September 2017
DocID030323 Rev 3
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www.st.com
UM2176
User manual
STEVAL-IPMNG3Q motor control power board based on the
SLLIMM-nano™ 2nd series of IGBT IPMs
Introduction
The STEVAL-IPMNG3Q is a compact motor drive power board based on SLLIMM-nano™ (small low-
loss intelligent molded module) 2nd series (STGIPQ3H60T-HZ). It provides an affordable and easy-to-
use solution for driving high power motors for a wide range of applications such as power white goods,
air conditioning, compressors, power fans, high-end power tools and 3-phase inverters for motor drives
in general. The IPM itself consists of short-circuit rugged IGBTs and a wide range of features like
undervoltage lockout, smart shutdown, embedded temperature sensor and NTC, and overcurrent
protection.
The main characteristics of this evaluation board are small size, minimal BOM and high efficiency. It
consists of an interface circuit (BUS and VCC connectors), bootstrap capacitors, snubber capacitor,
hardware short-circuit protection, fault event and temperature monitoring. In order to increase the
flexibility, it is designed to work in single- or three-shunt configuration and with triple current sensing
options: three dedicated onboard op-amps, an internal IPM op-amp and op-amps embedded in the
MCU. The Hall/Encoder section completes the circuit.
With these advanced characteristics, the system is designed to achieve fast and accurate current
feedback conditioning, satisfying the typical requirements for field-oriented control (FOC).
The STEVAL-IPMNG3Q is compatible with ST's STM32-based control board, enabling designers to
build a complete platform for motor control.
Figure 1: Motor control board (top view) based on SLLIMM-nano™ 2nd series
Contents
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Contents
1 Key features ..................................................................................... 5
2 Circuit schematics........................................................................... 6
2.1 Schematic diagrams .......................................................................... 7
3 Main characteristics ...................................................................... 12
4 Filters and key parameters ........................................................... 13
4.1 Input signals .................................................................................... 13
4.2 Bootstrap capacitor ......................................................................... 13
4.3 Overcurrent protection .................................................................... 14
4.3.1 SD pin ............................................................................................... 14
4.3.2 Shunt resistor selection .................................................................... 15
4.3.3 CIN RC filter ..................................................................................... 16
4.3.4 Single- or three-shunt selection ........................................................ 16
5 Current sensing amplifying network ............................................ 17
6 Temperature monitoring ............................................................... 19
6.1 NTC Thermistor ............................................................................... 19
7 Firmware configuration for STM32 PMSM FOC SDK .................. 20
8 Connectors, jumpers and test pins .............................................. 21
9 Bill of materials .............................................................................. 24
10 PCB design guide .......................................................................... 27
10.1 Layout of reference board ............................................................... 27
11 Recommendations and suggestions ........................................... 29
12 General safety instructions .......................................................... 30
13 References ..................................................................................... 31
14 Revision history ............................................................................ 32
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List of tables
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List of tables
Table 1: Shunt selection ........................................................................................................................... 15
Table 2: Op-amp sensing configuration .................................................................................................... 17
Table 3: Amplifying networks .................................................................................................................... 18
Table 4: ST motor control workbench GUI parameters - STEVAL-IPMNG3Q ......................................... 20
Table 5: Connectors .................................................................................................................................. 21
Table 6: Jumpers ...................................................................................................................................... 22
Table 7: Test pins ..................................................................................................................................... 23
Table 8: Bill of materials............................................................................................................................ 24
Table 9: Document revision history .......................................................................................................... 32
List of figures
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List of figures
Figure 1: Motor control board (top view) based on SLLIMM-nano™ 2nd series ........................................ 1
Figure 2: Motor control board (bottom view) based on SLLIMM-nano™ 2nd series .................................. 5
Figure 3: STEVAL-IPMNG3Q circuit schematic (1 of 5) ............................................................................. 7
Figure 4: STEVAL-IPMNG3Q circuit schematic (2 of 5) ............................................................................. 8
Figure 5: STEVAL-IPMNG3Q circuit schematic (3 of 5) ............................................................................. 9
Figure 6: STEVAL-IPMNG3Q circuit schematic (4 of 5) ........................................................................... 10
Figure 7: STEVAL-IPMNG3Q circuit schematic (5 of 5) ........................................................................... 11
Figure 8: STEVAL-IPMNG3Q architecture ............................................................................................... 12
Figure 9: CBOOT graph selection ............................................................................................................ 14
Figure 10: One-shunt configuration .......................................................................................................... 16
Figure 11: Three-shunt configuration ........................................................................................................ 16
Figure 12: NTC voltage vs temperature .................................................................................................... 19
Figure 13: Silk screen and etch - top side ................................................................................................ 27
Figure 14: Silk screen and etch - bottom side .......................................................................................... 28
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Key features
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1 Key features
Input voltage: 125 - 400 VDC
Nominal power: up to 300 W
Nominal current: up to 1.8 A
Input auxiliary voltage: up to 20 VDC
Motor control connector (32 pins) interfacing with ST MCU boards
Single- or three-shunt resistors for current sensing (with sensing network)
Three options for current sensing: external dedicated op-amps, internal SLLIMM-nano
op-amp (single) or through MCU
Overcurrent hardware protection
IPM temperature monitoring and protection
Hall sensors (3.3 / 5 V)/encoder inputs (3.3 / 5 V)
IGBT intelligent power module:
SLLIMM-nano™ 2nd series IPM (STGIPQ3H60T-HZ - Full molded package
package)
Universal design for further evaluation with bread board and testing pins
Very compact size
Figure 2: Motor control board (bottom view) based on SLLIMM-nano™ 2nd series
Circuit schematics
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DocID030323 Rev 3
2 Circuit schematics
The full schematics for the SLLIMM-nano™ 2nd series card for STGIPQ3H60T-HZ IPM
products is shown below. This card consists of an interface circuit (BUS and VCC
connectors), bootstrap capacitors, snubber capacitor, short-circuit protection, fault output
circuit, temperature monitoring, single-/three-shunt resistors and filters for input signals. It
also includes bypass capacitors for VCC and bootstrap capacitors. The capacitors are
located very close to the drive IC to avoid malfunction due to noise.
Three current sensing options are provided: three dedicated onboard op-amps, one internal
IPM op-amp and the embedded MCU op-amps; selection is performed through three
jumpers.
The Hall/Encoder section (powered at 5 V or 3.3 V) completes the circuit.
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Circuit schematics
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2.1 Schematic diagrams
Figure 3: STEVAL-IPMNG3Q circuit schematic (1 of 5)
Input
DC_bus_voltage
STEVAL-IPMNntmp decode r
t
m
p
G M
0 1 2 3
5 6 7
4
8 9
NQ
3.3V
+Bus 3.3V
1.65V
Bus_voltage
RC60
RC12
0
RC14
0
0 2CR
D1
RC10
+C4
47µ/35V
J1
INPUT-dc
1
2
RC10
0
RC7
0
R2
470K
R3 120R
R1
470K
R6
1k0
-
+
U1D
TSV994
12
13 14
411
RC13
0
RC3
0
RC80 RC11
0
RC4
0
+C3
47µ/35V
R4
7k5C2
10n
RC5
0
RC9
0
+C1
330µ/400V
R5
1k0
Circuit schematics
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DocID030323 Rev 3
Figure 4: STEVAL-IPMNG3Q circuit schematic (2 of 5)
phase_A
phase_B
phase_C
3.3V
+5V
EM_STOP
PWM-A-H
PWM-A-L
PWM-B-H
PWM-B-L
PWM-C-H
PWM-C-L
NTC_bypass_relay
PWM_Vref
M_phase_A
M_phase_B
Bus_voltage
M_phase_C
NTC
Current_B_amp
E2
Current_C_amp
E3
Current_A_amp
E1
J3
Motor Output
1
2
3
SW2
1
2
3
SW3
1
2
3
J2
Control Connector
1 2
3 4
5 6
7 8
9 10
11 12
13 14
15 16
17
19
21
23
25 26
27 28
29 30
31 32
33 34
18
20
22
24
SW1
1
2
3
Current_A
Current_B
Current_C
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Circuit schematics
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Figure 5: STEVAL-IPMNG3Q circuit schematic (3 of 5)
Phase C - input
Phase B - input
Phase A - input
IPM module
1_SHUNT 1_SHUNT
3_SHUNT
3_SHUNT
+Bus
phase_C
phase_B
phase_A
3.3V
PWM-C-H
PWM-C-L
PWM-B-H
PWM-B-L
PWM-A-H
PWM-A-L
EM_STOP
E3
E2
E1
NTC
nano OPOUT
nano OP+
nano OP-
TP16SW6
U2
STGIPQ3H60T-HZ
P18
HINW
4
VccW
3
LINV
11
VccV
9
HINV
10
CIN
12
LINU
16
VCCU
13
HINU
14
T/SD/OD1
15
GND
1
T/SD/OD
2
LINW
5
OP+
6
OPOUT
7
OP-
8
U,OUTU 19
NU 20
VbootV 21
V,OUTV 22
NV 23
VbootW 24
W, OUTW 25
NW 26
VbootU 17
TP19
TP27
C18
3.3n
TP21
D7
MMSZ5250B
R10
1k0
R18
0.2 1W
C13
100n
R7 1k0
TP4
SW5
C10
10p
TP11
R12
5k6
TP18
R15 1k0
TP3
D9
MMSZ5250B
C14
10p
TP5
R19 1k0
C8
1n
C16
10p
R9 1k0
D2
LED Red
R11
4k7
TP6
R13 1k0
D3
D6
MMSZ5250B
R14 1k0
C11
10p
C15
10p
C6
2.2u
TP20
R16
0.2 1W
C17
0,1 uF - 400V
TP13
TP12
TP17
TP22
TP7
J4
15V
1
2
D5
C19
10p
C5
2.2u
SW7 SW8
TP9
TP15
TP10
R17
0.2 1W
TP23
D4
TP2
D8
MMSZ5250B
SW4
TP8
R8 1k0
C7
2.2u
TP14
+C12
10u 50V
TP1
Circuit schematics
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DocID030323 Rev 3
Figure 6: STEVAL-IPMNG3Q circuit schematic (4 of 5)
3.3V
1.65V
1.65V
1.65V
3.3V
3.3V
3.3V
E1
Current_A_amp
E2
Current_B_amp
E3
Current_C_amp
nano OP+
nano OP-
nano OPOUT
R21 1k0
R20
1k9
-
+
U1A
TSV994
3
21
411
TP24
R22
1k
R33
1k9
C30
100p
R27 1k0
C29
330p
R31
1k
C24
100p
C28
10n
C25
330p
TP25
-
+
U1B
TSV994
5
67
411
R26 1k0
C23
100n
C22
10n
R25
1k9
D10
R24
1k9
R32 1k0 C31
330p
TP26
SW17
1
2
3
R23 1k0
R29
1k9
+
C21
4.7u 50V
C27
100p
-
+
U1C
TSV994
10
98
411
R30 1k0
R28
1k9
C26
10n
R43
1k
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Circuit schematics
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Figure 7: STEVAL-IPMNG3Q circuit schematic (5 of 5)
H3/Z+
H2/B+
H1/A+
GND
+ 3.3/5V
Hall/Encoder
M_phase_A
M_phase_C
M_phase_B
3.3V
+5V
3.3V
+5V
R42
4k7
R39 2k4
J5
Encoder/Hall
11
22
33
44
55
SW12
C37
10p
SW15
C34
100n
SW13
SW10
R40
4k7
SW9
1
2
3
R34
4k7
R41
4k7
R35
4k7
C33
100n
C35
10p
R37 2k4
SW14
R38 2k4
C32
100n
SW16
1
2
3
R36
4k7
SW11
C36
10p
Main characteristics
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3 Main characteristics
The board is designed for a 125 VDC to 400 VDC supply voltage.
An appropriate bulk capacitor for the power level of the application must be mounted at the
dedicated position on the board.
The SLLIMM-nano integrates six IGBT switches with freewheeling diodes and high voltage
gate drivers. Thanks to this integrated module, the system offers power inversion in a
simple and compact design that requires less PCB area and increases reliability.
The board offers the added flexibility of being able to operate in single- or three-shunt
configuration by modifying solder bridge jumper settings (see Section 4.3.4: "Single- or
three-shunt selection").
Figure 8: STEVAL-IPMNG3Q architecture
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Filters and key parameters
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4 Filters and key parameters
4.1 Input signals
The input signals (LINx and HINx) to drive the internal IGBTs are active high. A 375 kΩ
(typ.) pull-down resistor is built-in for each input signal. To prevent input signal oscillation,
an RC filter is added on each input as close as possible to the IPM. The filter is designed
using a time constant of 10 ns (1 kΩ and 10 pF).
4.2 Bootstrap capacitor
In the 3-phase inverter, the emitters of the low side IGBTs are connected to the negative
DC bus (VDC-) as common reference ground, which allows all low side gate drivers to share
the same power supply, while the emitter of the high side IGBTs is alternately connected to
the positive (VDC+) and negative (VDC-) DC bus during running conditions.
A bootstrap method is a simple and cheap solution to supply the high voltage section. This
function is normally accomplished by a high voltage fast recovery diode. The SLLIMM-nano
2nd series family includes a patented integrated structure that replaces the external diode
with a high voltage DMOS functioning as a diode with series resistor. An internal charge
pump provides the DMOS driving voltage.
The value of the CBOOT capacitor should be calculated according to the application
requirements.
Figure 9: "CBOOT graph selection" shows the behavior of CBOOT (calculated) versus
switching frequency (fsw), with different values of ∆VCBOOT for a continuous sinusoidal
modulation and a duty cycle δ = 50%.
This curve is taken from application note AN4840 (available on www.st.com);
calculations are based on the STGIP5C60T-Hyy device, which represents the
worst case scenario for this kind of calculation.
The boot capacitor must be two or three times larger than the CBOOT calculated in the
graph.
For this design, a value of 2.2 µF was selected.
Filters and key parameters
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Figure 9: CBOOT graph selection
4.3 Overcurrent protection
The SLLIMM-nano 2nd series integrates a comparator for fault sensing purposes. The
comparator has an internal voltage reference VREF (540 mV typ.) connected to the inverting
input, while the non-inverting input on the CIN pin can be connected to an external shunt
resistor to implement the overcurrent protection function. When the comparator triggers,
the device enters the shutdown state.
The comparator output is connected to the SD pin in order to send the fault message to
the MCU.
4.3.1 SD pin
The SD is an input/output pin (open drain type if used as output) used for enable and
fault; it is shared with NTC thermistor, internally connected to GND.
The pull-up resistor (R10) causes the voltage VSD-GND to decrease as the temperature
increases. To maintain the voltage above the high-level logic threshold, the pull-up resistor
is sized at 1 kΩ (3.3 V MCU power supply).
The filter on SD (R10 and C18) must be sized to obtain the desired re-starting time after
a fault event and placed as close as possible to the pin.
A shutdown event can be managed by the MCU; in which case, the SD functions as the
input pin.
Conversely, the SD functions as an output pin when an overcurrent or undervoltage
condition is detected.
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Filters and key parameters
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4.3.2 Shunt resistor selection
The value of the shunt resistor is calculated by the following equation:
Equation 1
Where Vref is the internal comparator (CIN) (0.54 V typ.) and IOC is the overcurrent
threshold detection level.
The maximum OC protection level should be set to less than the pulsed collector current in
the datasheet. In this design the over current threshold level was fixed at IOC = 3.9 A in
order to select a commercial shunt resistor value.
Equation 2
Where VF is the voltage drop across diodes D3, D4 and D5.
For the power rating of the shunt resistor, the following parameters must be considered:
Maximum load current of inverter (85% of Inom [Arms]): Iload(max).
Shunt resistor value at TC = 25 °C.
Power derating ratio of shunt resistor at TSH =100 °C
Safety margin.
The power rating is calculated by following equation:
Equation 3
For the STGIPQ3H60T-HZ, where RSH = 0.2 Ω:
Power derating ratio of shunt resistor at TSH = 100 °C: 80% (from datasheet
manufacturer)
Safety margin: 30%
Equation 4
Considering available commercial values, a 2 W shunt resistor was selected.
Based on the previous equations and conditions, the minimum shunt resistance and power
rating is summarized below.
Table 1: Shunt selection
Device
Inom (peak)
[A]
OCP(peak)
[A]
Iload(max)
[Arms]
RSHUNT
[Ω]
Minimum shunt power
rating PSH [W]
STGIPQ3H60T-
HZ
3
4.2
1.8
0.2
0.52
Filters and key parameters
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4.3.3 CIN RC filter
An RC filter network on the CIN pin is required to prevent short-circuits due to the noise on
the shunt resistor. In this design, the R15-C8 RC filter has a constant time of about 1 µs.
4.3.4 Single- or three-shunt selection
Single- or three-shunt resistor circuits can be adopted by setting the solder bridges SW5,
SW6, SW7 and SW8.
The figures below illustrate how to set up the two configurations.
Figure 10: One-shunt configuration
Figure 11: Three-shunt configuration
Further details regarding sensing configuration are provided in the next section.
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Current sensing amplifying network
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5 Current sensing amplifying network
The STEVAL-IPMNG3Q motor control demonstration board can be configured to run in
three-shunt or single-shunt configurations for field oriented control (FOC).
The current can be sensed thanks to the shunt resistor and amplified by using the on-board
operational amplifiers or by the MCU (if equipped with op-amp).
Once the shunt configuration is chosen by setting solder bridge on SW5, SW6, SW7 and
SW8 (as described in Section 4.3.4: "Single- or three-shunt selection"), the user can
choose whether to send the voltage shunt to the MCU amplified or not amplified.
Single-shunt configuration requires a single op amp so the only voltage sent to the MCU to
control the sensing is connected to phase V through SW2.
SW1, SW2, SW3 and SW17 can be configured to select which signals are sent to the
microcontroller, as per the following table.
Table 2: Op-amp sensing configuration
Configuration
Sensing
Bridge
(SW1)
Bridge
(SW2)
Bridge
(SW3)
Bridge
(SW17)
Single Shunt
IPM op-amp
open
1-2
open
2-3
On board op-
amp
open
1-2
open
1-2
MCU op-amp
open
2-3
open
1-2
Three Shunt
On board op-
amp
1-2
1-2
1-2
1-2
MCU op-amp
2-3
2-3
2-3
1-2
The operational amplifier TSV994 used on the amplifying networks has a 20 MHz gain
bandwidth from a single positive supply of 3.3 V.
The amplification network must allow bidirectional current sensing, so an output offset VO =
+1.65 V represents zero current.
For the STGIPQ3H60T-HZ (IOCP = 4.2 A; RSHUNT = 0.2 Ω), the maximum measurable phase
current, considering that the output swings from +1.65 V to +3.3 V (MCU supply voltage)
for positive currents and from +1.65 V to 0 for negative currents is:
Equation 5
The overall trans-resistance of the two-port network is:
Finally choosing Ra=Rb and Rc=Rd, the differential gain of the circuit is:
Current sensing amplifying network
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An amplification gain of 1.9 was chosen. The same amplification is obtained for all the
other devices, taking into account the OCP current and the shunt resistance, as described
in Table 1: "Shunt selection".
The RC filter for output amplification is designed to have a time constant that matches
noise parameters in the range of 1.5 µs:
Table 3: Amplifying networks
Phase
Amplifying network
RC filter
Ra
Rb
Rc
Rd
Re
Cc
Phase U
R21
R23
R20
R24
R22
C25
Phase V
R26
R27
R25
R29
R43
C29
Phase W
R30
R32
R28
R33
R31
C31
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Temperature monitoring
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6 Temperature monitoring
The SLLIMM-nano 2nd series family integrates an NTC thermistor placed close to the power
stage. The board is designed to use it in sharing with the SD pin. Monitoring can be
enabled and disabled via the SW4 switch.
6.1 NTC Thermistor
The built-in thermistor (85 kΩ at 25 °C) is inside the IPM and connected on SD /OD pin2
(shared with the SD function).
Given the NTC characteristic and the sharing with the SD function, the network is
designed to keep the voltage on this pin higher than the minimum voltage required for the
pull up voltage on this pin over the whole temperature range.
Considering Vbias = 3.3 V, a pull up resistor of 1 kΩ (R10) was used.
The figure below shows the typical voltage on this pin as a function of device temperature.
Figure 12: NTC voltage vs temperature
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
25 50 75 100 125
VSD [V]
Temperature [°C]
Vdd=3.3V
Rsd=1.0kohm
Isd (SD ON)=2.8mA
From/to mC SD/OD
M1
Smart
shut
down
VBias
RSD
CSD
SLLIMM
NTC
VSD_thL
VSD_thH
VMCU_thH
VMCU_thL
Firmware configuration for STM32 PMSM FOC
SDK
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7 Firmware configuration for STM32 PMSM FOC SDK
The following table summarizes the parameters which customize the latest version of the
ST FW motor control library for permanent magnet synchronous motors (PMSM): STM32
PMSM FOC SDK for this STEVAL-IPMNG3Q.
Table 4: ST motor control workbench GUI parameters - STEVAL-IPMNG3Q
Block
Parameter
Value
Over current protection
Comparator threshold
Overcurrent network offset
0
Overcurrent network gain
0.1 V/A
Bus voltage sensing
Bus voltage divider
1/125
Rated bus voltage info
Min rated voltage
125 V
Max rated voltage
400 V
Nominal voltage
325 V
Current sensing
Current reading typology
Single- or three-shunt
Shunt resistor value
0.2 Ω
Amplifying network gain
1.9
Command stage
Phase U Driver
HS and LS: Active high
Phase V Driver
HS and LS: Active high
Phase W Driver
HS and LS: Active high
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Connectors, jumpers and test pins
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8 Connectors, jumpers and test pins
Table 5: Connectors
Connector
Description / pinout
J1
Supply connector (DC – 125 V to 400 V)
1-L - phase
2 N - neutral
J2
Motor control connector
1 - emergency stop
3 - PWM-1H
5 - PWM-1L
7 - PWM-2H
9 - PWM-2L
11 - PWM-3H
13 - PWM-3L
15 - current phase A
17 - current phase B
19 - current phase C
21 - NTC bypass relay
23 - dissipative brake PWM
25 - +V power
27- PFC sync.
29 - PWM VREF
31 - measure phase A
33 - measure phase B
2 - GND
4 - GND
6 - GND
8 - GND
10 - GND
12 - GND
14 - HV bus voltage
16 - GND
18 - GND
20 - GND
22 - GND
24 - GND
26 - heat sink temperature
28 - VDD_m
30 - GND
32 - GND
34 - measure phase C
J3
Motor connector
phase A
phase B
phase C
J4
VCC supply (20 VDC max)
positive
negative
J5
Hall sensors / encoder input connector
1. Hall sensors input 1 / encoder A+
2. Hall sensors input 2 / encoder B+
3. Hall sensors input 3 / encoder Z+
4. 3.3 or 5 Vdc
5. GND
Connectors, jumpers and test pins
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Table 6: Jumpers
Jumper
Description
SW1
Choose current U to send to control board:
Jumper on 1-2: from amplification
Jumper on 2-3: directly from motor output
SW2
Choose current V to send to control board
Jumper on 1-2: from amplification
Jumper on 2-3: directly from motor output
SW3
Choose current W to send to control board:
Jumper on 1-2: from amplification
Jumper on 2-3: directly from motor output
SW4
Enable or disable sending temperature information from NTC to microcontroller
SW5, SW6
SW7, SW8
Choose 1-shunt or 3-shunt configuration.
(through solder bridge)
SW5, SW6 closed
SW7, SW8 open
one shunt
SW5, SW6 open
SW7, SW8 closed
three shunt
SW9, SW16
Choose input power for Hall/Encoder
Jumper on 1-2: 5 V
Jumper on 2-3: 3.3 V
SW10, SW13
Modify phase A hall sensor network
SW11, SW14
Modify phase B hall sensor network
SW12, SW15
Modify phase C hall sensor network
SW17
Choose on-board or IPM op-amp in one shunt configuration
Jumper on 1-2: on-board op-amp
Jumper on 2-3: IPM op-amp
UM2176
Connectors, jumpers and test pins
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Table 7: Test pins
Test Pin
Description
TP1
OUTW
TP2
HINW (high side W control signal input)
TP3
VccW
TP4
SD (shutdown pin)/NTC
TP5
LINW (high side W control signal input)
TP6
OP+
TP7
OPOUT
TP8
OP-
TP9
VbootW
TP10
OUTV
TP11
NV
TP12
HINV (high side V control signal input)
TP13
VbootV
TP14
LINV (high side V control signal input)
TP15
CIN
TP16
NU
TP17
NW
TP18
OUTU
TP19
VbootU
TP20
LINU (high side U control signal input)
TP21
Ground
TP22
Ground
TP23
HinU (high side U control signal input)
TP24
Current_A_amp
TP25
Current_B_amp
TP26
Current_C_amp
TP27
Ground
Bill of materials
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DocID030323 Rev 3
9 Bill of materials
Table 8: Bill of materials
Item
Q.
ty
Ref.
Part/Value
Description
Manufacturer
Order
code
1
1
C1
330 µF 400 V ±10%
Electrolytic
Capacitor
EPCOS
B4350
1A933
7M000
2
5
C2, C22, C26,
C28
10 nF 50 V ±10%
Ceramic
Multilayer
Capacitors
AVX
12065
C103K
AT2A
3
2
C3, C4
47 µF 50 V ±20%
Electrolytic
Capacitor
any
any
4
3
C5, C6, C7
2.2 µF 25V ±10%
Ceramic
Multilayer
Capacitors
Murata
GCM3
1MR71
E225K
A57L
5
1
C17
0.1 µF 630V ±10%
Ceramic
Multilayer
Capacitors
Murata
GRM4
3DR72
J104K
W01L
6
9
C10,C11,C14,
C15,C16,
C19,C35,C36,
C37
10 pF 100 V ±10%
Ceramic
Multilayer
Capacitors
AVX
12061
A100J
AT2A
7
5
C13,C23,C32,
C33,C34
100 nF 50 V ±10%
Ceramic
Multilayer
Capacitors
AVX
12065
C104K
AZ2A
8
1
C8
1 nF 50 V ±10%
Ceramic
Multilayer
Capacitors
Kemet
C1206
C102K
5RACT
U
9
1
C12
10 µF 50 V ±20%
Electrolytic
Capacitor
any
any
10
1
C18
3.3 nF 50 V ±10%
Ceramic
Multilayer
Capacitors
Kemet
C1206
C332K
5RACT
U
11
3
C24,C27,C30
100 pF 100 V ±10%
Ceramic
Multilayer
Capacitors
Kemet
C1206
C101J
1GACT
U
12
3
C25,C29,C31
330 pF 50 V ±10%
Ceramic
Multilayer
Capacitors
AVX
12065
A331J
AT2A
13
1
C21
4.7 µF 50 V ±20%
Electrolytic
Capacitor
any
any
14
5
D1,D3,D4,D5,
D10
Diode BAT48J
-
ST
BAT48
J
UM2176
Bill of materials
DocID030323 Rev 3
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Item
Q.
ty
Ref.
Part/Value
Description
Manufacturer
Order
code
15
4
D6,D7,D8,D9
Diode ZENER 20 V 5
-
Fairchild
Semiconductor
MMSZ
5250B
16
1
D2
LED Red
-
Ledtech
L4RR3
000G1
EP4
17
1
J1
Conector - 7.62 mm -
2P 300 V
-
TE Connectivity
AMP
Connectors
282845
-2
18
1
J2
Connector 34P
-
RS
625-
7347
19
1
J3
Connector - 7,62 mm -
3P 400 V
-
TE Connectivity
AMP
Connectors
282845
-3
20
1
J4
Connector - 5 mm - 2P
50 V
-
Phoenix Contact
172912
8
21
1
J5
Connector - 2.54 mm -
5P 63 V
-
RS
W8113
6T382
5RC
22
2
R1,R2
470 kΩ 400 V ±1%
metal film
SMD resistor
any
any
23
1
R3
120 Ω 400 V ±1%
metal film
SMD resistor
any
any
24
1
R4
7.5 kΩ 400 V ±1%
metal film
SMD resistor
Panasonic
ERJP0
8F750
1V
25
19
R5,R6,R7,R8,
R9,
R10,R13,R14,
R15,R19,
R21,R22,R23,
R26,R27,
R30,R31,R32,
R43
1 kΩ 25 V ±1%
metal film
SMD resistor
any
any
26
1
R12
5.6 kΩ 25 V ±1%
metal film
SMD resistor
any
any
27
3
R16,R17,R18
0.2 Ω
metal film
SMD resistor
Vishay / Dale
WSL25
12R20
00FEA
28
6
R20,R24,R25,
R28,R29, R33
1.9 kΩ
any
any
29
3
R37,R38,R39
2.4 kΩ 25 V ±1%
metal film
SMD resistor
any
any
30
7
R11,R34,R35,
R36,R40,
R41,R42
4.7 kΩ 25 V ±1%
metal film
SMD resistor
any
any
31
3
RC1,RC6,
RC14
0 Ω any
any
any
Bill of materials
UM2176
26/33
DocID030323 Rev 3
Item
Q.
ty
Ref.
Part/Value
Description
Manufacturer
Order
code
32
11
RC2,RC3,RC4
,RC5,RC7,
RC8,RC9,RC1
0,RC11,RC12,
RC13
DNM
33
2
SW7,SW8
Solder Bridge
-
-
-
34
2
SW5,SW6
open
-
-
-
35
6
SW1,SW2,SW
3,SW9,
SW16,SW17
Jumper 2.54
-
RS
W8113
6T382
5RC
36
7
SW4,SW10,S
W11,SW12,
SW13,SW14,S
W15
Jumper 2.54
-
RS
W8113
6T382
5RC
37
26
TP1,TP2,TP3,
TP4,TP5,
TP6,TP7,TP8,
TP9,TP10,
TP11,TP12,TP
13,TP14,TP15
,
TP16,TP17,TP
18,TP19,TP20
,
TP22,TP23,TP
24,TP25,TP26
, TP27
PCB terminal 1mm
-
KEYSTONE
5001
38
26
TP22,TP27
PCB terminal 1 mm
-
KEYSTONE
5001
39
1
TP21
PCB terminal 12.7mm
HARWIN
D3083
B-46
40
13
to close SWxy
Jumper TE Connectivity
female straight, Black,
2-way, 2.54 mm
-
RS
881545
-2
41
1
U1
TSV994IDT
-
ST
TSV99
4IDT
42
1
U2
STGIPQ3H60T-HZ ST-
SUPPLY
ST-SUPPLY
ST
STGIP
Q3H60
T-HZ
UM2176
PCB design guide
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10 PCB design guide
Optimization of PCB layout for high voltage, high current and high switching frequency
applications is a critical point. PCB layout is a complex matter as it includes several
aspects, such as length and width of track and circuit areas, but also the proper routing of
the traces and the optimized reciprocal arrangement of the various system elements in the
PCB area.
A good layout can help the application to properly function and achieve expected
performance. On the other hand, a PCB without a careful layout can generate EMI issues,
provide overvoltage spikes due to parasitic inductance along the PCB traces and produce
higher power loss and even malfunction in the control and sensing stages.
In general, these conditions were applied during the design of the board:
PCB traces designed as short as possible and the area of the circuit (power or signal)
minimized to avoid the sensitivity of such structures to surrounding noise.
Good distance between switching lines with high voltage transitions and the signal line
sensitive to electrical noise.
The shunt resistors were placed as close as possible to the low side pins of the
SLLIMM. To decrease the parasitic inductance, a low inductance type resistor (SMD)
was used.
RC filters were placed as close as possible to the SLLIMM pins in order to increase
their efficiency.
10.1 Layout of reference board
All the components are inserted on the top of the board. Only the IPM module is inserted
on the bottom to allow the insertion of a suitable heatsink for the application.
Figure 13: Silk screen and etch - top side
PCB design guide
UM2176
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DocID030323 Rev 3
Figure 14: Silk screen and etch - bottom side
UM2176
Recommendations and suggestions
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11 Recommendations and suggestions
The BOM list is not provided with a bulk capacitor already inserted in the PCB.
However, the necessary space has been included (C1). In order to obtain a stable bus
supply voltage, it is advisable to use an adequate bulk capacity. For general motor
control applications, an electrolytic capacitor of at least 100 µF is suggested.
Similarly, the PCB does not come with a heat sink. You can place one above the IPM
on the back side of the PCB with thermal conductive foil and screws. RTH is an
important factor for good thermal performance and depends on certain factors such as
current phase, switching frequency, power factor and ambient temperature.
The board requires +5 V and +3.3 V to be supplied externally through the 34-pin motor
control connector J2. Please refer to the relevant board manuals for information on
key connections and supplies.
General safety instructions
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DocID030323 Rev 3
12 General safety instructions
The evaluation board works with high voltage which could be deadly for the users.
Furthermore all circuits on the board are not isolated from the line input. Due to
the high power density, the components on the board as well as the heat sink can
be heated to a very high temperature, which can cause a burning risk when
touched directly. This board is intended for use by experienced power electronics
professionals who understand the precautions that must be taken to ensure that
no danger or risk may occur while operating this board.
After the operation of the evaluation board, the bulk capacitor C1 (if used) may
still store a high energy for several minutes. So it must be first discharged before
any direct touching of the board.
To protect the bulk capacitor C1, we strongly recommended using an external
brake chopper after C1 (to discharge the high brake current back from the
induction motor).
UM2176
References
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13 References
Freely available on www.st.com:
1. STGIPQ3H60T-HZ datasheet
2. TSV994 datasheet
3. BAT48 datasheet
4. MMSZ5250B datasheet
5. UM1052 STM32F PMSM single/dual FOC SDK v4.3
6. AN4840 SLLIMM™-nano 2nd series small low-loss intelligent molded module
Revision history
UM2176
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DocID030323 Rev 3
14 Revision history
Table 9: Document revision history
Date
Version
Changes
02-Mar-2017
1
Initial release.
17-May-2017
2
Updated Figure 1: "Motor control board (top view) based on SLLIMM-
nano™ 2nd series"
In Table 4: "ST motor control workbench GUI parameters - STEVAL-
IPMNG3Q", changed current sensing block amplifying network gain
parameter value to 1.9 (was 0.9)
19-Sep-2017
3
Updated Section 1: "Key features", Section 4.3.2: "Shunt resistor
selection" and Section 11: "Recommendations and suggestions".
UM2176
DocID030323 Rev 3
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