0.36mm ± 0.05mm
[0.014" ± 0.002"]
0.8mm typ.
2.48mm
[0.098"]
2.83mm
[0.112"]
13mm
[0.512"]
13mm
[0.512"]
0.9mm
[0.035"]
0.9mm [0.035"]
11.2mm square [0.441"]
Status: Released
Drawing: M.A. Fedde
Scale: 8:1 Rev: A
Date: 3/22/07
Modified:
File: SF-BGA177A-B-62 Dwg.mcd
SF-BGA177A-B-62(F) Drawing
© 2007 IRONWOOD ELECTRONIC S, INC.
11351 Rupp Dr. Ste 400 Burnsville, MN 55337
Tele: (952) 229-8200
www.ironwoodelectronics.com
Pins: shell material- Brass Alloy 360 1/2 hard;
shell finish- 0.25µm [10µ"] Au over 2.54µm
[100µ"] Ni (min.). Contact material- BeCu alloy
172, HT; contact finish 0.25µm [10µ"] Au over
1.27µm [50 µ"] Ni (min. ).
2
1
Top View
Side View
3
1
3
Description: Giga-snaP BGA SMT Foot
177 position (0.8mm pitch) gold plated fema le receptacle pins to SMT solder balls (BGA type). Pin asignment 1:1.
CONTACT DATA
Accepts 0.20mm - 0.33mm Diameter pins
3-finger
37/25 gram, Initial insertion force (with 0.254mm/0.203mm dia. pin)
30/22 gram, normal force (with 0.254mm/0.203mm dia. pin)
20/17 gram, extraction force (with 0.254mm0.203mm dia. pin)
2
Ordering Information:
Solder Ball Alloy Part Number Suffix
Sn63Pb37
*RoHS Compliant
-62
Sn96.5Ag3.0Cu0.5 -62F*
Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]
FR4/G10 or equivalent high temp material. 17µm
[1/2 oz.] Cu clad. (RoHS)
Solder Balls (See table above)
Tolerances: diameters ±0.03mm [±0.001"], PCB perimeters ±0.18mm [±0.007"], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position)
±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
Detail A
Detail A
0.89mm
[0.035"] 2.83mm
[0.112"]
