Top View 13mm [0.512"] Ordering Information: Solder Ball Alloy Part Number Suffix Sn63Pb37 -62 13mm [0.512"] Sn96.5Ag3.0Cu0.5 -62F* 0.8mm typ. *RoHS Compliant 0.9mm [0.035"] 0.9mm [0.035"] 2.48mm [0.098"] 11.2mm square [0.441"] Detail A Side View 2 2.83mm [0.112"] 1 Detail A 3 0.36mm 0.05mm [0.014" 0.002"] 0.89mm [0.035"] 2.83mm [0.112"] 1 CONTACT DATA Accepts 0.20mm - 0.33mm Diameter pins 3-finger 37/25 gram, Initial insertion force (with 0.254mm/0.203mm dia. pin) 30/22 gram, normal force (with 0.254mm/0.203mm dia. pin) 20/17 gram, extraction force (with 0.254mm0.203mm dia. pin) 2 3 Substrate: 1.59mm 0.18mm [0.0625" 0.007"] FR4/G10 or equivalent high temp material. 17m [1/2 oz.] Cu clad. (RoHS) Pins: shell material- Brass Alloy 360 1/2 hard; shell finish- 0.25m [10"] Au over 2.54m [100"] Ni (min.). Contact material- BeCu alloy 172, HT; contact finish 0.25m [10"] Au over 1.27m [50"] Ni (min. ). Solder Balls (See table above) Description: Giga-snaP BGA SMT Foot 177 position (0.8mm pitch) gold plated female receptacle pins to SMT solder balls (BGA type). Pin asignment 1:1. Tolerances: diameters 0.03mm [0.001"], PCB perimeters 0.18mm [0.007"], PCB thicknesses 0.18mm [0.007"], pitches (from true position) 0.08mm [0.003"], all other tolerances 0.13mm [0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. SF-BGA177A-B-62(F) Drawing (c) 2007 IRONWOOD ELECTRONICS, INC. 11351 Rupp Dr. Ste 400 Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Status: Released Scale: 8:1 Rev: A Drawing: M.A. Fedde Date: 3/22/07 File: SF-BGA177A-B-62 Dwg.mcd Modified: