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Page <1> V1.008/04/14
Common Mode Choke
Congurations and Dimensions
A 8.3 ±0.5mm
B 7 ±0.5mm
C 10 ±0.5mm
D 5 ±0.5mm
Dimensions : Millimetres
Test Data for Mechanical
Test Item A
mm
B
mm
C
mm
D
mm
Specication 8.3 ±0.5 7 ±0.5 10 ±0.5 5 ±0.5
1 8.24 7.03 10.03 4.99
2 8.2 7 10.02 5.02
3 8.25 7.04 10.03 5.03
4 8.23 7.01 10.04 5.04
5 8.2 7 10.01 5.05
Average 8.22 7.02 10.03 5.03
Electrical Characteristics (at 25°C)
1kHz 0.25V
L1-4 80μH +50% -35%
L2-3
L1-4-L2-3 3μH (Max.)
at 25°C DCR1-4 60mΩ (Max.)
DCR2-3
100MHz Z 1.34KΩ (Typical)
Coil-Coil DC 1,000 2mA Hi-pot 3S (Min.)
Operating temperature: -20°C to +85°C
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Page <2> V1.008/04/14
Common Mode Choke
Schematic Diagram
Note:
1-4.Wire Ø0.25mm × 1P 2UEWF 155°C × 12TS (Reference)
2-3.Wire Ø0.25mm × 1P 2UEWF 155°C × 12TS (Reference)
Test Data for Electrical
Test
Item
L1-4
μH
L2-3
μH
L1-4-L2-3
μH
DCR1-4
mΩ
DCR2-3
mΩ
Z
Ω
Hi-pot
S
Condition 1KHz
0.25V
1KHz
0.25V
1KHz
0.25V at 25°C at 25°C 100MHz Coil-Coil DC
1,000 2mA
Specication
80
+50%
-35%
80
+50%
-35%
3
(Max.)
60
(Max.)
60
(Max.)
1.34
(Typical)
3
(Min.)
1 88.7 88.6
0.1
47.51 46.47 1.036 OK
2 86.4 86.3 46.89 46.48 1.084 OK
3 86.7 86.6 47.35 46.96 0.862 OK
4 87.7 87.7 0 46.73 46.92 0.863 OK
5 92.4 92.3 0.1 47.1 46.78 0.812 OK
Average 88.38 88.3 0.08 47.12 46.72 0.93 OK
Electric Characteristics
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Page <3> V1.008/04/14
Common Mode Choke
Reliability Test
Test Item Specications Test Method and Remarks
Operating temperature
range -20°C to +85°C Including temperature rise due to self-generated heat
Storage condition Ambient temperature : 0°C to 40°C
Humidity : Below 70%RH
To maintain the solderability of terminal electrodes,
care must be taken to control temperature and humidity
in the storage area.
Moisture sensitivity
Appearance : No abnormality
No damage
DCR change : Within ±20%
Inductance change : Within ±20%
According to J-STD-020B level 3
Test condition : 60°C 60% RH
Test duration : 40 hours
Recovery : 1 to 2 hours of recovery under the standard
condition after the removal from the test
chamber.
Solderability
All termination shall exhibit a
continuous solder coating free from
defects for a minimum of 90% of the
surface area of any individual lead.
According to J-STD-002B
Steam aging category : 97°C 98% RH
Steam aging duration : 8 hours
Solder : Lead-free solder
Solder temperature : 260 ±5°C
Dip time : 5 +0/-0.5 seconds.
Material List
No. Item Material Description
1 Core S2K T4.3 × 2.5 × 2.8
2 Wire Ø0.3mm × 2P 2UEWF 155°C
3Solder (Lead Free) Sn99.3%Cu0.7%
4Base BG406-1 LCP4008
Important Notice : This data sheet and its contents (the “Information”) belong to the members of the Premier Farnell group of companies (the “Group”) or are licensed to it. No licence is granted
for the use of it other than for information purposes in connection with the products to which it relates. No licence of any intellectual property rights is granted. The Information is subject to change
without notice and replaces all data sheets previously supplied. The Information supplied is believed to be accurate but the Group assumes no responsibility for its accuracy or completeness, any
error in or omission from it or for any use made of it. Users of this data sheet should check for themselves the Information and the suitability of the products for their purpose and not make any
assumptions based on information included or omitted. Liability for loss or damage resulting from any reliance on the Information or use of it (including liability resulting from negligence or where the
Group was aware of the possibility of such loss or damage arising) is excluded. This will not operate to limit or restrict the Group’s liability for death or personal injury resulting from its negligence.
Multicomp is the registered trademark of the Group. © Premier Farnell plc 2012.
Part Number Table
Description Part Number
Choke, common mode, 80μH, 60mΩ MCBS3019P-800U
