Features
■ Superior circuit protection
■ Overcurrent and overvoltage protection
■ Blocks surges up to rated limits
■ High-speed performance
■ Small SMT package
■ Agency recognition:
Applications
■ Voice / VDSL cards
■ Protection modules and dongles
■ Process control equipment
■ Test and measurement equipment
■ General electronics
TBU-CA Series - TBU® High-Speed Protectors
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifi cations are subject to change without notice.
Customers should verify actual device performance in their specifi c applications.
General Information
The TBU-CA Series of Bourns® TBU®
products are low capacitance single
bidirectional high-speed protection
components, constructed using MOSFET
semiconductor technology, and designed
to protect against faults caused by short
circuits, AC power cross, induction and lightning surges.
The TBU® high-speed protector placed in the system circuit will monitor the current with
the MOSFET detection circuit triggering to provide an effective barrier behind which
sensitive electronics will not be exposed to large voltages or currents during surge
events. The TBU® device is provided in a surface mount DFN package and meets
industry standard requirements such as RoHS and Pb Free solder refl ow profi les.
Agency Approval
Description
UL File Number: E315805
Absolute Maximum Ratings (@ TA = 25 °C Unless Otherwise Noted)
Symbol Parameter Part Number Value Unit
Vimp Peak impulse voltage withstand with duration less than 10 ms
TBU-CA025-xxx-WH
TBU-CA040-xxx-WH
TBU-CA050-xxx-WH
TBU-CA065-xxx-WH
TBU-CA085-xxx-WH
250
400
500
650
850
V
Vrms Continuous A.C. RMS voltage
TBU-CA025-xxx-WH
TBU-CA040-xxx-WH
TBU-CA050-xxx-WH
TBU-CA065-xxx-WH
TBU-CA085-xxx-WH
100
200
250
300
425
V
Top Operating temperature range -40 to +125 °C
Tstg Storage temperature range -65 to +150 °C
Tjmax Maximum Junction Temperature +125 °C
ESD HBM ESD protection per IEC 61000-4-2 ±2 kV
TBU
®
Device
Line In/
Line Out
Line Out/
Line In
*RoHS COMPLIANT
A5050
E075
Asia-Pacifi c: Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116
Europe: Tel: +41-41 768 5555 • Fax: +41-41 768 5510
The Americas: Tel: +1-951 781-5500 • Fax: +1-951 781-5700
www.bourns.com
Specifi cations are subject to change without notice.
Customers should verify actual device performance in their specifi c applications.
TBU-CA Series - TBU® High-Speed Protectors
Electrical Characteristics (@ TA = 25 °C Unless Otherwise Noted)
Symbol Parameter Part Number Min. Typ. Max. Unit
Itrigger
Current required for the device to go from operating state to
protected state
TBU-CAxxx-050-WH
TBU-CAxxx-100-WH
TBU-CAxxx-200-WH
TBU-CAxxx-300-WH
TBU-CAxxx-500-WH
50
100
200
300
500
75
150
300
450
750
100
200
400
600
1000
mA
Rdevice
Series resistance of
the TBU device
Vimp = 250 V Itrigger (min.) = 50 mA
Vimp = 250 V Itrigger (min.) = 100 mA
Vimp = 250 V Itrigger (min.) = 200 mA
Vimp = 250 V Itrigger (min.) = 300 mA
Vimp = 250 V Itrigger (min.) = 500 mA
Vimp = 400 V Itrigger (min.) = 50 mA
Vimp = 400 V Itrigger (min.) = 100 mA
Vimp = 400 V Itrigger (min.) = 200 mA
Vimp = 400 V Itrigger (min.) = 300 mA
Vimp = 400 V Itrigger (min.) = 500 mA
Vimp = 500 V Itrigger (min.) = 50 mA
Vimp = 500 V Itrigger (min.) = 100 mA
Vimp = 500 V Itrigger (min.) = 200 mA
Vimp = 500 V Itrigger (min.) = 300 mA
Vimp = 500 V Itrigger (min.) = 500 mA
Vimp = 650 V Itrigger (min.) = 50 mA
Vimp = 650 V Itrigger (min.) = 100 mA
Vimp = 650 V Itrigger (min.) = 200 mA
Vimp = 650 V Itrigger (min.) = 300 mA
Vimp = 650 V Itrigger (min.) = 500 mA
Vimp = 850 V Itrigger (min.) = 50 mA
Vimp = 850 V Itrigger (min.) = 100 mA
Vimp = 850 V Itrigger (min.) = 200 mA
Vimp = 850 V Itrigger (min.) = 300 mA
Vimp = 850 V Itrigger (min.) = 500 mA
TBU-CA025-050-WH
TBU-CA025-100-WH
TBU-CA025-200-WH
TBU-CA025-300-WH
TBU-CA025-500-WH
TBU-CA040-050-WH
TBU-CA040-100-WH
TBU-CA040-200-WH
TBU-CA040-300-WH
TBU-CA040-500-WH
TBU-CA050-050-WH
TBU-CA050-100-WH
TBU-CA050-200-WH
TBU-CA050-300-WH
TBU-CA050-500-WH
TBU-CA065-050-WH
TBU-CA065-100-WH
TBU-CA065-200-WH
TBU-CA065-300-WH
TBU-CA065-500-WH
TBU-CA085-050-WH
TBU-CA085-100-WH
TBU-CA085-200-WH
TBU-CA085-300-WH
TBU-CA085-500-WH
13.3
7.1
4.2
3.2
2.6
14.3
8.1
5.2
4.3
3.6
15.7
9.5
6.6
5.6
5.0
17.7
11.5
8.6
7.6
7.0
21.4
15.2
12.3
11.3
10.7
15.3
8.2
4.8
3.8
3.0
16.5
9.4
6.0
5.0
4.2
18.0
10.9
7.5
6.5
5.7
20.3
13.2
9.8
8.8
8.0
24.5
17.4
14.0
13.0
12.2
Ω
tblock Time for the device to go from normal operating state to protected state 1 µs
IQCurrent through the triggered TBU® device with 50 Vdc circuit voltage 0.25 0.50 1.00 mA
Vreset Voltage below which the triggered TBU® device will transition to normal operating state 12 16 20 V
Rth(j-l) Junction to package pads - FR4 using recommended pad layout 98 °C/W
Rth(j-l) Junction to package pads - FR4 using heat sink on board (6 cm2) (1 in2) 40 °C/W
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
-75 -50 -25 0 25 50 75 100 125 150
Junction Temperature (°C)
Normalized Trigger Current
2.2
1.6
1.8
2.0
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
-75 -50 -25 0 25 50 75 100 125 150
Junction Temperature (°C)
Normalized Resistance
TBU-CA Series - TBU® High-Speed Protectors
Specifi cations are subject to change without notice.
Customers should verify actual device performance in their specifi c applications.
Reference Application
The TBU® devices are general use protectors used in a wide
variety of applications. The maximum voltage rating of the TBU®
device should never be exceeded. Where necessary, an OVP
should be employed to limit the maximum voltage. A cost-
effective protection solution combines Bourns® TBU® protection
devices with a pair of Bourns® MOVs. For bandwidth sensitive
applications, a Bourns® GDT may be substituted for the MOV.
The TBU® device, constructed using MOSFET semiconductor
technology, placed in the system circuit will monitor the
current with the MOSFET detection circuit triggering to provide
an effective barrier behind which sensitive electronics are not
exposed to large voltages or currents during surge events. The
TBU® device operates in approximately 1 μs - once line
current exceeds the TBU® device’s trigger current Itrigger.
When operated, the TBU® device restricts line current to less
than 1 mA typically. When operated, the TBU® device will
block all voltages including the surge up to rated limits.
After the surge, the TBU® device resets when the voltage
across the TBU® device falls to the Vreset level. The TBU®
device will automatically reset on lines which have no DC bias
or have DC bias below Vreset (such as unpowered signal lines).
If the line has a normal DC bias above Vreset, the voltage
across the TBU® device may not fall below Vreset after the
surge. In such cases, special care needs to be taken to ensure
that the TBU® device will reset, with software monitoring as one
method used to accomplish this. Bourns application
engineers can provide further assistance.
Basic TBU Operation
Performance Graphs
Typical V-I Characteristics (TBU-CA050-300-WH) Typical Trigger Current vs. Temperature
Equip.
OVP
OVP
Line
Line
TBU
®
Device
TBU
®
Device
Line In /
Line Out
Line Out
/ Line In
Line Out
/ Line In
Line In /
Line Out
Typical Resistance vs. Temperature
Power Derating Curve
CURRENT
(100 mA/div)
VOLTAGE
(5 V/div)
ITRIP
VRESET
No Additional PCB Cu
0.5 sq. in. Additional PCB Cu
Ambient Temperature (°C)
20
3.0
2.5
2.0
1.5
1.0
0.5
0.0
40 60 80 100 120 140
Total Max. Power (W)
Specifi cations are subject to change without notice.
Customers should verify actual device performance in their specifi c applications.
TBU-CA Series - TBU® High-Speed Protectors
Product Dimensions
DIMENSIONS: MM
(INCHES)
Recommended Pad Layout
TBU® High-Speed Protectors have a 100 % matte-tin termination
fi nish. For improved thermal dissipation, the recommended layout
uses PCB copper areas which extend beyond the exposed solder
pad. The exposed solder pads should be defi ned by a solder mask
which matches the pad layout of the TBU® device in size and spac-
ing. It is recommended that they should be the same dimension as
the TBU® pads but if smaller solder pads are used, they should be
centered on the TBU® package terminal pads and not more than
0.10-0.12 mm (0.004-0.005 in.) smaller in overall width or length.
Solder pad areas should not be larger than the TBU® pad sizes
to ensure adequate clearance is maintained. The recommended
stencil thickness is 0.10-0.12 mm (0.004-0.005 in.) with a stencil
opening size 0.025 mm (0.0010 in.) less than the solder pad size.
Extended copper areas beyond the solder pad signifi cantly improve
the junction to ambient thermal resistance, resulting in operation
at lower junction temperatures with a corresponding benefi t of reli-
ability. All pads should soldered to the PCB, including pads marked
as NC or NU but no electrical connection should be made to these
pads. For minimum parasitic capacitance, it is recommended that
signal, ground or power signals are not routed beneath any pad.
PIN 1 & BACKSIDE CHAMFER
4.00 ± 0.10
(.157 ± .004)
0.00 - 0.05
(.000 - .002)
6.50 ± 0.10
(.256 ± .004)
0.85 ± 0.05
(.033 ± .002)
0.30
(.012)
3.40
(.134)
0.30
(.012)
1.85
(.073)
0.70
(.028)
0.70
(.028) 0.80
(.031)
1.85
(.073)
C PIN 1
0.25
(.010)
3 2 1
Pad # Pin Out
1 Line In/Out
2NU
3 Line Out/In
Pad Designation
Dark grey areas show added PCB copper area for better
thermal resistance.
Specifi cations are subject to change without notice.
Customers should verify actual device performance in their specifi c applications.
TBU-CA Series - TBU® High-Speed Protectors
Refl ow Profi le
Profi le Feature Pb-Free Assembly
Average Ramp-Up Rate (Tsmax to Tp) 3 °C/sec. max.
Preheat
- Temperature Min. (Tsmin)
- Temperature Max. (Tsmax)
- Time (tsmin to tsmax)
150 °C
200 °C
60-180 sec.
Time maintained above:
- Temperature (TL)
- Time (tL)
217 °C
60-150 sec.
Peak/Classifi cation Temperature (Tp) 260 °C
Time within 5 °C of Actual Peak Temp. (tp) 20-40 sec.
Ramp-Down Rate 6 °C/sec. max.
Time 25 °C to Peak Temperature 8 min. max.
How to Order
TBU - CA 085 - 500 - WH
TBU® Product
Series
CA = Bi-Series
Impulse Voltage Rating
025 = 250 V
040 = 400 V
050 = 500 V
065 = 650 V
085 = 850 V
Trigger Current
050 = 50 mA
100 = 100 mA
200 = 200 mA
300 = 300 mA
500 = 500 mA
Hold to Trip Ratio Suffi x
W = Hold to Trip Ratio
Package Suffi x
H = DFN Package
Typical Part Marking
PIN 1
MANUFACTURING
DATE CODE
- 1ST DIGIT INDICATES THE YEAR’S 6-MONTH PERIOD.
- 2ND DIGIT INDICATES THE WEEK NUMBER IN THE 6-MONTH PERIOD.
- 3RD & 4TH DIGITS INDICATE SPECIFIC LOT FOR THE WEEK.
6-MONTH PERIOD CODES:
A = JAN-JUN 2009 C = JAN-JUN 2010 E = JAN-JUN 2011
B = JUL-DEC 2009 D = JUL-DEC 2010 F = JUL-DEC 2011
MANUFACTURER’S
TRADEMARK
PRODUCT CODE
- 1ST DIGIT INDICATES PRODUCT FAMILY:
A = TBU-CA SERIES
- 2ND & 3RD DIGITS INDICATE IMPULSE VOLTAGE:
25 = 250 V 40 = 400 V 50 = 500 V
65 = 650 V 85 = 850 V
- 4TH & 5TH DIGITS INDICATE TRIGGER CURRENT:
05 = 50 mA 10 = 100 mA 20 = 200 mA
30 = 300 mA 50 = 500 mA
Thermal Resistance vs Additional PCB Cu Area
Added Cu Area (Sq. In.)
0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
120
100
80
60
40
20
0
Thermal Resistance (°C/W)
Specifi cations are subject to change without notice.
Customers should verify actual device performance in their specifi c applications.
TBU-CA Series - TBU® High-Speed Protectors
“TBU” is a registered trademark of Bourns, Inc. in the United States and other countries.
REV. 11/11
Packaging Specifi cations
B
A
DC
NF
G (MEASURED AT HUB)
USER DIRECTION OF FEED
K0
B0
P2
D1
CENTER
LINES OF
CAVITY
EMBOSSMENT
tD
P0
TOP
COVER
TAPE
E
W
P
A0
DIMENSIONS: MM
(INCHES)
A B C D G N
Min. Max. Min. Max. Min. Max. Min. Max. Ref. Ref.
326
(12.835)
330
(13.002)
1.5
(.059)
2.5
(.098)
12.8
(.504)
13.5
(.531)
20.2
(.795) - 16.5
(.650)
102
(4.016)
A0 B
0 D D1 E F
Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Min. max.
4.3
(.169)
4.5
(.177)
6.7
(.264)
6.9
(.272)
1.5
(.059)
1.6
(.063)
1.5
(.059) -1.65
(.065)
1.85
(.073)
7.4
(.291)
7.6
(.299)
K0P P0 P
2 t W
Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Min. Max.
1.0
(.039)
1.2
(.047)
7.9
(.311)
8.1
(.319)
3.9
(.159)
4.1
(.161)
1.9
(.075)
2.1
(.083)
0.25
(.010)
0.35
(.014)
15.7
(.618)
16.3
(.642)
QUANTITY: 3000 PIECES PER REEL
