©2006 Fairchild Semiconductor Corporation
1
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FODMX Rev. 1.0.7
FODM121 Series, FODM124, FODM2701 Series, FODM2705 4-Pin Full Pitch Mini-Flat Package Transistor Output Optocouplers
February 2007
FODM121 Series, FODM124, FODM2701 Series, FODM2705
4-Pin Full Pitch Mini-Flat Package Transistor Output
Optocouplers
Features
■
>5mm creepage/clearance
■
Compact 4-pin surface mount package
(2.4mm maximum standoff height)
■
Current Transfer Ratio in selected groups
DC Input:
FODM121: 50–600% FODM2701: 50–300%
FODM121A: 100–300% FODM2701A: 150–300%
FODM121B: 50–150% FODM2701B: 80–160%
FODM121C: 100–200% FODM124: 100% MIN
FODM121D: 50–100%
FODM121E: 150–300%
FODM121F: 100–600%
FODM121G: 200–400%
AC Input:
FODM2705: 50–300%
■
Available in tape and reel quantities of 500 and 2500
■
Applicable to Infrared Ray reflow
(260°C max, 10 seconds)
■
C-UL, UL and VDE* certifications
*option ‘V’ required
Applications
■
Digital logic inputs
■
Microprocessor inputs
■
Power supply monitor
■
Twisted pair line receiver
■
Telephone line receiver
Description
The FODM124, FODM121, and FODM2701 series con-
sists of a gallium arsenide infrared emitting diode driving
a phototransistor in a compact 4-pin mini-flat package.
The lead pitch is 2.54 mm. The FODM2705 series con-
sists of two gallium arsenide infrared emitting diodes
connected in inverse parallel for AC operation.
Package Dimensions
1
2
4
3EMITTER
Equivalent Circuit
FODM121, FODM124, FODM2701
Equivalent Circuit
FODM2705
COLLECTORANODE
CATHODE
1
2
4
3EMITTER
COLLECTORANODE
CATHODE
4.40±0.20
2.54
3.85±0.20
2.00±0.20
0.10±0.10 0.40±0.10
5.30±0.30
7.00+0.2
–0.7
0.20±0.05
Note:
All dimensions are in millimeters.
2
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FODMX Rev. 1.0.7
FODM121 Series, FODM124, FODM2701 Series, FODM2705 4-Pin Full Pitch Mini-Flat Package Transistor Output Optocouplers
Absolute Maximum Ratings
(T
A
= 25°C unless otherwise specified)
Electrical Characteristics
(T
A
= 25°C)
Individual Component Characteristics
Symbol Parameter Value Units
TOTAL PACKAGE
T
STG
Storage Temperature -40 to +125 °C
T
OPR
Operating Temperature -40 to +110 °C
EMITTER
I
F (avg)
Continuous Forward Current 50 mA
I
F (pk)
Peak Forward Current (1µs pulse, 300 pps.) 1 A
V
R
Reverse Input Voltage 6 V
P
D
Power Dissipation 70 mW
Derate linearly (above 25°C) 0.65 mW/°C
DETECTOR
Continuous Collector Current 80 mA
P
D
Power Dissipation 150 mW
Derate linearly (above 25°C) 2.0 mW/°C
V
CEO
Collector-Emitter Voltage FODM2701 Series, FODM2705 40 V
FODM121 Series, FODM124 80
V
ECO
Emitter-Collector Voltage 7 V
Symbol Parameter Test Conditions Device Min. Typ.* Max. Unit
EMITTER
V
F
Forward Voltage I
F
= 10mA FODM121 Series
FODM124
1.0 1.3 V
I
F
= 5mA FODM2701 Series 1.4
I
F
= ±5mA FODM2705
I
R
Reverse Current V
R
= 5V FODM2701 Series 5 µA
FODM121 Series
FODM124
DETECTOR
BV
CEO
Breakdown Voltage
Collector to Emitter
I
C
= 1mA, I
F
= 0 FODM121 Series
FODM124
80 V
FODM2701 Series
FODM2705
40
BV
ECO
Emitter to Collector I
E
= 100µA, I
F
= 0 All 7 – V
I
CEO
Collector Dark
Current
V
CE
= 40V, I
F
= 0 All 100 nA
C
CE
Capacitance V
CE
= 0V, f = 1MHz All 10 pF
3
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FODMX Rev. 1.0.7
FODM121 Series, FODM124, FODM2701 Series, FODM2705 4-Pin Full Pitch Mini-Flat Package Transistor Output Optocouplers
Transfer Characteristics
(T
A
= 25°C)
Isolation Characteristics
*All typicals at T
A
= 25°C
Note:
1. Steady state isolation voltage, V
ISO
, is an internal device dielectric breakdown rating. For this test, pins 1 and 2 are
common, and pins 3 and 4 are common.
Symbol Characteristic Test Conditions Device Min. Typ.** Max. Unit
CTR DC Current Transfer Ratio I
F
= ±5mA, V
CE
= 5V FODM2705 50 300 %
I
F
= 5mA, V
CE
= 5V FODM2701 50 300
FODM2701A 150 300
FODM2701B 80 160
I
F
= 5mA, V
CE
= 5V FODM121 50 600
FODM121A 100 300
FODM121B 50 150
FODM121C 100 200
FODM121D 50 100
FODM121E 150 300
FODM121F 100 600
FODM121G 200 400
I
F
= 1mA, V
CE
= 0.4V FODM121F 30
I
F
= 1mA, V
CE
= 0.5V FODM124 100 1200
I
F
= 0.5mA, V
CE
= 1.5V FODM124 50
CTR Symmetry I
F
= ±5mA, V
CE
= 5V FODM2705 0.3 3.0
V
CE (SAT)
Saturation Voltage I
F
= ±10mA, I
C
= 2mA FODM2705 0.3 V
I
F
= 10mA, I
C
= 2mA FODM2701 0.3
FODM2701A 0.3
FODM2701B 0.3
I
F
= 8mA, I
C
= 2.4mA FODM121 0.4
FODM121A 0.4
FODM121B 0.4
FODM121C 0.4
FODM121D 0.4
FODM121E 0.4
FODM121F 0.4
FODM121G 0.4
I
F
= 1mA, I
C
= 0.2mA FODM121F 0.4
I
F
= 1mA, I
C
= 0.5mA FODM124 0.4
t
r
Rise Time (Non-Saturated) I
C
= 2mA, V
CE
= 5V,
R
L
= 100
Ω
All 3 µs
t
f
Fall Time (Non-Saturated) I
C
= 2mA, V
CE
= 5V,
R
L
= 100
Ω
All 3 µs
Characteristic Test Conditions Symbol Device Min. Typ.* Max. Unit
Steady State Isolation Voltage
(1)
1 Minute V
ISO
All 3750 VRMS
4
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FODMX Rev. 1.0.7
FODM121 Series, FODM124, FODM2701 Series, FODM2705 4-Pin Full Pitch Mini-Flat Package Transistor Output Optocouplers
Typical Performance Curves
Fig. 1 Forward Current vs. Forward Voltage
VF - Forward Voltage (V)
IF - Forward Current (mA)
VCE(sat) - Collector-Emitter Saturation Voltage(V)
CTR – Current Transfer Ratio (%)
0.6 0.8 1.0 1.2 1.4 1.6 1.8
1
10
100
T
A = 110oC
70oC
25oC0oC
-40oC
Fig. 2 Collector-Emitter Saturation Voltage vs.
Ambient Temperature (FODM121/2701/2705)
TA - Ambient Temperature (°C)
-40 -20 0 20 40 60 80 100 120
0.00
0.05
0.10
0.15
0.20
0.25
0.30
0.35
IF = 10mA
IC = 2mA
IF = 8mA
IC = 2.4mA
Fig. 3 Current Transfer Ratio vs. Forward Current
(FODM121/2701/2705)
IF - Forward Current (mA)
0.1 1 10 100
10
100
TA = 25oC
VCE = 5V
VCE = 10V
Fig. 4 Collector Current vs. Forward Current
(FODM121/2701/2705)
IF - Forward Current (mA)
0.1 1 10 100
0.1
1
10
100
TA = 25oC
VCE = 5V
VCE = 10V
Fig. 5 Collector Current vs. Ambient Temperature
(FODM121/2701/2705)
TA - Ambient Temperature (°C)
-40 -20 0 20 40 60 80 100 120
0.01
0.1
1
10
100
VCE = 5V
IF = 0.5mA
IF = 1mA
IF = 5mA
IF = 10mA
IF = 25mA
Fig. 6 Collector Current vs. Collector-Emitter
Voltage (FODM121/2701/2705)
VCE - Collector-Emitter Voltage (V)
0246810
0
10
20
30
40
TA = 25oC
IF = 50mA
IF = 1mA
IF = 5mA
IF = 10mA
IF = 20mA
IF = 30mA
IF = 40mA
IC - Collector Current (mA)
IC - Collector Current (mA)
IC - Collector Current (mA)
5
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FODMX Rev. 1.0.7
FODM121 Series, FODM124, FODM2701 Series, FODM2705 4-Pin Full Pitch Mini-Flat Package Transistor Output Optocouplers
CTR – Current Transfer Ratio (%)
CTR – Normalized Current Transfer Ratio (%)
ICEO - Collector Dark Current (nA)Switching Time (µs)
Fig 7. Collector Dark Current vs. Ambient
Temperature (FODM121/2701/2705)
TA - Ambient Temperature (°C) TA - Ambient Temperature (°C)
-40 -20 0 20 40 60 80 100 120
0.1
1
10
100
1000
10000
VCE = 40V
Fig. 8 Normalized Current Transfer Ratio vs.
Ambient Temperature (FODM121/2701/2705)
-40 -20 0 20 40 60 80 100 120
20
40
60
80
100
120
140
160
IF = 5mA
VCE = 5V
Normalized to TA = 25
oC
Fig. 9 Switching Time vs. Load Resistance
(FODM121/2701/2705)
RL - Load Resistance (kΩ)
110100
1
10
100
1000
VCC = 5V
TA = 25
oC
tOFF
tON
IF = 16mA
tS
IF = 5mA
Fig. 10 Collector-Emitter Saturation Voltage
vs. Ambient Temperature (FODM124)
TA - Ambient Temperature (°C)
-40 -20 0 20 40 60 80 100 120
0.00
0.05
0.10
0.15
0.20
0.25
0.30
0.35
IF = 1mA
IC = 0.5mA
Fig. 11 Current Transfer Ratio vs.
Forward Current (FODM124)
I
F
- Forward Current (mA)
0.1 1 10
10
100
TA = 25°C
VCE = 0.5V
Fig 12. Collector Current vs. Forward Current
(FODM124)
IF - Forward Current (mA)
0.1 1 10
0.01
0.1
1
10
TA = 25°C
VCE = 0.5V
VCE(sat) - Collector-Emitter Saturation Voltage(V)
IC - Collector Current (mA)
6
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FODMX Rev. 1.0.7
FODM121 Series, FODM124, FODM2701 Series, FODM2705 4-Pin Full Pitch Mini-Flat Package Transistor Output Optocouplers
CTR – Normalized Current Transfer Ratio (%)
Switching Time (µs)
I
C
- Collector Current (mA)
I
CEO
- Collector Dark Current (nA)
I
C
- Collector Current (mA)
Fig 13. Collector Current vs. Ambient Temperature
(FODM124)
TA - Ambient Temperature (°C)
-40 -20 0 20 40 60 80 100 120
0.1
1
10
VCE = 0.5V
IF = 0.5mA
IF = 1mA
IF = 5mA IF = 10mA
IF = 2mA
Fig. 14 Collector Current vs. Collector-Emitter Voltage
(FODM124)
VCE - Collector-Emitter Voltage (V)
0.0 0.2 0.4 0.6 0.8 1.0
0
2
4
6
8
10
T
A = 25
o
C
IF = 0.5mA
IF = 1mA
IF = 5mA
IF = 10mA
IF = 2mA
Fig. 15 Collector Dark Current vs. Ambient
Temperature (FODM124)
TA - Ambient Temperature (°C)
-40 -20 0 20 40 60 80 100 120
0.1
1
10
100
1000
10000 VCE = 40V
Fig. 16 Normalized Current Transfer Ratio vs.
Ambient Temperature (FODM124)
TA - Ambient Temperature (°C)
-40 -20 0 20 40 60 80 100 120
20
40
60
80
100
120
140
160
IF = 1mA,
VCE = 0.5V
Normalized to TA
= 25°C
Fig. 17 Switching Time vs. Load Resistance (FODM124)
RL - Load Resistance (kΩ)
110100
1
10
100
1000
V
CC = 5V
IF = 1mA
TA = 25°C
tOFF
tON
tS
7
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FODMX Rev. 1.0.7
FODM121 Series, FODM124, FODM2701 Series, FODM2705 4-Pin Full Pitch Mini-Flat Package Transistor Output Optocouplers
Ordering Information
Marking Information
Option Description
V VDE Approved
R1 Tape and Reel (500 units)
R2 Tape and Reel (2500 units)
R1V Tape and Reel (500 units) and VDE Approved
R2V Tape and Reel (2500 units) and VDE Approved
1
2
6
4
35
Definitions
1Fairchild logo
2Device number
3VDE mark (Note: Only appears on parts ordered with VDE option –
See order entry table)
4 One digit year code
5Two digit work week ranging from ‘01’ to ‘53’
6 Assembly package code
121
XVR
YY
8
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FODMX Rev. 1.0.7
FODM121 Series, FODM124, FODM2701 Series, FODM2705 4-Pin Full Pitch Mini-Flat Package Transistor Output Optocouplers
D
D
W
K
t
d
1
0
PP
A
P
0
B
0
0
2
E
F
W
1
0
R1
Reel Diameter
R2
Devices Per Reel
Max. Component Rotation or Tilt
Cover Tape Thickness
Cover Tape Width
Pocket Hole Dia.
Pocket Dimension
Pocket Location
Sprocket Hole Location
Sprocket Hole Dia.
Sprocket Hole Pitch
Tape Thickness
Pocket Pitch
Tape Width
Symbol
Description
R1
R2
B
d
W
1
D
K
0
1
0
E
A
P
0
P
F
2
D
P
0
0
t
W
178 mm (7")
330 mm (13")
Dimensions (mm)
12.00±0.4
7.30±0.20
20° max
500
1.55±0.20
2.30±0.20
0.065±0.02
9.20
1.75±0.20
8.00±0.20
2.00±0.20
5.50±0.20
4.75±0.20
1.55±0.20
4.00±0.20
0.35±0.02
2.54 Pitch
2500
9
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FODMX Rev. 1.0.7
FODM121 Series, FODM124, FODM2701 Series, FODM2705 4-Pin Full Pitch Mini-Flat Package Transistor Output Optocouplers
Footprint Drawing for PCB Layout
Recommended Infrared Reflow Soldering Profile
Note:
All dimensions are in mm.
0.80
6.50
2.54
1.00
• Peak reflow temperature: 260°C (package surface temperature)
• Time of temperature higher than 245°C: 40 seconds or less
• Number of reflows: 3
300
250
200
Temperature (°C)
150
100
50
0
500 100 150 200 250 300
Time (s)
10 s
260°C
245°C
40 s
10
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FODMX Rev. 1.0.7
FODM121 Series, FODM124, FODM2701 Series, FODM2705 4-Pin Full Pitch Mini-Flat Package Transistor Output Optocouplers
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not
intended to be an exhaustive list of all such trademarks.
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS
HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE
APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER
ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S
WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS.
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR
SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or systems which,
(a) are intended for surgical implant into the body, or (b) support or
sustain life, or (c) whose failure to perform when properly used in
accordance with instructions for use provided in the labeling, can be
reasonably expected to result in significant injury to the user.
2. A critical component is any component of a life support device or
system whose failure to perform can be reasonably expected to
cause the failure of the life support device or system, or to affect its
safety or effectiveness.
Definition of Terms
ACEx™
ActiveArray™
Bottomless™
Build it Now™
CoolFET™
CROSSVOLT ™
DOME™
EcoSPARK™
E2CMOS™
EnSigna™
FACT®
FAST®
FASTr™
FPS™
FRFET™
FACT Quiet Series™
GlobalOptoisolator™
GTO™
HiSeC™
I2C™
i-Lo™
ImpliedDisconnect™
IntelliMAX™
ISOPLANAR™
LittleFET™
MICROCOUPLER™
MicroFET™
MicroPak™
MICROWIRE™
MSX™
MSXPro™
OCX™
OCXPro™
OPTOLOGIC®
OPTOPLANAR™
PACMAN™
POP™
Power247™
PowerEdge™
PowerSaver™
PowerTrench®
QFET®
QS™
QT Optoelectronics™
Quiet Series™
RapidConfigure™
RapidConnect™
µSerDes™
ScalarPump™
SILENT SWITCHER®
SMART START™
SPM™
Stealth™
SuperFET™
SuperSOT™-3
SuperSOT™-6
SuperSOT™-8
SyncFET™
TCM™
TinyBoost™
TinyBuck™
TinyPWM™
TinyPower™
TinyLogic®
TINYOPTO™
TruTranslation™
UHC®
UniFET™
VCX™
Wire™
Across the board. Around the world.™
The Power Franchise®
Programmable Active Droop™
Datasheet Identification Prod uct S tatus Definition
Advance Information Formative or In Design This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
Preliminary First Production This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice to improve
design.
No Identification Needed Full Production This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice to improve design.
Obsolete Not In Production This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
FAIRCHILD SEMICONDUCTOR TRADEMARKS
DISCLAIMER
LIFE SUPPORT POLICY
PRODUCT STATUS DEFINITIONS
Rev. I22
