacitance
tolerance
静電容量
許容差
公 称
静電容量 温度特性 tanδ
Dissipation
factor
[L]Max.
Soldering method
R:リフロー
Reflow soldering
W:フロー
Wave soldering
実装条件
3.5
5
9
16
R
R
LMK316BJ225MD
LMK316BJ335MF
JMK316BJ335MD
JMK316BJ475MD
JMK316BJ685MF
LMK316F475ZD
LMK316F106ZF
JMK316F106ZD
Ordering code
J80L
K20L
F325TYPE(1210 case size)
1.0
3.3
4.7
10
10
22
M20L
0.85M0.1 (0.033M0.004)
1.15M0.1 (0.045M0.004)
0.85M0.1 (0.033M0.004)
1.15M0.1 (0.045M0.004)
25V
10V
6.3V
16V
10V
RatedVoltage
定 格
電 圧
形 名
Temperature
characteristics
Capacitance
[AF]
Capacitance
tolerance
静電容量
許容差
公 称
静電容量 温度特性 tanδ
Dissipation
factor
[L]Max.
Soldering method
R:リフロー
Reflow soldering
W:フロー
Wave soldering
実装条件
3.5
5
7
16
R
R
TMK325BJ105MD
LMK325BJ335MD
LMK325BJ475MF
JMK325BJ106MD
EMK325F106ZF
LMK325F226ZF
Ordering code
BJ/X7R
BJ/X5R
F/Y5V
BJ/X7R
BJ/X5R
F/Y5V
BJ/X7R
BJ/X5R
F/Y5V
形名のGには静電容量許容差記号が入ります。
厚 み
[mm]
Thickness
(inch)
厚 み
[mm]
Thickness
(inch)
厚 み
[mm]
Thickness
(inch)
F107TYPE(0603 case size)
0.47
1.0
M10L,M20L
J80L,K20L
0.45M0.05
(0.018M0.002)
6.3V
RatedVoltage
定 格
電 圧
形 名
Temperature
characteristics
Capacitance
[AF]
Capacitance
tolerance
静電容量
許容差
公 称
静電容量 温度特性 tanδ
Dissipation
factor
[L]Max.
Soldering method
R:リフロー
Reflow soldering
W:フロー
Wave soldering
実装条件
5
16 R
JMK107BJ474□K
JMK107F105ZK
Ordering code
形名のGには静電容量許容差記号が入ります。
厚 み
[mm]
Thickness
(inch)
BJ/X5R
F/Y5V
M10L
44
特性図 ELECTRICAL CHARACTERISTICS
JMK107F225Z
インピーダンスYESR–周波数特性例 Example of Impedance ESR vs. Frequency characteristics
Y当社積層セラミックコンデンサ例 (Taiyo Yuden multilayer ceramic capacitor)
LMK107F105Z LMK212F475Z
LMK316F106Z
LMK316F226Z
LMK432F476Z JMK432F107Z
CAPACITORS
44
45
特性図 ELECTRICAL CHARACTERISTICS
LMK212BJ105K LMK212BJ225M
LMK432BJ226M
JMK212BJ106M
81
CAPACITORS
4
RELIABILITY DATA 1/3
Item Temperature Compensating (Class 1)
Standard
Specified Value
Test Methods and RemarksHigh Permitivity (Class 2)
High ValueStandard Note1
K55 to J125C
K55 to J125C
50VDC,25VDC,
16VDC
No breakdown or dam-
age
10000 ME min.
0.5 to 5 pF: M0.25 pF
1 to 10pF: M0.5 pF
5 to 10 pF: M1 pF
11 pF or over: M 5%
M10%
105TYPERQ, SQ, TQ, UQ only
0.5〜2pF
: M
0.1pF
2.2〜20pF
: M
5
%
Under 30 pF
: QU400 + 20C
30 pF or over : QU1000
C= Nominal capacitance
CKD0M250
CJD0M120
CHD0M60
CGD0M30
PKDK150M250
PJDK150M120
PHDK150M60
RKDK220M250
RJDK220M120
RHDK220M60
SKDK330M250
SJDK330M120
SHDK330M60
TKDK470M250
TJDK470M120
THDK470M60
UKDK750M250
UJDK750M120
SLD
+350 to -1000 (ppm/C)
Appearance:
No abnormality
Capacitance change:
Within M5% or M0.5 pF,
whichever is larger.
BDK55 to J125C
FDK25 to J85C
BDK55 to J125C
FDK25 to J85C
50VDC,25VDC
K25 to J85C
K25 to J85C
50VDC,35VDC,25VDC
16VDC,10VDC,6.3VDC
4DVC
16VDC
No abnormality No breakdown or damage
500 MEAF. or 10000 ME., whichever is the
smaller.
Note 4
0.5 to 2 pF : M0.1 pF
2.2 to 5.1 pF : M5%
Refer to detailed speci-
fication
CHD0M60
RHDK220M60
fppm/Cg
Appearance:
No abnormality
Capacitance change:
WithinM0.5 pF
Appearance:
No abnormality
Capacitance change:
B, BJ: Within M12.5%
F: Within M30%
B: M10%, M20%
FD %
B: 2.5% max.
(50V, 25V)
F: 5.0% max.
(50V, 25V)
BDM10L
fK25V85Cg
FD L
fK25V85Cg
BfX7RgDM15L
FfY5VgD L
High Frequency Type
1.Operating Temperature
Range
2.Storage Temperature
Range
3.Rated Voltage
4.Withstanding Voltage
Between terminals
5.Insulation Resistance
6.Capacitance (Tolerance)
7.
Q or Tangent of Loss Angle
(tan d)
8.Temperature
Characteristic
of Capacitance
9.Resistance to Flexure of
Substrate
(Without
voltage
application)
Multilayer Ceramic Capacitor Chips
BJDM10L,
M20L
FD %
BJ: 2.5% max.(50V, 35V, 25V)
3.5% max. F
5.0% max. F
10.0% max. F
F: 7.0% max.
5.0% max. F
9.0% max. F
11.0% max. F
16.0% max. F
20.0% max. F
F See Table.1
BJDM10L
fK25V85Cg
FD L
fK25V85Cg
BJfX7R,X5RgDM15L
FfY5VgD L
J80
K20
J80
K20
J30
K80 J30
K80
According to JIS C 5102 clause 7.12.
Temperature compensating:
Measurement of capacitance at 20C and 85C shall be made
to calculate temperature characteristic by the following
equation.
(C - C )
P 10 (ppm/C)
C P QT
High permitivity:
Change of maximum capacitance deviation in step 1 to 5
Temperature at step 1: +20C
Temperature at step 2: minimum operating temperature
Temperature at step 3: +20C (Reference temperature)
Temperature at step 4: maximum operating temperature
Temperature at step 5: +20C
Reference temperature for X7R, X5R and Y5V shall be +25C
High Capacitance Type BJfX7RgDK55 to J125C
BJfX5RgDK55 to J85C
BFfY5VgDK30 to J85C
High Capacitance Type BJfX7RgDK55 to J125C
BJfX5RgDK55 to J85C
BFfY5VgDK30 to J85C
J22
K82 J22
K82
20
85 20 6
Warp: 2mm
Testing board: paper-phenol substrate
Thickness: 1.6mm
The measurement shall be made with board in the bent position.
Applied voltage: Rated voltageP3 (Class 1)
Rated voltageP2.5 (Class 2)
Duration: 1 to 5 sec.
Charge/discharge current: 50mA max. (Class 1,2)
Applied voltage: Rated voltage
Duration: 60M5 sec.
Charge/discharge current: 50mA max.
Measuring frequencyD
Class1D1ＭHzM10%fCT1000pFg
1ｋHzM10%fCX1000pFg
Class2D1ｋHzM10%fCT22
AFg
120HzM10HzfCX22AFg
Measuring voltageD
Class1D0.5V5VrmsfCT1000pFg
1M0.2VrmsfCX1000pFg
Class2D1M0.2VrmsfCT22
AFg
0.5M0.1VrmsfCX22AFg
Bias application: None
Multilayer:
Measuring frequencyD
Class1D1ＭHzM10%fCT1000pFg
1ｋHzM10%fCX1000pFg
Class2D1ｋHzM10%fCT22
AFg
120HzM10HzfCX22AFg
Measuring voltageD
Class1D0.5V5VrmsfCT1000pFg
1M0.2VrmsfCX1000pFg
Class2D1M0.2VrmsfCT22AFg
0.5M0.1VrmsfCX22AFg
Bias application: None
High-Frequency-Multilayer:
Measuring frequency: 1GHz
Measuring equipment: HP4291A
Measuring jig: HP16192A
83
CAPACITORS
4
RELIABILITY DATA 2/3
10.Body Strength
11.Adhesion of Electrode
12.Solderability
13.Resistance to soldering
14.Thermal shock
15.Damp Heat (steady state)
No mechanical dam-
age.
Appearance: No abnor-
mality
Capacitance change:
Within M2.5%
Q: Initial value
Insulation resistance:
Initial value
Withstanding voltage
(between terminals): No
abnormality
Appearance: No abnor-
mality
Capacitance change:
Within M0.25pF
Q: Initial value
Insulation resistance:
Initial value
Withstanding voltage
(between terminals): No
abnormality
Appearance: No abnor-
mality
Capacitance change:
Within M0.5pF,
Insulation resistance:
1000 ME min.
Appearance: No abnormality
Capacitance change: Within M7.5% (B, BJ)
Within M20% (F)
tan d: Initial value
Insulation resistance: Initial value
Withstanding voltage (between terminals): No
abnormality
Appearance: No abnormality
Capacitance change: Within M7.5% (B, BJ)
Within M20% (F)
tan d: Initial value
Insulation resistance: Initial value
Withstanding voltage (between terminals): No
abnormality
Appearance: No abnor-
mality
Capacitance change:
Within M2.5% or
M0.25pF, whichever is
larger.
Q: Initial value
Insulation resistance:
Initial value
Withstanding voltage
(between terminals): No
abnormality
Appearance: No abnor-
mality
Capacitance change:
Within M2.5% or
M0.25pF, whichever is
larger.
Q: Initial value
Insulation resistance:
Initial value
Withstanding voltage
(between terminals): No
abnormality
Appearance: No abnor-
mality
Capacitance change:
Within M5% or M0.5pF,
whichever is larger.
Q:
CU30 pF : QU350
10TC＜30 pF: QU275
+ 2.5C
C＜10 pF : QU200 +
10C
C: Nominal capacitance
Insulation resistance:
1000 ME min.
No separation or indication of separation of electrode.
At least 95% of terminal electrode is covered by new solder.
Appearance: No abnor-
mality
Capacitance change:
B: Within M12.5%
F: Within M30%
tan d: B: 5.0% max.
F: 7.5% max.
Insulation resistance: 50
MEAF or 1000 ME
whichever is smaller.
Appearance: No abnor-
mality
Capacitance change:
BJ: Within M12.5%
F: Within M30%
tan d: BJ: 5.0% max.
7.5% max.F
20.0% max.F
F: 11.0% max.
7.5% max.F
16.0% max.F
19.5% max.F
25.0% max.F
FSee Table.2
Insulation resistance:
50 MEAF or 1000 ME
whichever is smaller.
High Frequency Multilayer:
Applied force: 5N
Duration: 10 sec.
Applied force: 5N
Duration: 30M5 sec.
Solder temperature: 230M5C
Duration: 4M1 sec.
Preconditioning: Thermal treatment (at 150C for 1 hr)
(Applicable to Class 2.)
Solder temperature: 270M5C
Duration: 3M0.5 sec.
Preheating conditions: 80 to 100C, 2 to 5 min. or 5 to 10 min.
150 to 200C, 2 to 5 min. or 5 to 10 min.
Recovery: Recovery for the following period under the stan-
dard condition after the test.
24M2 hrs (Class 1)
48M4 hrs (Class 2)
Preconditioning: Thermal treatment (at 150C for 1 hr)
(Applicable to Class 2.)
Conditions for 1 cycle:
Step 1: Minimum operating temperature 30M3 min.
Step 2: Room temperature 15 min.
Step 3: Maximum operating temperature 30M3 min.
Step 4: Room temperature 15 min.
Number of cycles: 5 times
Recovery after the test: 24M2 hrs (Class 1)
48M4 hrs (Class 2)
Item Temperature Compensating (Class 1)
Standard
Test Methods and RemarksHigh Permittivity (Class 2)
High ValueStandard Note1High Frequency Type
Specified Value
MultilayerD
Preconditioning: Thermal treatment (at 150C for 1 hr)
(Applicable to Class 2.)
Temperature: 40M2C
Humidity: 90 to 95% RH
Duration: 500 hrs
Recovery: Recovery for the following period under the stan-
dard condition after the removal from test chamber.
24M2 hrs (Class 1)
48M4 hrs (Class 2)
High-Frequency Multilayer:
Temperature: 60M2C
Humidity: 90 to 95% RH
Duration: 500 hrs
Recovery: Recovery for the following period under the stan-
dard condition after the removal from test chamber.
24M2 hrs (Class 1)
Multilayer Ceramic Capacitor Chips
+24
K
0
+24
K
0
85
CAPACITORS
4
RELIABILITY DATA 3/3
According to JIS C 5102 Clause 9. 9.
Multilayer:
Preconditioning: Voltage treatment (Class 2)
Temperature: 40M2C
Humidity: 90 to 95% RH
Duration: 500 hrs
Applied voltage: Rated voltage
Charge and discharge current: 50mA max. (Class 1,2)
Recovery: Recovery for the following period under the standard
condition after the removal from test chamber.
24M2 hrs (Class 1)
48M4 hrs (Class 2)
High-Frequency Multilayer:
Temperature: 60M2C
Humidity: 90 to 95% RH
Duration: 500 hrs
Applied voltage: Rated voltage
Charge and discharge current: 50mA max.
Recovery: 24M2 hrs of recovery under the standard condi-
tion after the removal from test chamber.
According to JIS C 5102 clause 9.10.
Multilayer:
Preconditioning: Voltage treatment (Class 2)
Temperature:125M3CfClass 1, Class 2: B, BJfX7Rgg
85M2C (Class 2: BJ,F)
Duration: 1000 hrs
Applied voltage: Rated voltageP2, , P1.5（Table.4）
Recovery: Recovery for the following period under the stan-
dard condition after the removal from test chamber.
As for Ni product, thermal treatment shall be performed
prior to the recovery.
24M2 hrs (Class 1)
48M4 hrs (Class 2)
High-Frequency Multilayer:
Temperature: 125M3C (Class 1)
Duration: 1000 hrs
Applied voltage: Rated voltageP2
Recovery: 24M2 hrs of recovery under the standard condi-
tion after the removal from test chamber.
16.Loading under Damp Heat
17.Loading at High Tempera-
ture
Appearance: No abnor-
mality
Capacitance change:
CT2 pF: Within M0.4 pF
CX2 pF: Within M0.75
pF
CD Nominal capaci-
tance
Insulation resistance:
500 ME min.
Appearance: No abnor-
mality
Capacitance change:
Within M3% or
M0.3pF, whichever is
larger.
Insulation resistance:
1000 ME min.
Appearance: No abnor-
mality
Capacitance change:
Within M7.5% or
M0.75pF, whichever is
larger.
Q: CU30 pF: QU200
C＜30 pF: QU100 +
10C/3
CD Nominal capaci-
tance
Insulation resistance:
500 ME min.
Appearance: No abnor-
mality
Capacitance change:
Within M3% or
M0.3pF, whichever is
larger.
Q: CU30 pF : QU350
10TC＜30 pF: QU275
+ 2.5C
C＜10 pF: QU200 +
10C
CD Nominal
capacitance
Insulation resistance:
1000 ME min.
Appearance: No abnor-
mality
Capacitance change:
BJ: Within M12.5%
(50V, 35V, 25V)
Within M15.0% (16V
and under)
F: Within M30%
tan d: BJ:
5.0% max.
7.5% max.F
20.0% max.F
F:
11.0% max.
7.5% max.F
16.0% max.F
19.5% max.F
25.0% max.F
FSee Table.2
Insulation resistance:
25 MEAF or 500 ME,
whichever is the smaller.
Appearance: No abnormality
Capacitance change:
BJ: Within M12.5%
F: Within M30%
tan d: 5.0% max.
7.5% max.F
20.0% max.F
F: 11.0% max.
7.5% max.F
16.0% max.F
19.5% max.F
25.0% max.F
FSee Table.2
Insulation resistance: 50
MEAF or 1000 ME, which-
ever is smaller.
Appearance: No abnor-
mality
Capacitance change:
B: Within M12.5%
F: Within M30%
tan d: B: 5.0% max.
F: 7.5% max.
Insulation resistance:
25 MEAF or 500 ME,
whichever is the smaller.
Appearance: No abnor-
mality
Capacitance change:
B: Within M12.5%
F: Within M30%
tan d:
B: 4.0% max.
F: 7.5% max.
Insulation resistance:
50 MEAF or 1000 ME,
whichever is smaller.
Item Temperature Compensating (Class 1)
Standard
Specified Value
Test Methods and RemarksHigh Permittivity (Class 2)
High ValueStandard Note1High Frequency Type
+24
K
0
+24
K
0
+48
K
0
Note 1: For 105 type, specified in "High value".
Note 2: Thermal treatment (Multilayer): 1 hr of thermal treatment at 150 J0 /K10 C followed by 48M4 hrs of recovery under the standard condition shall be performed before the measurement.
Note 3:
Voltage treatment (Multilayer): 1 hr of voltage treatment under the specified temperature and voltage for testing followed by 48M4 hrs of recovery under the standard condition shall be performed before the measurement.
+48
K
0
Note on standard condition: "standard condition" referred to herein is defined as follows: 5 to 35C of temperature, 45 to 85% relative humidity, and 86 to 106kPa of air pressure.
When there are questions concerning measurement results: In order to provide correlation data, the test shall be conducted under condition of 20M2C of temperature, 65 to 70% relative humidity,
and 86 to 106kPa of air pressure. Unless otherwise specified, all the tests are conducted under the "standard condition."
Multilayer Ceramic Capacitor Chips
Table. 1 tand(D. F.) Table. 2 tand(D. F.)
Note 4: Specified value for Instration Resistance of Table.3 only: 100MEAF or more.
Item
BJ: LMK type; 063 type
105 type (CT0.047AF)
107 type (CT0.47AF)
212 type (CT1AF)
316 / 325 / 432 type
EMK type;
105 / 107/ 212 / 316 / 325 type
TMK type; 316 type(C > 0.47AF)
325 / 432 type
GMK type;212 type (CU0.22AF)
316 type (CU0.68AF)
325 type
UMK type;212 type (C > 0.1AF)
316 type (CU0.47AF)
325 type (C T1AF)
BJ: JMK type; 063 type
107 type (C > 2.2AF)
212type (C > 10AF)
316type (C > 22AF)
325type (C > 47AF)
432type (C > 100AF)
LMK type; 105 type (CU0.056AF)
107 type (C > 0.47AF)
212 type (C > 1AF)
J4K, E4K, L4K, J2K, L2K type
F: 105 type (50V, 25V)
F: LMK type; 212 type
316 type
(
CW10AF
)
D汎用
(
CW4.7AF
)D低背
325 type
(C > 10AF)
EMK type;105 type (C U0.068AF)
UMK type; 325 type (C U4.7AF)
BJ: Table. 3
F: LMK type; 105 type (C W0.22AF)
F:
JMK type; 105 / 107 / 212 / 316 / 325 / 432 type
LMK type;
107 type,
325 type
432 type,316 type (C > 10AF)
F: JMK type; 105 type (C W1AF)
AMK type; 063 type
tand
3.5%max.
5.0% max.
9.0% max.
10.0% max.
11.0% max.
16.0% max.
20.0% max.
Item
BJ: JMK type; 107 type (C > 2.2AF)
212type (C > 10AF)
316type (C > 22AF)
325type (C > 47AF)
432type (C > 100AF)
LMK type; 063 type
105 type (CU0.056AF)
107 type (CU0.47AF)
212 type (C > 1AF)
J4K, E4K, L4K, J2K, L2K type
F: 105 type(50V, 25V)
F: LMK type; 105 type (CW0.22AF)
F:
JMK type; 105 / 107 / 212 / 316 / 325 / 432 type
LMK type; 107 type
432 type
BJ: Tabie.3
F: JMK type; 105 type (C W1AF)
AMK type; 063 type
tand
7.5% max.
16.0% max.
19.5% max.
20.0% max.
25.0% max.
Table. 3
Item
BJ: JMK type; 105 type (C W1AF)
107(C＞1.0μF)
212(C＞4.7μF)
316(C＞10μF)
325(C＞22μF)
432(C＞4.7μF)
Table. 4
Item
BJ: 105(C＞0.1μF)
107(C＞1.0μF)
212(C＞4.7μF)
316(C＞10μF)
325(C＞22μF)
432(C＞47μF)
F: 105(C＞0.47μF)
212(C＞4.7μF)
325(C＞22μF)
432(C＞47μF)
78
梱包 PACKAGING
V
W
A
Z
D
G
D
D
D
F
G
L
F
D
F
H
N
M
0.5
f0.020g
0.8
f0.031g
0.85
f0.033g
1.25
f0.049g
0.85
f0.033g
0.85
f0.033g
0.85
f0.033g
1.15
f0.045g
1.25
f0.049g
1.6
f0.063g
1.15
f0.045g
0.85
f0.033g
1.15
f0.045g
1.5
f0.059g
1.9
f0.075g
2.5
f0.098g
GMK105f0402g
E VK105f0402g
GMK107f0603g
GMK212f0805g
G4K212f0805g
G2K212f0805g
GMK316f1206g
G4K316f1206g
GMK325f1210g
標準数量
[pcs]
1標準数量 Standard quantity
F袋づめ梱包 Bulk packaging
2テーピング材質 Taping material
1000
mmfinchg
code
Fテーピング梱包 Taped packaging
標準数量
Standard
quantity
[pcs]
製品厚み
Thickness形式fEIAg
Type
P
V
W
K
A
Z
K
D
G
D
D
D
F
G
L
F
D
F
H
N
M
M
M
0.3
f0.012g
0.5
f0.020g
0.45
f0.018g
0.8
f0.031g
0.45
f0.018g
0.85
f0.033g
1.25
f0.049g
0.85
f0.033g
0.85
f0.033g
0.85
f0.033g
1.15
f0.045g
1.25
f0.049g
1.6
f0.063g
1.15
f0.045g
0.85
f0.033g
1.15
f0.045g
1.5
f0.059g
1.9
f0.075g
2.5
f0.098g
2.5
f0.098g
2.5
f0.098g
GMK063f0201g
GMK105f0402g
E VK105f0402g
GMK107f0603g
GMK212f0805g
G4K212f0805g
G2K212f0805g
GMK316f1206g
G4K316f1206g
GMK325f1210g
GMK432f1812g
GMK550f2220g
mmfinchg
code
製品厚み
Thickness
形式fEIAg
Type
E
E
E
E
E
E
3000
E
E
E
3000
2000
3000
2000
500
500
500
15000
10000
4000
4000
4000
4000
E
4000
4000
4000
E
E
E
E
E
E
E
標準数量
Standard quantity
[pcs]
紙テープ
paper
エンボステープ
Embossed tape
UnitDmm finchg
105, 107, 212形状で個別対応致しますのでお問い合せ下さい。
Please contact any of our offices for accepting your requirement according
to dimensions 0402, 0603, 0805.(inch)
3バルクカセット Bulk Cassette
79
CAPACITORS
4
梱包 PACKAGING
3テーピング寸法 Taping dimensions
紙テープ Paper Tape（8mm幅）f0.315inches wideg
Type チップ挿入部 挿入ピッチ テープ厚み
fEIAgChip Cavity
Insertion Pitch
Tape Thickness
ABFT
GMK063f0201g0.37M0.0650.67M0.06552.0M0.05 0.45max.
f0.06M0.002gf0.027M0.002gf0.079M0.002gf
0.018max.g
GMK105f0402g0.65M0.151.15M0.1552.0M0.05 0.8max.
ＥVK105f0402g
f0.026M0.004gf0.045M0.004gf0.079M0.002gf
0.031max.g
GMK107f0603g1.0M0.2 1.8M0.2 4.0M0.1 1.1max.
f0.039M0.008gf0.071M0.008gf0.157M0.004gf0.043max.g
GMK212f0805g1.65M0.252.4M0.2
G4K212f0805g
f0.065M0.008gf0.094M0.008g
4.0M0.1 1.1max.
G2K212f0805g
f0.157M0.004gf0.043max.g
GMK316f1206g2.0M0.2 3.6M0.2
f0.079M0.008gf0.142M0.008g
UnitDmmfinchg
UnitDmmfinchg
Type チップ挿入部 挿入ピッチ テープ厚み
fEIAgChip cavity
Insertion Pitch
Tape Thickness
ABFKT
3.7M0.2 4.9M0.2 8.0M0.1
0.6max.
GMK432f1812g
f0.146M0.008gf0.193M0.008gf0.315M0.004g
3.4max.
f0.024max.gf0.134max.g
GMK550f2220g5.4M0.2 6.1M0.2 8.0M0.1
3.5max. 0.6max.
f0.213M0.008gf0.240M0.008gf0.315M0.004g
f0.138max.gf0.024max.g
エンボステープ Embossed tape（8mm幅）f0.315inches wideg
UnitDmmfinchg
4リーダ部／空部 Leader and Blank portion
5リール寸法 Reel size
6トップテープ強度 Top Tape Strength
トップテープのはがし力は下図矢印方向にて0.1〜0.7Nとなります。
The top tape requires a peel-off force of 0.1V0.7N in the direction of the
arrow as illustrated below.
エンボステープ Embossed tape（12mm幅）f0.472inches wideg
Type チップ挿入部 挿入ピッチ テープ厚み
fEIAgChip cavity
Insertion Pitch
Tape Thickness
ABFKT
GMK212f0805g1.65M0.252.4M0.2
f0.065M0.008gf0.094M0.008g
GMK316f1206g2.0M0.2 3.6M0.2 4.0M0.1
2.5max. 0.6max
G4K316f1206g
f0.079M0.008gf0.142M0.008gf0.157M0.004g
f0.098max.gf0.024max.g
GMK325f1210g2.8M0.2 3.6M0.2
3.4max.
f0.110M0.008gf0.142M0.008g
f0.134max.g
CAPACITORS
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PRECAUTIONS
CAPACITORS
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1/6
Technical considerationsStages Precautions
Precautions on the use of Multilayer Ceramic Capacitors
1.Circuit Design Verification of operating environment, electrical rating and per-
formance
1. A malfunction in medical equipment, spacecraft, nuclear re-
actors, etc. may cause serious harm to human life or have
severe social ramifications. As such, any capacitors to be
used in such equipment may require higher safety and/or reli-
ability considerations and should be clearly differentiated from
components used in general purpose applications.
Operating Voltage (Verification of Rated voltage)
1. The operating voltage for capacitors must always be lower
than their rated values.
If an AC voltage is loaded on a DC voltage, the sum of the two
peak voltages should be lower than the rated value of the ca-
pacitor chosen. For a circuit where both an AC and a pulse
voltage may be present, the sum of their peak voltages should
also be lower than the capacitor's rated voltage.
2. Even if the applied voltage is lower than the rated value, the
reliability of capacitors might be reduced if either a high fre-
quency AC voltage or a pulse voltage having rapid rise time is
present in the circuit.
1.The following diagrams and tables show some examples of recommended patterns to
prevent excessive solder amourts.flarger fillets which extend above the component end
terminationsg
Examples of improper pattern designs are also shown.
(1) Recommended land dimensions for a typical chip capacitor land patterns for PCBs
2.PCB Design Pattern configurations
(Design of Land-patterns)
1. When capacitors are mounted on a PCB, the amount of sol-
der used (size of fillet) can directly affect capacitor performance.
Therefore, the following items must be carefully considered in
the design of solder land patterns:
(1) The amount of solder applied can affect the ability of chips
to withstand mechanical stresses which may lead to break-
ing or cracking. Therefore, when designing land-patterns
it is necessary to consider the appropriate size and con-
figuration of the solder pads which in turn determines the
amount of solder necessary to form the fillets.
(2) When more than one part is jointly soldered onto the same
land or pad, the pad must be designed so that each
component's soldering point is separated by solder-re-
sist.
Recommended land dimensions for wave-soldering (unit: mm)
Recommended land dimensions for reflow-soldering (unit: mm)
Type 107 212 316 325
1.6 2.0 3.2 3.2
0.8 51.25 1.6 2.5
A 0.8V1.0 1.0V1.4 1.8V2.5 1.8V2.5
B 0.5V0.8 0.8V1.5 0.8V1.7 0.8V1.7
C 0.6V0.8 0.9V1.2 1.2V1.6 1.8V2.5
L
W
Size
Excess solder can affect the ability of chips to withstand mechanical stresses. Therefore,
please take proper precautions when designing land-patterns.
Size L
W
Type 063 105 107 212 316 325 432 550
0.6 1.0 1.6 2.0 3.2 3.2 4.5 5.7
0.3 0.5 0.8 51.25 1.6 2.5 3.2 5.0
A
0.20V0.30 0.45V0.55
0.6V0.8 0.8V1.2 1.8V2.5 1.8V2.5 2.5V3.5 3.7V4.7
B
0.20V0.30 0.40V0.50
0.6V0.8 0.8V1.2 1.0V1.5 1.0V1.5 1.5V1.8 1.5V2.3
C
0.25V0.40 0.45V0.55
0.6V0.8 0.9V1.6 1.2V2.0 1.8V3.2 2.3V3.5 3.5V5.5
Size
Type 316（4 circuits）212（4 circuits）
3.2 2.0
1.6 1.25
a 0.7V0.9 0.5V0.6
b 1 0.5V0.6
c 0.4V0.5 0.2V0.3
d 0.8 0.5
L
W
Size
Type 212（2 circuits）
2.0
1.25
a 0.5V0.6
b 0.5V0.6
c 0.5V0.6
d 1.0
L
W
89
PRECAUTIONS
CAPACITORS
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(2) Examples of good and bad solder application2.PCB Design
1-1. The following are examples of good and bad capacitor layout; SMD capacitors should
be located to minimize any possible mechanical stresses from board warp or deflection.
Not recommended Recommended
Deflection of
the board
Pattern configurations
(Capacitor layout on panelized [breakaway] PC boards)
1. After capacitors have been mounted on the boards, chips can
be subjected to mechanical stresses in subsequent manufac-
turing processes (PCB cutting, board inspection, mounting of
additional parts, assembly into the chassis, wave soldering
the reflow soldered boards etc.) For this reason, planning
pattern configurations and the position of SMD capacitors
should be carefully performed to minimize stress.
Items
Component
placement close
to the chassis
Not recommended Recommended
1-2. To layout the capacitors for the breakaway PC board, it should be noted that the amount
of mechanical stresses given will vary depending on capacitor layout. The example
below shows recommendations for better design.
1-3. When breaking PC boards along their perforations, the amount of mechanical stress on
the capacitors can vary according to the method used. The following methods are listed
in order from least stressful to most stressful: push-back, slit, V-grooving, and perfora-
tion. Thus, any ideal SMD capacitor layout must also consider the PCB splitting proce-
dure.
Technical considerationsStages Precautions
Mixed mounting
of SMD and
leaded
components
Hand-soldering
of leaded
components
near mounted
components
Horizontal
component
placement
Precautions on the use of Multilayer Ceramic Capacitors
91
PRECAUTIONS
CAPACITORS
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3/6
3.Considerations for auto-
matic placement
Adjustment of mounting machine
1. Excessive impact load should not be imposed on the capaci-
tors when mounting onto the PC boards.
2. The maintenance and inspection of the mounters should be
conducted periodically.
Technical considerationsStages Precautions
1. If the lower limit of the pick-up nozzle is low, too much force may be imposed on the
capacitors, causing damage. To avoid this, the following points should be considered
before lowering the pick-up nozzle:
(1)The lower limit of the pick-up nozzle should be adjusted to the surface level of the PC
board after correcting for deflection of the board.
(2)The pick-up pressure should be adjusted between 1 and 3 N static loads.
(3)To reduce the amount of deflection of the board caused by impact of the pick-up nozzle,
supporting pins or back-up pins should be used under the PC board. The following dia-
grams show some typical examples of good pick-up nozzle placement:
Not recommended Recommended
Single-sided
mounting
Double-sided
mounting
2. As the alignment pin wears out, adjustment of the nozzle height can cause chipping or
cracking of the capacitors because of mechanical impact on the capacitors. To avoid
this, the monitoring of the width between the alignment pin in the stopped position, and
maintenance, inspection and replacement of the pin should be conducted periodically.
1. Some adhesives may cause reduced insulation resistance. The difference between the
shrinkage percentage of the adhesive and that of the capacitors may result in stresses
on the capacitors and lead to cracking. Moreover, too little or too much adhesive applied
to the board may adversely affect component placement, so the following precautions
should be noted in the application of adhesives.
(1)Required adhesive characteristics
a. The adhesive should be strong enough to hold parts on the board during the mounting &
solder process.
b. The adhesive should have sufficient strength at high temperatures.
c. The adhesive should have good coating and thickness consistency.
d. The adhesive should be used during its prescribed shelf life.
e. The adhesive should harden rapidly
f. The adhesive must not be contaminated.
g. The adhesive should have excellent insulation characteristics.
h. The adhesive should not be toxic and have no emission of toxic gasses.
(2)The recommended amount of adhesives is as follows;
Figure 212/316 case sizes as examples
a 0.3mm min
b 100 V120 Am
c Adhesives should not contact the pad
Selection of Adhesives
1. Mounting capacitors with adhesives in preliminary assembly,
before the soldering stage, may lead to degraded capacitor
characteristics unless the following factors are appropriately
checked; the size of land patterns, type of adhesive, amount
applied, hardening temperature and hardening period. There-
fore, it is imperative to consult the manufacturer of the adhe-
sives on proper usage and amounts of adhesive to use.
Precautions on the use of Multilayer Ceramic Capacitors
93
PRECAUTIONS
CAPACITORS
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4. Soldering Selection of Flux
1. Since flux may have a significant effect on the performance of
capacitors, it is necessary to verify the following conditions
prior to use;
(1)Flux used should be with less than or equal to 0.1 wt%
(equivelent to chroline) of halogenated content. Flux hav-
ing a strong acidity content should not be applied.
(2)When soldering capacitors on the board, the amount of
flux applied should be controlled at the optimum level.
(3)When using water-soluble flux, special care should be taken
to properly clean the boards.
Soldering
Temperature, time, amount of solder, etc. are specified in accor-
dance with the following recommended conditions.
1-1. When too much halogenated substance (Chlorine, etc.) content is used to activate the
flux, or highly acidic flux is used, an excessive amount of residue after soldering may
lead to corrosion of the terminal electrodes or degradation of insulation resistance on
the surface of the capacitors.
1-2. Flux is used to increase solderability in flow soldering, but if too much is applied, a large
amount of flux gas may be emitted and may detrimentally affect solderability. To mini-
mize the amount of flux applied, it is recommended to use a flux-bubbling system.
1-3. Since the residue of water-soluble flux is easily dissolved by water content in the air, the
residue on the surface of capacitors in high humidity conditions may cause a degrada-
tion of insulation resistance and therefore affect the reliability of the components. The
cleaning methods and the capability of the machines used should also be considered
carefully when selecting water-soluble flux.
1-1. Preheating when soldering
Heating: Ceramic chip components should be preheated to within 100 to 130C of the sol-
dering.
Cooling: The temperature difference between the components and cleaning process should
not be greater than 100C.
Ceramic chip capacitors are susceptible to thermal shock when exposed to rapid or concen-
trated heating or rapid cooling. Therefore, the soldering process must be conducted with
great care so as to prevent malfunction of the components due to excessive thermal shock.
Technical considerationsStages Precautions
Recommended conditions for soldering
[Reflow soldering]
Temperature profile
Caution
1. The ideal condition is to have solder mass (fillet) controlled to 1/2 to 1/3 of the thick-
ness of the capacitor, as shown below:
2. Because excessive dwell times can detrimentally affect solderability, soldering dura-
tion should be kept as close to recommended times as possible.
[Wave soldering]
Temperature profile
Caution
1. Make sure the capacitors are preheated sufficiently.
2. The temperature difference between the capacitor and melted solder should not be
greater than 100 to130C
3. Cooling after soldering should be as gradual as possible.
4. Wave soldering must not be applied to the capacitors designated as for reflow solder-
ing only.
Precautions on the use of Multilayer Ceramic Capacitors
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PRECAUTIONS
CAPACITORS
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Caution
1. Use a 20W soldering iron with a maximum tip diameter of 1.0 mm.
2. The soldering iron should not directly touch the capacitor.
[Hand soldering]
Temperature profile
5.Cleaning Cleaning conditions
1. When cleaning the PC board after the capacitors are all
mounted, select the appropriate cleaning solution according
to the type of flux used and purpose of the cleaning (e.g. to
remove soldering flux or other materials from the production
process.)
2. Cleaning conditions should be determined after verifying,
through a test run, that the cleaning process does not affect
the capacitor's characteristics.
1. The use of inappropriate solutions can cause foreign substances such as flux residue to
adhere to the capacitor or deteriorate the capacitor's outer coating, resulting in a degra-
dation of the capacitor's electrical properties (especially insulation resistance).
2. Inappropriate cleaning conditions (insufficient or excessive cleaning) may detrimentally
affect the performance of the capacitors.
(1)Excessive cleaning
In the case of ultrasonic cleaning, too much power output can cause excessive vibration of
the PC board which may lead to the cracking of the capacitor or the soldered portion, or
decrease the terminal electrodes' strength. Thus the following conditions should be
carefully checked;
Ultrasonic output Below 20 W/b
Ultrasonic frequency Below 40 kHz
Ultrasonic washing period 5 min. or less
4. Soldering
6.Post cleaning processes 1. With some type of resins a decomposition gas or chemical
reaction vapor may remain inside the resin during the harden-
ing period or while left under normal storage conditions result-
ing in the deterioration of the capacitor's performance.
2. When a resin's hardening temperature is higher than the
capacitor's operating temperature, the stresses generated by
the excess heat may lead to capacitor damage or destruction.
The use of such resins, molding materials etc. is not recom-
mended.
Breakaway PC boards (splitting along perforations)
1. When splitting the PC board after mounting capacitors and
other components, care is required so as not to give any
stresses of deflection or twisting to the board.
2. Board separation should not be done manually, but by using
the appropriate devices.
Mechanical considerations
1. Be careful not to subject the capacitors to excessive mechani-
cal shocks.
(1)If ceramic capacitors are dropped onto the floor or a hard
surface, they should not be used.
(2)When handling the mounted boards, be careful that the
mounted components do not come in contact with or bump
against other boards or components.
7.Handling
Technical considerationsStages Precautions
Precautions on the use of Multilayer Ceramic Capacitors
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PRECAUTIONS
CAPACITORS
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6/6
8.Storage conditions Storage
1. To maintain the solderability of terminal electrodes and to keep
the packaging material in good condition, care must be taken
to control temperature and humidity in the storage area. Hu-
midity should especially be kept as low as possible.
YRecommended conditions
Ambient temperature Below 40C
Humidity Below 70% RH
The ambient temperature must be kept below 30C. Even un-
der ideal storage conditions capacitor electrode solderability
decreases as time passes, so ceramic chip capacitors should
be used within 6 months from the time of delivery.
YThe packaging material should be kept where no chlorine or
sulfur exists in the air.
2. The capacitance value of high dielectric constant capacitors
(type 2 &3) will gradually decrease with the passage of time,
so this should be taken into consideration in the circuit design.
If such a capacitance reduction occurs, a heat treatment of
150C for 1hour will return the capacitance to its initial level.
1. If the parts are stored in a high temperature and humidity environment, problems such
as reduced solderability caused by oxidation of terminal electrodes and deterioration of
taping/packaging materials may take place. For this reason, components should be used
within 6 months from the time of delivery. If exceeding the above period, please check
solderability before using the capacitors.
Technical considerationsStages Precautions
Precautions on the use of Multilayer Ceramic Capacitors
