
3
Precision Edge®
SY89874U
Micrel, Inc.
M9999-031208
hbwhelp@micrel.com or (408) 955-1690
Note 1. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is
not implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum ratlng
conditions for extended periods may affect device reliability.
Note 2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
Note 3. Due to the limited drive capability use for input of the same package only.
Note 4. Junction-to-board resistance assumes exposed pad is soldered (or equivalent) to the device’s most negative potential on the pcb.
Absolute Maximum Ratings(Note 1)
Supply Voltage (VCC) .................................. –0.5V to +4.0V
Input Voltage (VIN) .................................. –0.5V to VCC+0.3
ECL Output Current (IOUT)
Continuous .........................................................50mA
Surge................................................................100mA
Input Current IN, /IN (IIN)..........................................±50mA
VT Current (IVT) ......................................................±100mA
VREF-AC Sink/Source Current (IVREF-AC), Note 3.......±2mA
Lead Temperature (soldering 20 sec.) ...................... 260°C
Storage Temperature (TS) .......................–65°C to +150°C
Operating Ratings(Note 2)
Supply Voltage (VCC) ................+3.3V ±10% or +2.5V ±5%
Ambient Temperature (TA).........................–40°C to +85°C
Package Thermal Resistance
MLF® (θJA)
Still-Air .............................................................60°C/W
500lfpm............................................................54°C/W
MLF® (ψJB), Note 4
Junction-to-Board ............................................32°C/W
TA= –40°C to +85°C; Unless otherwise stated.
Symbol Parameter Condition Min Typ Max Units
VCC Power Supply 2.375 3.63 V
ICC Power Supply Current No load, max. VCC 50 75 mA
RIN Differential Input Resistance 90 100 110 Ω
(IN-to-/IN)
VIH Input High Voltage (IN, /IN) Note 3 0.1 –VCC+0.3 V
VIL Input Low Voltage (IN, /IN) Note 3 –0.3 –VIH–0.1 V
VIN Input Voltage Swing Notes 3, 4 0.1 –VCC V
VDIFF_IN Differential Input Voltage Swing Notes 3, 4, 5 0.2 –V
|IIN| Input Current (IN, /IN) Note 3 ––45 mA
VREF-AC Reference Voltage Note 6 VCC–1.525 VCC–1.425 VCC–1.325 V
Note 1. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.
Note 2. Specification for packaged product only.
Note 3. Due to the internal termination (see
“Input Structures”
) the input current depends on the applied voltages at IN, /IN and VT inputs. Do not apply
a combination of voltages that causes the input current to exceed the maximum limit!
Note 4. See
“Timing Diagram”
for VIN definition. VIN (Max) is specified when VT is floating.
Note 5. See
“Typical Operating Characteristics”
section for VDIFF definition.
Note 6. Operating using VIN is limited to AC-coupled PECL or CML applications only. Connect directly to VT pin.
DC ELECTRICAL CHARACTERISTICS(Notes 1, 2)
VCC = 3.3V ±10% or 2.5V ±5%; TA = –40°C to +85°C, RL = 50Ω to VCC –2V; Unless otherwise stated.
Symbol Parameter Condition Min Typ Max Units
VOH Output High Voltage VCC–1.145 VCC–1.020 VCC–0.895 V
VOL Output Low Voltage VCC–1.945 VCC–1.820 VCC–1.695 V
VOUT Output Voltage Swing 550 800 1050 mV
VDIFF_OUT Differential Output Voltage Swing 1.10 1.60 2.10 V
Note 1. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.
Note 2. Specification for packaged product only.
(100KEP) LVPECL DC ELECTRICAL CHARACTERISTICS(Notes 1, 2)