PS2701A-1-V-F3-A-N - Renesas Electronics

R08DS0071EJ0600 Rev.6.00 Page 1 of 12

Jan 9, 2013

PIN CONNECTION

(Top View)

1. Anode

2. Cathode

3. Emitter

4. Collector

The mark <R> shows major revised points.

The revised points can be easily searched by copying an "<R>" in the PDF file and specifying it in the "Find what:" field.

Data Sheet

PS2701A-1

HIGH ISOLATION VOLTAGE SOP PHOTOCOUPLER

DESCRIPTION

The PS2701A-1 is an opticall y coupled isolator containing a GaAs light emitting d iode and an NPN silicon

phototransistor to realize an excellent cost performance.

This package is SOP (Small Outline Package) type and has shield effect to cut off ambient ligh t.

It is designed for high density mounting applications.

FEATURES

• High isolati on vol t a ge (BV = 3 750 Vr.m.s.)

• SOP (Small Outline Package) type

• Ordering number of taping product : PS2 70 1 A- 1- F3: 3 5 00 pcs/ reel

• Pb-Free product

• Safety standards

• UL approved: No. E72422

• CSA approved: No. CA 101391 (CA5A, CAN/CSA-C22.2 60065, 6095 0)

• BSI approved (BS EN 60065 , BS EN 60950)

• SEMKO, NEMKO, DEMKO, FIMKO approved (EN 60065, EN 60950)

• DIN EN 60747-5-5 (VDE 0884-5) approved (Option)

APPLICATIONS

• Hybrid IC

• Measuring instruments

• Power supply

• Programmable logic controllers

R08DS0071EJ0600

Rev.6.00

Jan 9, 2013

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PS2701A-1

R08DS0071EJ0600 Rev.6.00 Page 2 of 12

Jan 9, 2013

PACKAGE DIMENSIONS (UNIT: mm)

4.0±0.5

7.0±0.3

4.4

0.5±0.3

0.15

+0.10

–0.05

2.0

0.1±0.1

2.1±0.2

2.54

0.4

+0.10

–0.05

0.25 M

PHOTOCOUPLER CONSTRUCTION

Parameter Unit (MIN.)

Air Distance 5 mm

Outer Creepage Distance 5 mm

Inner Creepage Distance 2.5 mm

Isolation Distance 0.3 mm

PS2701A-1

R08DS0071EJ0600 Rev.6.00 Page 3 of 12

Jan 9, 2013

MARKING EXAMPLE

3 01

CTR Rank Code

Year Assembled

(Last 1 Digit)

Week Assembled

701A

N301

No. 1 pin Mark

Remark "PS2" and "-1" are omitted from original type number

Trade Mark

Type Number

Assembly Lot

Note: Bar indication cont ents of *1 and *2.

Made in Taiwan

701A

N301

*1: No indication

*2: No indication

*1: No indication

*2: " " (Vertical bar)

" " (Vertical bar)

:Made in Japan

Made in Japan

701A

N301

Made in Taiwan

Halogen free

701A

N301

" " (Horizontal bar)

:Made in Taiwan & Halogen free

*1: " " (Horizontal bar)

*2: No indication

*1: No indication

*2: " " (Horizontal bar)

Made in Japan

Halogen free

701A

N301

" " (Horizontal bar)

:Made in Japan & Halogen free

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PS2701A-1

R08DS0071EJ0600 Rev.6.00 Page 4 of 12

Jan 9, 2013

ORDERING INFORMATION

Part Number Order Number Solder Plating

Specification Packing Style Safety Standard

Approval Application

Part Number*1

PS2701A-1-F3 PS2701A-1-F3-A Embossed Tape

3 500 pcs/reel Standard products

(UL, CSA, BSI,

SEMKO, NEMKO,

DEMKO, FIMKO

approved)

PS2701A-1-V-F3 PS2701A-1-V-F3-A

Pb-Free

Embossed Tape

3 500 pcs/reel DIN EN 60747-5-5

(VDE0884-5)

Approved (Option)

PS2701A-1

PS2701A-1-F3 PS2701A-1Y-F3-A Embossed Tape

3 500 pcs/reel Standard products

(UL, CSA, BSI,

SEMKO, NEMKO,

DEMKO, FIMKO

approved)

PS2701A-1-V-F3 PS2701A-1Y-V-F3-A

Special version

(Pb-Free and

Halogen Free)

Embossed Tape

3 500 pcs/reel DIN EN 60747-5-5

(VDE0884-5)

Approved (Option)

PS2701A-1

Note: *1. For the application of the Safet y Standard, following part number sho uld b e used.

ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified)

Parameter Symbol Ratings Unit

Diode Forward Current (DC) IF 50 mA

Reverse Voltage VR 6 V

Power Dissipation Derating

PD/°C 0.8 mW/°C

Power Dissipation PD 80 mW

Peak Forward Current*1 IFP 0.5 A

Transistor Collector to Emitter Voltage VCEO 70 V

Emitter to Collector Voltage VECO 5 V

Collector Current IC 30 mA

Power Dissipation Derating

PC/°C 1.5 mW/°C

Power Dissipation PC 150 mW

Isolation Voltage*2 BV 3 750 Vr.m.s.

Operating Ambient Temperature TA –55 to +100 °C

Storage Temperature Tstg –55 to +150 °C

Note: *1. PW = 100

s, Duty Cycle = 1%

*2. AC voltage for 1 minute at TA = 25°C, RH = 60% bet ween in put and output.

Pins 1-2 shorted together, 3-4 shorted together.

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PS2701A-1

R08DS0071EJ0600 Rev.6.00 Page 5 of 12

Jan 9, 2013

ELECTRICAL CHARACTERISTICS (TA = 25°C)

Parameter Symbol Conditions MIN. TYP. MAX. Unit

Diode Forward Voltage VF I

F = 5 mA 1.2 1.4 V

Reverse Current IR V

R = 5 V 5

Terminal

Capacitance Ct V = 0 V, f = 1.0 MHz 10 pF

Transistor Collector to Emitter

Dark Current ICEO I

F = 0 mA, VCE = 70 V 100 nA

Coupled Current Transfer

Ratio (IC/IF)*1 CTR IF = 5 mA, VCE = 5 V 50 300 %

Collector Saturation

Voltage VCE (sat) I

F = 10 mA, IC = 2 mA 0.13 0.3 V

Isolation Resistance RI-O V

I-O = 1.0 kVDC 1011 Ω

Isolation

Capacitance CI-O V = 0 V, f = 1.0 MHz 0.4 pF

Rise Time*2 t

r V

CC = 5 V, IC = 2 mA, RL = 100 Ω 5

Fall Time*2 t

f 7

Turn-on Time*2 t

on 8

Turn-off Time*2 t

off 10

Note: *1. CTR rank

N: 50 to 300 (%)

P: 150 to 300 (%)

L: 100 to 300 (%)

M: 50 to 150 (%)

*2. Test Circuit for Switching Time

PW = 100 s,

Duty cycle = 1/10

Pulse input V

OUT

= 100 Ω50 Ω

Input

Output

90%

10%

off

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PS2701A-1

R08DS0071EJ0600 Rev.6.00 Page 6 of 12

Jan 9, 2013

TYPICAL CHARACTERISTICS (TA = 25°C, unless otherwise specified)

100

200

150

100

0 25 50 75 100 125 0 25 50 75 100 125

00246810

100

0.5

0.1

0.05 1.51.41.31.21.11.00.90.80.7

0.8 mW/°C1.5 mW/°C

= 10 mA

5 mA

2 mA

1 mA

–25

–55

+60

+25

= +100

Ambient Temperature T

(°C)

Diode Power Dissipation P

(mW)

DIODE POWER DISSIPATION vs.

AMBIENT TEMPERATURE

Ambient Temperature T

(°C)

Transistor Power Dissipation P

(mW)

TRANSISTOR POWER DISSIPATION vs.

AMBIENT TEMPERATURE

Forward Voltage V

(V)

Forward Current I

(mA)

FORWARD CURRENT vs.

FORWARD VOLTAGE

Collector to Emitter Voltage V

(V)

Collector Current I

(mA)

COLLECTOR CURRENT vs.

COLLECTOR TO EMITTER VOLTAGE

Ambient Temperature T

(°C)

COLLECTOR TO EMITTER DARK

CURRENT vs. AMBIENT TEMPERATURE

Collector to Emitter Dark Current I

CEO

(nA)

Collector Saturation Voltage V

CE (sat)

(V)

Collector Current I

(mA)

COLLECTOR CURRENT vs.

COLLECTOR SATURATION VOLTAGE

10 000

1 000

100

0 25 50 75 100

= 24 V

= 70 V

0.1 0 0.2 0.4 0.6 0.8 1.0

5 mA

2 mA

1 mA

= 10 mA

Remark The graphs indicate nominal characteristics.

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PS2701A-1

R08DS0071EJ0600 Rev.6.00 Page 7 of 12

Jan 9, 2013

1.2

1.0

0.8

0.6

0.4

0.2

–

–7

–

25 025 7550 100

300

250

200

150

100

0.01 0.1 1 10 100

100

0.1

1 000

100

10 100 1 000 10 000

IC = 2 mA, VCC = 5 V,

CTR = 236%

1 10 100

IF = 5 mA, VCC = 5 V,

CTR = 236%

RL = 1 kΩ

300 Ω

100 Ω

IF = 5 mA,

VCE = 5 V

–

0.1 1 10 100 1 000

300%

90%

VCE = 5 V,

n = 3

Ambient Temperature TA (°C)

NORMALIZED CURRENT TRANSFER

RATIO vs. AMBIENT TEMPERATURE

Normalized Current Transfer Ratio CTR

Normalized to 1.0

at TA = 25°C,

IF = 5 mA, VCE = 5 V

Forward Current IF (mA)

Current Transfer Ratio CTR (%)

CURRENT TRANSFER RATIO vs.

FORWARD CURRENT

Sample A

Load Resistance RL (Ω)

SWITCHING TIME vs.

LOAD RESISTANCE

Switching Time t ( s)

Load Resistance RL (kΩ)

SWITCHING TIME vs.

LOAD RESISTANCE

Switching Time t ( s)

Frequency f (kHz)

Normalized Gain GV

FREQUENCY RESPONSE

Remark The graphs indicate nominal characteristics.

PS2701A-1

R08DS0071EJ0600 Rev.6.00 Page 8 of 12

Jan 9, 2013

TAPING SPECIFICATIONS (UNIT: mm)

Tape Direction

Outline and Dimensions (Reel)

Packing: 3 500 pcs/reel

2.0±0.5

R 1.0

13.0±0.2

21.0±0.8

330±2.0

100±1.0

2.0±0.5

11.9 to 15.4

Outer edge of

flange

17.5±1.0

13.5±1.0

13.0±0.2

PS2701A-1-F3

1.55±0.1

2.0±0.05

4.0±0.1

1.75±0.1

4.6±0.1

2.9 MAX.

0.3

8.0±0.1

Outline and Dimensions (Tape)

2.4±0.1

1.5

+0.1

–0

7.4±0.1

5.5±0.05

12.0±0.2

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PS2701A-1

R08DS0071EJ0600 Rev.6.00 Page 9 of 12

Jan 9, 2013

NOTES ON HANDLING

1. Recommended soldering conditions

(1) Infrared reflow soldering

• Peak reflow temperature 260°C or below (package surface temperature)

• Time of peak reflo w temperature 10 seconds or less

• Time of temperature higher than 220°C 60 seconds or less

• Time to preheat temperature from 120 to 180°C 120±30 s

• Number of reflows Three

• Flux Rosin flux containing small amount of chlorine (The flux

with a maximum chlorine content of 0.2 Wt% is

recommended.)

120±30 s

(preheating)

220°C

180°C

Package Surface Temperature T (°C)

Time (s)

Recommended Temperature Profile of Infrared Reflow

(heating)

to 10 s

to 60 s

260°C MAX.

120°C

(2) Wave soldering

• Temperature 260°C or below (molten solder temperature)

• Time 10 seconds or less

• Preheating conditions 120°C or below (package surface temperature)

• Number of times One (Allowed to be dipped in solder including plastic mold portion.)

• Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine

content of 0.2 Wt% is recommended.)

(3) Soldering by Soldering Iron

• Peak Temperature (lead part temperature) 350°C or below

• Time (each pin) 3 seconds or less

• Flux Rosin flux containing small amount of chlorine (The flux with a

maximum chlori ne co nt ent of 0.2 Wt% is recomme nded .)

(a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead

(4) Cautions

• Fluxes Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.

PS2701A-1

R08DS0071EJ0600 Rev.6.00 Page 10 of 12

Jan 9, 2013

2. Cautions regarding noise

Be aware that when voltage is applied suddenly between the photocoupler’s input and output or between collector-

emitters at startup, the output transistor may enter the on state, even if the voltage is within the absolute maximum

ratings.

3. Measurement conditions of current transfer ratios (CTR), which differ according to photocoupler

Check the setting values before use, since the forward current conditions at CTR measurement differ according to

product.

When using products other than at the specified forward current, the characteristics curves may differ from the

standard curves due to CTR value variations or the like. This tendency may sometimes be obvious, especially below

IF = 1 mA.

Therefore, check the characteristics under the actual operating conditions and thoroughly take variations or the like

into consideration before use.

USAGE CAUTIONS

1. Protect against static electricity when handling.

2. Avoid storage at a high temperature and high humidity.

PS2701A-1

R08DS0071EJ0600 Rev.6.00 Page 11 of 12

Jan 9, 2013

SPECIFICATION OF VDE MARKS LICENSE DOCUMENT

Parameter Symbol Spec. Unit

Climatic test class (IEC 60068-1/DIN EN 60068-1) 55/100/21

Dielectric strength

maximum operating isolati on voltage

Test voltage (partial discharge test, procedure a for type test and

random test)

Upr = 1.6 × UIORM, Pd < 5 pC

UIORM

Upr

707

1 131

Vpeak

Test voltage (partial discharge test, procedure b for all devic es)

Upr = 1.875 × UIORM, Pd < 5 pC Upr 1 325 Vpeak

Highest permissible overvoltage UTR 6 000 Vpeak

Degree of pollution (DIN EN 60664-1 VDE0 110 Part 1) 2

Comparative tracking index (IEC 60112/DIN EN 60112 (VDE 0303

Part 11)) CTI 175

Material group (DIN EN 60664-1 VDE0110 Part 1) III a

Storage temperature range Tstg –55 to +150 °C

Operating temperature range TA –55 to +100 °C

Isolation resistance, minimum value

VIO = 500 V dc at TA = 25°C

VIO = 500 V dc at TA MAX. at least 100°C

Ris MIN.

1012

1011

Safety maximum ratings (maximum permissible in case of fault, see

thermal derating curve)

Package temperature

Current (input current IF, Psi = 0)

Power (output or total power dissipation)

Isolation resistance

VIO = 500 V dc at TA = Tsi

Tsi

Isi

Psi

Ris MIN.

150

300

500

109

°C

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PS2701A-1

R08DS0071EJ0600 Rev.6.00 Page 12 of 12

Jan 9, 2013

Caution GaAs Products This product uses gallium arsenide (GaAs).

GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe

the following points.

• Follow related laws and ordinances when disposing of the product. If there are no applicable laws

and/or ordinances, dispose of the product as recommended below.

1. Commission a disposal company able to (with a license to) collect, transport and dispose of

materials that contain arsenic and other such industrial waste materials.

2. Exclude the product from general industrial waste and household garbage, and ensure that the

product is controlled (as industrial waste subject to special control) up until final disposal.

• Do not burn, destroy, cut, crush, or chemically dissolve the product.

• Do not lick the product or in any way allow it to enter the mouth.

All trademarks and registered trademarks are t he property of their respective owners.

C - 1

Revision History PS2701A-1 Data Sheet

Description

Rev. Date Page Summary

1.00 May 20, 2004 − This data sheet was released as PN10396EJ01V0DS

6.00 Jan 9, 2013 Thoughout Renesas format is applied to this data sh eet.

p.1 The safety standards are revised.

p.3 The explanation in MARKING EXAMPLE is revised.

p.4

ORDERING INFORMATION is modified with the revision of the safety

standards.

The value in Ratings of Parameter “Forward Current (DC)” is changed from 30

to 50.

p.5

Turn-on Time (ton) and Turn-off Time(toff) are added to the table in

ELECTRICAL CHARACTERISTICS.

p.7

The graph of LONG TERM CTR DEGRADATION is deleted from those in

TYPICAL CHARACTERISTICS.

p.8

PS2701A-1-F4 is deleted form Tape Direction ima ge in TAPING

SPECIFICATIONS.

p.11

The value in SPECIFICAT ION OF VDE MARKS LICENSE DOCUMENT is

changed as follows.

-- Test voltage is changed from the factor, 1.5, and the value, 1 060, to 1.6 and

1 131, respectively.

Notice

1. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. You are fully responsible for

the incorporation of these circuits, software, and information in the design of your equipment. Renesas Electronics assumes no responsibility for any losses incurred by you or third parties arising from the

use of these circuits, software, or information.

2. Renesas Electronics has used reasonable care in preparing the information included in this document, but Renesas Electronics does not warrant that such information is error free. Renesas Electronics

assumes no liability whatsoever for any damages incurred by you resulting from errors in or omissions from the information included herein.

3. Renesas Electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property rights of third parties by or arising from the use of Renesas Electronics products or

technical information described in this document. No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of Renesas Electronics or

others.

4. You should not alter, modify, copy, or otherwise misappropriate any Renesas Electronics product, whether in whole or in part. Renesas Electronics assumes no responsibility for any losses incurred by you or

third parties arising from such alteration, modification, copy or otherwise misappropriation of Renesas Electronics product.

5. Renesas Electronics products are classified according to the following two quality grades: "Standard" and "High Quality". The recommended applications for each Renesas Electronics product depends on

the product's quality grade, as indicated below.

"Standard": Computers; office equipment; communications equipment; test and measurement equipment; audio and visual equipment; home electronic appliances; machine tools; personal electronic

equipment; and industrial robots etc.

"High Quality": Transportation equipment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; anti-crime systems; and safety equipment etc.

Renesas Electronics products are neither intended nor authorized for use in products or systems that may pose a direct threat to human life or bodily injury (artificial life support devices or systems, surgical

implantations etc.), or may cause serious property damages (nuclear reactor control systems, military equipment etc.). You must check the quality grade of each Renesas Electronics product before using it

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incurred by you or third parties arising from the use of any Renesas Electronics product for which the product is not intended by Renesas Electronics.

6. You should use the Renesas Electronics products described in this document within the range specified by Renesas Electronics, especially with respect to the maximum rating, operating supply voltage

range, movement power voltage range, heat radiation characteristics, installation and other product characteristics. Renesas Electronics shall have no liability for malfunctions or damages arising out of the

use of Renesas Electronics products beyond such specified ranges.

7. Although Renesas Electronics endeavors to improve the quality and reliability of its products, semiconductor products have specific characteristics such as the occurrence of failure at a certain rate and

malfunctions under certain use conditions. Further, Renesas Electronics products are not subject to radiation resistance design. Please be sure to implement safety measures to guard them against the

possibility of physical injury, and injury or damage caused by fire in the event of the failure of a Renesas Electronics product, such as safety design for hardware and software including but not limited to

redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because the evaluation of microcomputer software alone is very difficult,

please evaluate the safety of the final products or systems manufactured by you.

8. Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental compatibility of each Renesas Electronics product. Please use Renesas Electronics

products in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. Renesas Electronics assumes

no liability for damages or losses occurring as a result of your noncompliance with applicable laws and regulations.

9. Renesas Electronics products and technology may not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable domestic or foreign laws or

regulations. You should not use Renesas Electronics products or technology described in this document for any purpose relating to military applications or use by the military, including but not limited to the

development of weapons of mass destruction. When exporting the Renesas Electronics products or technology described in this document, you should comply with the applicable export control laws and

regulations and follow the procedures required by such laws and regulations.

10. It is the responsibility of the buyer or distributor of Renesas Electronics products, who distributes, disposes of, or otherwise places the product with a third party, to notify such third party in advance of the

contents and conditions set forth in this document, Renesas Electronics assumes no responsibility for any losses incurred by you or third parties as a result of unauthorized use of Renesas Electronics

products.

11. This document may not be reproduced or duplicated in any form, in whole or in part, without prior written consent of Renesas Electronics.

12. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electronics products, or if you have any other inquiries.

(Note 1) "Renesas Electronics" as used in this document means Renesas Electronics Corporation and also includes its majority-owned subsidiaries.

(Note 2) "Renesas Electronics product(s)" means any product developed or manufactured by or for Renesas Electronics.

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